Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites

Nano/micro ceramic‐filled epoxy composite materials have been processed with various percentage additions of SiO₂, Al₂O₃ ceramic fillers as reinforcements selected from the nano and micro origin sources. Different types of filler combinations, viz. only nano, only micro, nano/micro, and micro/micro particles, were designed to investigate their influence on the thermal expansion, thermal conductivity, and dielectric properties of epoxy polymers. Thermal expansion studies were conducted using thermomechanical analysis that revealed a two‐step expansion pattern consecutively before and after vitreous transition temperatures. The presence of micro fillers have shown vitreous transition temperature in the range 70–80°C compared with that of nano structured composites in which the same was observed as ~90°C. Similarly, the bulk thermal conductivity is found to increase with increasing percentage of micron‐size Al₂O₃. It was established that the addition of micro fillers lead to epoxy composite materials that exhibited lower thermal expansion and higher thermal conductivity compared with nano fillers. Moreover, nano fillers have a significantly decisive role in having low bulk dielectric permittivity. In this study, epoxy composites with a thermal expansion coefficient of 2.5 × 10^?5/K, thermal conductivity of 1.18 W/m · K and dielectric permittivity in the range 4–5 at 1 kHz have been obtained. The study confirms that although the micro fillers seem to exhibit good thermal conductivity and low expansion coefficient, the nano‐size ceramic fillers are candidate as cofillers for low dielectric permittivity. However, a suitable proportion of nano/micro‐mixed fillers is necessary for achieving epoxy composites with promising thermal conductivity, controlled coefficient of thermal expansion and dielectric permittivity. Copyright © 2013 John Wiley & Sons, Ltd.     

Highly thermal conductive benzoxazine‐epoxy interpenetrating polymer networks containing liquid crystalline structures

A diamine‐based benzoxazine monomer (Bz) and a liquid crystalline epoxy monomer (LCE) are synthesized, respectively. Subsequently, a benzoxazine‐epoxy interpenetrating polymer network (PBEI) containing liquid crystalline structures is obtained by sequential curing of the LCE and the Bz in the presence of imidazole. The results show that the preferential curing of LCE plays a key role in the formation mechanism of liquid crystalline phase. Due to the introduction of liquid crystalline structures, the thermal conductivity of PBEI increases with increasing content of LCE. When the content of LCE is 80 wt %, the thermal conductivity reaches 0.32 W m^?1 K^?1. Additionally, the heat‐resistance of PBEI is superior to liquid crystalline epoxy resin. Among them, PBEI55 containing equal weight of Bz and LCE has better comprehensive performance. Its thermal conductivity, glass transition temperature, and the 5 % weight loss temperature are 0.28 W m^?1 K^?1, 160 °C, and 339 °C, respectively. By introducing boron nitride (BN) fillers into PBEI55, a composite of PBEI/BN with the highest thermal conductivity of 3.00 W m^?1 K^?1 is obtained. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55 , 1813–1821     

Challenges and rewards of the electrosynthesis of macroscopic aligned carbon nanotube array/conducting polymer hybrid assemblies

Hybrid assemblies based on conducting polymers and carbon nanomaterials with organized nanoscale structure are excellent candidates for various application schemes ranging from thermal management to electrochemical energy conversion and storage. In the case of macroscopic samples, however, precise control of the nanoscale structure has remained a major challenge to be solved for the scientific community. In this study we demonstrate possible routes to homogeneously infiltrate poly(3‐hexylthiophene), poly(3,4‐ethylenedioxythiophene), and polyaniline into macroscopic arrays of vertically aligned multiwalled carbon nanotubes (MWCNTAs). Electron microscopic images and Raman spectroscopic analysis (performed along the longitudinal dimension of the hybrid samples) both confirmed that optimization of the electropolymerization circumstances allowed fine tuning of the hybrid structure towards the targeted application. In this vein, three different application avenues were tested. The remarkable anisotropy in both the electrical and thermal conductivity of the nanocomposites makes them eminently attractive candidates to be deployed in thermal management. Thermoelectric studies, aimed to understand the effect of organized nanoscale morphology on the important parameters (Seebeck coefficient, electrical‐, and thermal conductivity) compared to their non‐organized hybrid counterparts. Finally, extraordinary high charge storage capacity values were registered for the MWCNTA/PANI hybrids (500 F g^?1 and 1–3 F cm^?2). © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2015 , 53, 1507–1518     

Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application

This current study aimed to enhance the thermal conductivity of thin film composites without compromising other polymer qualities. The effect of adding high thermal conductivity nanoparticles on the thermal properties and moisture absorption of thin film epoxy composites was investigated. Three types of fillers in nanosize with high thermal conductivity properties, boron nitride (BN), synthetic diamond (SD), and silicon nitride (Si₃N₄) were studied. SN was later used as an abbreviation for Si₃N₄. The contents of fillers varied between 0 and 2 vol.%. An epoxy nanocomposite solution filled with high thermal conductivity fillers was spun at 1500–2000 rpm to produce thin film 40–60 µm thick. The effects of the fillers on thermal properties and moisture absorption were studied. The addition of 2 vol.% SD produced the largest improvement with 78% increment in thermal conductivity compared with the unfilled epoxy. SD‐filled epoxy thin film also showed good thermal stability with the lowest coefficients of thermal expansion, 19 and 124 ppm, before and after T_g, respectively, which are much lower compared with SN‐filled and BN‐filled epoxy thin film composites. However the SD‐filled epoxy film has its drawback as it absorbs more moisture compared with BN‐filled and SN‐filled epoxy film. Copyright © 2012 John Wiley & Sons, Ltd.     

Liquid crystalline epoxies bearing biphenyl ether and aromatic ester mesogenic units: Synthesis and thermal properties

Two liquid crystalline epoxies containing biphenyl ether and aromatic ester mesogenic units, oxybis(4,1-phenylene)bis(4-(oxiran-2-ylmethoxy)benzoate)(LCE1) and oxybis(4,1-phenylene) bis(4-(4-(oxiran-2-yl)butoxy)benzoate)(LCE2), were synthesized and characterized. Subsequently, the epoxy monomers were cured with diaminodiphenylsulfone (DDS). From DSC, XRD and POM results, monomers did not show liquid crystalline phase while the cured samples exhibited nematic phase. The cured samples showed good mechanical properties with strength of 99.1MPa and excellent thermal stabilities with high glass transition temperature up to 168.0?°C, 5% weight loss temperature at 343?°C and high char yield of 24.5% at 800?°C. The relationship between thermal conductivity and network structure was discussed in this work. Due to the introduction of mesogenic units into epoxy networks, the cured resins showed high thermal conductivity as high as 0.292?W/(m*K), more than 1.5times higher than conventional epoxy resins. By introducing alumina (Al₂O₃) into LCE1/DDS cured system, composites of LCE1/DDS/Al₂O₃ with the highest thermal conductivity of 1.61?W/(m*K) was obtained with the content of 80?wt% while that of diglycidyl ether of bisphenol A (DGEBA, E51) epoxy resin/DDS/Al₂O₃ was 1.10?W/(m*K). The as-prepared epoxy resins showed high glass transition temperature and excellent thermal stabilities, indicating the potential of application in microelectronics.     

Enhancement of thermal conductivity and tensile strength of liquid silicone rubber by three-dimensional alumina network

ABSTRACT

Rapidly increasing demands for higher integration density and stability of electronic devices embrace higher requirements for thermally conductive silicone rubber, which is promisingly used in ultra-thin components. In this work, alumina whiskers (AWs) and alumina flakes (AFs) are used to modify liquid silicone rubber (LSR) by fabricating binary (AFs/LSR) or ternary (AWs/AFs/LSR) composites. The thermal conductivity and mechanical strength of the binary and ternary composites were investigated. Thermal conductivity of the binary AFs/LSR composite (25AFs/LSR) was 0.1990 W m^?1 K^?1, while the thermal conductivity of the ternary AFs/AWs/LSR composite (20AFs/5AWs/LSR) was 0.2655 W m^?1 K^?1. Furthermore, the tensile strength of the ternary AWs/AFs/LSR composites increased by 180.9% as compared with the binary system, increased to 7.81 MPa from 2.78 MPa due to the introduction of 1 wt% AWs. As a reason, a significant synergistic effect of AWs and AFs in the enhancement of both thermal and mechanical properties of the LSR was proved. Furthermore, the dielectric property measurements demonstrated that the ternary composites exhibited a lower dielectric constant and dielectric loss, indicating that the AWs/AFs/LSR composites were qualified to be applied in the field of electronic devices.     

Thermal conductivity of gel-spun polyethylene fibers

The thermal conductivities of unidirectional gel-spun polyethylene fiber-reinforced composites have been measured parallel (K∥?) and perpendicular (K⊥) to the fiber axis from 15 to 300K. The axial thermal conductivity K∥? varies linearly with volume fraction v_f of fiber, while the transverse thermal conductivity K⊥ follows the Halpin-Tsai equation. Extrapolation to v_f = 1 gives the thermal conductivity of gel-spun polyethylene fiber which, at 300K, has values of 380 and 3.3 mW cm^?1K^?1 along and perpendicular to the fiber axis, respectively. The axial thermal conductivity is exceptionally high for polymers, and is more than twice the thermal conductivity of stainless steel. This high value arises from the presence of a large fraction of long (> 50 nm) extended chain crystals in the fiber. Further improvement of up to a factor of 10 is possible if the length and volume fraction of the extended chain crystals can be increased. © 1993 John Wiley & Sons, Inc.     

Thermally conductive and electrically insulative nanocomposites based on hyperbranched epoxy and nano‐Al2O3 particles modified epoxy resin

Novel epoxy nanocomposites based on a diglycidyl ether of bisphenol A (DGEBA) epoxy, an epoxy functionalized hyperbranched polymer (HTTE) and nano‐Al₂O₃ were synthesized with the aim of determining the effect of the nano‐Al₂O₃ particles and HTTE on the structure and properties of epoxy nanocomposites. The mechanical properties, thermal conductivity, bulk resistivity, and thermal stability of the nano‐Al₂O₃/HTTE/DGEBA ternary composites were evaluated and compared with the corresponding matrix. The improvement in impact properties of these nanocomposites was explained in terms of fracture surface analysis by SEM. The results indicate that the incorporation of nanoparticles and hyperbranched epoxy effectively improved the toughness of epoxy composites without sacrificing thermal conductivity and bulk resistivity compared to the neat epoxy and Al₂O₃/DGEBA, obtaining a well dispersion of nanoparticles in epoxy matrix and solving the drawbacks for single fillers filled epoxy nanocomposite. Copyright © 2010 John Wiley & Sons, Ltd.     

Synthesis and Characterization of Polyvinylferrocene/Polypyrrole Composites

Conducting polymer composites of polyvinylferrocene and polypyrrole (PVF/PPy) were synthesized chemically by the in situ polymerization of pyrrole in the presence of PVF using FeCl₃ as oxidant. Acetic (CH₃COOH) and boric (H₃BO₃) acids were used as the synthesis medium. Effects of the synthesis medium on the properties of the PVF/PPy composite were investigated. The PVF/PPy composites and homopolymers were characterized by fourier transform infrared spectroscopy (FTIR), thermogravimetric analysis (TGA), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and magnetic susceptibility techniques. Conductivity measurements were performed using the four‐probe technique. We found that the conductivities of PVF/PPy‐H₃BO₃ (1.19 S cm^?1) and PVF/PPy‐CH₃COOH (4.5×10^?1 S cm^?1) increased relative to those of the homopolymers of PPy‐H₃BO₃ (2.1×10^?2 S cm^?1) and PPy‐CH₃COOH (1.2×10^?2 S cm^?1) due to the interaction of PVF with the pyrrole moiety. The stability of all homopolymers and composites were investigated by thermogravimetric analysis and by conductivity measurements during heating‐cooling cycles. There was a small drop in conductivity caused by the annealing of PVF/PPy composites at 70°C. The conductivity of all samples increased with temperature and exhibited stable electrical behavior with increasing temperature. TGA analysis of samples showed that the composites were more stable than the homopolymers or PVF separately. The magnetic susceptibility values of samples were negative, except for PVF/PPy‐H₃BO₃. Morphology changes of the composites investigated by scanning electron microscopy (SEM), attributed to synthesis conditions, have a significant effect on their conductivity.     

Effect of aluminum diethylphosphinate on flame retardant and thermal properties of rigid polyurethane foam composites

Rigid polyurethane foam/aluminum diethylphosphinate (RUPF/ADP) composites were prepared by one-step water-blown method. Furthermore, scanning electron microscope (SEM), thermal conductivity meter, thermogravimetric analysis (TGA), limiting oxygen index, Underwriters Laboratories vertical burning test (UL-94) and microsacle combustion calorimetry were applied to investigate thermal conductivity, thermal stability, flame retardancy and combustion behavior of RPUF/ADP composites. Thermogravimetric analysis–Fourier transform infrared spectroscopy (TG–FTIR) was introduced to investigate gaseous products in degradation process of RPUF/ADP composites, while SEM and X-ray photoelectron spectroscopy were used to research char residue of the composites. It was confirmed that RPUF/ADP composites presented well cell structure with density of 53.1–59.0 kg m^?3 and thermal conductivity of 0.0425–0.0468 W m^?1 K^?1, indicating excellent insulation performance of the composites. Flame retardant test showed that ADP significantly enhanced flame retardancy of RPUF/ADP composites, RPUF/ADP30 passed UL-94 V-1 rating with LOI of 23.0 vol%. MCC test showed that ADP could significantly decrease peak of heat release rate (PHPR) of RPUF/ADP composites. PHPR value of RPUF/ADP20 was decreased to 158 W g^?1, which was 21.8% reduced compared with that of pure RPUF. TG–FTIR test revealed that the addition of ADP promoted the release of CO₂, hydrocarbons and isocyanate compound in first-step degradation of RPUF matrix while inhibited the release of CO in second step degradation. Char residue analysis showed that the addition of ADP promoted polyurethane molecular chain to form aromatic and aromatic heterocyclic structure, enhancing strength and compactness of the char. This work associated a gas–solid flame retardancy mechanism with the incorporation of ADP, which presented an effective strategy for preparation of flame retardant RPUF composites.

     

Thermosets containing benzoxazole units: Liquid‐crystalline behavior and thermal conductivity

A series of liquid‐crystalline (LC) thermosetting monomers containing benzoxazole (BO) units were synthesized to evaluate the thermal conductivities (λ) of their cured resins. A BO‐containing bisnadiimide system showed LC behavior during the heating process. However, the thermal cure of the bisnadiimide provided a film without optical anisotropy; consequently, the cured film exhibited normal levels of thermal diffusivity (α) and thermal conductivity (λ). The disappearance of the optically anisotropic ordered structures during thermal curing is likely related to the temperature gaps between the cure reaction ranges and LC ranges (T_cure‐T_LC gap). In addition, epoxy resins consisting of bisepoxides and BO‐containing diamines were investigated because of their high flexibility in terms of molecular design that can be used to reduce the T_cure‐T_LC gap. The combination of a terephthalylidene‐type bisepoxide and BO‐containing diamine with a controlled flexible chain length resulted in the smallest T_cure‐T_LC gap among the epoxy resin systems examined herein. The cured epoxy resin film exhibited an appreciably increased λ value (0.257 W m^?1 K^?1) in the Z direction. This indicated the importance of the T_cure‐T_LC gap for enhancing the α and λ values of the cured films. This epoxy resin system was cured under a continuous DC electric field during polarizing optical microscopy. A prompt response with deformation of the LC domains was observed in harmony with temporal ON/OFF switching of the DC power supply. As expected, the cured film exhibited a significantly enhanced λ value (0.488 W m^?1 K^?1) in the Z direction.     

Simultaneously improving the thermal conductive and flame retardant performance for epoxy resins thermosets by constructing core‐shell‐brush structure and distributing of MWCNTs in brush intervals

Fire safety and thermal dissipation performance of epoxy resins thermosets were critical for its application in key fields such as electronic devices. The simultaneous improvement of flame retardant and thermal conductivity properties were still a challenge. Herein, ammonium polyphosphate (APP) was firstly encapsulated with 5‐wt% epoxy resins based on APP and then surface grafted with polyurethane polymer chain, and the resulting APP with core‐shell‐brush structure was constructed. Finally, the multiwalled carbon nanotube (MWCNT) was assembled in the intervals of polymer brush on APP surface, and the prepared filler was defined as MF‐APP. Its chemical structure and morphologies were characterized and confirmed. The wettability of MF‐APP was evaluated by water contact angles tests (WCA) and MF‐APP exhibited hydrophobic property with the WCA of 138°. When 9‐wt% MF‐APP was incorporated into EP thermosets, the thermal conductive value of EP/MF‐APP achieved 1.02 Wm^?1 K^?1, and the MWCNTs concentration was only 1.8 wt% in thermosets. Compared with the previous work, the prepared EP/MF‐APP thermosets exhibited outstanding thermal conductive efficiency because of the homogeneously distribution of MWCNTs. Moreover, the samples fulfilled UL‐94 V‐0 grade during vertical burning tests with the limiting oxygen index of 30.8%. As a result, the thermal conductivity and flame retardancy of EP thermosets were simultaneously enhanced with a relatively low addition amount of MF‐APP, which would bring more chance for wider application of EP thermosets in key fields.     

Thermal conductivity epoxy resin composites filled with boron nitride

Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd.     

Achieving a high thermal conductivity for segregated BN/PLA composites via hydrogen bonding regulation through cellulose network

Normally, the effective dispersion of thermal conductive fillers is a prerequisite for ensuring thermally conductive networks formed in polymer composites. In this work, a facile method was provided by using cellulose to alter the distribution state of boron nitride (BN) for the preparation of high thermally conductive polylactic acid (PLA). After powder mixing and hot‐pressing process, the Cellulose@BN was located at the boundaries of PLA granules to form consecutive thermally conductive networks with more compact structure. Morphology observation and FTIR spectra confirmed that BN edges absorbed on the cellulose surface under the intermolecular hydrogen bond interaction between PLA and BN. At the BN content of 25 wt%, contrasted with traditional BN/PLA segregated polymer composites (SPCs), thermal conductivity coefficient of Cellulose@BN/PLA SPCs improved by 53.5% from 0.71 to 1.09 Wm^?1 K^?1. This enhancement could be attributed to the reason that the cellulose regulated stripe aggregation allowed the BN connect with each other more compact, thus a thermal conduction networks with reduced phonon scattering were formed.     

Liquid crystalline epoxy resin with improved thermal conductivity by intermolecular dipole–dipole interactions

To address tremendous needs for developing efficiently heat dissipating materials with lightweights, a series of liquid crystalline epoxy resins (LCEs) are designed and synthesized as thermally conductive matrix. All prepared LCEs possess epoxies at the molecular side positions and cyanobiphenyl mesogenic end groups. Based on several experimental results such as differential scanning calorimetry, polarized optical microscopy, and X‐ray diffraction, it is found that the LCEs exhibited liquid crystalline mesophases. When LCE is cured with a diamine crosslinker, the cured LCE maintains the oriented LC domain formed in the uncured state, ascribing to a presence of dipole–diploe and π–π interactions between cyanobiphenyl mesogenic end groups. Due to the anisotropic molecular orientation, the cured LCE exhibits a high thermal conductivity of 0.46 W m^?1 K^?1, which is higher than those of commercially available crystalline or amorphous epoxy resins. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2019 , 57, 708–715     

Benzoxazine-epoxy thermosets with smectic phase structures for high thermal conductive materials

ABSTRACT

To further increase the intrinsic thermal conductivity (TC) of polybenzoxazine, a series of benzoxazine-epoxy thermosets (s-PBEI) were obtained through the sequential curing of a smectic phase epoxy monomer (s-EP) and a bifunctional benzoxazine monomer (BZ) in the presence of imidazole. The results show that s-PBEI exhibits a smectic mesophase. The formation mechanism of the smectic phase is reaction-induced phase separation caused by the preferential curing of s-EP. Owing to the increment of the liquid crystalline structure content, the TC of s-PBEI increases with increasing s-EP content. The TC of s-PBEI55 containing equal weight of BZ and s-EP reaches 0.30 W m^?1 K^?1, which is higher than that of n-PBEI55, a benzoxazine-epoxy thermoset with nematic phase structures. Additionally, the TC, glass transition temperature, and 10% weight loss temperature of s-PBEI64 containing 60 wt% BZ and 40 wt% s-EP are 0.28 W m^?1 K^?1, 216°C, and 334°C, respectively, indicating its potential applications in electronic packaging, LED lighting, and other fields requiring a high TC resin matrix.     

Synthesis of networked polymers with lithium counter cations from a difunctional epoxide containing poly(ethylene glycol) and an epoxide monomer carrying a lithium sulfonate salt moiety

Poly(ethylene glycol)‐based networked polymers that had lithium sulfonate salt structures on the network were prepared by heating a mixture of poly(ethylene glycol) diglycidyl ether (PEGGE), poly(ethylene glycol) bis(3‐aminopropyl) terminated (PEGBA), and an ionic epoxy monomer, lithium 3‐glycidyloxypropanesulfonate (LiGPS). Flexible self‐standing networked polymer films showed high thermal stability, low crystallinity, low glass transition temperature, and good mechanical strength. The materials were ion conductive at room temperature even under a dry condition, although the ionic conductivity was rather low (10^?6 to 10^?5 S/m). The ionic conductivity increased with the increase in temperature to above 1 × 10^?4 S/m at 90 °C. The film samples became swollen by immersing in propylene carbonate (PC) or PC solution of lithium bis(trifluoromethanesulfonyl)imide (LiTFSI). The samples swollen in PC showed higher ionic conductivity (ca.1 × 10^?3 S/m at room temperature), and the samples swollen in LiTFSI/PC showed much higher ionic conductivity (nearly 1 S/m at room temperature). © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 3113–3118, 2010     

Evaluation of the performance of microcrystalline cellulose in retarding degradation of two epoxy resin systems

Accelerated weathering studies are necessary to determine future risks arising from the loss of durability of materials under environmental conditions (e.g. ultraviolet irradiation from the sun, moisture from rainfall, temperature cycling). The influence of different accelerated weathering conditions such as UV light and moisture on the properties of two epoxy resin systems incorporating microcrystalline cellulose (MCC) was evaluated. This study aimed to assess changes in chemical properties (FTIR), mechanical properties (tensile tests), thermal properties (TGA and DSC) and morphology (SEM) before and after accelerated weathering. The samples exposed to different accelerated weathering times (1, 2, 3, 4, and 6?months) were based on the diglycidyl ether of bisphenol A, DGEBA, or hydrogenated diglycidyl ether of bisphenol A, HDGEBA, with amine crosslinker (2,2,4-trimethyl-1,6-hexanediamine, TMDA) and 2% MCC. Incorporation of MCC improved thermal stability, reduced surface oxidation, and gave better retention of mechanical properties after accelerated weathering. Both epoxy resins and epoxy composites exhibited a reduction in the tensile strength upon accelerated weathering with the composites showing less reduction in the tensile strength after 6 months. The glass transition temperatures (T_g) before and after accelerated weathering were also measured. DGEBA-TMDA/2%MCC and HDGEBA-TMDA/2% MCC composites reduced the decrease in the T_g after accelerated weathering, compared to that of DGEBA-TMDA and HDGEBA-TMDA samples. Degradation primarily decreased the mechanical properties of the composites, with some damaged specimens showing on the surfaces of DGEBA-TMDA/2% epoxy composites and HGEBA-TMDA/2%MCC composites. Fewer morphological changes with limited voids were seen on the DGEBA epoxy interface for HDGEBA compared to DGEBA composite samples. Incorporation of 2%MCC in DGEBA-TMDA and HDGEBA-TMDA increased resistance to thermal degradation after accelerated weathering.     

Coagulation method for preparing single-walled carbon nanotube/poly(methyl methacrylate) composites and their modulus,electrical conductivity,and thermal stability

A coagulation method providing a better dispersion of single-walled carbon nanotubes (SWNTs) in a polymer matrix was used to produce SWNT/poly(methyl methacrylate) (PMMA) composites. Optical microscopy and scanning electron microscopy showed an improved dispersion of SWNTs in the PMMA matrix, a key factor in composite performance. Aligned and unaligned composites were made with purified SWNTs with different SWNT loadings (0.1–7 wt %). Comprehensive testing showed improved elastic modulus, electrical conductivity, and thermal stability with the addition of SWNTs. The electrical conductivity of a 2 wt % SWNT composite decreased significantly (>10⁵) when the SWNTs were aligned, and this result was examined in terms of percolation. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 3333–3338, 2003