美、韩科学家制成世界上首个分子晶体管

美国耶鲁大学2009年12月23日发表新闻公报称，该校及韩国光州科学技术研究院科学家最近合作制成世界上首个分子晶体管，制作分子晶体管的材料是单个苯分子。相关论文发表于12月24日的《自然》杂志。     

The Anomalous Effect of Interface Traps on Generation Current in Lightly Doped Drain nMOSFET＇s

The anomalous phenomenon of generation current ICD in the lightly doped drain （LDD） nMOSFET measured under the drain bias VD-step mode is reported. We propose an assumption of activated （A） and frozen （F） traps for the VD-step mode： The A traps contributes to ICD while the F process can make them lose the roles as generation centers. The A and F regions can form the F-A region. The comparison of the F and A regions decides the role of the F-A region. The experiments confirm the assumption.     

集成单电子晶体管的研究动态

随着微电子器件集成度的提高，芯片上的功能元件尺寸不断减小．国外（如日本东芝公司）已建立０－１μｍ生产线，国内也正研制０－３５μｍ的集成电路．但进一步减小功能元件尺寸的更高集成度的芯片的性能将因量子涨落和散热等问题而非常不稳定，解决这些问题的出路在于选择功耗低并能抑制多种涨落的单电子晶体管．单电子晶体管因它的体积小、无引线集成和极低的操作功率等特点，其高度集成化可远远超越目前大规模集成化的极限并达到海森伯不确定原理设定的极限，是将来不可被取代的新型器件．单电子晶体管由一个量子点和两个分别与源和漏耦…     

Evaluation of thermal resistance constitution for packaged A1GaN/GaN high electron mobility transistors by structure function method＊

The evaluation of thermal resistance constitution for packaged A1GaN/GaN high electron mobility transistor （HEMT） by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the A1GaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger A1GaN/GaN HEMT with 400μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged A1GaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip- level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage.     

Transport in graphene nanostructures

Graphene nanostructures are promising candidates for future nanoelectronics and solid-state quantum information technology. In this review we provide an overview of a number of electron transport experiments on etched graphene nanostructures. We briefly revisit the electronic properties and the transport characteristics of bulk, i.e., two-dimensional graphene. The fabrication techniques for making graphene nanostructures such as nanoribbons, single electron transistors and quantum dots, mainly based on a dry etching ??paper-cutting?? technique are discussed in detail. The limitations of the current fabrication technology are discussed when we outline the quantum transport properties of the nanostructured devices. In particular we focus here on transport through graphene nanoribbons and constrictions, single electron transistors as well as on graphene quantum dots including double quantum dots. These quasi-one-dimensional (nanoribbons) and quasi-zero-dimensional (quantum dots) graphene nanostructures show a clear route of how to overcome the gapless nature of graphene allowing the confinement of individual carriers and their control by lateral graphene gates and charge detectors. In particular, we emphasize that graphene quantum dots and double quantum dots are very promising systems for spin-based solid state quantum computation, since they are believed to have exceptionally long spin coherence times due to weak spin-orbit coupling and weak hyperfine interaction in graphene.     

水热法制备注射器样纳米氧化锌场发射特性的研究

应用水热法制备了注射器样纳米结构氧化锌样品,室温下测量其真空场发射特性.根据测量数据,基于Fowler-Nordheim方程,估算了场发射效应增强因子,观察到增强因子随外加电压增加取值的两阶段性;结合样品的光致发光谱和能量散射谱,应用半导体材料中强场效应理论,结合场发射电流密度测量系统的串联电路等效,研究样品中空位对场发射特性影响机理.结果表明,制备过程中形成的锌、氧空位,在样品中产生了相当于杂质态的缺陷能级,缺陷能级与样品形貌共同作用,使样品较大的增强因子随场强增加而阶跃性下降.最后,用电化学沉淀法和气 关键词： 场发射 强场效应 缺陷态 串联等效