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1.
本文用FTIR内标法跟踪观察了醇酸树脂的固化过程,选取1600cm~(-1)处的苯环振动峰作内标峰。结果表明,随着固化的进行,不饱和键递减,涂膜的羧基、羟基等含氧基团递增。固化过程的快慢同涂膜厚度有关,它是受氧扩散作用控制的。  相似文献   

2.
Unsaturated poly (ester–amide)s resins (UPEAs) were prepared by the reaction between an epoxy resin, namely diglycidyl ether of bisphenol-A (DGEBA) and unsaturated aliphatic bisamic acids (B14) using a base catalyst. These UPEAs were then diluted by styrene and blended with commercial unsaturated polyester resin (o-phthalic anhydride based) to produce a homogeneous resin. The curing of these Styrenated UPEAs–UPR blends was carried out using Benzoyl peroxide (BPO) as a catalyst and N,N′-Dimethyl aniline (DMA) as a promoter. The glass fiber reinforced composites (i.e. laminates) of these Styrenated UPEAs–UPR (o-phthalic anhydride based) blends were fabricated. The mechanical and chemical resistance properties of the glass fiber composites have also been evaluated. The unreinforced cured samples of the Styrenated UPEAs–UPR (o-phthalic anhydride based) blends were also analyzed by thermogravimetry (TGA).  相似文献   

3.
A novel crystalline epoxy resin—4-(p-glycidyloxyphenoxy)-4′-glycidyloxybiphenyl (DGEBP) was synthesized via a four-step procedure on base 4,4′-biphenol as the starting material. The obtained epoxy exhibited good crystallinity with a melting point of 165.7°C. A monoclinic crystal phase was elucidated by a single crystal X-ray diffraction measurement. The curing behavior of DGEBP with a commercial phenol-4,4′-dimethylbiphenylene novolac resin (trade name GPH65) as the hardener was investigated. For comparison, another two epoxy systems based on the same hardener and two commercially-available biphenyl-containing epoxy resins, including a crystalline epoxy compound, 3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl diglycidyl ether (trade name: YX4000H) and an amorphous 4,4′-dimethylbiphenylene type epoxy resin (trade name NC3000H) were also prepared. It was found that the DGEBP/GPH65 formulation exhibited a superior melt flow behavior to those of YX4000H/GPH65 and NC3000/GPH65 systems. DGEBP/GPH65 epoxy formulation exhibited a minimum melt viscosity of 0.12 Pa s at 150°C. This value is obviously lower than those of YX4000H/GPH65 (0.27 Pa s) and NC3000H/GPH65 (0.59 Pa s) systems. The cured DGEBP/GPH65 thermoset exhibited good thermal stability with a glass transition temperature of 123°C and a 5% weight loss temperature of 415°C. In addition, the DGEBP/GPH65 thermoset possessed good tensile and flexural properties, low water uptake, good dielectric properties and flame retardancy.  相似文献   

4.
The curing behavior of unsaturated polyester resin was investigated. In the present study, styrene, methyl ethyl keton peroxide (MEKP) and cobalt octoate (CO) have been selected as solvent (monomer), catalyst and accelerator, respectively. The effect of the concentration of both MEKP and CO on the curing exotherm, curing time, hardness and compressive strength of the prepared copolymers was investigated.  相似文献   

5.
Microgel-epoxy resin two-phase polymers were prepared by in situ copolymerization of ethylenic monomers with unsaturated polyesters. The choice of monomers and the effect of monomer concentration on microgel particle size were discussed. Agglomeration of particles played a significant role in the early stage of polymerization. The microgel dispersion in epoxy resin was stable after the finish of polymerization. Upon curing the particles remained well dispersed.  相似文献   

6.
Thermosetting blends of an aliphatic epoxy resin and a hydroxyl‐functionalized hyperbranched polymer (HBP), aliphatic hyperbranched polyester Boltorn H40, were prepared using 4,4′‐diaminodiphenylmethane (DDM) as the curing agent. The phase behavior and morphology of the DDM‐cured epoxy/HBP blends with HBP content up to 40 wt % were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). The cured epoxy/HBP blends are immiscible and exhibit two separate glass transitions, as revealed by DMA. The SEM observation showed that there exist two phases in the cured blends, which is an epoxy‐rich phase and an HBP‐rich phase, which is responsible for the two separate glass transitions. The phase morphology was observed to be dependent on the blend composition. For the blends with HBP content up to 10 wt %, discrete HBP domains are dispersed in the continuous cured epoxy matrix, whereas the cured blend with 40 wt % HBP exhibits a combined morphology of connected globules and bicontinuous phase structure. Porous epoxy thermosets with continuous open structures on the order of 100–300 nm were formed after the HBP‐rich phase was extracted with solvent from the cured blend with 40 wt % HBP. The DSC study showed that the curing rate is not obviously affected in the epoxy/HBP blends with HBP content up to 40 wt %. The activation energy values obtained are not remarkably changed in the blends; the addition of HBP to epoxy resin thus does not change the mechanism of cure reaction of epoxy resin with DDM. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 889–899, 2006  相似文献   

7.
丁腈羟增韧环氧树脂研究——Ⅰ.端异氰酸酯基预聚物法   总被引:2,自引:1,他引:1  
丁腈羟液体聚合物和甲苯二异氰酸酯反应生成端异氰酸酯基预聚物,加入到环氧树脂中,得到性能良好的增韧树脂。用扭辫仪测定了它的动态力学性能,表明有两个损耗峰。透射电镜照片显示有两相结构,预聚物用量为30Phr时,发生明显的相倒转,从固化机理解释了这种现象。  相似文献   

8.
A small amount — less than 0.5% — carbon nanotube reinforcement may improve the mechanical properties of epoxy based composite materials significantly. The basic technical problem on one side is the dispersion of the nanotubes into the viscous matrix resin, namely, the fine powder-like — less than 100 nanometer diameter — nanotubes are prone to form aggregates. On the other side, the good connection between the nanofiber and matrix, which is determining the success of the reinforcement, requires some efficient adhesion promoting treatment. The goal of our research was to give one such treatment capable of industrial size application.A two step curing epoxy/vinylester resin process technology has been developed where the epoxy component has been cured conventionally, while the vinylester has been cured by electron treatment afterwards. The sufficient irradiation dose has been selected according to Raman spectroscopy characterization. Using the developed hybrid resin system hybrid composites containing carbon fibers and multiwalled carbon nanotubes have been prepared.The effect of the electron beam induced curing of the vinylester resin on the mechanical properties of the composites has been characterized by three point bending and interlaminar shear tests, which showed clearly the superiority of the developed resin system. The results of the mechanical tests have been supported by AFM studies of the samples, which showed that the difference in the viscoelastic properties of the matrix constituents decreased significantly by the electron beam treatment.  相似文献   

9.
BMD/UP体系非等温固化动力学研究   总被引:1,自引:0,他引:1  
不饱和聚酯是最常用的一种热固性材料,其力学性能和耐热性是较受关注的两个方面,利用双马来酰亚胺作为第二组分对不饱和聚酯进行耐热改性的工作取得了较好的效果。研究其动力学过程对于固化反应温度、时间等工艺合理优化控制,制备高性能复合材料具有重要意义。考虑到BMD/UP体系中反应的复杂性,本文采用n级动力学模型,进行了非等温动力学研究。  相似文献   

10.
田骏翔  李善君 《化学学报》2003,61(9):1471-1477
采用交叉反应研究在促进剂2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反 应机理,用傅立叶转换红外(FTIR)原位测量技术,NMR,气-质联用(GC-MS)等 手段研究了模型化合物的反应动力学,并提出了其反应机理。结果表明,在促进剂 2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反应是通过分子内机理进行的。  相似文献   

11.
可紫外光固化的聚乙烯基硅氮烷合成与表征   总被引:1,自引:0,他引:1  
采用带丙烯酸酯基团的烯丙基溴化合物(4-溴丁烯酸乙酯)和聚乙烯基硅氮烷发生取代反应,实现了丙烯酸酯基团在聚乙烯基硅氮烷主链上的链接.采用质子核磁共振谱(1H-NMR)和二维质子核磁共振谱(2D-1H-1H-NMR)对分子结构进行了表征,采用光学差热分析仪(Photo-DSC)和傅立叶转换红外光谱仪(FT-IR)测试了改性高分子的光敏性能,用热重分析仪(TGA)分析了产物在高纯氮气氛围下的陶瓷收率.结果表明,通过分子改性,交联固化时间从改性前的20min减少到1min之内,功能化的聚乙烯基硅氮烷可以在光刻蚀工艺中作为负性光刻胶使用.  相似文献   

12.
一种新BCN化合物先驱体的合成及其表征   总被引:2,自引:1,他引:2  
杨建  丘泰  沈春英 《物理化学学报》2005,21(12):1373-1377
以三聚氰胺和硼酸为原料在水溶液中反应合成了一种新的BCN化合物先驱体, 通过元素分析、XRD、FT-IR、电喷雾质谱及单晶X射线衍射对其进行了表征. 结构分析表明该化合物属单斜晶系, 化学式为C3H6N6(H3BO3)2, 是由C3H6N6分子和H3BO3分子通过氢键加合组装成的具有三维超分子结构的化合物. 将该先驱体在1900 ℃氮气气氛下热解, 对产物进行XRD和XPS表征, 结果表明得到了含碳量较低的具有乱层石墨结构的新型B3CN3化合物.  相似文献   

13.
A novel type of hyperbranched (3-hydroxyphenyl) phosphate (HHPP) with high functionality as a curing agent of epoxy resins was synthesized and characterized by FTIR, 1H NMR and vapor phase osmometry (VPO). The cured epoxy resin with HHPP possessed improved glass transition temperature. The thermostability and flame retardancy of O-cresol novolac epoxy resin cured with different contents of HHPP were investigated by thermogravimetric analysis (TGA), limiting oxygen index (LOI) and cone calorimetry. The obtained results show that the samples containing a higher percentage of HHPP exhibit relatively lower thermostability at lower temperature while higher thermostability at elevated temperature and more char was formed compared with those containing a lower percentage of HHPP. The LOI value increased from 22.0 to 30.0 when HHPP, instead of 1,3-dihydroxybenzene, was used as a curing agent. The 25 wt% addition of HHPP in the curing agent complex effectively decreased the heat release rate and improved the char yield to the content nearly similar as those of the epoxy resin cured with pure HHPP.  相似文献   

14.
The influence of pressure on the polycondensation reaction between novolac resin (N) present in commercially available moulding compounds and hexamethylenetetramine (HMTA) was studied up to 80 bars under air and in an inert atmosphere. For a low HMTA content (N/HMTA=98/2 mass ratio) high pressure enables the detection of two successive curing reactions. With increasing HMTA content the peak due to the first curing reaction becomes less pronounced at high pressure, while the enthalpy of the second increases. In an inert atmosphere both curing reactions are well observable even at ambient pressure and for lower HMTA content take place at lower temperatures, as expected. For the sample with N/HMTA=98/2 the curing reaction was followed using TG-MS.  相似文献   

15.
A novel thermally stable unsaturated poly(ester-imide) (UPEI-50) was prepared by thermal polycondensation of a diimidodicarboxylic acid monomer, 1,4-bis[2′-trifluoromethyl-4′-(4″-carboxylic acid)trimellitimido phenoxy]benzene (BTTB), maleic anhydride and 1,2-propylene glycol. The poly(ester-imide) resin obtained was found to be easily dissolved in glycidyl methacrylate (GMA) to give a homogeneous resin composition with low viscosity, which was then thermally cured into thermosetting poly(ester-imide)/glycidyl polymethacrylate polymer composite (UPEI-50/GMA). Effects of curing processing parameters such as the curing temperature and curing time, the reactive monomer concentration and the initiator amount etc. on curing reaction were systematically investigated. Experimental results indicated that the thermally cured UPEI-50/GMA polymer composite exhibited outstanding thermal stability, mechanical and electrical insulating properties.  相似文献   

16.
Unsaturated bisamic acids were prepared by reaction between maleic anhydride and different aromatic diamines. Unsaturated poly(ester-amide) resin (UPEAs) was prepared by reaction of diglycidylether of bisphenol-A (DGEBA) with unsaturated bisamic acids. Acrylation of Unsaturated poly(ester-amide)s (UPEAs) was carried out to afford acrylated UPEAs resin (i.e., AUPEAs). Interacting blends of Acrylated unsaturated poly(ester-amide)s (AUPEAs) with vinyl ester epoxy (VE) resin were prepared. APEAs and AUPEAs were characterized by elemental analysis, molecular weight determined by vapor pressure osmometer and by IR spectral study and by thermogravimetry. The curing of interacting blends was monitored on differential scanning calorimeter (DSC). Based on DSC data in situ glass reinforced composites of the resultant blends have been prepared and characterized for mechanical, electrical and chemical properties. Unreinforced blends were characterized thermo-gravimetrically (TGA).  相似文献   

17.
The kinetics of the curing process of epoxy resin (ED-22) in the presence of the anhydride hardeners (iso-methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and dodecylsuccinic anhydride) and accelerators (2-methyl imidazole and n-butyltriphenylphosphonium bromide) has been investigated by DSC method in the dynamic mode. Processing of experimental DSC thermograms recorded at different heating rates was carried out within the frameworks of isoconvertional analysis in two versions, namely "model-free" method of Friedman and the Ozawa—Flynn—Wall method. The possibility to describe the kinetics of epoxy compositions curing in the frameworks of one-step autocatalytic reaction model has been demonstrated. Obtained kinetic parameters were used to predict the curing kinetics under isothermal conditions and for comparative analysis of the compositions.  相似文献   

18.
取代脲促进环氧树脂/双氰胺固化体系反应机理   总被引:5,自引:0,他引:5  
双氰胺作为环氧树脂的固化剂,由于固化产物具有优良的机械和电性能,广泛应用在汽车、航天及电子等领域中.但由于其固化温度高达180C以上,使应用范围受到很大限制.专利文献曾报道晚衍生物作为环氧树脂/双氰胺固化体系的促进剂,可以使体系的固化温度降低到130~140oC,并且在室温下仍保持一定的潜伏性[‘,’].在以往的研究中,认为取代脉的促进作用在于其与环氧发生反应生成环状化合物2一心竣烷酮和仲胺,仲胺与环氧基进一步反应生成的叔胺可以催化环氧发生阴离子聚合[’~’].实验表明,环氧树脂/双氰胺/取代脉体系的固化温…  相似文献   

19.
The crystal structures of two solid phases of the title compound, C4H5N2+·C6HCl2O4·H2O, have been determined at 225 and 120 K. In the high‐temperature phase, stable above 198 K, the transition temperature of which has been determined by 35Cl nuclear quadrupole resonance and differential thermal analysis measurements, the three components are held together by O—H...O, N...H...O, C—H...O and C—H...Cl hydrogen bonds, forming a centrosymmetric 2+2+2 aggregate. In the N...H...O hydrogen bond formed between the pyrimidin‐1‐ium cation and the water molecule, the H atom is disordered over two positions, resulting in two states, viz. pyrimidin‐1‐ium–water and pyrimidine–oxonium. In the low‐temperature phase, the title compound crystallizes in the same monoclinic space group and has a similar molecular packing, but the 2+2+2 aggregate loses the centrosymmetry, resulting in a doubling of the unit cell and two crystallographically independent molecules for each component in the asymmetric unit. The H atom in one N...H...O hydrogen bond between the pyrimidin‐1‐ium cation and the water molecule is disordered, while the H atom in the other hydrogen bond is found to be ordered at the N‐atom site with a long N—H distance [1.10 (3) Å].  相似文献   

20.
端环氧基聚硅氧烷对环氧模塑料的改性   总被引:9,自引:0,他引:9  
陈丽  黄英 《应用化学》1995,12(5):67-72
引入端环氧基聚硅氧烷对环氧封装材料的低应力化作用,将聚硅氧烷直接与环氧树脂及固化剂共混,由于聚硅氧烷不能完全键事到脂基体上,模塑料出现表面渗油,将端环氧基聚二甲基硅氧烷首先与不环氧树脂首先与环氧树脂的固化剂-酚醛树脂预反应形成嵌段共聚物,然后再与环氧树脂混合,解决了渗油,使聚硅氧烷在环氧树脂中的分布更均匀,相区尺寸更小,在环氧树脂固化物中,聚硅氧烷微区尺寸依赖于预反应条件、聚硅氧烷嵌段链长和聚硅氧  相似文献   

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