Compositional modulation of CuZn,CuAl and CuNi alloys

A differential reflectometer that is capable of measuring small differences in optical reflectivity or transmissivity of two specimens and therefore enhances the structure in the spectral reflectivity of materials was used to study various α-Cu-Zn, α-Cu-Al, and Cu-Ni alloys with the aim of investigating the changes in band structure as a function of composition. In Cu-Zn and Cu-Al alloys three main absorption peaks were identified that were associated with the Δ₅ → Δ₁, X₅ → X_4' and L_2' → L₁sitions. It was found that the Δ₅→ Δ₁transition increases slightly in energy with increasing Zn or Al concentration. These transitional energies are identical for both alloys in the entire α-phase region. The X₅ → X_4' and L_2' → L₁ transitions decrease in energy with increasing solute concentration. The shift in energy is significantly larger for the Cu-Al system. In Cu-Ni alloys no shift of the absorption edge around 2.2 eV was found, which is consistent with the predictions of the virtual-bound-state model.     

63Cu and65Cu Fourier transform nuclear magnetic resonance studies

⁶³Cu and⁶⁵Cu NMR studies are reported in liquid and solid copper (I) compounds. Ratios ofg _I-factors, nuclear magnetic moments and nuclear magnetic shielding constants in the atomic reference scale are given for⁶³Cu and⁶⁵Cu in a solution of Cu(I)(CH₃CN)₄BF₄ in CH₃CN, which is a reasonable reference sample due to the relatively narrow NMR line.     

Synthesis and thermoelectric properties of Cu excess Cu2ZnSnSe4

Quaternary stannites with an excess of copper were successfully synthesized by reacting the constituent elements and subsequent solid state annealing, followed by densification by hot‐pressing. The composition for each specimen was confirmed with a combination of Rietveld refinement and elemental analysis. Their high temperature thermoelectric properties were measured from 300 K to 800 K and compared with that of Cu₂ZnSnSe₄. The thermal conductivity decreases significantly with increasing Cu content at elevated temperatures due to the crystal structure of this material system. A maximum ZT value of 0.86 was obtained at 800 K for the specimen with the highest Cu content, Cu_2.2Zn_0.8SnSe₄. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

On the Auger-photoelectron coincidence spectroscopy spectra of Cu(100), Cu metal and CuOx/Cu surface

The M₃–VV Auger-photoelectron coincidence spectroscopy (APECS) spectrum of Cu(100) and the L₃–VV APECS spectra of Cu metal and CuOx/Cu surface are analyzed in detail. The narrowing and energy shift of the photoelectron line in the M₃–VV APECS spectrum is well predicted by the present theory. The spectrum shows the presence of the M₂–M₃(V)–VV(V) decay in which a hole in the 4s band hops away prior to the decay of M₃ hole. The analysis of the L₃ photoelectron spectra of Cu metal measured in coincidence with the ³F or ¹G Auger line raises a question concerning the presence of two different core–hole states upon the L₃ level ionization recently proposed by Thurgate and Jiang [Surf. Sci. 466 (2000) L807]. The analysis of the L₃–VV APECS spectrum of CuOx/Cu shows that the final-state charge–transfer interaction plays an important role in CuO.     

Cu nuclear spin-spin relaxation in YBa2Cu3O6.98 and YBa2Cu4O8

We have measured the temperature (T) dependence of the transverse relaxation rate (T _G ^–1 ) of the Cu(1) nuclear spin in YBa₂Cu₃O_6.98 (T _c=92 K) and YBa₂Cu₄O₈ (T _c=82 K). From the scaling ratio ofT _G ^–2 (Cu1) toT _G ^–2 (Cu2), we have estimated the strength of a covalent bonding between the CuO₂ plane and the CuO chain to be B0.38×A _zz. The experimentalT _G ^–1 (Cu1) in YBa₂Cu₄O₈ was of the same order of magnitude as the estimated one fromT _G ^–1 (Cu2). These results appear to indicate that the electrons in the CuO₂ plane fairly spread out of the plane in both compounds.     

Formation and diffusion of S-decorated Cu clusters on Cu(111)

S-decorated Cu trimers are a likely agent of S-enhanced Cu transport between islands on Cu(111). According to ab initio calculations, excellent S bonding to trimer-Cu dangling valence results in an ad- Cu(3)S(3) formation energy of only approximately 0.28 eV, compared to 0.79 eV for a self-adsorbed Cu atom, and a diffusion barrier < or =0. 35 eV.     

Giant Magnetoresistance and Coercivity of electrodeposited multilayered FeCoNi/Cu and CrFeCoNi/Cu

The effect of Cr addition on electrodeposited multilayered nanowires CrFeCoNi/Cu was investigated from a magnetic property perspective: current perpendicular to the plane-Giant Magnetoresistance (CPP-GMR) and Coercivity (BH loops). The magnetic behavior of multilayered nanowires of CrFeNiCo/Cu was also affected by the alloy deposition potential, alloy pulsing time (layer thickness) and number of bilayers. Furthermore, the addition of Cr influenced both the nanowires GMR and Coercivity. Cr addition to the ferromagnetic FeCoNi layer induced a reduction in the room temperature GMR from 10.64% to 5.62%; however, the magnetic saturation field decreased from 0.45 to 0.27 T. The increase in the number of bilayers, from 1000 to 2500, resulted in a higher GMR value, 14.56% with 0.35 T magnetic saturation field. Addition of Cr to the ferromagnetic layer decreased the coercivity from 0.015 to 0.0054 T. Low saturation field CPP-GMR nanowires showing low coercivity at room temperature opens a new door for magnetic sensing devices. To the best of our knowledge, this is the first study on electrodeposited CrFeCoNi/Cu multilayered nanowires.     

Synthesis and magnetic properties of multilayer Ni/Cu and NiFe/Cu nanowires

Highly ordered composite nanowires with multilayer Ni/Cu and NiFe/Cu have been fabricated by pulsed electrodeposition into nanoporous alumina membrane. The diameter of wires can be easily varied by pore size of alumina, ranging from 30 to 100 nm. The applied potential and the duration of each potential square pulse determine the thickness of the metal layers. The nanowires have been characterized by transmission electron microscopy (TEM), magnetic force microscopy (MFM), and vibrating sample magnetometer (VSM) measurements. The MFM images indicate that every ferromagnetic layer separated by Cu layer was present as single isolated domain-like magnet. This technique has potential use in the measurement and application of magnetic nanodevices.     

Di-jet correlation in Au+Au and Cu+Cu Collisions from PHENIX

PHENIX has measured the two-particle azimuth correlation in Au+Au at √s=200 GeV. Jet shape and yield at the away side are found to be strongly modified at intermediate and low p _T, and the modifications vary dramatically with p _T and centrality. At high p _T, away side jet peak reappears but the yield is suppressed. Similar jet strength is found for Au+Au and Cu+Cu collisions with similar number of participant nucleons.     

Vacancy formation and strain in low-temperature Cu/Cu(100) growth

The development of compressive strain in metal thin films grown at low temperature has recently been revealed via x-ray diffraction and explained by the assumption that a large number of vacancies were incorporated into the growing films. The results of our molecular dynamics and parallel temperature-accelerated dynamics simulations suggest that the experimentally observed strain arises from an increased nanoscale surface roughness caused by the suppression of thermally activated events at low temperature combined with the effects of shadowing due to off-normal deposition.     

Detection and formation mechanism of micro-defects in ultrafine pitch Cu Cu direct bonding

In this paper, Cu–Cu interconnects with ultrafine pad pitches of 6 μm, 8 μm, and 15 μm are implemented on the12 inch wafers by a direct bonding process. Defects are not found by traditional non-destructive(NDT) c-mode scanning acoustic microscopy(c-SAM). However, cross sectional observation of bonding interfaces reveals that micro-defects such as micro seams are located at SiO_2 bonding interfaces. In order to examine the micro-defects in the ultra-fine pitch direct bonding process by the NDT technology, a novel "defect-enlarged approach" is proposed. The bonded dies are first annealed in an N_2 oven at 300?C for a few hours and then cooled quickly in air. The c-SAM scanning images show large defects at the place where nothing can be detected by c-SAM before this treatment. Cross sectional observation of the bonding interfaces indicates that these defects consist of large size micro seams at the SiO_2 bonding interface, especially near Cu pads with an ultrafine pitch of 6 μm. However, these large defects disappear after several hours at room temperature, observed by c-SAM. It is inferred that the disappearance of these defects inspected by the "defect-enlarged approach" results from the combination of intrinsic micro seams and "weak" bonds in the silicon oxide layer. Then the underlying physical mechanism of these micro-defects is proposed, which is influenced by Cu pad surface topology and bonding models.     

ACEL ZnS：Cu发光体内的Cu+迁移与发光的老化

众所周知,Cu对ZnS粉末ACEL是不可或缺和不可替代的。因此维持Cu和它的存在形式在ZnS晶粒中的稳定对ACEL的老化致关重要。Cu⁺在ZnS中具有很高的热扩散率,500℃时热扩散系数已达10^-9cm²/s,是各种杂质中热扩散最强的杂质。900℃时几分钟内即可使7~10μm的ZnS晶粒完全激活。Cu_xS具有很强的离子导电特性,在电场作用下表现出很强的Cu⁺迁移特性。由于Cu_xS具有很高的电导率,可视为导体,因此在外电场中ZnS晶粒内的Cu_xS导电线处于等电位状态。与Cu_xS导电线电位不同的所有等位面不能与Cu_xS相交叉而发生扭曲。由于电流的流动方向必须与等位面垂直,所以导致流过ZnS晶粒的大部分电流被汇集到Cu_xS导线上,并且在导电线上的电流密度分布呈两端弱、中间强的状态。因此在电场作用下Cu_xS导电线及其周边可能达到很高温度。如上所述,Cu⁺迁移是必然的,以此可以很好地解释Fischer所观察到的发光线对的老化现象。     

Grain Boundary Motion during Ag and Cu Grain Boundary Diffusion in Cu Polycrystals

Grain boundary (GB) motion in high-purity Cu material (5N8 and 5N Cu) is investigated using the results of radiotracer GB diffusion measurements with tracers exhibiting fundamental differences in the solute-matrix atom interactions. The results on GB solute diffusion of Ag (revealing a miscibility gap in the Ag-Cu phase diagram) and Au (forming intermetallic compounds with Cu) in Cu and on Cu self-diffusion are analyzed.The initial parts of the Ag and Cu penetration profiles turned out to be substantially curved. The profile curvature is explained via the effect of GB motion during ^110m Ag and ⁶⁴Cu GB penetration. The activation enthalpies of GB motion in these two independent measurements occurred to be very close, 95 and 103 kJ/mol, respectively. Moreover, these values turn out to be close, but still somewhat larger than the activation enthalpy of Cu GB self-diffusion in Cu material of the same very high purity, Q ^Cu _gb = 72 kJ/mol. Although tracer diffusion measurements of Au GB diffusion in Cu yielded only limited information on GB motion, the absolute values of GB velocities are consistent with those calculated from the Ag and Cu GB diffusion data.     

X-ray magnetic circular dichroism study of the induced spin polarization of Cu in Co/Cu and Fe/Cu multilayers

We present an x-ray magnetic circular dichroism (XMCD) study of Co/Cu and Fe/Cu multilayers, finding that the Cu atoms in these structures exhibit an induced magnetic moment in the d shell. The average Cu spin moment is shown to fall-off inversely with the thickness of the Cu layer. Further, for comparable Cu layer thicknesses, the Cu moments in Fe/Cu and Co/Cu multilayers are found to be nearly equal, despite the fact that the Cu layers in the Co/Cu multilayers are shown to be fee while those in the Fe/Cu structures are bcc. These observations suggest that the induced moment is primarily situated at the Co/Cu and Fe/Cu interfaces and is resultant from short range chemical hybridization between the ferromagnetic and Cu atoms. Results from a local spin density functional theory are presented and found to be in excellent agreement with experimental observations. These results indicate that the Cu d electrons play a central role in mediating the exchange coupling between successive ferromagnetic layers.