Thermal and physical properties of flame-retardant epoxy resins containing 2-(6-oxido-6H-dibenz〈c,e〉〈1,2〉oxaphosphorin-6-yl)-1,4-naphthalenediol and cured with dicyanate ester

2-(6-oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol (DOPONQ) was prepared by the addition reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) with 1,4-naphthoquinone. The phosphorus-containing diol (DOPONQ) was used as a reactive flame retardant by an advancement reaction with the diglycidyl ether of bisphenol-A epoxy (DGEBA) resin at various stoichiometric ratios. DOPONQ-containing advanced epoxy was separately cured with various dicyanate esters to form flame-retardant epoxy/cyanate ester systems. The effect of the phosphorus content and dicyanate ester structure on the curing characteristic, glass transition temperature, dimensional stability, thermal stability, flame retardancy, and dielectric property was studied and compared with that of the control advanced bisphenol-A epoxy system. The DOPONQ-containing epoxy/cyanate ester systems exhibited higher glass transition temperatures as well as better thermal dimensional and thermal degradation stabilities. The flame retardancy of the phosphorus-containing epoxy/dicyanate ester system increased with the phosphorus content, and a UL-94 V-0 rating could be achieved with a phosphorus content as low as 2.1%.     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Synthesis,Characterization of Phosphorus ContainingDiamide-diimide-tetraamines Based on L-TryptophanAmino Acid and Their Effect on Flame Retardancy ofEpoxy Resins简

The curing behavior of diglycidyl ether of bisphenol-A(DGEBA) with different phosphorus containing diamidediimide-tetraamines(DADITAs) was studied by DSC. Eight DADITAs of varying structures were synthesized by reacting 1 mole of pyromellitic anhydride(PMDA)/3,3′-benzophenone tetracarboxylic dianhydride(BTDA)/1,4,5,8-naphthalene tetracarboxylic dianhydride(NTDA)/4,4′-oxydiphthalic anhydride(ODPA) with 2 mole of L-tryptophan(T) in a mixture of acetic acid and pyridine(3:2 V/V) followed by activaton with thionyl chloride and then condensation with excess of phosphorus containing triamines tris(3-aminophenyl) phosphine(TAP) and tris(3-aminophenyl) phosphine oxide(TAPO). DADITAs obtained by reacting PMDA/BTDA/NTDA/ODPA with L-tryptophan followed by condensation with TAP/TAPO were designated as PTAP, PTAPO, BTAP, BTAPO, NTAP, NTAPO, OTAP and OTAPO respectively. The structural characterization of synthesized DADITAs was done by FTIR,1H-NMR,13C-NMR,31P-NMR spectroscopic techniques and elemental analysis. Thermal stability of the isothermally cured epoxy was investigated using dynamic thermogravimetry analysis. The glass transition temperature(Tg) was highest in DGEBA cured using PTAP. All epoxy thermosets exhibited excellent flame retardancy, moderate changes in Tg and thermal stability. Due to presence of phosphorus in curing agents, all epoxy resin systems met the UL-94 V-0 classification and the limiting oxygen index(LOI) reached up to 38.5, probably because of the nitrogen-phosphorus synergistic effect.     

碳纳米管改性环氧树脂的导热和阻燃性能

以双酚A二缩水甘油醚(DGEBA)环氧树脂(Epoxy Resin,EP)为基体、甲基六氢苯酐(MHHPA)为固化剂、以多壁碳纳米管(MWCNTs)为添加剂制备了环氧树脂/碳纳米管纳米复合材料。通过对微观结构、玻璃化转变温度(Tg)、热失重、热导率和锥形量热测试结果分析,研究了质量分数少于1.5%的MWCNTs对环氧树脂的导热和阻燃性能影响,结果表明,MWCNTs质量分数为1.5%时,复合材料发生团聚;纳米复合材料随着MWCNTs质量分数的增加Tg值先增加后降低;失重5%时,对应的温度先增加后降低,残炭量增加;样品的热导率呈现先升高后降低的趋势,当MWCNTs质量分数为1%时,复合材料的热导率最大;MWCNTs加入后环氧树脂的总释热量减少,释烟量增加,阻燃性得到一定程度的提高。     

Facile preparation of novel epoxy curing agents and their high‐performance thermosets

Two flame‐retardant epoxy curing agents, 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐tris(4‐hydroxyphenyl)methane (1) and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐ (4‐aminophenyl)‐bis(4‐hydroxyphenyl)methane (2), were prepared by a facile, economic, one‐pot procedure. The structures of the curing agents were confirmed by IR, high‐resolution mass, 1‐D, and 2‐D NMR spectra. A reaction mechanism was proposed for the preparation, and the effect of electron withdrawing/donating effects on the stabilization of the carbocation was discussed. (1‐2) served as curing agents for diglycidyl ether of bisphenol A (DGEBA), dicyclopentadiene epoxy (HP‐7200), and cresol novolac epoxy (CNE). Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting epoxy thermosets were evaluated. The resulting epoxy thermosets show high T_g, low thermal expansion, moderate thermostability, and excellent flame retardancy. The bulky biphenylene phosphinate pendant makes polymer chains difficult to rotate, explaining the high T_g and low thermal expansion characteristic. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7898–7912, 2008     

Preparation of phosphorus‐containing phenolic resin and its application in epoxy resin as a curing agent and flame retardant

For the sake of improving the flame retardancy of epoxy resin (EP), a novel phosphorus‐containing phenolic resin (PPR) synthesized in our group instead of conventional phenolic resin (PR) was used to cure EP in the present research. The curing processes and the corresponding crosslinking structure and mechanical performance were investigated by differential scanning calorimeter and dynamic mechanical thermal analysis. Because of the introduction of flame‐retarding elements including P and Si, PPR exhibited higher charring capacity in the condensed phase, which is helpful to construct a char layer of higher quality. Correspondingly, PPR‐cured EP displayed remarkably improved flame retardance as compared to conventional PR‐cured EP through the related evaluations including limiting oxygen index, vertical burning test, and microscale combustion colorimeter. As a multifunction agent, it is believable that PPR possesses potential commercial value to prepare flame‐retardant EP with high performance.     

Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system

Phenyl bisthioureas: 4,4′-(bisthiourea)diphenylmethane (DTM), 4,4′-(bisthiourea)diphenyl ether (DTE), and 4,4′-(bisthiourea)diphenyl sulfone (DTS) were synthesized and used as curing agents for the epoxy resin diglydicyl ether bisphenol A (DGEBA). Synthesized phenyl bisthioureas were characterized using FT-IR and ¹H-NMR analysis. For comparison studies the epoxy system was also cured using the conventional aromatic amine 4,4′-diaminodiphenyl ether (DDE). Curing kinetics of epoxy/amine system was studied by dynamic and isothermal differential scanning calorimeter (DSC). Curing kinetic was evaluated based on model-free kinetics (MFK) and ASTM E 698 model, and the activation energy was compared with DDE. Curing system of phenyl bisthiourea link (DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS) shows two exothermic peaks, while that of the conventional aromatic amines showed only a single peak. The initial exothermic peak is due to the primary nitrogen of the thiourea group, and the exotherm at higher temperature is due to the presence of thiourea groups. Glass transition temperature (T _g) of DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS cured resins were lowered by 323 K when compared to the widely used diaminodiphenyl ether (DDE) cured resin. Oxidation induction temperature measurement performed on DSC suggests that the DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS system cured resins has better oxidative stability when compared to cured DGEBA/DDE resin system.     

Vanillin‐derived phosphorus‐containing compounds and ammonium polyphosphate as green fire‐resistant systems for epoxy resins with balanced properties

Flame retardants from vanillin when utilized together with ammonium polyphosphate (APP) yield excellent synergistic flame retardancy toward epoxy resins. Bisphenol A epoxy resins have been widely used due to their excellent mechanical properties, chemical resistance, electrical properties, adhesion, etc., while they are flammable. Environment‐friendly and bio‐based flame retardants have captured increasing attention due to their ecological necessity. In this paper, 3 bio‐based flame retardants were synthesized from abundant and more importantly renewable vanillin, and their chemical structures were determined by ¹H NMR and ¹³C NMR. They were used together with APP (an environment‐friendly commercial flame retardant) to improve the fire resistance of bisphenol A epoxy resin. With the addition APP content of 15 phr, the modified bisphenol A epoxy resin could reach UL‐94V0 rating during vertical burning test and limit oxygen index values of above 35%, but reducing APP content to 10 phr, the flame retardancy became very poor. With the total addition content of 10 phr, the epoxy resins modified by 7 to 9 phr APP and 1 to 3 phr bio‐based flame retardants with epoxy groups or more benzene rings showed excellent flame retardancy with UL‐94V0 rating and limit oxygen index values of around 29%. The T_gs of the epoxy resins could be remained or even increased after introducing bio‐based flame retardants, as the control; those of APP alone‐modified epoxy resins compromised a lot. The green synergistic flame‐retardant systems have a great potential to be used in high‐performance materials.     

Synthesis of a novel phosphorus‐containing curing agent and its effects on the flame retardancy,thermal degradation and moisture resistance of epoxy resins

A novel phosphorus‐containing compound diphenyl‐(1, 2‐dicarboxylethyl)‐phosphine oxide defined as DPDCEPO was synthesized and used as a flame retardant curing agent for epoxy resins (EP). The chemical structure of the prepared DPDCEPO was well characterized by Fourier transform infrared spectroscopy, and ¹H, ¹³C and ³¹P nuclear magnetic resonance. The DPDCEPO was mixed with curing agent of phthalic anhydride (PA) with various weight ratios into epoxy resins to prepare flame retardant EP thermosets. The flame retardant properties, combustion behavior and thermal analysis of the EP thermosets were respectively investigated by limiting oxygen index (LOI), vertical burning tests (UL‐94), cone calorimeter measurement, dynamic mechanical thermal analysis and thermogravimetric analysis (TGA) tests. The surface morphologies and chemical compositions of the char residues for EP thermosets were respectively investigated by scanning electron microscopy and X‐ray photoelectron spectroscopy (XPS). The water resistant properties of the cured EP were evaluated by putting the samples into distilled water at 70°C for 168 hr. The results revealed that the EP/20 wt% DPDCEPO/80 wt% PA thermosets successfully passed UL‐94 V‐0 flammability rating and the LOI value was as high as 33.2%. The cone test results revealed that the incorporation of DPDCEPO effectively reduced the combustion parameters of the epoxy resin thermosets, such as heat release rate and total heat release. The dynamic mechanical thermal analysis test demonstrated that the glass transition temperature (Tg) decreased with the increase of DPDCEPO content. The TGA results indicated that the incorporation of DPDCEPO promoted the decomposition of epoxy resin matrix ahead of time and led to a higher char yield and thermal stability at high temperatures. The surface morphological structures and analysis of the XPS of the char residues of EP thermosets revealed that the introduction of DPDCEPO benefited the formation of a sufficient, compact and homogeneous char layer with rich flame retardant elements on the epoxy resin material surface during combustion. The mechanical properties and water resistance of the cured epoxy resins were also measured. After water resistance tests, the EP/20 wt% DPDCEPO/80 wt% PA thermosets retained excellent flame retardancy, and the moisture adsorption of the EP thermosets decreased with the increase of DPDCEPO content in EP thermosets because of the existence of the P–C bonds and the rigid aromatic hydrophobic structure in DPDCEPO. Copyright © 2015 John Wiley & Sons, Ltd.     

Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend

In the present study, TEIA bioresin was blended with the diglycidyl ether bisphenol A (DGEBA) epoxy resin in different ratios (i.e. 10, 20, 30, 40 mass%), cured with methylhexahydrophthalic anhydride curing agent in the presence of 2-methylimidazole catalyst. The optimized composition of DGEBA and TEIA bioresin blends system was employed as an adhesive strength. The adhesive strength of the TEIA-modified DGEBA epoxy resin blend system was increased from 4.14 to 6.31 MPa on an aluminium substrate compared to the DGEBA epoxy resin. The curing kinetics of non-isothermal, DGEBA epoxy resin and its bio-based blend systems were investigated employing differential scanning calorimetry. An increase in the peak temperature and reduction in a heat of curing as well as activation energy in DGEBA epoxy resin were observed with the addition of TEIA bioresin content. The activation energy (E_a) of the DGEBA resin and their bio-based blend system were obtained from Kissinger and Flynn–Wall–Ozawa methods.

     

Synthesis and characterization of P/Si flame retardant and its application in epoxy systems

In this report, a novel phosphorus/silicon‐containing reactive flame retardant, hexa(3‐triglycidyloxysilylpropyl)triphosphazene (HGPP), was synthesized and characterized by Fourier transform infrared spectrometry and nuclear magnetic resonance spectra (¹H, ³¹P, and ²⁹Si), respectively. To prepare cured epoxy, HGPP had been co‐cured with diglycidyl ether of bisphenol‐A (DGEBA) via 4,4‐diaminodiphenylsulfone as a curing agent. The mechanical, thermal, and flame retardant properties of the cured epoxy were evaluated by dynamic mechanical analysis, thermogravimetric analysis, and limiting oxygen index (LOI). According to these results, it could be found that incorporation of HGPP in the cured epoxy system showed good thermal stability, high LOI values, and high char yield at high temperature. As moderate loading of HGPP in the epoxy system, its storage modulus and glass transition temperature were higher than those of neat DGEBA. Copyright © 2011 John Wiley & Sons, Ltd.     

Synthesis and properties of a phosphorus-containing flame retardant epoxy resin based on bis-phenoxy (3-hydroxy) phenyl phosphine oxide

A reactive phosphorus-containing compound, bis-phenoxy (3-hydroxy) phenyl phosphine oxide (BPHPPO) was first successfully synthesized to produce the phosphorus-containing flame retardant epoxy resin (BPHPPO-EP). The chemical structures were characterized from FTIR, MS, NMR spectra and elemental analyses. Thermal degradation behaviors and flame retardant properties of the cured epoxy resins were investigated from the thermogravimetric analysis (TGA) and the limiting oxygen index (LOI) test using 4,4′-diaminodiphenylsulfone (DDS) as curing agent. The high char yields and the high limiting oxygen index values were found to certify the great flame retardancy of this phosphorus-containing epoxy resin.     

Preparation, characterization and curing properties of epoxy-terminated poly(alkyl-phenylene oxide)s

A series of dihydroxyl telechelic poly(alkyl-phenylene oxide)s (1) have been synthesized by oxidative polymerization of alkylphenols with various aromatic diols using manganese or copper amine catalysts. The novel telechelic derivatives (1) were epoxidized with epichlorohydrin yielding a series of new epoxidized poly(alkyl-phenylene oxide)s (EPPO, 2) and the structures, properties were studied by nuclear magnetic resonance spectroscopy (NMR), differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA) and gel permeation chromatography (GPC). The 1:1 blends of diglycidyl ether of bisphenol-A (DGEBA) with EPPO resins were cured with three curing agents and the effects of chemical structure change on thermal property of the curing matrixes were discussed. Incorporation of EPPOs to DGEBA epoxy system resulted in a significant increase in its glass transition temperature (T_g), thermal stability and flame resistance. The T_g values and char yields arising from a DDM-cured epoxy resin are usually higher than those of dicyandiamide (DICY) or 2-methylimidazole (2-MI) analogues and the reactivity of epoxy blends with three curing agents presents an increase in the order of 2-MI, DDM and DICY. In general, the tetramethylbisphenol-A (TMBPA)-derived polymer exhibits the lowest T_g, char yield and dielectric constant among PPO derivatives whereas the biphenol polymers usually results in higher T_g and char yield due to its rigid rod structure.     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Synthesis and effect of hyperbranched (3-hydroxyphenyl) phosphate as a curing agent on the thermal and combustion behaviours of novolac epoxy resin

A novel type of hyperbranched (3-hydroxyphenyl) phosphate (HHPP) with high functionality as a curing agent of epoxy resins was synthesized and characterized by FTIR, ¹H NMR and vapor phase osmometry (VPO). The cured epoxy resin with HHPP possessed improved glass transition temperature. The thermostability and flame retardancy of O-cresol novolac epoxy resin cured with different contents of HHPP were investigated by thermogravimetric analysis (TGA), limiting oxygen index (LOI) and cone calorimetry. The obtained results show that the samples containing a higher percentage of HHPP exhibit relatively lower thermostability at lower temperature while higher thermostability at elevated temperature and more char was formed compared with those containing a lower percentage of HHPP. The LOI value increased from 22.0 to 30.0 when HHPP, instead of 1,3-dihydroxybenzene, was used as a curing agent. The 25 wt% addition of HHPP in the curing agent complex effectively decreased the heat release rate and improved the char yield to the content nearly similar as those of the epoxy resin cured with pure HHPP.     

Preparation of Poly(phosphoric acid piperazine) and Its Application as an Effective Flame Retardant for Epoxy Resin

A phosphorus-nitrogen containing flame retardant additive of poly(phosphoric acid piperazine),defined as PPAP,was synthesized by the salt-forming reaction between anhydrous piperazine and phosphoric acid,and the dehydration polymerization under heating in nitrogen atmosphere.Its chemical structure was well characterized by Fourier transform infrared (FTIR) spectroscopy,13C and 31p solid-state nuclear magnetic resonance measurements.The synthesized PPAP and curing agent m-phenylenediamine were blended into epoxy resin (EP) to prepare flame retardant EP thermosets.The effects of PPAP on the fire retardancy and thermal degradation behavior of cured EP/PPAP composites were investigated by limiting oxygen index (LOI),vertical burning (UL-94),thermogravimetric analysis/infrared spectrometry (TG-IR) and cone calorimeter tests.The morphologies and chemical compositions of char residues for cured epoxy resin were investigated by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS),respectively.The results demonstrated that the flame retardant EP thermosets successfully passed UL-94 V-0 flammability rating and the LOI value was as high as 30.8％ when incorporating 5wt％ PPAP into the EP thermosets.The TGA results indicated that the synthesized PPAP flame retardant additive possessed high thermal stability and excellent charring capability.Meanwhile,the incorporation of PPAP stimulated the epoxy resin matrix to decompose and charring ahead of time due to its catalytic decomposition effect,which led to a higher char yield at high temperature.The morphological structures and the analysis results of XPS for char residues of EP thermosets revealed that the introduction of PPAP benefited the formation of a sufficient,more compact and homogeneous char layer containing phosphorus-nitrogen flame retardant elements on the material surface during combustion.The formed char layer with high quality effectively prevented the heat transmission and diffusion,limited the production of combustible gases,and inhibited the emission of smoke,leading to the reduction of heat and smoke release.     

The non-halogen flame retardant epoxy resin based on a novel compound with phosphaphenanthrene and cyclotriphosphazene double functional groups

A novel flame retardant additive hexa-(phosphaphenanthrene -hydroxyl-methyl-phenoxyl)-cyclotriphosphazene (HAP-DOPO) with phosphazene and phosphaphenanthrene double functional groups has been synthesized from hexa-chloro-cyclotriphosphazene, 4-hydroxy-benzaldehyde and 9,10-dihydro-9-oxa-10- phosphaphenanthrene 10-oxide(DOPO). The structure of HAP-DOPO was characterized by Fourier transformed infrared (FT-IR) spectroscopy and ¹H nuclear magnetic resonance (¹H NMR) and ³¹P nuclear magnetic resonance (³¹P NMR). The additive HAP-DOPO was blended into diglycidyl ether of bisphenol-A (DGEBA) to prepare flame retardant epoxy resins. The flame retardant properties and thermal properties of the epoxy resins cured by 4, 4′-Diamino-diphenyl sulfone (DDS) were investigated from the differential scanning calorimeter (DSC), the thermogravimetric analysis (TGA), UL94 test, the limiting oxygen index (LOI) test and Cone calorimeter. Compared to traditional DOPO-DGEBA and ODOPB-DGEBA thermosets, the HAP-DOPO/DGEBA thermosets have higher T_gs at the same UL94 V-0 flammability rating for their higher crosslinking density and have higher char yield and lower pk-HRR at same 1.2 wt.% phosphorus content which confirm that HAP-DOPO has higher flame retardant efficiency on thermosets. The scanning electron microscopy (SEM) results shows that HAP-DOPO in DGEBA/DDS system obviously accelerate formation of the sealing, stronger and phosphorus-rich char layer to improve flame retardant properties of matrix during combustion.     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Synthesis and thermal degradation behaviors of hyperbranched polyphosphate

A novel epoxy-terminated hyperbranched polyphosphate (E-HBPP) was synthesized by employing an A₂ + B₃ polycondensation and characterized by FTIR, ¹H NMR and GPC. E-HBPP was used as a reactive-type flame retardant for diglycidyl ether of bisphenol-A/m-phenylene diamine (DGEBA/mPDA) system. A series of flame retardant resins were prepared and their flame retardancy was monitored by the limiting oxygen index (LOI). The results showed that the LOI value of the cured samples and the degree of expansion of the formed char after burning increased along with the E-HBPP content. Their thermal degradation behaviors were investigated by thermogravimetric analysis and in situ FTIR and showed that the phosphate group of E-HBPP first degraded to form poly(phosphoric acid)s at around 300 °C, which had a major contribution to form the compact char to protect the sample from further degradation. The dynamic mechanical thermal properties were studied by dynamic mechanical thermal analysis (DMTA) and the results showed a good miscibility between E-HBPP and DGEBA. The mechanical properties of the cured films were also investigated. Less than 20% E-HBPP addition improved both the tensile strength and elongation at break.     

A Well-Defined Cyclotriphosphazene-Based Epoxy Monomer and Its Application as A Novel Epoxy Resin: Synthesis,Curing Behaviors,and Flame Retardancy

Abstract

A novel cyclotriphosphazene-based epoxy monomer, hexa-[4-(glycidyloxycarbonyl) phenoxy]cyclotriphosphazene (HGCP), was synthesized via a four-step synthetic route, and fully characterized by ¹H, ¹³C, and ³¹P NMR spectroscopy, high-resolution mass spectrometry, and elemental analysis. Thermosetting systems based on HGCP with three curing agents, for example, 4,4′-diaminodiphenylsulfone (DDS), 4,4′-diaminodiphenylmethane (DDM), and dicyandiamide (DICY), were used for making a comparison of their thermal curing behaviors. The curing behaviors were measured by differential scanning calorimetry. Moreover, flame retardancy of HGCP thermosetting systems was estimated by Limiting Oxygen Index (LOI) and Vertical Burning Test (UL-94). The resulting HGCP thermosetting systems exhibited better flame retardancy than the common epoxy resins diglycidyl ether of bisphenol A (DGEBA) and the regular brominated bisphenol A epoxy resin (TBBA) cured by DDS, respectively. When HGCP was cured by DDS, its thermosetting system gave the most char residues, met the UL-94 V-0 classification, and had a limiting oxygen index value greater than 35.