插值矩阵法分析与复合材料界面相交的平面裂纹奇异应力场

提出了用插值矩阵法分析与各向异性材料界面相交的平面裂纹应力奇异性。基于V形切口尖端附近区域位移场渐近展开,将位移场的渐近展开式的典型项代入线弹性力学基本方程,得到关于平面内与复合材料界面相交的裂纹应力奇异性指数的一组非线性常微分方程的特征值问题,运用插值矩阵法求解,获得了平面内各向异性结合材料中与界面以任意角相交的裂纹尖端的应力奇异性指数随裂纹角的变化规律,数值计算结果与已有结果比较表明,本文方法具有很高的精度和效率。     

复合材料Reissner板中与界面相交的裂纹奇异性分析

基于切口尖端附近区域位移场的渐近展开,提出了分析复合材料板中与界面相交的切口应力奇异性的新方法。将位移场渐近展开式的典型项代入弹性板的基本方程,得到关于复合材料板中与界面相交的切口应力奇异性指数的一组非线性常微分方程的特征值;采用变量代换法,将非线性特征问题转化为线性特征问题,并用插值矩阵法求解获得了各向异性结合材料中与界面以任意角相交的裂纹尖端的应力奇异性指数随裂纹角的变化规律;最后将计算结果与现有结果进行对比。结果表明:两种结果吻合较好,表明本文方法是有效的。     

各向同性材料接头和界面相交裂纹应力奇异性特征分析

提出了用插值矩阵法分析各向同性材料接头以及与界面相交的平面裂纹应力奇异性。基于接头和裂纹端部附近区域位移场渐近展开,将位移场的渐近展开式的典型项代入线弹性力学基本方程,得到关于平面内各向同性材料接头以及与两相材料界面相交裂纹应力奇异性指数的一组非线性常微分方程的特征值问题,运用插值矩阵法求解,获得了两相材料平面接头端部应力奇异性指数以及与界面以任意角相交的裂纹尖端的应力奇异性指数随裂纹角的变化规律,数值计算结果与已有结果比较表明,本文方法具有很高的精度和效率。     

纤维端部的界面裂纹分析

基于弹性力学空间轴对称问题的通解,研究了短纤维增强复合材料中纤维端部的轴对称币形和柱形界面裂纹尖端的应力奇异性,得到了裂纹尖端附近的奇异应力场．研究结果表明,这两种轴对称界面裂纹尖端的应力奇异性相同,并且与平面应变状态下相应模型的应力奇异性一致,材料性能对裂纹尖端附近奇异应力场的影响可用三个组合参数描述     

纤维增强复合材料圆柱型界面裂纹分析

以裂纹面上的位错函数为未知量将圆柱型界面裂纹问题化成一组奇异积分方程的求解问题．应用Ｍｕｓｋｈｅｌｉｓｈｖｉｌｉ的奇异积分方程理论，分析了圆柱型界面裂纹尖端应力场．针对裂纹尖端分别存在和不存在接触区两种情况，确定了裂纹尖端应力场的奇异性．利用数值方法计算了圆柱型界面裂纹尖端接触区尺寸对剪应力强度因子的影响．     

层状压电陶瓷致动器中力电耦合场奇异性的数值分析

首先推导了不同压电材料界面裂纹尖端处的扇形区域内包含基本方程、裂纹面D-P边界条件和交界面处边界条件的弱形式。通过假设力电耦合位移场(位移和电势)与到裂纹尖端距离的(λ 1)次方成正比,可以得到一个分析压电材料裂纹尖端处力电耦合场奇异性的特殊的一维有限元列式。该一维有限元列式只需对扇形区域在角度方向上离散,最后的总体方程为一个关于λ的二次特征根方程。探讨了层状压电陶瓷致动器中可能出现奇异力电耦合场的部位的裂纹面边界条件及交界面处边界条件,进而将该一维有限元法进行推广,用于研究了这些部位的力电耦合场的奇异性。通过数值算例与相应的精确解的比较表明该方法是正确的,而且仅用很少单元就可以得到非常精确的结果。     

两相材料界面裂纹的起裂方向及断裂参量研究

采用FRANC2D软件研究了两相材料含界面裂纹的断裂特性。通过在材料界面利用CASCA手动生成界面裂纹并在裂纹尖端附近设置1/4奇异等参元,得到了界面裂纹的复应力强度因子;数值模拟得到了界面裂纹的起裂方向,并分析了界面裂纹的破坏特征。计算结果表明:1/4奇异等参元很好地描述了裂纹尖端场的1/r(1/2)奇异性,FRANC2D软件能够模拟界面裂纹的扩展方向,可以得到界面裂纹尖端的应力场和复应力强度因子,为界面裂纹的断裂特性的进一步分析提供依据。     

层状介质垂直界面有限裂纹问题的积分变换解

层状弹性材料包含垂直于界面有限裂纹时，可运用富里叶变换及引用位错密度函数，导出了反映裂纹尖端奇异性的奇异积分方程组，并使用Ｌｏｂａｔｔｏ－ｃｈｅｂｙｓｈｅｖ方法解此方程组，最后得到裂纹尖端应力强度因子，为检验方法的正确性，对某两层含裂实际结构进行了计算，结果是满意的。     

双材料界面Ⅰ型扩展裂纹尖端的弹黏塑性场

双材料界面中存在材料黏性效应, 对界面裂纹尖端场的分布和界面本身性能 的变化起着重要的影响. 考虑裂纹尖端的奇异性, 建立了双材料界面扩展裂纹尖端的弹黏塑 性控制方程. 引入界面裂纹尖端的位移势函数和边界条件, 对刚性-弹黏塑性界面I型界面 裂纹进行了数值分析, 求得了界面裂纹尖端应力应变场, 并讨论了界面裂纹尖端场随各影响 参数的变化规律. 计算结果表明, 黏性效应是研究界面扩展裂纹尖端场时的一个主要因素, 界面裂纹尖端为弹黏塑性场, 其场受材料的黏性系数、马赫数和奇异性指数控制.     

与界面垂直相交V形切口的边界元分析方法

建立了边界元法计算各向同性结合材料中与界面垂直相交V形切口奇异应力场的分析方法。首先将V形切口尖端附近区域的位移场和应力场用Williams渐近展开式表达,将其代入弹性力学基本方程中,由插值矩阵法获得应力奇异性指数及其对应的位移函数;然后在V形切口尖端区域挖取一个小扇形域,将该扇形区域的位移场表示为有限项奇性指数和特征角函数的线性组合,并对挖去小扇形域后的剩余结构建立边界积分方程;最后将扇形区域位移场表达式和边界积分方程联合求出其切口尖端位移场的组合系数,从而获得各向同性结合材料中与界面垂直相交V形切口尖端的应力强度因子。本文的计算结果与现有结果对比吻合良好,表明了本文方法的有效性。     

Singular behaviour and asymptotic stress field of a crack terminating at a bimaterial interface

A crack terminating at an interface of two dissimilar elastic materials is investigated. It is found that the asymptotic stress field near the crack tip is in general composed of two parts with each part being characterized by one singularity. The detailed relation of the two singularities with the bimaterial properties is given for some special cases of the crack.     

Stress intensity factors of a rectangular crack meeting a bimaterial interface

Using the hypersingular integral equation method based on body force method, a planar crack meeting the interface in a three-dimensional dissimilar materials is analyzed. The singularity of the singular stress field around the crack front terminating at the interface is analyzed by the main-part analytical method of hypersingular integral equations. Then, the numerical method of the hypersingular integral equation for a rectangular crack subjected to normal load is proposed by the body force method, which the crack opening dislocation is approximated by the product of basic density functions and polynomials. Numerical solutions of the stress intensity factors of some examples are given.     

Singular stress field near the edge of interface of bonded dissimilar materials with an interlayer

For bonded dissimilar materials, the free-edge stress singularity usually prevails near the intersection of the free-surface and the interface. When two materials are bonded by using an adhesive, an interlayer develops between the two bonded materials. When a ceramic and a metal are bonded, the residual stress develops because of difference in the coefficient of thermal expansion. An interlayer may be inserted between the two materials to defuse the residual stress. Stress field near the intersection of the interface and free-surface in the presence of the interlayer is then very important for evaluating the strength of bonded dissimilar materials.In this study, stress distributions on the interface of bonded dissimilar materials with an interlayer were calculated by using the boundary element method to investigate the effect of the interlayer on the stress distribution. The relation between the free-edge singular stress fields of bonded dissimilar materials with and without an interlayer was investigated numerically. It was found that the influence of the interlayer on the stress distributions was confined within a small area of the order of interlayer thickness around the intersection of the interface and the free-surface when the interlayer was very thin. The stress distribution near the intersection of the interface and the free-surface was controlled by the free-edge stress singularity of the bonded dissimilar materials without the interlayer. In this case, the interlayer can be called free-edge singularity-controlled interlayer. If a stress distribution on the interface is known for one thickness of an interlayer h, stress distributions on the interface for other values of h can be estimated.     

Stress intensity factor for an edge crack in two bonded dissimilar materials under convective cooling

The transient thermal stress crack problem for two bonded dissimilar materials subjected to a convective cooling on the surface containing an edge crack perpendicular to the interface is considered. The problem is solved using the principle of superposition and the uncoupled quasi-static thermoelasticity. The crack problem is formulated by applying the transient thermal stresses obtained from the uncracked medium with opposite sign on the crack surfaces to be the only external loads. Fourier integral transform is used to solve the perturbation problem resulting in a singular integral equation of Cauchy type in which the derivative of the crack surface displacement is the unknown function. The numerical results of the stress intensity factors are calculated for both the edge crack and the crack terminating at the interface using two different composite materials and illustrated as a function of time, crack length, coefficient of heat transfer, and the thickness ratio.     

Anti-plane shear crack normal to and terminating at the interface of two bonded piezoelectric ceramics

The electroelastic analysis of two bonded dissimilar piezoelectric ceramics with a crack perpendicular to and terminating at the interface is made. By using Fourier integral transform, the associated boundary value problem is reduced to a singular integral equation with generalized Cauchy kernel, the solution of which is given in closed form. Results are presented for a permeable crack under anti-plane shear loading and in-plane electric loading. Obtained results indicate that the electroelastic field near the crack tip in the homogeneous piezoelectric ceramic is dominated by a traditional inverse square-root singularity, while the electroelastic field near the crack tip at the interface exhibits the singularity of power law r^−α, r being distance from the interface crack tip and α depending on the material constants of a bi-piezoceramic. In particular, electric field has no singularity at the crack tip in a homogeneous solid, whereas it is singular around the interface crack tip. Numerical results are given graphically to show the effects of the material properties on the singularity order and field intensity factors.     

多重应力奇异性及其强度系数的数值分析方法

以具有两个应力奇异性次数的平面问题为例,提出了一种利用普通的数值分析结果确定奇异点附近多重应力奇异性的各阶次数以及相应的应力强度系数的数值分析方法,计算实例表明,本方法可以精确地求得各阶应力奇异性的次数,并且可以很方便地应用外插法确定出对应的应力强度系数。     

Investigation of the behavior of a griffith crack at the interface between two dissimilar orthotropic elastic half-planes for the opening crack mode

The behaviors of an interface crack between dissimilar orthotropic elastic halfplanes subjected to uniform tension was reworked by use of the Schmidt method. By use of the Fourier transform, the problem can be solved with the help of two pairs of dual integral equations, of which the unknown variables are the jumps of the displacements across the crack surfaces. Numerical examples are provided for the stress intensity factors of the cracks. Contrary to the previous solution of the interface crack, it is found that the stress singularity of the present interface crack solution is of the same nature as that for the ordinary crack in homogeneous materials. When the materials from the two half planes are the same, an exact solution can be otained.     

The collinear crack problem for an orthotropic functionally graded coating–substrate structure

A theoretical treatment of antiplane crack problem of two collinear cracks on the two sides of and perpendicular to the interface between a functionally graded orthotropic strip bonded to an orthotropic homogeneous substrate is put forward. Various internal cracks and crack terminating at the interface and crack crossing the interface configurations are investigated, respectively. The problem is formulated in terms of a singular integral equation with the crack face displacement as the unknown variable. The asymptotic stress field near the tip of a crack crossing the interface is examined, and it is shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case, the “kink” in material property at the interface does not introduce any singularity. Numerical calculations are carried out, and the influences of the orthotropy and nonhomogeneous parameters and crack interactions on the mode III stress intensity factors are investigated.     

Interface crack problems for mode Ⅱ of double dissimilar orthotropic composite materials

The fracture problems near the interface crack tip for mode Ⅱ of double dissimilar orthotropic composite materials are studied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized bi-harmonic equations,the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions,a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about himaterial engineering parameters. According to the uniqueness theorem of limit,both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same,the stress singularity exponents,stress intensity factors and stresses for mode Ⅱ crack of the orthotropic single material are obtained.