焊接残余应力平板多个共面表面裂纹的应力强度因子

采用线弹簧模型求解含焊接残余应力平板多个共面任意分布表面裂纹的应力强度因子.利用边裂纹权函数给出了裂纹表面上沿厚度非线性分布的残余应力向线性分布的转化公式.基于Reissner板理论和连续分布位错思想,将含多个共面任意分布表面裂纹的无限平板问题归结为一组Cauchy型奇异积分方程,并采用Gauss-Chebyshev方法获得了奇异积分方程的数值解.以三共面表面裂纹为例,计算了表面裂纹的应力强度因子,并讨论了裂纹间距、裂纹几何形状等因素对应力强度因子的影响.     

表面裂纹平板应力强度因子的杂交应力元-线弹簧模型方法

本文采用基于杂交应力元和线弹簧模型相结合的方法,计算表面裂纹平板的应力强度因子。结果表明,本文解和三维有限元解吻合很好,与基于位移元和线弹簧模型相结合的解相比,具有更高的精度和较宽的适用范围。     

齿轮参数对三维裂纹应力强度因子影响的研究

建立了齿轮三维精确三齿模型,结合线弹性疲劳力学和边界元方法,运用专业断裂分析软件FRANC3D对齿轮齿根裂纹进行了数值分析,模拟求解了齿根椭圆形裂纹的裂尖三种类型的应力强度因子,并且探讨了三种应力强度因子随载荷、裂纹长度、模数、齿数、变位系数、裂纹角度等齿轮参数的变化规律。结果表明:I型、II型应力强度因子的数值在裂纹前缘呈近似于抛物线分布,而III型应力强度因子的数值在裂纹前缘呈近似于正弦曲线分布;应力强度因子随齿面载荷的变化呈线性规律;模数对裂纹两端的II型应力强度因子、裂纹中间的I型和III型应力强度因子影响较小,基本不变;齿数对应力强度因子影响较小,其在不同齿数下的最大差值仅为187 N.m-3/2;变位系数对其影响基本也呈线性变化;裂纹发生角度为60°时,I型应力强度因子比其它角度下的值都要大,因此应尽量避免产生此角度下的裂纹。本文研究为齿轮的断裂分析和寿命预测奠定了一定的基础。     

多个共面任意分布表面裂纹的应力强度因子

采用线弹簧模型求解多个共面任意分布表面裂纹的应力强度因子。基于Ｒｅｉｓｓｎｅｒ板理论和连续分布位错思想,通过积分变换方法,将含有多个共面任意分布表面裂纹的无限平板问题归结为一组Ｃａｕｃｈｙ型奇异积分方程。利用Ｇａｕｓｓ－Ｇｈｅｂｙｓｈｅｖ笔法获得了奇异积分方程的数值解。为验证本文法的正确性,文中最后给出了有关应力强度因子或Ｐ－Ｖ曲线的数值结果并与现有的理论结果或实验结果进行了对比。结果表明了连续位     

压电体内孔边裂纹的应力强度因子

本文研究含有Ⅲ型孔边裂纹压电弹性体的反平面问题.根据Muskhelishvili的数学弹性力学理论,并利用保角变换和Cauchy积分的方法,对含有圆孔孔边单裂纹和双裂纹的压电弹性体分别进行了分析.基于电不可穿透裂纹模型,得到了在反平面剪力和面内电载荷的共同作用下裂纹尖端应力强度因子的解析解.最后,通过数值算例,讨论了应力强度因子随裂纹长度变化的规律.结果表明:应力强度因子随着裂纹和孔的相对尺寸的增加而增加,并且单边裂纹的应力强度因子要比双边裂纹的应力强度因子大.     

运动载荷下的三维裂纹应力强度因子

本文分析了无界弹性体中含一半平面一裂纹， 在裂纹面上受运动的复型冲击集中载荷的三维应力强度因子历史。求得了Ⅱ、Ⅲ型复合强度因子精确解。求解方法基于积分变换法、Ｗｉｅｎｅｒ－Ｈｏｐｆ技术以及Ｃａｇｎｉａｒｄ－ｄｅ Ｈｏｏｐ变换。本文还给出了若干数值结果并对解的性质进行了一些讨论。     

用弹簧质量模型求解三点弯曲试样的动态应力强度因子

用弹簧质量模型求解三点弯曲试样的动态应力强度因子李玉龙，刘元镛（西安西北工业大学，７１００７２）关键词动态应力强度因子，等效刚度，等效质量，阶跃载荷，有限元法１引言动态起裂韧性Ｋ；ｄ（》）是含裂纹体在冲击载荷作用下，起裂控制设计的一个基本参数，象静态...     

三点弯曲试样应力强度的动态响应

采用振动理论分析了三点弯曲试样的动态响应,得到了一个计及冲击速度影响的动态应力强度因子计算公式。当不考虑冲击速度影响时,本文给出的计算模型可退化成经典的K.Kishimoto模型。数值计算的结果表明,无论是在阶跃载荷作用下,还是在周期载荷作用下,冲击速度对三点弯曲试样应力强度因子的动态响应都有明显的影响。     

常幅载荷下结构元件断裂可靠度估算的应力强度因子模型

给出了一个估算结构元件疲劳可靠度的应力强度因子模型,系统阐述了元件在常幅载荷下疲劳可靠性的分析方法。该模型研究了常幅载荷作用下材料瞬时裂纹长度和应力强度因子的分布形式,建立了应力强度因子与断裂韧性之间的干涉关系。对7075-T7351铝合金中心裂纹试件试验数据分析的结果表明：裂纹的瞬时扩展长度和可靠度的预测结果均与试验结果符合很好,本文给出的基于应力强度因子的可靠性分析模型是合理的。     

基于p型有限元法和围线积分法计算复合型应力强度因子

传统有限元法由于采用低阶插值计算应力强度因子时,需要划分的网格数较多,收敛速度较慢,得到的应力强度因子精度不足。p型有限元法在网格确定时通过增加插值多项式的阶数来提高计算精度,具有网格划分少、收敛速度快、精度高、自适应能力强等特点。本文采用基于p型有限元法的有限元计算软件StressCheck计算得到应力场和位移场,并由围线积分法导出混合型应力强度因子(SIFs)。通过几个经典算例,分析了围线的选择对计算精度的影响,计算了不同裂纹长度、不同裂纹角度和裂纹在应力集中区域不同位置时的应力强度因子。并将数值结果、理论解与文献中其他数值计算方法所得的部分结果进行了对比分析,结果表明自由度数不大于7000时,导出的应力强度因子相对误差最大不超过1.2%,数值解表现出较高的精度及数值稳定性。     

Experimental and numerical investigation of a cracked transversely graded plate subjected to in plane bending

The variation of stress intensity factor along the thickness in a cracked transversely graded plate subjected to in plane bending is investigated in this study. A transversely graded plate having elastic modulus varying continuously along the thickness was prepared by embedding glass beads in epoxy resin. An edge crack in this plate was subjected to in plane bending and the crack tip displacement field on the surfaces of the plate was measured using digital image correlation (DIC). Using the recently reported asymptotic displacement fields for cracked transversely graded plates (Wadgaonkar, S.C., Parameswaran, V., 2009. Structure of near tip stress field and variation of stress intensity factor for a crack in a transversely graded material, Journal of Applied Mechanics 76 (1), 011014), the stress intensity factor (SIF) on the surfaces of the plate was calculated from the experimental data. The results of this part of the study indicated that the extent of variation of the SIF across the plate thickness is nearly the same as that of the elastic modulus. An expression to calculate the variation of the SIF through the plate thickness was developed assuming simple bending of the plate. The predicted variation of SIF was verified through finite element calculations. Further, the behavior of the SIF near the intersection of the crack front and the plate surfaces, the extent of dominance of the corner singular field and the exponent of the corner singularity were also investigated in detail. Finally, the effect of gradation strength and gradation type on the SIF was also studied.     

正交异性材料平面裂纹尖端应力场

根据正交各向异性材料力学性能确定出了用应力函数表示的弹性力学基本方程,利用坐标变换和复变函数方法求解了正交异性材料平面裂纹体的应力边值问题。借鉴一般断裂力学解法构造了I型和II型裂纹问题的应力函数,推导出了正交各向异性板裂纹尖端区的奇异应力场。通过数值计算说明了裂纹尖端应力表达式的正确性,验证了裂尖前沿应力变化规律,即σx与材料特征参数h2成正比,而σy和τxy不随材料特性变化。     

Cracking of an orthotropic substrate reinforced by an orthotropic plate

A solution method is derived to determine the stress intensity factors for both an internal crack and an edge crack in an orthotropic substrate that is reinforced on its boundary by a finite-length orthotropic plate. The method utilizes the Green’s functions for a pair of dislocations and a concentrated force on the boundary while invoking the concept of superposition. Enforcing the traction-free boundary condition along the crack surfaces and the continuity of displacement gradients along the plate/substrate interface results in a coupled system of singular integral equations. An asymptotic analysis of the kernels in these equations for the region of the junction point between the plate corner and the substrate boundary reveals the strength of the singularity in the case of an edge crack. The numerical solution of the integral equations provides results for the stress intensity factors for both an internal crack and an edge crack perpendicular to the substrate boundary and aligned with one of the corners of the plate. The present results have been validated against previously published stress intensity factors for an internal crack and an edge crack in an isotropic substrate.     

Stress functions for central straight cracked anisotropic plates

In this paper, the plane problem for an anisotropic plate with a central straight crack in any direction is solved. The stress functions are given to represent the finite stress concentrations near the crack tips by the weight integral method. It shows that there is no stress singularity at the crack tip. The model can be used to appropriate to fracture mechanics for non-metallic materials.     

The Stress State of an Elastic Medium with an Elliptic Crack and Two Ellipsoidal Cavities

This paper is a study into the interaction of two triaxial ellipsoidal cavities whose surfaces are under different pressures with an elliptic crack in an infinite elastic medium. The stress state in the elastic space is represented by a superposition of perturbed states due to the presence and interaction of the cavities and the crack. The exact solution of the problem is constructed by using a modified method of equivalent inclusion, the potential of an inhomogeneous ellipsoid, and a system of harmonic functions for the elliptic crack. A numerical analysis is carried out to find how the geometry of the cavities and the crack, the distance between them, and the pressure on their surfaces affect the stress intensity factors     

单边裂纹通电瞬间裂尖处应力场的复变函数解

本文应用复变函数中的Schwarz-Christoffel变换方法，在具单边裂纹的导电薄板通电瞬间温度场复变函数解的基础上，推导出用复变函数表示的应力场的表达式，并且给出算例，通过理论计算得知；当对具有单边裂纹的导电薄板通入适当密度的电流时，裂尖处温度急剧升高并熔化便裂尖变钝。同时，在裂尖周围形成了有利于遏制裂纹扩展的压应力场，有效地防止了裂纹沿其主方向和其它方向延伸。从理论上证明了电磁热效应在裂尖处产生高温形成焊口的同时，压应力场的形成是遏制裂纹扩展的主要因素之一。理论计算结果与实验结果比较吻合，为这一止裂方法的应用打下了理论基础。     

有限厚度板穿透裂纹前缘附近三维弹性应力场分析

通过三维有限元计算来研究有限宽度、有限厚度含有穿透裂纹板的裂纹前缘应力场，从中找出应力强度因子与板的厚度、裂纹长度之间的关系，同时还分析了裂尖的三维约束程度和三维约束区的大小。分析结果表明：应力强度因子沿厚度的分布是不均匀的，应力强度因子的最大值及其位置与厚度有关；有限厚度板中面应力强度因子(KI)m-p及最大应力强度因子(KI)max均大于平面应力或平面应变的应力强度因子。对有限厚度裂纹问题，按平面应力或平面应变来考虑是不安全的；板中面的应力强度因子(KI)m-p及最大应力强度因子(KI)max是厚度B／a的函数；板的中面离面约束系数Tx最大，自由面(z=B)Tx=0。沿厚度方向裂尖附近的离面约束系数Tx也是z／B和B／a的函数，随着厚度的增加离面约束系数Tx增大，离中面越近离面约束系数Tx越大。Tx随着x的增大急剧减小，三维约束影响区域大小大约为板厚的一半，且裂纹长度a／W对应力强度因子沿厚度变化规律及Tx影响区域大小影响较小。     

Orthotropic semi-infinite medium with a crack under thermal shock

A cracked orthotropic semi-infinite plate under thermal shock is investigated. The thermal stresses are generated due to sudden cooling of the boundary by ramp function temperature change. The superposition technique is used to solve the problem. The crack problem is formulated by applying the thermal stresses obtained from the uncracked plate with opposite sign to be the only external loads on the crack surfaces as the crack surface tractions. The Fourier transform technique is used to solve the problem leading to a singular equation of the Cauchy type. The singular integral equation is solved numerically using the expansion method. The influence of the material orthotropy on the stress intensity factors is shown by comparing the results obtained for different orthotropic materials and isotropic materials in the case of plane stress. The numerical results of the stress intensity factors are demonstrated as a function of time, crack length, location of the crack and the duration of the cooling rate.     

Stress intensity factors for an edge interface crack in a bonded semi-infinite plate for arbitrary material combination

Although a lot of interface crack problems were previously treated, few solutions are available under arbitrary crack lengths and material combinations. In this paper the stress intensity factors of an edge interface crack in a bonded strip are considered under tension with varying the crack length and material combinations systematically. Then, the limiting solutions are provided for an edge interface crack in a bonded semi-infinite plate under arbitrary material combinations. In order to calculate the stress intensity factors accurately, exact solutions in an infinite bonded plate are also considered to produce proportional singular stress fields in the analysis of FEM by superposing specific tensile and shear stresses at infinity. The details of this new numerical solution are described with clarifying the effect of the element size on the stress intensity factor. It is found that for the edge interface crack the normalized stress intensity factors are not always finite depending upon Dunders’ parameters. This behavior can be explained from the condition of the singular stress at the end of bonded strip. Convenient formulas are also given by fitting the computed results.     

Observation of Stress Field Around an Oscillating Crack Tip in a Quenched Thin Glass Plate

The variation of stress field around an oscillating crack tip in a quenched thin glass plate is observed using instantaneous phase-stepping photoelasticity. The successive images around the propagating crack are recorded by a CCD camera that is equipped with a pixelated micro-retarder array. Then, the phase maps of the principal stress difference and the principal direction are easily obtained even though the photoelastic fringes cannot be visualized. The path of the crack growth as well as the stress intensity factors and the crack tip constraint are obtained from these phase distributions. Results show that the mode I stress intensity factor and the crack tip constraint vary remarkably with the crack growth. In addition, the results show that the mode-II stress intensity factor exists even though the crack propagates smoothly.