The a-C:H/p-Si solar cell deposited by pulsed laser deposition

Hydrogenated amorphous carbon films (a-C:H) were deposited on p-type silicon as well as silica substrates by pulsed laser deposition technique using a mixture of graphite and camphor powders. The Fourier transform infrared spectroscopy measurement revealed the presence of hydrogen in the a-C:H films. The optical properties and structure of the a-C:H film were investigated by UV-visible and Raman scattering spectroscopy. The formation of a heterojunction between the a-C:H film and silicon substrate was confirmed by the current-voltage (I-V) measurement. Furthermore, the structure of a-C:H/p-Si showed photovoltaic characteristics with an open-circuit voltage (V_oc) of 0.4 V and short-circuit current density (J_sc) of about 15 mA/cm² under AM1.5 (100 mW/cm²) illumination. From the calculation, the energy conversion efficiency and fill factor were found to be 2.1% and 0.38, respectively. The carbon layer contributed to the energy conversion efficiency, which was proved by the measurement of quantum efficiency.     

Hydrogenated amorphous silicon with substrate-dependent structure

Hydrogenated amorphous silicon (a-Si:H) thin films grown at 250°C on (1 0 0) crystalline substrate using plasma-enhanced chemical vapor deposition (PECVD) with SiH₄/H₂ gas flow ratio equal to 5/1 (sccm) are investigated by transmission electron microscopy. It is found that the thin film is totally amorphous when grown on a glass substrate. But when the substrate is changed to crystalline silicon, some crystalline grains are found embedded in the amorphous structure in certain regions even if the thickness of the film reaches 600 nm. It is suggested that the amorphous silicon film grown on a crystalline silicon substrate at a temperature of 250°C without heavy H₂ dilution is a mixed network of a small amount of crystalline silicon and the major portion of amorphous silicon.     

Correlation between interfacial structure and c-axis-orientation of LiNbO3 films grown on Si and SiO2 by electron cyclotron resonance plasma sputtering

Thin films of crystalline lithium niobate (LN) grown on Si(1 0 0) and SiO₂ substrates by electron cyclotron resonance plasma sputtering exhibit distinct interfacial structures that strongly affect the orientation of respective films. Growth at 460–600 °C on the Si(1 0 0) surface produced columnar domains of LiNbO₃ with well-oriented c-axes, i.e., normal to the surface. When the SiO₂ substrate was similarly exposed to plasma at temperatures above 500 °C, however, increased diffusion of Li and Nb atoms into the SiO₂ film was seen and this led to an LN–SiO₂ alloy interface in which crystal-axis orientations were randomized. This problem was solved by solid-phase crystallization of the deposited film of amorphous LN; the degree of c-axis orientation was then immune to the choice of substrate material.     

Microstructure and ferroelectric properties of BaTiO3 films on LaNiO3 buffer layers by rf sputtering

We have fabricated LaNiO₃ and BaTiO₃ films using the rf sputtering method. The LaNiO₃ were deposited on Si substrates, demonstrating a (1 0 0) highly oriented structure and nanocrystalline characteristic with a grain size of 30 nm. The BaTiO₃ thin films were deposited on the LaNiO₃ buffer layers, and have exhibited a (1 0 0) texture with a thickness of 400 nm. A smooth interface is obtained between the LaNiO₃ bottom electrode and the BaTiO₃ film from cross-section observations by scanning electron microscopy. The bi-layer films show a dense and column microstructure with a grain size of 60 nm. Ferroelectric characterizations have been obtained for the BaTiO₃ films. The remnant polarization and coercive field are 2.1 μC/cm² and 45 kV/cm, respectively. The leak current measurements have shown a good insulating property.     

The photoluminescence of ZnO thin films grown on Si (1 0 0) substrate by plasma-enhanced chemical vapor deposition

High-quality ZnO thin films have been grown on a Si(1 0 0) substrate by plasma-enhanced chemical vapor deposition (PECVD) using a zinc organic source (Zn(C₂H₅)₂) and carbon dioxide (CO₂) gas mixtures at a temperature of 180°C. A strong free exciton emission with a weak defect-band emission in the visible region is observed. The characteristics of photoluminescence (PL) of ZnO, as well as the exciton absorption peak in the absorption spectra, are closely related to the gas flow rate ratio of Zn(C₂H₅)₂ to CO₂. Full-widths at half-maximum of the free exciton emission as narrow as 93.4 meV have been achieved. Based on the temperature dependence of the PL spectra from 83 to 383 K, the exciton binding energy and the transition energy of free excitons at 0 K were estimated to be 59.4 meV and 3.36 eV, respectively.     

Growth of epitaxial thin films of scandium nitride on 100-oriented silicon

A series of 100-oriented ScN films was grown under N-rich conditions on 100-oriented Si using different Sc fluxes. The ScN films grew in an epitaxial cube-on-cube orientation, with [0 0 1]_ScN//[0 0 1]_Si and [1 0 0]_ScN//[1 0 0]_Si, despite the high (11%) lattice mismatch between ScN and Si. The film grain size increases and the film ω-FWHM decreases with increasing Sc flux, but the film roughness increases. Films grown under similar conditions on 111-oriented Si resulted in mixed 111 and 100 orientations, indicating that the 100 orientation is favoured both due to texture inheritance from the substrate and due to the growth conditions used.     

Low-pressure chemical vapor deposition of TaCN films by pyrolysis of ethylamido-tantalum

Thin films of Tantalum nitride (TaN) were deposited from tetra-ethylamido-tantalum (Ta (NEt₂)₄) by low-pressure chemical vapor deposition. Good-quality step coverage is achieved below 400°C, because the deposition rate is determined by the reaction rates on the surface. The film resistivity increases, however, as the substrate temperature decreases. In order to obtain the low resistivity of films deposited at lower temperatures, we have increased the amount of injected H₂ gas during the deposition. The resistivity decreases by the increase in the H₂ gas flow rate, and it is shown that a large amount of H₂ gas injection during the deposition is an effective method for obtaining both low resistivity and high-quality step coverage. The residual carbon concentration in the film is measured to be >10%, on the other hand, the concentration of N less than 1%. The microstructural investigation using transmission electron microscopy (TEM) reveals that crystalline structure of the deposited film has an amorphous phase.     

Structure and thermal stability of MOCVD ZrO2 films on Si (1 0 0)

The structure and thermal stability of ZrO₂ films grown on Si (1 0 0) substrates by metalorganic chemical vapor deposition have been studied by high-resolution transmission electron microscopy, selected area electron diffraction and X-ray energy dispersive spectroscopy. As-deposited films consist of tetragonal ZrO₂ nanocrystallites and an amorphous Zr silicate interfacial layer. After annealing at 850°C, some monoclinic phase is formed, and the grain size is increased. Annealing a 6 nm thick film at 850°C in O₂ revealed that the growth of the interfacial layer is at the expense of the ZrO₂ layer. In a 3.0 nm thick Zr silicate interfacial layer, there is a 0.9 nm Zr-free SiO₂ region right above the Si substrate. These observations suggest that oxygen reacted with the Si substrate to grow SiO₂, and SiO₂ reacted with ZrO₂ to form a Zr silicate interfacial layer during the deposition and annealing. Oxygen diffusion through the tetragonal ZrO₂ phase was found to be relatively easier than through the monoclinic phase.     

Effect of NH3 on the growth characterization of TiN films at low temperature

Titanium nitride (TiN) films were obtained by the atmospheric pressure chemical vapor deposition method of the TiCl₄–N₂–H₂ system with various flow rates of NH₃ at 600°C. The growth characteristics, morphology and microstructure of the TiN films deposited were analyzed by X-ray diffraction, scanning electron microscopy and transmission electron microscopy. Without NH₃ addition, no TiN was deposited at 600°C as shown in the X-ray diffraction curve. However, by adding NH₃ into the TiCl₄–N₂–H₂ system, the crystalline TiN was obtained. The growth rate of TiN films increased with the increase of the NH₃ flow rate. The lattice constant of TiN films decreased with the increase of the NH₃ flow rate. At a low NH₃ flow rate, the TiN (2 2 0) with the highest texture coefficient was found. At a high NH₃ flow rate, the texture coefficient of TiN (2 0 0) increased with the increase of the NH₃ flow rate. In morphology observation, thicker plate-like TiN was obtained when the NH₃ flow rate was increased. When the flow rate of NH₃ was 15 sccm, Moiré fringes were observed in the TiN film as determined by TEM analysis. The intrinsic strain was found in the TiN film as deposited with 60 sccm NH₃.     

CrO2 (1 0 0) and TiO2 (1 0 0) film heteroepitaxy on a BaF2 (1 1 1)/Si (1 0 0) substrate

Multi-domained heteroepitaxial rutile-phase TiO₂ (1 0 0)-oriented films were grown on Si (1 0 0) substrates by using a 30-nm-thick BaF₂ (1 1 1) buffer layer at the TiO₂–Si interface. The 50 nm TiO₂ films were grown by electron cyclotron resonance oxygen plasma-assisted electron beam evaporation of a titanium source, and the growth temperature was varied from 300 to 600 °C. At an optimal temperature of 500 °C, X-ray diffraction measurements show that rutile phase TiO₂ films are produced. Pole figure analysis indicates that the TiO₂ layer follows the symmetry of the BaF₂ surface mesh, and consists of six (1 0 0)-oriented domains separated by 30° in-plane rotations about the TiO₂ [1 0 0] axis. The in-plane alignment between the TiO₂ and BaF₂ films is oriented as [0 0 1] TiO₂ || BaF₂ or [0 0 1] TiO₂ || BaF₂ . Rocking curve and STM analyses suggest that the TiO₂ films are more finely grained than the BaF₂ film. STM imaging also reveals that the TiO₂ surface has morphological features consistent with the BaF₂ surface mesh symmetry. One of the optimally grown TiO₂ (1 0 0) films was used to template a CrO₂ (1 0 0) film which was grown via chemical vapor deposition. Point contact Andreev reflection measurements indicate that the CrO₂ film was approximately 70% spin polarized.     

Hexagonal AlN films grown on nominal and off-axis Si(0 0 1) substrates

Nucleation and growth of wurtzite AlN layers on nominal and off-axis Si(0 0 1) substrates by plasma-assisted molecular beam epitaxy is reported. The nucleation and the growth dynamics have been studied in situ by reflection high-energy electron diffraction. For the films grown on the nominal Si(0 0 1) surface, cross-sectional transmission electron microscopy and X-ray diffraction investigations revealed a two-domain film structure (AlN¹ and AlN²) with an epitaxial orientation relationship of [0 0 0 1]_AlN || [0 0 1]_Si and AlN¹ || AlN² || [1 1 0]_Si. The epitaxial growth of single crystalline wurtzite AlN thin films has been achieved on off-axis Si(0 0 1) substrates with an epitaxial orientation relationship of [0 0 0 1]_AlN parallel to the surface normal and 0 1 1 0_AlN || [1 1 0]_Si.     

Atmospheric aging and thermal annealing effects in a-C:H thin films

Atmospheric aging and thermal annealing effects have been studied in hydrogenated amorphous carbon (a-C:H) thin films deposited using a dc saddle field glow discharge technique with different ion energies (85–225 eV) during deposition. The a-C:H films grown with low ion energies showed aging effects when they were exposed to the ambient atmosphere. Infrared (IR) absorption due to O–H and C=O vibration modes increased while the IR absorption due to C–H vibrations decreased with aging. The absence of absorption due to O–D vibrations in deuterated films indicates that the films reacted with water rather than oxygen when exposed to the atmosphere. The C–H and O–H bond concentrations decreased when the a-C:H films which had been exposed to the atmosphere for a one month period were thermally annealed. The a-C:H films grown with high ion energies exhibited neither atmospheric aging nor thermal annealing effects.     

Growth and properties of (Pb0.90La0.10)TiO3 thick films prepared by RF magnetron sputtering with a PbO buffer layer

The (Pb_0.90La_0.10)TiO₃ [PLT] thick films (3.0 μm) with a PbO buffer layer were deposited on the Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates by RF magnetron sputtering method. The PLT thick films comprise five periodicities, the layer thicknesses of (Pb_0.90La_0.10)TiO₃ and PbO in one periodicity are fixed. The PbO buffer layer improves the phase purity and electrical properties of the PLT thick films. The microstructure and electrical properties of the PLT thick films with a PbO buffer layer were studied. The PLT thick films with a PbO buffer layer possess good electrical properties with the remnant polarization (P_r=2.40 μC cm⁻²), coercive field (E_c=18.2 kV cm⁻¹), dielectric constant (ε_r=139) and dielectric loss (tan δ=0.0206) at 1 kHz, and pyroelectric coefficient (9.20×10⁻⁹ C cm⁻² K⁻¹). The result shows the PLT thick film with a PbO buffer layer is a good candidate for pyroelectric detector.     

Homoepitaxial growth of 6H–SiC thin films by metal-organic chemical vapor deposition using bis-trimethylsilylmethane precursor

Homoepitaxial silicon carbide (SiC) films were grown on 3.5° off-oriented (0 0 0 1) 6H–SiC by metal-organic chemical vapor deposition (MOCVD) using bis-trimethylsilylmethane (BTMSM, C₇H₂₀Si₂). A pronounced effect of the growth conditions such as source flow rate and growth temperature on the polytype formation and structural imperfection of the epilayer was observed. The growth behavior was explained by a step controlled epitaxy model. It was demonstrated by high-resolution X-ray diffractometry and transmission electron microscopy that high-quality 6H–SiC thin films were successfully grown at the optimized growth condition of substrate temperature 1440°C with the carrier gas flow rate of 10 sccm.     

Electronic structure and charge transport properties of amorphous Ta2O5 films

Amorphous Ta₂O₅ films were deposited by sputtering Ta onto silicon substrates with reactive ion beam. Electron energy loss spectroscopy measurements on the film found that the plasma oscillation energy is 23.1 eV. The refractive index and the extinction coefficient were measured with spectroscopic ellipsometry over the spectral range of 1.9–4.9 eV. The optical band gap is found to be 4.2 ± 0.05 eV. The valence band consists of three bands separated by ionic gaps. The values of electron effective masses were estimated with DFT quantum-chemical calculation. Experiments on injection of minority carriers from silicon into oxide were also conducted and we found that the electron component of conduction current governed by the electron current in the amorphous Ta₂O₅.     

Characteristics of sputtered amorphous carbon films prepared by a closed-field unbalanced magnetron sputtering method

We discuss the tribological performance of sputtered amorphous carbon (a-C) films deposited by closed-field unbalanced magnetron (CFUBM) sputtering with a graphite target using a mixture of helium (He) and argon (Ar) as sputtering gases. We investigated the effects of the graphite target power density on the micro-structural and physical properties. In the Raman spectra, the G-peak position moved to the higher wavenumbers. The I_D/I_G ratio increased with the increase of target power density in the fixed DC bias voltage. This was the result of the structural change in the a-C film that resulted with the increase in sp² bonding fraction. Also, the maximum hardness of the a-C film was 23 GPa, the friction coefficient was 0.1, and the critical load was 25.9 N on the Si wafer. In addition, the compressive residual stress of the film increased a little with increasing target power density. Consequently, the various properties of a-C films, with an increase of the target power density, were associated with the increase of cross-linked sp² bonding fraction and the cluster size. The tribological properties of a-C film showed clear dependence on the energy of ion bombardment with the increase of plasma density during film growth.     

Epitaxial growth of ZnO thin films on Si substrates by PLD technique

Epitaxial ZnO thin films have been grown on Si(1 1 1) substrates at temperatures between 550 and 700 °C with an oxygen pressure of 60 Pa by pulsed laser deposition (PLD). A ZnO thin film deposited at 500 °C in no-oxygen ambient was used as a buffer layer for the ZnO growth. In situ reflection high-energy electron diffraction (RHEED) observations show that ZnO thin films directly deposited on Si are of a polycrystalline structure, and the crystallinity is deteriorated with an increase of substrate temperature as reflected by the evolution of RHEED patterns from the mixture of spots and rings to single rings. In contrast, the ZnO films grown on a homo-buffer layer exhibit aligned spotty patterns indicating an epitaxial growth. Among the ZnO thin films with a buffer layer, the film grown at 650 °C shows the best structural quality and the strongest ultraviolet (UV) emission with a full-width at half-maximum (FWHM) of 86 meV. It is found that the ZnO film with a buffer layer has better crystallinity than the film without the buffer layer at the same substrate temperature, while the film without the buffer layer shows a more intense UV emission. Possible reasons and preventive methods are suggested to obtain highly optical quality films.     

射频磁控溅射氧气流量对制备的Ga2O3∶Cr薄膜光致发光性能的影响

在不同氧气流量下,采用双靶射频磁控共溅射的方法在蓝宝石(α-Al₂O₃)基底上制备得到系列掺Cr的Ga₂O₃(Ga₂O₃∶Cr)薄膜,详细研究了薄膜在900 ℃退火前后的结构和光学性能。结果表明,未退火的Ga₂O₃∶Cr薄膜为非晶结构,其发光主要位于蓝绿波段。经900 ℃退火后,薄膜的结构由非晶变为多晶,且在近红外波段观测到了来源于Cr³⁺掺杂的发光。退火后的薄膜结晶质量和近红外发光均与氧气流量密切相关,而其光学带隙不受氧气流量的影响。在所研究的氧气流量范围,4 mL/min氧气流量下薄膜的近红外发光强度最强,这与此条件下薄膜结晶质量较好以及Cr³⁺替代Ga³⁺的数量较多有关。以上研究成果可为制备高质量Ga₂O₃∶Cr薄膜提供参考。     

HREM investigations of intermediate ZnO and ZnO/Y–ZrO2 layers in Y–ZrO2 bicrystals and ZnO films grown on Y–ZrO2 bicrystal substrates

The structure of yttrium-stabilized ZrO₂ (YSZ) bicrystals with ZnO and ZnO/YSZ/ZnO/YSZ/ZnO intermediate layers, as well as ZnO films grown on YSZ bicrystal (1 1 0)/90° substrates, has been investigated by means of high-resolution electron microscopy (HREM) and microanalysis. All bicrystals were produced by the solid-phase intergrowth (SPI) method. The internal ZnO film in the bicrystal formed at the SPI temperature of 1400°C consisted of domains with two symmetrical orientations: , and , . A bicrystal with a ZnO/YSZ/ZnO/YSZ/ZnO internal film was formed at the temperature of 1200°C. There was no mixing of ZnO and YSZ films and no traces of any solid-phase reactions were observed. Grains in all internal ZnO films and ZnO films grown on the bicrystal substrates had numerous stacking faults. It was found that SPI does not influence the density and structure of these defects. Orientational relationships between YSZ and ZnO in all samples were determined. The ZnO films grown on (1 1 0)/90° bicrystal substrates inherited the grain boundary (GB) from the substrate. Its structure and geometry is determined by four variants of ZnO grain growth.     

Annealing effects of highly homogeneous a-Si1−xCx:H

We report the effect of annealing on the properties of amorphous hydrogenated silicon carbide thin films. The samples were deposited onto different substrates by plasma enhanced chemical vapor deposition at temperatures between 300 and 350 °C. The gaseous mixture was formed by silane and methane, at the ‘silane starving plasma regime’, and diluted with hydrogen. Rutherford backscattering and Fourier transform infrared spectrometry were used, respectively, to determine the atomic composition and chemical bonds of the samples. The film’s structure was analyzed by means of X-ray absorption fine structure and X-ray diffraction. For temperatures higher than 600 °C, amorphous silicon carbide films annealed under inert atmosphere (Ar or N₂) clearly changed their structural and compositional properties due to carbon loss and oxidation, caused by the presence of some oxygen in the annealing system. At 1000 °C, crystallization of the films becomes evident but only stoichiometric films deposited on single crystalline Si[1 0 0] substrates presented epitaxial formation of SiC crystals, showing that the crystallization process is substrate dependent. Films annealed in high-vacuum also changed their structural properties for annealing temperatures higher than 600 °C, but no traces of oxidation were observed or variations in their silicon or carbon content. At 1200 °C the stoichiometric films are fully polycrystalline, showing the existence of only a SiC phase. The XANES signal of samples deposited onto different substrates and annealed under high-vacuum also show that crystallization is highly substrate dependent.