Computing lower and upper bounds on stress intensity factors in bimaterials

This paper presents a finite element approach for finding complementary bounds of stress intensity factors (SIFs) in bimaterials. The SIF is formulated as an explicit computable linear function of displacements by means of the two-point extrapolation method. An appropriate and computable form of the SIF plays a crucial role in the dual problem involved in the computing procedure of both lower and upper bounds. In our discussions, computable forms of stress intensity factors, K₀ and K_r, are derived, which are related to the energy release rate, and the ratio of the open mode and shear mode SIFs, respectively. Based on a posteriori finite element error estimation, a bounding procedure is used to compute the bounds on the two stress intensity factors. Finally, bounds on the SIFs in a bimaterial interface crack problem are provided to verify the procedure.     

A technique for studying interaction between a screw dislocation dipole or a concentrated load and a mode III crack crossing an interface

A method of potentially wide application is developed for deriving analytical expressions of the elastic interaction between a screw dislocation dipole or a concentrated force and a crack cutting perpendicularly across the interface of a bimaterial. The cross line composed of the interface and the crack is mapped into a line, and then the complex potentials are educed. The Muskhelishvili method is extended by creating a Plemelj function that matches the singularity of the real crack tips, and eliminates the pseudo tips’ singularity induced by the conformal mapping. The stress field is obtained after solving the Riemann–Hilbert boundary value problem. Based on the stress field expressions, crack tip stress intensity factors, dislocation dipole image forces and image torque are formulated. Numerical curves show that both the translation and rotation must be considered in the static equilibrium of the dipole system. The crack tip stress intensity factor induced by the dipole may rise or drop and the crack may attract or reject the dipole. These trends depend not only on the crack length, but also on the dipole location, the length and the angle of the dipole span. Generally, the horizontal image force exerted at the center of the dislocation dipole is much smaller than the vertical one. Whether the dipole subjected to clockwise torque or anticlockwise torque is determined by whether the Burgers vector of the crack-nearby dislocation of the dipole is positive or negative. A concentrated load induces no singularity to crack tip stress fields as the load is located at the crack line. However, as the concentrated force is not located on the crack line but approaches the crack tip, the nearby crack tip stress intensity factor K_IIIu increases steeply to infinity.     

Fracture analysis of mode-II crack perpendicular to imperfect bimaterial interface

The problem of a mode-II crack close to and perpendicular to an imperfect interface of two bonded dissimilar materials is investigated.The imperfect interface is modelled by a linear spring with the vanishing thickness.The Fourier transform is used to solve the boundary-value problem and to derive a singular integral equation with the Cauchy kernel.The stress intensity factors near the left and right crack tips are evaluated by numerically solving the resulting equation.Several special cases of the mode-II crack problem with an imperfect interface are studied in detail.The effects of the interfacial imperfection on the stress intensity factors for a bimaterial system of aluminum and steel are shown graphically.The obtained observation reveals that the stress intensity factors are dependent on the interface parameters and vary between those with a fully debonded interface and those with a perfect interface.     

FRACTURE ASSESSMENT OF AN INTERFACE CRACK BETWEEN TWO DISSIMILAR MAGNETOELECTROELASTIC MATERIALS UNDER HEAT FLOW AND MAGNETOELECTROMECHANICAL LOADINGS

A magnetoelectrically permeable interface crack between two semi-infinite magnetoelectroelastic planes under the action of a heat flow and remote magnetoelectromechanical loadings is considered, where the assumption of frictionless contact between two dissimilar halfplanes is adopted. Not only the solutions of the interface crack problem are presented in an explicit form, but also the general condition for the transition from a perfect thermal contact of two magnetoelectroelastic bodies to their separation is given.     

Magneto-electro-elastic antiplane analysis of a bimaterial BaTiO3–CoFe2O4 composite wedge with an interface crack

The antiplane analysis is made for a bimaterial BaTiO₃–CoFe₂O₄ composite wedge containing an interface crack. The coupled magneto-electro-elastic field is induced by the piezoelectric/piezomagnetic BaTiO₃–CoFe₂O₄ composite materials. For the crack problems, the intensity factors of stress, strain, electric displacement, electric field, magnetic induction and magnetic field at crack tips are derived analytically. Also, the energy density criterion is applied to predict the fracture behavior of the interface crack. The numerical results also show that the energy release rate for a crack in a single wedge is negative.     

Stress state of a transversely isotropic magnetoelectroelastic body with a plane crack under antisymmetric loads

The static equilibrium of a transversely isotropic magnetoelectroelastic body with a plane crack of arbitrary shape in the isotropy plane under antisymmetric mechanical loading is studied. The relationships between the stress intensity factors (SIFs) for an infinite magnetoelectroelastic body and the SIFs for a purely elastic body with the same crack and under the same antisymmetric loading are established. This enables the SIFs for a magnetoelectroelastic body to be found directly from the analogous problem of elasticity. As an example of using this result, the SIFs for penny-shaped, elliptic, and parabolic cracks in a magnetoelectroelastic body under antisymmetric mechanical loading are found Translated from Prikladnaya Mekhanika, Vol. 44, No. 10, pp. 37–51, October 2008.     

Pre-kinking of a moving crack in a magnetoelectroelastic material under in-plane loading

A constant moving crack in a magnetoelectroelastic material under in-plane mechanical, electric and magnetic loading is studied for impermeable crack surface boundary conditions. Fourier transform is employed to reduce the mixed boundary value problem of the crack to dual integral equations, which are solved exactly. Steady-state asymptotic fields near the crack tip are obtained in closed form and the corresponding field intensity factors are expressed explicitly. The crack speed influences the singular field distribution around the crack tip and the effects of electric and magnetic loading on the crack tip fields are discussed. The crack kinking phenomena is investigated using the maximum hoop stress intensity factor criterion. The magnitude of the maximum hoop stress intensity factor tends to increase as the crack speed increases.     

Arbitrarily oriented crack near interface in piezoelectric bimaterials

Arbitrarily oriented crack near interface in piezoelectric bimaterials is considered. After deriving the fundamental solution for an edge dislocation near the interface, the present problem can be expressed as a system of singular integral equations by modeling the crack as continuously distributed edge dislocations. In the paper, the dislocations are described by a density function defined on the crack line. By solving the singular integral equations numerically, the dislocation density function is determined. Then, the stress intensity factors (SIFs) and the electric displacement intensity factor (EDIF) at the crack tips are evaluated. Subsequently, the influences of the interface on crack tip SIFs, EDIF, and the mechanical strain energy release rate (MSERR) are investigated. The J-integral analysis in piezoelectric bimaterals is also performed. It is found that the path-independent of J₁-integral and the path-dependent of J₂-integral found in no-piezoelectric bimaterials are still valid in piezoelectric bimaterials.     

双材料界面裂纹的改进广义有限差分法

采用数值方法进行断裂力学分析时,裂纹尖端奇异区域处理的好坏直接关系到最终断裂力学参数的求解精度。与传统均匀介质不同,复合材料界面裂纹渐近位移和应力场表现出剧烈的振荡特性,许多用于表征经典的平方根和负平方根物理场渐近性的传统方法也因此失效。论文提出了一种改进的广义有限差分法,该方法基于多元函数泰勒级数展开和移动最小二乘法的思想,将节点变量的各阶导数由相邻点集函数的加权线性累加来近似,具有无网格、无数值积分、数据准备简单、稀疏矩阵快速求解等优点。为提高该方法求解断裂力学问题的计算精度和数值稳定性,论文引入了裂尖奇异区域局部点簇的自动创建技术和一种基于局部点簇几何尺寸的矩阵正则化算法。数值算例表明,所提算法稳定,效率高,在不增加计算量的前提下,显著提高了裂尖近场力学参量和断裂力学参数的求解精度和数值稳定性。     

Analysis of a mode-I crack perpendicular to an imperfect interface

The elastostatic problem of a mode-I crack embedded in a bimaterial with an imperfect interface is investigated. The crack is in proximity to and perpendicular to the imperfect interface, which is governed by linear spring-like relations. The Fourier transform is applied to reduce the associated mixed-boundary value problem to a singular integral equation with Cauchy kernel. By numerically solving the resulting equation, stress intensity factors near both crack tips are evaluated. Obtained results reveal that the stress intensity factors in the presence of the imperfect interface vary between that with a perfect interface and that with a completely debonding interface. Moreover, an increase in the interface parameters decreases the stress intensity factors. In particular, when crack approaches to the weakened interface closer, the stress intensity factors become larger for a sliding interface, and become larger or smaller for a Winkler interface, depending on the crack lying in a stiffer or softer material. The influences of the imperfection of the interface on the stress intensity factors for a bimaterial composed of aluminum and steel are presented graphically.     

Analysis method of planar interface cracks of arbitrary shape in three-dimensional transversely isotropic magnetoelectroelastic bimaterials

Using the fundamental solutions for three-dimensional transversely isotropic magnetoelectroelastic bimaterials, the extended displacements at any point for an internal crack parallel to the interface in a magnetoelectroelastic bimaterial are expressed in terms of the extended displacement discontinuities across the crack surfaces. The hyper-singular boundary integral–differential equations of the extended displacement discontinuities are obtained for planar interface cracks of arbitrary shape under impermeable and permeable boundary conditions in three-dimensional transversely isotropic magnetoelectroelastic bimaterials. An analysis method is proposed based on the analogy between the obtained boundary integral–differential equations and those for interface cracks in purely elastic media. The singular indexes and the singular behaviors of near crack-tip fields are studied. Three new extended stress intensity factors at crack tip related to the extended stresses are defined for interface cracks in three-dimensional transversely isotropic magnetoelectroelastic bimaterials. A penny-shaped interface crack in magnetoelectroelastic bimaterials is studied by using the proposed method.The results show that the extended stresses near the border of an impermeable interface crack possess the well-known oscillating singularity r^?1/2±iε or the non-oscillating singularity r^?1/2±κ. Three-dimensional transversely isotropic magnetoelectroelastic bimaterials are categorized into two groups, i.e., ε-group with non-zero value of ε and κ-group with non-zero value of κ. The two indexes ε and κ do not coexist for one bimaterial. However, the extended stresses near the border of a permeable interface crack have only oscillating singularity and depend only on the mechanical loadings.     

Mode III stress intensity factors for edge-cracked circular shafts,bonded wedges,bonded half planes and DCB’s

Antiplane shear deformation of several edge-cracked geometries is considered. Analytical expressions are derived for the mode III stress intensity factor (SIF) of circular shafts with edge cracks, bonded half planes containing an interfacial edge crack, bonded wedges with an interfacial edge crack and also DCB’s. The results are extracted for simple isotropic materials as well as anisotropic materials and also bonded dissimilar materials and it is shown that the same expressions are obtained for the SIF under the same geometries but with different above-mentioned material properties. Different boundary conditions are assumed and the SIF relations are derived in each case. As the special cases, the SIF’s of the two bonded quarter planes containing an edge crack at the interface and infinite strip with a semi-infinite edge crack are extracted which coincide with the results cited in the literature.     

Stress-intensity factors for materials with interface cracks under harmonic loading

The paper studies the distribution of the mode I, II, and III stress-intensity factors (SIFs) for a penny-shaped interface crack in a bimaterial under normal harmonic loading. The dependence of SIFs on the type of a wave (compression–dilatation or shear), loading frequency, and the mechanical properties of the bimaterial is analyzed     

Fracture of magnetoelectroelastic composite materials using boundary element method (BEM)

The behavior of cracked linear magnetoelectroelastic solids is analysed by means of the dual Boundary Element Method (BEM) approach. Media possessing fully coupled piezoelectric, piezomagnetic and magnetoelectric effects are considered. An explicit 2-D Green’s function in terms of the extended Stroh formalism for magnetoelectroelastic full-plane under static loading is implemented. Hypersingular integrals arising in the traction boundary integral equations are computed through a regularization technique. Evaluation of fracture parameters directly from computed nodal values is discussed. The stress intensity factors (SIF), the electric displacement intensity factor (EDIF), the magnetic induction intensity factor (MIIF) as well as the mechanical strain energy release rate (MSERR) are evaluated for different crack configurations in both finite and infinite solids subjected to in-plane combined magnetic–electric–mechanical loading conditions. The accuracy of the boundary element solution is confirmed by comparison with selected analytical solutions in the literature. The new results that can be of interest in the design and maintenance of novel magnetoelectroelastic devices are also discussed.     

Electro-elastic green's functions for a piezoelectric half-space and their application

I.IntroductionItiswell'knownthatoneofthemostpowerfultoolsinlinearfieldtheoriesistheGreen'sfunction.Fore1asticity,considerableresearchcanbefoundintheliterature.However,theGreen'sfunctionforpiezoe1ectricityisratherlimitedduetotheanisotropyandelectromechanic…     

Crack tip field in piezoelectric/piezomagnetic media

This paper considers the magnetoelectroelastic problem of a crack in a medium possessing coupled piezoelectric, piezomagnetic and magnetoelectric effects. Based on the extended Stroh formalism, the general two-dimensional solutions to the magnetoelectroelastic problem are obtained, involving five analytic functions of different variables. The magnetoelectroelastic field around the crack tip is given. It contains five modes of square root singularities. Expressions of the stresses, electric displacements and magnetic inductions in the vicinity of the crack tip are derived and the field intensity factors are provided. The path-independent conservative integral is derived. The energy release rate is written in terms of those field intensity factors. The explicit algebraic results are given for a special case of an anti-plane crack in a magnetoelectroelastic medium.     

A generalized screw dislocation interacting with interfacial cracks along a circular inhomogeneity in magnetoelectroelastic solids

The interaction of a generalized screw dislocation with circular arc interfacial cracks under remote antiplane shear stresses, in-plane electric and magnetic loads in transversely isotropic magnetoelectroelastic solids is dealt with. By using the complex variable method, the general solutions to the problem are presented. The closed-form expressions of complex potentials in both the inhomogeneity and the matrix are derived for a single circular-arc interfacial crack. The intensity factors of stress, electric displacement and magnetic induction are provided explicitly. The image forces acting on the dislocation are also calculated by using the generalized Peach–Koehler formula. For the case of piezoelectric matrix and piezomagnetic inclusion, the shielding and anti-shielding effect of the dislocation upon the stress intensity factors is evaluated in detail. The results indicate that if the distance between the dislocation and the crack tip remains constant, the dislocation in the interface will have a largest shielding effect which retards the crack propagation. In addition, the influence of the interfacial crack geometry and materials magnetoelectroelastic mismatch upon the image force is discussed. Numerical computations show that the perturbation effect of the above parameters upon the image force is significant. The main result shows that a stable or unstable equilibrium point may be found when a screw dislocation approaches the surface of the crack from infinity which differs from the perfect bonded case under the same conditions. The present solutions contain a number of previously known results which can be shown to be special cases.     

The mixed-mode fracture mechanics analysis of an embedded arbitrary oriented crack in a two-dimensional functionally graded material plate

Mixed-mode fracture mechanics analysis of an embedded arbitrarily oriented crack in a two-dimensional functionally graded material using plane elasticity theory is considered. The material properties are assumed to vary exponentially in two planar directions. Then, employing Fourier integral transforms with singular integral equation technique, the problem is solved. The stress intensity factors (SIFs) at the crack tips are calculated under in-plane mechanical loads. Finally, the effects of crack orientation, material non-homogeneity, and other parameters are discussed on the value of SIF in mode I and mode II fracture.     

Uniformly moving screw dislocation interacting with interface cracks in anisotropic bimaterials

This paper attempts to investigate the problem for the interaction between a uniformly subsonic moving screw dislocation and interface cracks in two dissimilar anisotropic materials. Using Riemann–Schwarz’s symmetry principle integrated with the analysis singularity of complex functions, we present the general elastic solutions of this problem and the closed form solutions for interface containing one and two cracks. The expressions of stress intensity factors at the crack tips and image force acting on moving dislocation are derived explicitly. The results show that the stress intensity factors at the crack tips decrease with increasing velocity of dislocation, and larger dislocation velocity leads to the equilibrium position of dislocation leaving from crack tips. The presented solutions contain previously known results as the special cases.     

Stress intensity factor for a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation

The asymptotic problem of a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation is investigated. The linear transformation method for the problem of the anisotropic bimaterial with a straight interface is proposed. The stress intensity factor for the kinked interfacial crack in the anisotropic composite is obtained from the solution of the transformed problem of the kinked interfacial crack in the isotropic bimaterial based on the linear transformation method. The effects of the material parameters as well as the kink angle on the stress intensity factor are discussed from numerical results of the stress intensity factor. The finite element analysis is carried out to verify the stress intensity factor obtained by using the linear transformation. The influence of the material orientations on the stress intensity factor is investigated for the kinked crack in the bimaterial consisting of dissimilar inclined orthotropic materials.