红外光谱法测定酚醛树脂的羟甲基指数

介绍用红外光谱法测定酚醛树脂羟甲基指数的原理和实验条件。红外光谱积分强度法和基线法测定酚醛树脂羟甲基指数的不确定度分别为6.2%和3.2%。以红外光谱积分强度法为例，测定了ZnO催化型酚醛树脂在45℃和25℃时，其羟甲基指数随时间的变化规律。试验结果表明，该方法可以于酚醛树脂的质量控制。     

用红外光谱法对热固性酚醛树脂固化过程的研究

用红外光谱法研究了四种热固性酚醛树脂在固化过程中的化学变化。结果表明热固性酚醛树脂的固化过程,首先是羟甲基发生缩合反应,缩合反应形成醚键是主要的。热固性酚醛树脂在进一步固化时(150—200°)出现了羰基,它的出现不是亚甲基氧化所致,而是部分醚键断裂形成了醛羰基。对热固性酚醛树脂的固化过程的机理进行了讨论。     

硼酸与甲阶酚醛树脂的配位反应及配合物的结构

本文通过对溶液pH值的测定和外光谱分析，研究了硼酸与甲阶酚醛树脂的配位反应。结果表明：在室温下硼酸能与甲阶酚醛树脂中的羟基发生配位反应，并产生H^ 使溶液的pH值降低；溶液的酸性强弱与甲阶酚醛树脂中的羟甲基含量和硼酸的用量有关；硼酸以硼酸根离子的形式与树脂中的酚羟基和邻位羟甲基发生配位反应，形成了一个含有两个氧原子和一个硼原子的六元环，使甲阶酚醛树脂发生交联。     

硼酸根与甲阶酚醛树脂中酚羟基和邻位羟甲基的螯合反应

通过溶液pH值的测定和红外光谱分析，研究硼砂与甲阶酚醛树脂水溶液的反应表明：在水溶液中硼砂能与甲阶酚醛树脂很快地发生反应；硼砂水解产生的B／（OH)4^-，以定量的方式与树脂中酚羟基和邻位羟甲基以共价配键相结合，形成具有四面体结构的螯合物，并放出H^ 离子。     

硼酚醛树脂热分解动力学及其耐热性

用热重法研究了固化硼酚醛树脂的热分解动力学。并用红外光谱法跟踪硼酚醛树脂的固化过程；结果表明，热分解过程为一级反应，由于硼酯键代替了醚键和次甲基键使得热氧化裂解速率常数随硼含量的增加而减小。     

3种三羟甲基丙烷己二酸、庚酸混合酯的对比研究

以硫酸为催化剂,采用三羟甲基丙烷、庚酸和己二酸一步法和两步法合成了三羟甲基丙烷己二酸、庚酸混合酯;采用三羟甲基丙烷三庚酸酯与己二酸酯交换法合成了三羟甲基丙烷己二酸、庚酸混合酯。通过基团和质量守恒,计算三羟甲基丙烷和己二酸的反应比例;根据¹³CNMR结果,发现与酯化/酯交换反应的原料比例具有明显的一致性,通过分析不同方法形成的酯键情况,发现3种方法合成的混合酯中己二酸含量相当。      

均四甲苯改性沥青的化学结构特征

平均结构参数分析法是分析沥青类复杂分子体系化学结构的一种有效方法。通过分析比较热处理改性沥青和均四甲苯改性沥青在化学结构上的不同 ,发现均四甲苯改性沥青中有机分子的分子量较大 ,但氢含量较高 ,芳香度较小 ,主要表现为脂肪环结构的增多和甲基取代基的大量引入。氢转移、质子化、亚甲基桥的形成可能是导致这些结构特征的主要原因。     

自交联型丙烯酸酯共聚物乳液的研究

以羟甲基丙烯酰胺、丙烯酸作为活性单体，采用种子乳液聚合法制得四元体系自交联型丙烯酸酯共聚物乳液。用透射电镜观察了乳胶粒的微观形态，并对共聚物乳液的流变性，稳定性等进行了测试，考察了羟甲基丙烯酰胺和丙烯酸的含量、聚合方式对共聚物乳液性能的影响。     

均甲甲苯改性沥青的化学结构特征

平均结构参数分析法是沥青类复杂分子体系化学结构的一种有效方法。通过分析比较热处理改性沥青和均甲甲苯改性沥青在化学结构上的不同,发现均甲甲苯改性沥青中有机分子的分子量较大,但氢含量较高,芳香度较小,主要表现为脂肪环结构的增多和甲基取代基的大量引入。氢转移、质子化、亚甲基桥的形成可能是导致这些结构特征的主要原因。     

对甲基酚醛树脂热裂解产物的固体^13C NMR

对甲基酚醛树脂热裂解产物的固体~（１３）ＣＮＭＲ谢德民，张建国，王存国，王荣顺（东北师范大学化学系，长春，１３００２４）关键词对甲基酚醛树脂，裂解，固体~（１３）Ｃ，ＮＭＲ酚醛树脂经热裂解制备的聚并苯导电材料在空气中稳定，由裂解温度可控制碳化程度，其本...     

Effect of alkylresorcinols on curing behaviour of phenol-formaldehyde resol resin

Thermal behaviour of cure-accelerated phenol-formaldehyde (PF) resins was studied using the addition of commercial mixture of water soluble oil shale alkylresorcinols (AR) to PF resin, 5-MR being as model compound. The acceleration effect of AR is based on the promotion of condensation of resin methylol groups and subsequent reaction of released formaldehyde with AR. Commercial PF resins SFŽ-3013VL and SFŽ-3014 from the Estonian factory VKG Resins have been used. The chemical structure of resins was characterised by ¹³C NMR spectroscopy. TG-DTA analysis was carried out using labsys^TM instrument Setaram. By TG-DTA measurements, the shift of exothermic and endothermic peaks and the changes of mass loss rate in the ranges of 1.5–10 g AR/100 g PF resin were studied. The effect of AR on the curing behaviour of PF resins was also followed by gel time. Testing of the plywood when using PF resin with 5 mass% of AR shows that the press time could be reduced by about 15%.     

A 13C NMR study of the methylol derivatives of 2,4′‐ and 4,4′‐dihydroxydiphenylmethanes found in resol phenol–formaldehyde resins

A total of 13 of the 16 possible methylol derivatives of 2,4′‐ and 4,4′‐dihydroxydiphenylmethane have been synthesized, isolated, and identified. These compounds are found as intermediates in the cure process of resol phenol–formaldehyde (PF) resins. Analysis of the ¹³C NMR spectra (in acetone‐d₆) of these compounds provided a way to evaluate the seven methylolphenol ring types (methylol derivatives of 2‐hydroxyphenyl and 4‐hydroxyphenyl rings) found in typical resol PF resins using the ipso carbon region from 150 to 160 ppm. A simple diagnostic test was developed using the chemical shift values of the methylol methylene carbon atoms to identify the presence of intermediates containing either a 2‐hydroxyphenyl or a 4‐hydroxyphenyl ring. Using these data it is now possible to analyze the major components in extracted prepreg PF resins. Copyright © 2002 John Wiley & Sons, Ltd.     

Thermal study of phenol–formaldehyde resin modified with cashew nut shell liquid

In this study, an experimental phenol–formaldehyde resin with 20% phenol replacement by cashew nut shell liquid (CNSL) was studied and compared with a conventional phenol–formaldehyde resin synthesized totally from petrochemical raw materials. The resins were characterized with standard lab analysis for their physicochemical specifications, while their thermal properties were studied with thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). For comparison reasons pure CNSL and wood were also included in the TGA study. A DSC study conducted both for the neat resins and the system wood–resin as to examine the effect of wood on the curing performance of the resins in the real time conditions of their usage at the wood-based panels industry.The adhesion strength of these resins was investigated by their application in plywood production. The plywood panels were tested for their shear strength and wood failure performance while their free formaldehyde emissions were determined with the desiccator method. It was proved that although the neat CNSL modified PF resin (PCF) cures at longer time and higher temperature than a conventional PF resin, wood affects it more significantly, resulting in the evening of their curing performance. This is a novel finding that manifests the possibility of replacing a convention PF resin by a CNSL modified one in the plywood production, without changing any of their production conditions and with improvement to their overall properties.     

Phenol‐urea‐formaldehyde cocondensed resol resins: Their synthesis,curing kinetics,and network properties

Several phenol‐urea‐formaldehyde (PUF) cocondensed resol resins were synthesized by different procedures. The curing kinetics and network properties of these PUF resins were examined by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). A kinetic study indicated that the activation energy values of PUF resins are generally higher than those of phenol‐formaldehyde (PF) resins during curing processes, but the curing rates of PUF resins are faster than those of PF resins. The pH values of PUF systems have a significant influence on the rate constants, although they affect the activation energy very slightly. Moreover, the dependence of activation energy on the conversion showed that there are more individual reactions with different activation energies occurring during the curing processes in PUF resins than in PF resins. The decomposition of methylene ether bridges to form methylene bridges probably occurs at high temperature in PUF resins. DMTA data indicated that the network rigidity of PUF resins is slightly lower than that of PF resin. The gel point and T_{tan δ2} transition measured by DMTA were consistent with the kinetic results obtained from the DSC data, but they were also related to the physical and mechanical properties of the network, especially with regard to the T_{tan δ2} transition. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1929–1938, 2003     

酚醛树脂热（裂）解产物的X射线衍射研究

用X射线衍射方法研究了酚醛树脂及对甲基酚醛树脂热解产物本征态及碘掺杂结构,结果表明,不加ZnCl_2的酚醛树酯热解产物具有多晶结构,且随T_p升高层间距如值逐渐减小,加入一定比例ZnCl_2起着增大比表面积和孔径的作用,掺杂碘后如值比本征态有所增加,对甲基酚醛树脂热解产物虽具有无定形结构,但如值基本上不随T_p变化。     

Curing Kinetics Of Tannin-Phenol-Formal- dehyde Adhesives As Determined By DSC

Differential scanning calorimetry (DSC) was used to compare the thermal curing of two adhesives suitable for using in the manufacture of exterior-grade plywood boards: a commercial phenol-formaldehyde (PF) resin, and a tannin-phenol-formaldehyde (TPF) resin developed in our laboratory. The experimental curves were well simulated by means of the Model Free Kinetics isoconversional method incorporated in the Mettler-Toledo STAR^e software package. The corresponding kinetic calculations predict that the TPF resin cures faster than the PF resin. This finding implies the possibility that the TPF resin may allow the achievement of higher productivity by permitting the use of shorter press times than with conventional PF resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

Thermal degradation of lignin–phenol–formaldehyde and phenol–formaldehyde resol resins

Resol resins are used in many industrial applications as adhesives and coatings, but few studies have examined their thermal degradation. In this work, the thermal stability and thermal degradation kinetics of phenol–formaldehyde (PF) and lignin–phenol–formaldehyde (LPF) resol resins were studied using thermogravimetric analysis (TG) in air and nitrogen atmospheres in order to understand the steps of degradation and to improve their stabilities in industrial applications. The thermal stability of samples was estimated by measuring the degradation temperature (T _d), which was calculated according to the maximum reaction rate criterion. In addition, the ash content was determined at 800 °C in order to compare the thermal stability of the resol resin samples. The results indicate that 30 wt% ammonium lignin sulfonate (lignin derivative) as filler in the formulation of LPF resin improves the thermal stability in comparison with PF commercial resin. The activation energies of degradation of two resol resins show a difference in dependence on mass loss, which allows these resins to be distinguished. In addition, the structural changes of both resins during thermal degradation were studied by Fourier transform infrared spectroscopy (FTIR), with the results indicating that PF resin collapses at 300 °C whereas the LPF resin collapses at 500 °C.     

Thermal behaviour of hydroxymethyl compounds as models for adhesive resins

Urea–formaldehyde (UF) and phenol–formaldehyde (PF) resins are the most widely used wood adhesives. The first stage in resin manufacturing is the formation of methylol derivatives which polycondensation leads to building the tridimensional network. Understanding the behaviour of methylol compounds in curing provides useful information for developing appropriate resin structures. Thermal behaviour of N,N′-dihydroxymethylurea, 2- and 4-hydroxymethylphenols, urea and phenol as model compounds for UF, PF and phenol–urea–formaldehyde (PUF) resins was followed by TG-DTA method. The measurements were carried out by the labsys instrument Setaram at 30–450 °C in nitrogen flow. The characteristic signals for model compounds and for some reaction mixtures were measured by high resolution ¹³C NMR spectroscopy.     

Preparation and Characterization of Polyborosiloxanesand Their Blends with Phenolic Resin as ShapeableCeramic Precursors简

Two polyborosiloxanes(PBSis) with char yield up to 74.13% at 800 °C were synthesized by the direct polycondensation of boric acid with phenyltrimethoxysilane in diglyme. The PBSis were characterized by gel permeation chromatography, IR spectroscopy as well as1H-,29Si- and11B-NMR. PBSi modified phenol-formaldehyde resins(PBSi/PFs) were prepared at different PBSi/PF mass ratios and were cured at 150 °C. The PBSi/PFs were characterized by IR spectroscopy, scanning electron microscopy, thermogravimetric analysis and tensile test. The results revealed that the cured PBSi/PFs had sea-island morphology and higher char yield than the common PF. PBSi/PF blend with PBSi/PF mass ratio of 0.4:1 had char yield up to 70.83% at 800 °C. The PBSi/PFs had tensile strength similar to PF. The ceramization of PBSi/PFs was also studied. The silicon boron oxycarbide(SiBOC) ceramics formed were characterized by IR spectroscopy and elemental analysis. This method provided a valuable way to prepare easily shapeable polymer blends as ceramic precursors.     

Phenol-Crotonaldehyde Resins. III. Curing Behavior with Hexamethylenetetramine

Solid thermoplastic resins were prepared by acid-catalyzed condensation of phenol and crotonaldehyde (both crude and distilled). The thermal and curing properties were compared with the conventional phenol-formaldehyde (PF) novolak resins. Phenol-crotonaldehyde (PC) resins were found to be thermoplastic even after curing with the crosslinking agent hexamethylenetetramine up to 160°C. This curing behavior was observed irrespective of the purity of the crotonaldehyde or the phenol-to-crotonaldehyde mole ratio in the resin. Postcuring of these resins at elevated temperatures yielded insoluble and infusible thermoset products. This unique thermal characteristic could lead to interesting processing possibilities for the resins. The technical feasibility of thermoplastic processing of the PC resins followed by postcure heat treatment for transforming the molded part into a thermoset has been demonstrated.