焊锡接点IMC层的扩散应力

钎焊过程中在焊锡接点中形成的金属间化合物(IMC)对焊锡接点可靠性具有重要影响。在原子扩散效应下,回流焊和等温时效过程中IMC层的生长会在其内部产生应力,其微结构也发生变化,致使IMC层和整个焊点的力学性能下降。本文基于扩散反应机制,研究了由于原子扩散产生的IMC层的扩散应力。首先建立了焊锡接点IMC层生长早期微结构特征的2界面(Cu/Cu6Sn5/Solder)分析模型,然后运用Laplace变换法求解扩散方程得到了Cu原子在IMC层中的浓度分布;采用把原子扩散作用转换为体应变方法,计算了IMC层在形成和生长过程中应力的解析解。结果表明：IMC层中的扩散应力为压应力,最大值位于Cu/IMC界面处,大小与扩散原子浓度密切相关;随着时效时间的增加,扩散应力增大,但最终趋于稳定并沿IMC厚度方向线性变化。     

EXPERIMENTAL INVESTIGATIONS OF STRENGTH,TOUGHNESS AND FAILURE MECHANISM OF THE METAL/EPOXY/METAL ADHESIVE SYSTEM

本文系统地开展了金属/环氧/金属胶结体系的强韧机理及失效行为实验研究,针对铝合金圆棒与铝合金圆棒通过环氧树脂胶层的各种斜截面方向粘结,实验观测了该体系的拉伸变形和失效行为,测量了界面失效载荷对胶层厚度和粘结界面倾斜角的依赖关系;通过引入胶结界面平均正应力、平均剪应力、平均正应变、平均剪应变等概念,可对界面失效强度进行测量,获得界面强度与界面粘结角度以及胶层厚度的关系,进而获得了铝合金/环氧胶层/铝合金体系的强度失效面以及胶结界面的断裂能和胶结体系的能量释放率.上述研究结果为深入认识金属胶结体系的强韧性能和失效机制提供了科学依据,对金属胶结体系的优化设计和性能评判具有重要指导意义.研究结果表明,铝合金/环氧胶层/铝合金体系的拉伸失效总体呈弹脆性破坏特征,失效表现为胶层粘结界面的断裂,失效强度和界面断裂能在胶层厚度为百微米量级时表现出强烈的尺度效应：界面粘结强度随着胶层厚度的减小而显著增大,临界状态的平均正应力和平均剪应力在强度破坏面上近似位于同一圆上,界面断裂能随着胶层厚度的减小而显著减小;与此同时,界面失效强度和界面断裂能也密切依赖于界面粘结角度.     

跌落冲击载荷下焊锡接点金属间化合物层的动态开裂

跌落冲击载荷作用下,含铅焊锡接点与无铅焊锡接点的破坏模式明显不同,而导致这种差异的原因目前尚不明朗。本文提出了一种可用于模拟焊锡接点在跌落冲击载荷下破坏行为的有限元模型,此模型中,金属间化合物（IMC）与焊料间的界面采用粘性区模型（CZM）来模拟其损伤开裂过程,而IMC层内的破坏程度则通过计算其能量释放率来判断。通过对板级封装跌落冲击过程的数值模拟发现,与无铅焊锡接点（Sn3.5Ag）相比,含铅焊锡接点（Sn37Pb）与IMC间的CZM层更容易发生损伤破坏,而该层的开裂会减小IMC层的应力,即降低了其内部的裂纹驱动力,从而缓解了IMC层裂纹的起始和扩展。     

基于内聚力模型法PBGA封装焊点/IMC界面的分层开裂研究

塑料球栅阵列封装PBGA的可靠性分析中,考虑封装过程中SnAgCu焊料与铜焊盘界面间产生的金属间化合物（Intermetallic compound,IMC）的影响,并引入内聚力模型（Cohesive zone model, CZM）,利用ANSYS对热循环作用下焊点/IMC界面的脱层开裂情况进行研究。结果表明：热循环作用下,在封装器件中焊点承受较大的应力应变,且远离中心的外侧焊点具有比内侧焊点更大的应力应变。IMC的存在极大的降低了焊点的可靠性。界面分层最先发生在最外侧的IMC/焊点界面的两端,随着热循环次数的增加,分层逐渐沿着界面两端向里扩展。在热循环的前几个阶段,各个界面的最大损伤值增大较快,随着热循环的继续加载,界面最大损伤值逐渐趋于稳定。整个过程中四号焊点界面的损伤值始终最大。     

SIMULATIONS OF MECHANICAL BEHAVIOR OF POLYCRYSTALLINE COPPER WITH NANO-TWINS

Mechanical behavior and microstructure evolution of polycrystalline copper with nano-twins were investigated in the present work by finite element simulations. The fracture of grain boundaries are described by a cohesive interface constitutive model based on the strain gradient plasticity theory. A systematic study of the strength and ductility for different grain sizes and twin lamellae distributions is performed. The results show that the material strength and ductility strongly depend on the grain size and the distribution of twin lamellae microstructures in the polycrystalline copper.     

Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

In this paper, the mechanical properties and creep behavior of lead-free solder joints has been characterized by nano-mechanical testing of single grain SAC305 solder joints extracted from plastic ball grid array (PBGA) assemblies. The anisotropic mechanical properties characterized include the elastic modulus, hardness, and yield stress. An approach is suggested to predict tensile creep strain rates for low stress levels using nanoindentation creep data measured at very high compressive stress levels. The uniaxial creep rate measured on similarly prepared bulk (large) specimens was found to be of the same order-of-magnitude as the creep rate observed in single-grain BGA joints, with chararacteristically (slightly) higher creep strains measured during nanoindentation. This suggests that the same creep mechanism operates in both size domains. Electron backscattered diffraction (EBSD) and nanoindentation testing further showed that the modulus, hardness, and creep properties of solder joints are highly dependent on the crystal orientation.     

新型纳米结构金属材料的力学性能及变形机制

“纳米结构” 化是金属及其合金材料获得优异力学性能的有效途径.纳米结构金属材料表面或内部的缺陷, 包括晶界、位错、孪晶、孔洞、裂纹、第二相等, 其形核、演化及互相作用对材料的强度和韧性具有重要影响. 该文综述了与上述科学问题相关的新型纳米结构金属材料的微观组织结构表征及力学性能测试、强韧化机制计算模拟方面的研究进展. 并讨论了急需从微观尺度上就新型纳米结构金属材料的特征力学行为和关键变形机制开展深入、系统研究.      

温度循环载荷对柔性接头界面损伤的影响

固体火箭发动机在生产、运输和储存的过程中会受到环境湿热和老化载荷的作用,导致柔性接头界面的力学性能产生退化.为研究柔性接头界面力学性能退化对界面损伤的影响规律,基于双线性内聚力模型建立了一种描述界面力学性能退化的数学模型.以某柔性接头为研究对象,为便于研究,以温度循环载荷代替环境老化载荷开展了界面损伤分析,并采用ABAQUS 6.14进行了仿真.结果 表明,与后法兰粘接的界面损伤程度最大.当温度循环周期达到672次时,界面13和界面14的损伤程度分别由初始状态的2.9％和4.3％增加到5.2％和8.2％,增幅分别高达81.2％和91.7％.同时,温度循环载荷会加速柔性接头的界面损伤.该界面力学性能退化模型可为柔性接头老化研究提供参考.     

微电子封装中导电胶连接可靠性研究

导电胶连接是近年来发展起来的新技术,其连接可靠性对于连接器件的长期稳定运行至关重要.本文基于导电胶互连失效模式的分析,介绍了各向异性导电胶膜的力学性能,综述了外力载荷、环境因素和组件性能对导电胶连接可靠性影响的研究进展,给出了导电胶粘接接触电阻、粘接强度和失效概率的理论分析,以及连接器件界面残余应力和疲劳寿命的研究.最后,针对导电胶连接可靠性研究中涉及的主要方面进行了展望.     

基于圆筒模型的热障涂层安定分析

热载荷作用下,由于热障涂层(thermal barrier coatings, TBCs) 各层材料的热不匹配以及材料参数的温度相关等因素,会使热障涂层界面区域存在复杂的应力应变场,影响系统安定性,并导致涂层开裂和剥落. 将热障涂层外凸和内凹微观界面结构简化为多层圆筒模型,借助经典机动安定定理,利用特雷斯卡(Tresca) 屈服准则和增量破坏准则处理对时间的积分问题,避免了常规安定性分析的数学规划问题,建立了热障涂层安定极限分析方法,将材料屈服强度随温度变化关系简化为双线性关系,利用补偿变换的方法简化求解过程,对典型热障涂层安定性进行了研究. 结果表明,利用基于圆筒的安定极限分析方法,能够方便求解安定极限,便于工程应用;热障涂层安定极限值明显高于弹性设计值,且界面外凸区域安定极限高于内凹区域极限值,结构首先在内凹处失效;圆筒模型基体曲率和涂层厚度越大,结构安定极限越高,分析结果与试验结果一致;所建立的热障涂层安定分析方法,对进一步研究考虑蠕变因素影响的热障涂层安定性具有重要意义.      

MOVEMENT AND SPLASHING OF A DROPLET IMPACTING ON A WET WALL

壁面液体层的存在对液滴撞击壁面的运动具有重要的影响。采用气液两相流动相界面追踪的水平集和流体体积复合方法和壁面润湿模型，实现了液滴撞击湿润壁面运动的数值求解；在此基础上，开展了液滴撞击湿润壁面运动的研究。研究结果表明：液滴以不同速度撞击湿润壁面时，会呈现出黏附铺展、波动运动、皇冠几何体运动以及飞溅运动等几种不同的运动形态，液滴撞击湿润壁面后的压力分布是不同运动形态形成的主要原因；飞溅运动是一定条件下皇冠几何体运动的一种特殊形态，液滴从皇冠几何体侧壁顶端的飞溅分离满足毛细破碎理论；撞击速度对分离液滴的运动方向影响较小，而对壁面液体层厚度的影响则较大；撞击速度和壁面液体层厚度对分离液滴形态、飞溅分离位置、飞溅速度以及飞溅发生时刻等都具有一定的影响。     

The scale effect on the yield strength of nanocrystalline materials

The microstructure of the nanocrystalline can be divided generally into two parts: grain and interface. When the grain size is about or less than 10 nm, the interface can be divided into grain boundary and triple junctions. The mechanical performance of nanocrystalline materials with complicated microstructures is greatly different from that of the coarse grain materials. In this paper, the nanocrystalline material is considered as a composite with three phases: the grain core, the grain boundaries, and the triple junction. The model analysis for nanocrystalline material deformation is established and the relationship between yield strength and grain size is obtained. The obtained result explains the inverse Hall–Petch relation.     

Optimization design of strong and tough nacreous nanocomposites through tuning characteristic lengths

How nacreous nanocomposites with optimal combinations of stiffness, strength and toughness depend on constituent property and microstructure parameters is studied using a nonlinear shear-lag model. We show that the interfacial elasto-plasticity and the overlapping length between bricks dependent on the brick size and brick staggering mode significantly affect the nonuniformity of the shear stress, the stress-transfer efficiency and thus the failure path. There are two characteristic lengths at which the strength and toughness are optimized respectively. Simultaneous optimization of the strength and toughness is achieved by matching these lengths as close as possible in the nacreous nanocomposite with regularly staggered brick-and-mortar (BM) structure where simultaneous uniform failures of the brick and interface occur. In the randomly staggered BM structure, as the overlapping length is distributed, the nacreous nanocomposite turns the simultaneous uniform failure into progressive interface or brick failure with moderate decrease of the strength and toughness. Specifically there is a parametric range at which the strength and toughness are insensitive to the brick staggering randomness. The obtained results propose a parametric selection guideline based on the length matching for rational design of nacreous nanocomposites. Such guideline explains why nacre is strong and tough while most artificial nacreous nanocomposites aere not.     

Grain-boundary sliding and separation in polycrystalline metals: application to nanocrystalline fcc metals

In order to model the effects of grain boundaries in polycrystalline materials we have coupled a crystal-plasticity model for the grain interiors with a new elastic-plastic grain-boundary interface model which accounts for both reversible elastic, as well irreversible inelastic sliding-separation deformations at the grain boundaries prior to failure. We have used this new computational capability to study the deformation and fracture response of nanocrystalline nickel. The results from the simulations reflect the macroscopic experimentally observed tensile stress-strain curves, and the dominant microstructural fracture mechanisms in this material. The macroscopically observed nonlinearity in the stress-strain response is mainly due to the inelastic response of the grain boundaries. Plastic deformation in the interior of the grains prior to the formation of grain-boundary cracks was rarely observed. The stress concentrations at the tips of the distributed grain-boundary cracks, and at grain-boundary triple junctions, cause a limited amount of plastic deformation in the high-strength grain interiors. The competition of grain-boundary deformation with that in the grain interiors determines the observed macroscopic stress-strain response, and the overall ductility. In nanocrystalline nickel, the high-yield strength of the grain interiors and relatively weaker grain-boundary interfaces account for the low ductility of this material in tension.     

Crack propagation under mode II dominance at stainless steel–epoxy interfaces with residual stresses and micro-scale roughness

This report describes investigations of grain boundary groove effects on mode II dominated interface fracture. The study focused on a specific interface between stainless steel and an epoxy adhesive. First, a finite element model was developed to simulate residual stresses and crack propagation. Second, the simulation results were compared with the experimental results from a previous study (Kanerva et al., 2013. Eng. Fract. Mech. 99, 147-158). Additional measurements were performed using atomic force microscopy. Based on the simulation, a 100-fold toughening effect due to the grain boundaries was determined. Implementation of flaws, in the form of interfacial voids, decreased the toughening effect by 35% and increased the mode II dominance significantly. The work underlines the practical importance of complete wetting by the adhesive and its necessary adherence to the grain boundary groove walls.     

热障涂层-基体体系界面高温疲劳和断裂性能的实验研究

热障涂层(TBCs)作为发动机叶片的热防护涂层,能够显著提高叶片在高温环境下的使用寿命.本文围绕TBCs-镍基高温合金基体体系的界面性能,展开了比较系统的实验研究.通过实验方法得到了等温热处理前后陶瓷层的弹性模量、硬度及陶瓷层-粘结层界面的微结构的变化.结果显示,随着等温热处理时间的增加,弹性模量及硬度先增加后降低;氧化层随等温热处理时间和温度的增加逐渐增厚.利用本文提出的多相位角界面断裂韧性试验方法,建立了以应力强度因子为表征参数的TBCs界面失效准则.在假定界面间为粘性接触的条件下,预测了界面承载能力随陶瓷层弹性模量和氧化层厚度的变化趋势.通过热循环实验研究了TBCs-基体体系的热疲劳性能及失效机理.随着热循环高温保温时间的增加,热疲劳寿命先升高后降低,失效模式由界面失效转化为界面失效与陶瓷层失效并存;体系的失效由陶瓷层及氧化层的应变能密度、陶瓷层、氧化层及界面的断裂韧性,以及它们和界面微结构缺陷的相互作用共同决定.     

缝纫复合材料单向板面内力学性能的试验研究

对缝纫复合材料单向板在单向拉伸载荷作用下的面内力学性能进行试验研究,给出了缝纫密度、缝纫线直径对复合材料单向板面内拉伸强度的影响规律.研究发现复合材料的破坏模式与缝纫密度有关,对于中低密度缝纫的单向板其破坏模式为纤维断裂,而对于高密度缝纫的单向板其破坏模式为复合材料撕裂破坏.并从复合材料细观结构层次上揭示了破坏模式和拉伸强度与缝纫密度之间的内在关系.     

Effects of adhesive thickness on global and local Mode-I interfacial fracture of bonded joints

The interfacial fracture of adhesively bonded structures is a critical issue for the extensive applications to a variety of modern industries. In the recent two decades, cohesive zone models (CZMs) have been receiving intensive attentions for fracture problems of adhesively bonded joints. Numerous global tests have been conducted to measure the interfacial toughness of adhesive joints. Limited local tests have also been conducted to determine the interface traction-separation laws in adhesive joints. However, very few studies focused on the local test of effects of adhesive thickness on the interfacial traction-separation laws. Interfacial toughness and interfacial strength, as two critical parameters in an interfacial traction-separation law, have important effect on the fracture behaviors of bonded joints. In this work, the global and local tests are employed to investigate the effect of adhesive thickness on interfacial energy release rate, interfacial strength, and shapes of the interfacial traction-separation laws. Basically, the measured laws in this work reflect the equivalent and lumped interfacial fracture behaviors which include the cohesive fracture, damage and plasticity. The experimentally determined interfacial traction-separation laws may provide valuable baseline data for the parameter calibrations in numerical models. The current experimental results may also facilitate the understanding of adhesive thickness-dependent interface fracture of bonded joints.     

Mechanical response of multicrystalline thin films in mesoscale field dislocation mechanics

A continuum model of plasticity, Phenomenological Mesoscopic Field Dislocation Mechanics (PMFDM), is used to study the effect of surface passivation, grain orientation, grain boundary constraints, and film thickness on the mechanical response of multicrystalline thin films. The numerical experiments presented in this paper show that a surface passivation layer on thin films introduces thickness dependence of the mechanical response. However, the effect of passivation decreases in films with impenetrable grain boundaries. The orientation of individual grains of the multicrystal also has a significant effect on the mechanical response. Our results are in qualitative agreement with experimental observations. A primary contribution of this work is the implementation of a jump condition that enables the modeling of important limits of grain boundary constraints to plastic flow, independent of ad-hoc constitutive assumptions and interface conditions.     

焊锡材料的应变率效应及其材料模型

采用分离式霍普金森压杆和拉杆实验,研究了含铅Sn37Pb、无铅Sn3.5Ag和Sn3.0Ag0.5Cu3种焊锡材料在600~2200s^{-1}应变率下的力学性能,得到了它们在不同应变率下的应力应变曲线. 根据实验数据建立了3种焊锡材料的应变率无关弹塑性材料模型和率相关Johnson-Cook材料模型,并用于模拟板级电子封装在跌落冲击载荷下焊锡接点的力学行为. 结果表明,高应变率下无铅焊料比含铅焊料对应变率更敏感,其抗拉强度为含铅焊料的1.5倍,其韧性也明显高于含铅焊料;在跌落冲击过程中,焊锡接点经历的应变率可达到1000s^{ -1}左右;给出的率相关Johnson-Cook材料模型能预测出比率无关的弹塑性模型更合理的应力应变结果.