取代脲促进环氧树脂／双氰胺固化体系反应机理

双氰胺作为环氧树脂的固化剂，由于固化产物具有优良的机械和电性能，广泛应用在汽车、航天及电子等领域中．但由于其固化温度高达180C以上，使应用范围受到很大限制．专利文献曾报道晚衍生物作为环氧树脂／双氰胺固化体系的促进剂，可以使体系的固化温度降低到130～140oC，并且在室温下仍保持一定的潜伏性［‘，’］．在以往的研究中，认为取代脉的促进作用在于其与环氧发生反应生成环状化合物2一心竣烷酮和仲胺，仲胺与环氧基进一步反应生成的叔胺可以催化环氧发生阴离子聚合［’～’］．实验表明，环氧树脂／双氰胺／取代脉体系的固化温…     

2,4,6-三(羟基苯甲基氨基)-均三嗪的合成及其与双酚A型环氧树脂的固化行为研究

合成了一种含三嗪环结构的环氧树脂固化剂2,4,6-三(羟基苯甲基氨基)-均三嗪(MFP).用动态DSC和原位红外光谱对MFP/DGEBA(双酚A型环氧树脂)体系的固化行为进行了研究.动态DSC研究表明,由于MFP分子结构中存在两种活泼氢(酚羟基氢和仲胺氢),固化反应存在明显的两个峰,相对应的表观活化能分别为70.5 kJ.mol-1和86.5 kJ.mol-1(Kissinger法),通过与另一相似化合物固化DGEBA的比较可知,在MFP固化DGEBA的过程中,酚羟基与环氧基反应相对较难.原位红外动力学结果很好地支持了上述结论.     

升温与等温法非模型动力学研究环氧树脂固化反应

基于DSC数据,采用以Vyazovkin积分法为基础的升温法非模型动力学和等温法非模型动力学对双酚A型环氧树脂E51/4,4′-二氨基二苯基砜(DDS)体系及多官能度环氧树脂AG80/DDS体系的固化过程进行了研究,并结合玻璃化转变温度的变化和原位红外测试技术,对比分析了升温与等温条件下的固化反应规律.结果表明,与传统的模型拟合法相比,非模型动力学更适合定量预测树脂固化反应过程,并能为固化过程中反应机理变化的研究提供重要依据;等温法非模型动力学能够更好地预测两种树脂体系在不同恒温条件下的固化反应历程,并且升温法与等温法非模型动力学所得到的反应活化能-固化度之间的变化关系不同,表明不同温度条件下树脂的反应机理不同,这与升温和恒温条件下玻璃化效应及环氧官能团的变化规律相吻合.     

DSC分析及原位FT-IR法对聚合物接枝碳纳米管/环氧树脂固化体系的固化反应的研究

合成了一种扩链脲修饰的多壁碳纳米管(MWCNT-PEG-TU),差示扫描量热分析(DSC)结果表明,MWCNT-PEG-TU可明显提高E-51环氧树脂/双氰双胺(DICY)固化体系的固化反应活性。利用原位傅里叶变换红外光谱(in situ FT-IR)法研究了MWCNT-PEG-TU/E-51环氧树脂/DICY固化体系的等温固化动力学,该固化体系在不同温度下的dα/dt与α的关系曲线较好地符合Kamal自催化反应模型。     

环氧树脂固化过程的红外光谱研究

通过对环氧树脂和顺丁烯二酸酐在加热固化过程中红外光谱演变情况的观察,阐明了树脂在不同固化阶段和不同固化温度所进行的各类反应和相应的结构变化。在固化过程中使树脂的分子量增大和形成交联结构的主要反应是酯化反应。Fisch等提出的醚化反应在红外光谱中没有得到证实。树脂在酯化反应中生成的顺丁烯二酸酯的结构受热的影响会产生顺、反异构化反应。反应的进程取决于固化温度。在180℃加热已固化的树脂将导致部分碳-碳双键和剩余环氧基的减少,同时产生新的羟基和羰基。     

双酚S/双酚A环氧树脂固化物的相容性研究

采用高分子材料动态力学谱（TBA）和傅立叶变换红外光谱（FTIR）两种方法研究了双酚S／双酚A环氧树脂／芳胺固化体系的固化过程。探讨了在双酚S环氧树脂（BPSER）和双酚A环氧树脂（BPAER）以不同质量比与固化剂4，4'- 二氨基二苯甲烷（DDM）组成固化体系中，所得固化产物的相容性。结果表明，在一个很宽的BPSER／BPAER比例范围，其固化产物具有良好的相容性。     

碱性介质中甘氨酸在Pt电极上解离吸附和氧化反应的原 …

运用原位红外反射光谱研究了碱性介质中甘氨酸在Ｐｔ电极上的解离吸附和氧化反应行为,并利用纳米Ｐｔ膜极的异常红外效应鉴定反应过程中生成的表现吸附物种。结果表明,甘氨酸在Ｐｔ电极上极易发生解离,生成强吸附于电极表面上的氰基负离子。     

二维红外相关光谱研究二胺型苯并噁嗪树脂的热固化机理

以原位红外加热附件(in situ FTIR)跟踪二胺型苯并噁嗪树脂的交联固化过程,用二维红外相关光谱(2D-IR)研究其固化机理.In situ FTIR系列图谱显示苯并噁嗪发生热开环反应后,生成的中间体以两种形式存在,含有C N键的中间体不再继续链的增长,其中一部分在高温下发生裂解反应,生成含有亚胺正离子C N+的Schiff碱;含有碳正离子的中间体继续发生交联聚合反应,生成含有羟基、三取代芳香醚和Mannich桥结构的自聚产物.通过2D-IR的分析,进一步给出固化过程中关键基团的变化顺序,确定了二胺型苯并噁嗪树脂的自聚产物结构含有三取代芳香醚和Mannich桥结构.     

抗坏血酸升温氧化过程的二维相关红外光谱分析

采用傅里叶变换红外光谱法 (FTIR)和二维相关分析 (2DCorrelationAnalysis)技术研究了固态抗坏血酸在 2 0℃～ 1 60℃的升温氧化过程。结果表明 :抗坏血酸随着温度升高的红外光谱的特征峰在一维图上变化不明显。借助于二维相关分析 ,不仅提高了谱图的分辨率 ,将一维红外谱图上 1 674cm- 1 处的单峰分解为两个自相关峰 ,显示了抗坏血酸的互变异构体中酮式结构的CO基团和醇式结构的CC基团的振动 ;还揭示了分子内各官能团之间的相互作用 ,反映了在升温氧化过程中这些基团之间的协同关系和变化的先后顺序。抗坏血酸分子中CO、CC和COC基团发生了相互作用 ,其变化的顺序是CC先于COC发生偶极矩的变化 ,最后是CO发生变化 ,此现象与抗坏血酸的氧化反应机理相一致。总之 ,二维相关红外分析可以作为研究抗坏血酸升温氧化过程中结构动态变化的一种新方法 ,也为抗坏血酸在氧化过程中的机理研究提供了一个重要的理论依据。     

双氰胺固化环氧树脂的研究

<正> 双氰胺做为环氧树脂的固化剂,其贮存期可以达到一年以上,这种固化物的机械和介电性能优异,因此,广泛用于制造层压等电工材料方面。国外许多人都曾对双氰胺与环氧树脂的固化反应历程和固化物的性能做过研究,指出了在固化过程中化学结构的变化     

Synthesis, characterization, thermal properties and flame retardancy of a novel nonflammable phosphazene-based epoxy resin

Hexakis(4-hydroxyphenoxy)-cyclotriphosphazene (PN-OH) was synthesized through nucleophilic substitution of the chloride atoms of hexachlorocyclotriphosphazene and reduction of the aldehyde groups, and its chemical structure was characterized by elemental analysis, ¹H and ³¹P NMR, and Fourier transform infrared (FTIR) spectroscopy. A new phosphazene-based epoxy resin (PN-EP) was successfully synthesized through the reaction between diglycidyl ether of bisphenol-A (DGEBA) and PN-OH, and its chemical structure was confirmed by FTIR and gel permeation chromatography. Four PN-EP thermosets were obtained by curing with 4,4′-diaminodiphenylmethane (DDM), dicyandiamide (DICY), novolak and pyromellitic dianhydride (PMDA). The reactivity of PN-EP with the four curing agents presents an increase in the order of DDM, PMDA, novolak and DICY. An investigation on their thermal properties shows that the PN-EP thermosets achieve higher glass-transition and decomposition temperatures in comparison with the corresponding DGEBA ones while their char yields increase significantly. The PN-EP thermosets also exhibit excellent flame retardancy. The thermosets with novolak, DICY and PMDA achieve the LOI values above 30 and flammability rating of UL94 V-0, whereas the one with DDM reaches the V-1 rating. The nonflammable halogen-free epoxy resin synthesized in this study has potential applications in electric and electronic fields in consideration of the environment and human health.     

Carbonyldiimidazole‐accelerated efficient cure of epoxidized soybean oil with dicyandiamide

This study investigates the curing of epoxidized soybean oil (ESO) using dicyandiamide (DICY) and combinations of DICY with several accelerators as curing agents. The differential scanning calorimetry (DSC) results indicated that carbonyldiimidazole (CDI) is a highly efficient accelerator for the ESO‐DICY curing system. CDI accelerated ESO‐DICY curing system can gel within a short period of 13 min at 190 °C. The activation energies of the ESO‐DICY curing systems with and without CDI are 95 and 121 kJ mol^?1, respectively. Similar acceleration effect was observed in the ESO‐diglycidyl ether of biphenyl A (DGEBA) blending formulations. When the molar part of the glycidyl epoxy groups of DGEBA was equal to the internal epoxy groups of ESO in the mixture, gelation of the DICY curing system accelerated by CDI was achieved in 3 min at 160 °C. Furthermore, the DSC results with FTIR analysis suggest that the stoichiometric curing molar ratio was 3 ESO epoxy units per 1 DICY molecule. Two epoxy units reacted with DICY to give secondary alcohols, while the other one linked to the nitrile group. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 375–382     

环氧树脂与氰酸酯共聚反应研究

研究了催化剂对环氧树脂与氰酸酯树脂的共聚固化反应行为的影响,并初步探索氰酸酯／环氧固化的反应历程．研究表明,催化剂能明显地促进其固化反应,降低固化温度,缩短固化时间;氰酸酯与环氧共聚反应历程是首先氰酸酯三聚反应生成三嗪环结构,然后三嗪环开环与环氧共聚反应,最后是未能参与共聚反应的环氧官能团在唑啉结构和三嗪环的催化下发生聚醚化反应;在氰酸酯官能团欠量的条件下,固化树脂中主要是唑啉和聚醚结构,而三嗪环结构的含量很少．     

Pulsed NMR study of the curing process of epoxy resin

To analyze a curing process of epoxy resin in terms of molecular motion, we adapted a pulsed NMR method. Three kinds of (1)H spin-spin relaxation times (T(2L) (long), T(2S) (short) and T(2M) (intermediate)) were estimated from observed solid echo train signals as the curing process proceeded. A short T(2S) value below 20 micros suggests the existence of a motion-restricted chain, that is, cured elements of resin, and its fraction, P(S), sigmoidally increased with the curing time. On the other hand, the fraction of T(2L), P(L), decreased with the reaction time reciprocally against P(S), suggesting the disappearance of highly mobile molecules raised from pre-cured resin. The spin-lattice relaxation time, T(1), was also measured to check another aspect of molecular motion in the process. T(1) of the mixed epoxy resin and curing agent gradually increased just after mixing both of them. This corresponds to an increment of a less-mobile fraction, of which the correction time is more than 10(-6) s, and also means that the occurrence of a network structure whose mobility is strongly restricted by chemically bonded bridges between the epoxy resin and curing agent. The time courses of these parameters coincided with those of IR peaks pertinent to the curing reaction. Therefore, pulsed NMR is a useful tool to monitor the hardening process of epoxy resin in real time non-distractively in terms of the molecular motion of protons.     

Efficient accelerating effect of carbonyldiimidazole on epoxy‐dicyandiamide curing system

Carbonyldiimidazole (CDI) was inventively used as an accelerator for the curing reaction of diglycidyl ether of bisphenol A (DGEBA) with dicyandiamide (DICY) and a high acceleration more effective than imidazole in double usage was observed. This result implies the accelerating role of CDI in the curing process is complex and involved not only the release of imidazole. To detail the accelerating mechanism of CDI, a series of curing reactions was studied by differential scanning calorimetry (DSC), NMR, IR, and viscosity monitoring. The results suggested that the accelerating mechanism of CDI involves (1) acylation of DICY with CDI to give the corresponding adduct with enhanced solubility, (2) the consequent release of imidazole that can react with epoxide, and (3) abstraction of proton of DICY by the alkoxide moiety to give the corresponding DICY anion endowed with enhanced nucleophilicity. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

电子束辐射固化环氧树脂的反应过程分析

对双酚A型环氧树脂的电子束辐射固化反应过程进行了分析.考察了引发剂、稀释剂对树脂体系辐射反应的影响,以环氧丙烷作为模型化合物,研究了环氧丙烷-碘盐体系的电子束辐射反应机理,证实了在电子束辐射下,碘盐分解产生质子酸,引发环氧树脂阳离子开环聚合的反应过程.观测环氧树脂辐射固化区域发现,电子束穿过样品时发生强烈的散射,在辐射方向以及周围一定区域内引发固化反应,固化反应从活性中心开始向体系内部层层扩展,整个固化区域由很多的层状结构组成.     

Mechanism Studies on Water Sorption and Permeation in Epoxy Resin by Impedance Spectroscopy. II. Cure Kinetics of O-Cresol Novolac Resin with Esterfied Phenol Novolac Resin

Abstract

To study the effect of water affinity of the cured epoxy resin on water sorption and permeation in the cured epoxy resin, a novel hardener (esterfied phenol novolac was synthesized and used for obtaining the cured product without free hydroxyl group. Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FT-IR) were used to study the cure kinetics of o-cresol novolac epoxy resin using esterfied phenol novolac resin as curing agent in the presence of 2-methylimidazole as accelerator. Some kinetic parameters of the curing reaction such as the reaction order, activation energy, and frequency factor were obtained in the temperature range studied. The results show that this curing process is a first-order kinetic mechanism, which was different with that cured with phenol novolac resin.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

Toughening of a highly cross-linked epoxy resin by reactive blending with bisphenol A polycarbonate. I. FTIR spectroscopy

A highly cross-linked thermosetting epoxy resin was modified by a reactive blending process carried out in the presence of bisphenol A polycarbonate (PC). Prior to the curing process the PC component was dissolved at high temperature in the uncured epoxy matrix. FTIR investigation of this reactive mixture demonstrated the occurrence of physical and chemical interactions among the blend components. Isothermal kinetic measurements performed by FTIR spectroscopy showed that the presence of PC does not affect the overall curing mechanism but decreases both the initial reaction rate and the final conversion of reactants. © 1994 John Wiley & Sons, Inc.