人体静电放电对有机发光二极管的影响

研究了静电放电（ESD）人体模式（HBM）下的脉冲应力对有机发光二极管（OLED）的性能及寿命的影响,并讨论了相应的物理机制。对比分析了4组OLED在施加ESD放电为0,200,800,1 600 V前后的电学和光学特性,并进行了相应的寿命测试分析。研究发现,OLED器件的光谱对ESD不敏感,随着冲击电压的增大,由于静电打击对载流子的短期抑制效应,OLED的亮度出现轻微下降。在静电冲击电压为200 V和800 V时,伏安特性没有发生变化;当静电冲击电压增至1 600 V时,反向漏电有明显增加。后续的加速寿命实验表明,静电打击对器件的工作寿命没有明显的规律性影响,但是会一定程度提高非本质老化失效的概率。     

人体模式静电对GaN基蓝光LED载流子运动及其可靠性的影响

对GaN基蓝光发光二极管(LED)分别施加-400,-800,-1 200,-1 500 V的反向人体模式静电打击,每次静电打击后,测量LED样品电学参数和光学参数的变化,从理论上分析了静电对LED可靠性的影响。实验发现:对GaN基蓝光LED进行人体模式下的静电打击后,其I-V特性曲线发生变形,光通量减小,老化时性能衰减的速率加快,这是由于受静电打击后在LED芯片内部产生了二次缺陷和熔融通道。对LED在不同温度下进行了I-V特性曲线的测量。实验结论认为未受静电打击的LED中浅能级离化占主导地位,受静电打击的LED中深能级离化占主导地位。静电引起的失效机理可以概述为二次缺陷和熔融通道的产生、深浅能级载流子的运动和辐射复合、非辐射复合之间的转变等因素引起的LED性能退化。     

人体模式静电放电对GaN基大功率发光二极管特性的影响

对GaN基大功率蓝光发光二极管(LED)分别施加了-200,-400,-600,-800,-1100和-1500V的反向人体模式静电打击,每次静电打击后,测量样品电学参数和光学参数的变化,研究了静电对LED可靠性的影响,并从理论上分析了相关衰减机理.结果表明,在-200,-400,-600和-800V的打击后,有明显的...     

基于电容和电导特性分析GaN蓝光发光二极管老化机理

采用正向交流小信号方法测试和分析老化前后GaN发光二极管（LED）的电容-电压特性,结合串联电阻、理想因子、隧穿电流参数讨论负电容以及电导变化情况.基于L-V曲线定性分析老化前后负电容的阈值电压,老化之后样管的受主浓度降低,辐射复合概率下降,大量缺陷以及非辐射复合中心出现,对载流子俘获作用增强,造成负电容降低.反向偏压以及小正向偏压下,隧穿效应导致老化之后样管的电导增大;正向偏压大于2.2 V区域,考虑串联电阻效应,老化后样管电导减小.在分析LED电容-电压、光输出、电学特性曲线与老化机理基础上,通过实验论证以及理论解释表明,负电容以及电导特性可作为分析LED老化特性的参考依据. 关键词： GaN发光二极管 负电容 电导 老化机理     

载流子分布对GaN基LED频率特性的影响

分别在直流偏置和交流偏置下,对大功率GaN基LED的电学和光学特性进行了研究。结果显示,通过改变靠近p型层的量子垒（也就是最后一个量子垒）中的In组分可以调控有源区中的载流子分布。有源区内积累的电子会引起负电容效应。而通过降低有源区量子垒的势垒高度,可以改善LED中载流子传输特性,并实现载流子复合速率及通信调制带宽20%的提高。这个工作将有助于理解GaN基LED中载流子分布对频率特性的影响,并为设计适用于可见光通信的大功率高速LED奠定基础。     

激光剥离技术实现垂直结构GaN基LED

为改善GaN基发光二极管(Light-emitting diode,LED)的电学特性和提高其输出光功率,采用激光剥离技术,在KrF准分子激光器脉冲激光能量密度为400mJ/cm2的条件下,将GaN基LED从蓝宝石衬底剥离,结合金属熔融键合技术,在300℃中将GaN基LED转移至高电导率和高热导率的硅衬底,制备出了具有垂直结构的GaN基LED,并对其电学和光学特性进行了测试。结果表明:在110mA注入电流下,垂直结构器件的开启电压由普通结构的3.68V降低到了3.27V;在560mA注入电流下,器件输出光功率没有出现饱和现象;采用高电导率和高热导率的硅衬底能有效地改善GaN基LED的电学和光学特性。     

载流子分布对GaN基LED频率特性的影响（英文）

分别在直流偏置和交流偏置下,对大功率GaN基LED的电学和光学特性进行了研究。结果显示,通过改变靠近p型层的量子垒(也就是最后一个量子垒)中的In组分可以调控有源区中的载流子分布。有源区内积累的电子会引起负电容效应。而通过降低有源区量子垒的势垒高度,可以改善LED中载流子传输特性,并实现载流子复合速率及通信调制带宽20%的提高。这个工作将有助于理解GaN基LED中载流子分布对频率特性的影响,并为设计适用于可见光通信的大功率高速LED奠定基础。     

功率型白光LED光学特性退化分析

将GaN基蓝光芯片涂敷YAG荧光粉和透明硅胶制成额定功率为1 W的白光发光二极管(LED),对其施加900mA的电流应力,在老化过程中测量白光LED的主要光学参数,考察其光学特性的退化情况。经过4 200 h的老化,样品光通量退化为初始值的15%~18% 。样品的漏电流明显增大,表明芯片有源区缺陷密度提高,但光谱分布图中蓝光部分的辐射量未减少,仅观察到黄光部分辐射量的减少,推断出YAG荧光粉的转换效率降低。同时,从原理上分析了样品色温逐渐增大,显色指数基本不变的原因,对大功率白光LED在照明领域的应用有一定的借鉴意义。     

衬底弯曲度对GaN基LED芯片性能的影响

利用低压MOCVD系统在弯曲度值不同的蓝宝石衬底上生长了GaN基LED外延结构并制作芯片。测量了芯片的主要电学和光学参数,并分析了衬底弯曲度值对芯片性能的影响。分析结果表明:存在弯曲度的衬底预先弛豫了外延层中的部分应力,改善了外延层的质量,从而提高了LED芯片的性能。随着衬底弯曲度值的逐渐增加,下层GaN对有源层中InGaN材料的压应力作用不断减小,导致芯片的主波长逐渐发生蓝移。     

GaN基白光发光二极管失效机理分析

对小功率白光GaN基发光二极管(LED)在室温、40 ℃和70 ℃下进行温度加速老化寿命实验,通过对老化前后不同时间段器件的电学、光学和热学特性进行测量来分析器件的失效机理,着重分析器件的芯片和荧光粉的失效机理.器件老化前后的I-V特性表明:老化过程中,器件的串联电阻和低正向偏压下的隧道电流增大,这是由于器件工作时其芯片的欧姆接触退化和半导体材料的缺陷密度升高而引起的.器件的热特性表明:高温度应力下器件的热阻迅速变大,封装材料迅速退化,这是器件退化的主要原因;光谱曲线表明温度加速了器件的     

InGaN/GaN多量子阱蓝光发光二极管老化过程中的光谱特性

系统地研究了小注入电流(＜4 mA)下InGaN/GaN多量子阱结构蓝光发光二极管的发光光谱特性在老化过程中的变化。对比老化前后的电致发光(EL)光谱,发现在注入电流1 mA下的峰值波长(peak wavelength)和半高宽(FWHM)随老化时间增加而减小,变化过程分两个阶段：前期(＜100 h)减小速度较快,而后逐渐变缓,呈现出与LEDs的发光光功率一致的变化规律,说明LEDs的等效极化电场在老化过程中减弱,这一变化和量子阱内缺陷的增加有明确的关系。通过电学特性测量发现同一结电压(V_j=1.8 V)下的结电容C_j和由交流小信号I—V方法计算得到的注入电流1 mA下的结电压V_j随老化时间增加而增大,明确了在同等小注入电流下量子阱内的载流子浓度随老化过程增加。分析表明在老化过程中InGaN/GaN 多量子阱结构蓝光发光二极管量子阱内的缺陷及其束缚的载流子数量增加,形成了增强的极化电场屏蔽效应,减弱的等效极化电场导致了量子阱的能带倾斜变小,带边辐射复合能量增大,能态密度增多,对应的发光过程的峰值波长变短(蓝移),半高宽变窄。     

低色温无荧光粉LED光源的可靠性研究

为了对比研究新型低色温无荧光粉LED光源和低色温荧光粉LED光源的可靠性,本文进行了85℃加速老化和温度步进应力实验,测试了各光电参数在老化过程中的变化规律,并分析了有无荧光粉低色温光源的老化衰减机理。实验结果表明,在20 A/cm2工作电流密度、85℃的加速老化条件下,两种类型的光源都表现出很好的稳定性,但随着功率的增加,无荧光粉光源展现出更好的光通量稳定性;随着温度的升高,无荧光粉光源在高达200℃左右仍表现出良好的可靠性,而荧光粉光源则在175℃后出现了明显的光通量衰减和色温升高。电流应力或温度应力提升以后,无荧光粉光源展现出更优异的可靠性。     

Effects of electrical stress on the characteristics and defect behaviors in GaN-based near-ultraviolet light emitting diodes

The degradation mechanism of GaN-based near-ultraviolet (NUV, 320-400 nm) light emitting diodes (LEDs) with low-indium content under electrical stress is studied from the aspect of defects. A decrease in the optical power and an increase in the leakage current are observed after electrical stress. The defect behaviors are characterized using deep level transient spectroscopy (DLTS) measurement under different filling pulse widths. After stress, the concentration of defects with the energy level of 0.47-0.56 eV increases, accompanied by decrease in the concentration of 0.72-0.84 eV defects. Combing the defect energy level with the increased yellow luminescence in photoluminescence spectra, the device degradation can be attributed to the activation of the gallium vacancy and oxygen related complex defect along dislocation, which was previously passivated with hydrogen. This study reveals the evolution process of defects under electrical stress and their spatial location, laying a foundation for manufacture of GaN-based NUV LEDs with high reliability.     

星上定标光源LED长期工作的稳定性

为配合空间相机研制任务,对LED作为星上定标光源的可行性进行了研究。介绍了试验用LED的结构。从理论上分析了深能级的产生对LED发光效率的影响,引入阿仑尼斯模型对LED的衰减进行了分析。根据任务需要,对LED进行了老化试验,利用积分球法测量LED的相对发光强度,定时监测,得到LED发光强度随时间变化的曲线及趋势。根据试验结果,研究和分析了LED长时间工作的稳定性。试验结果显示,老化初期LED相对发光强度变化明显,经过250h的持续工作后,变化趋于平稳。3000h后LED相对发光强度总的衰减量约为3%,期间峰值变化量小于1.5%,满足星上定标的要求。给出了试验过程中LED的衰减情况,作为校正参考。最后根据实验结果对LED的寿命进行了理论的估算。     

Effect of AlGaN interlayer on luminous efficiency and reliability of GaN-based green LEDs on silicon substrate

The effect of AlGaN interlayer in quantum barrier on the electroluminescence characteristics of GaN-based green light emitting diodes(LEDs)grown on silicon substrate was investigated.The results show that AlGaN interlayer is beneficial to improve the luminous efficiency of LED devices and restrain the phase separation of In GaN.The former is ascribed to the inserted AlGaN layers can play a key role in determining the carrier distribution and screening dislocations in the active region,and the latter is attributed to the increased compressive stress in the quantum well.However,when the electrical stress aging tests were performed at a current density of 100 A/cm^2,LED devices with AlGaN interlayers are more likely to induce the generation/proliferation of defects in the active region under the effect of electrical stress,resulting in the reduced light output power at low current density.     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.     

Enhanced ESD properties of GaN-based light-emitting diodes with various MOS capacitor designs

High electrostatic discharge (ESD) protection of GaN-based light-emitting diodes (LEDs) has been developed using a metal–oxide semiconductor (MOS) capacitor. This structure is realized by adopting various metal electrode patterns. The MOS capacitor can be implemented by extending the metal line directly from the p-type electrode to the top surface of an SiO₂-capped n-GaN layer near the vicinity of the n-type electrode. By connecting a MOS capacitor in parallel with the GaN-based LED, the negative ESD strike could be significantly increased from 385 to 1075 V of human body mode (HBM).     

老化产生的深能级对GaP纯绿发光二极管发光效率的影响

测量了GaP纯绿发光二极管老化前后的可见和近红外发光光谱,研究了老化产生的深能级的来源及其对二极管发光效率的影响.在老化后的发光光谱中观测到650nm和1260nm发光带,发现1260nm发光带的发光强度随老化时间的增加而增强.实验结果表明老化产生的与磷相关的深能级严重地影响了GaP纯绿LED的发光效率.