III–V semiconductor interface properties as a knowledge basis for modern heterostructure devices

Some examples of interface studies are reported which show their close link with progress in III–V modern semiconductor device physics and technology. The surface electronic properties investigated in-situ by reflectance anisotropy spectroscopy during InGaP/InP growth (metal-organic vapor-phase epitaxy) are essential for the control of ordering phenomena in these layers, which is relevant for high-performance optoelectronic devices. Studies of electronic interface states at metal/narrow-gap III–V semiconductors are presented, which enabled the successful preparation of semiconductor/superconductor hybrid devices. For group-III nitrides with wurtzite structure the presence of fixed polarization interface charges yields new challenges in order to understand and control Schottky-barrier heights, band offsets and 2D confinement in heterostructure field-effect transistors. Received: 26 April 2001 / Accepted: 23 July 2001 / Published online: 3 April 2002     

Molecular tuning of quantum Hall edge states

Hybrid organic/inorganic devices may find applications as sensors and in futuristic molecular-electronic devices. Here, we demonstrate molecular control of vertical transport in semiconductor superlattices in strong magnetic fields by adsorption of organic molecules onto the sidewalls of a GaAs/AlGaAs device. The molecules have identical attachment groups functionalized by end groups with different electronegativities. For magnetic fields in quantized Hall states, we find that the adsorbate substantially modifies the network of edge states that carries the electrical current. The data indicate that molecules with appropriately chosen end groups can enhance or decrease the vertical conductivity of the edge state system.     

Structural characterization of nickel-titanium film on silicon carbide

The presented work describes behavior of contact structures of Ni/Ti type on 6H-SiC n-type. The best contact resistivity obtained is 3.3 × 10⁻⁴ Ω cm². The structure showed excellent thermal stability, it was stable after being tested for 10 h at 900 °C. XRD analysis after annealing at 960 °C revealed orthorhombic Ni₂Si as the dominate phase.     

Rectification behaviour of molecular layers on Si(111)

Reproducible and strong diode-like behaviour is observed for molecular films of 2,2,6,6-tetramethyl-1-piperidinyloxy (TEMPO) on n-type Si(111)- 7×7 surfaces studied by scanning tunnelling microscopy (STM) and spectroscopy (STS) at 77 K. The mechanism behind the rectification is likely to be related to the electron distribution at the molecule-silicon interface. We suggest that the adsorption of the molecular layer profoundly modifies the electronic structure of the Si(111)- 7×7 surface.     

The conductance and capacitance-frequency characteristics of Au/pyronine-B/p-type Si/Al contacts

The rectifying junction characteristics of the organic compound pyronine-B (PYR-B) film on a p-type Si substrate have been studied. The PYR-B has been evaporated onto the top of p-Si surface. The barrier height and ideality factor values of 0.67 ± 0.02 eV and 2.02 ± 0.03 for this structure have been obtained from the forward bias current-voltage (I-V) characteristics. The energy distribution of the interface states and their relaxation time have been determined from the forward bias capacitance-frequency and conductance-frequency characteristics in the energy range of ((0.42 ± 0.02) − E_v)-((0.66 ± 0.02) − E_v) eV. The interface state density values ranges from (4.21 ± 0.14) × 10¹³ to (3.82 ± 0.24) × 10¹³ cm⁻² eV⁻¹. Furthermore, the relaxation time ranges from (1.65 ± 0.23) × 10⁻⁵ to (8.12 ± 0.21) × 10⁻⁴ s and shows an exponential rise with bias from the top of the valance band towards the midgap.     

Temperature-dependent optical absorption measurements and Schottky contact behavior in layered semiconductor n-type InSe(:Sn)

The layered n-InSe(:Sn) single crystal samples have been cleaved from a large crystal ingot grown from non-stoichiometric melt by the Bridgman-Stockbarger method. It has been made the absorption measurements of these samples without Schottky contact under electric fields of 0.0 and 6000 V cm⁻¹. The band gap energy value of the InSe:Sn has been calculated as 1.36 ± 0.01 eV (at 10 K) and 1.28 ± 0.01 eV (at 300 K) under zero electrical field, and 1.31 ± 0.01 eV (at 10 K) and 1.26 ± 0.01 eV (at 300 K) under 6000 Vcm⁻¹. The current-voltage (I-V) characteristics of Au-Ge/InSe(:Sn)/In Schottky diodes have been measured in the temperature range 80-320 K with a temperature step of 20 K. An experimental barrier height (BH) Φ_ap value of about 0.70 ± 0.01 eV was obtained for the Au-Ge/InSe(:Sn)/In Schottky diode at the room temperature (300 K). An abnormal decrease in the experimental BH Φ_b and an increase in the ideality factor n with a decrease in temperature have been explained by the barrier inhomogeneities at the metal-semiconductor interface. From the temperature-dependent I-V characteristics of the Au-Ge/InSe(:Sn)/In contact, that is, and A^* as 0.94 ± 0.02 and 0.58 ± 0.02 eV, and 27 ± 2 and 21 ± 1 (A/cm² K²), respectively, have been calculated from a modified versus 1/T plot for the two temperature regions. The Richardson constant values are about two times larger than the known value of 14.4 (A/cm² K²) known for n-type InSe. Moreover, in the temperature range 80-320 K, we have also discussed whether or not the current through the junction has been connected with TFE.     

Current-voltage characteristics of Au/GaN/GaAs structure

Au/GaN/n-GaAs structure has been fabricated by the electrochemically anodic nitridation method for providing an evidence of achievement of stable electronic passivation of n-doped GaAs surface. The change of the electronic properties of the GaAs surface induced by the nitridation process has been studied by means of current-voltage (I-V) characterizations on Schottky barrier diodes (SBDs) shaped on gallium nitride/gallium arsenide structure. Au/GaN/n-GaAs Schottky diode that showed rectifying behavior with an ideality factor value of 2.06 and barrier height value of 0.73 eV obeys a metal-interfacial layer-semiconductor (MIS) configuration rather than an ideal Schottky diode due to the existence of GaN at the Au/GaAs interfacial layer. The formation of the GaN interfacial layer for the stable passivation of gallium arsenide surface is investigated through calculation of the interface state density N_ss with and without taking into account the series resistance R_s. While the interface state density calculated without taking into account R_s has increased exponentially with bias from 2.2×10¹² cm⁻² eV⁻¹ in (E_c−0.48) eV to 3.85×10¹² cm⁻² eV⁻¹ in (E_c−0.32) eV of n-GaAs, the N_ss obtained taking into account the series resistance has remained constant with a value of 2.2×10¹² cm⁻² eV⁻¹ in the same interval. This has been attributed to the passivation of the n-doped GaAs surface with the formation of the GaN interfacial layer.     

Short channel effect improved strained-Si:C-source/drain PMOSFETs

The suppression of short channel effect in strained-Si surface channel PMOSFET with carbon incorporation on relaxed SiGe buffers is demonstrated. The lateral diffusion of boron from source/drain into the channels is retarded by a reduction of interstitial formation due to carbon incorporation in the strained-Si layer. It is necessary to avoid the high temperature (>900 °C) process for SiC precipitations as trap centers which are observed by atomic force microscope and X-ray diffraction. An incorporated carbon in the source/drain is not only being stressor but also improves short channel effect for extremely shallow junctions, and makes it possible to have high speed devices.     

On possible spin injection at non-ideal Schottky contacts

The role of the tunneling mechanisms in metal-disordered layer-semiconductor structure under spin injection at the interface is investigated. The non-ideal metal-semiconductor structure as prepared by ionized cluster beam deposition is considered, and it is shown that the depletion region of the semiconductor can be tailored to include a suitably heavily doped region near the interface. The tunneling is described within a simplified model in which the expression for the interface resistance of the metal-disordered layer-semiconductor structure is obtained. It is argued that in the case of ionized cluster beam deposited non-ideal Schottky structure a significant spin injection is achieved.     

Reproducible resistive switching effect for memory applications in heterocontacts based on strongly correlated electron systems

The transitional processes in heterocontacts based on strongly correlated electron systems (SCES) are studied for analyzing of the effect of resistive switching (ERS). It has been shown that the process is asymmetric with respect to switching into “on” and “off” states, the switching time is controlled by a voltage level, this time can be less than microseconds, on the other hand, relaxation processes can reach tens seconds. The switching is controlled by two processes: a change in the resistance state of the normal metal/SCES interface under effect of electric current field and by electrodiffusion of oxygen to vacancies, at that the doping level of the contact area and resistive properties of the heterocontact change. In particular, electrodiffusion of mobile oxygen induced by the electric field makes it possible to use a device with ERS as a memristor. On the other hand, a possibility to control the switching time and ON and OFF parameters show the possibilities to use these devices as memory elements “RAM”.     

Giant magnetoresistance in Co–Al2O3 granular films prepared by self-organized growth

Co–Al₂O₃ granular films with a narrow distribution in cluster size of Co clusters embedded in Al₂O₃ matrix were prepared by sequential deposition based on self-organized growth. Resistivity dependence of giant magnetoresistance (GMR) was studied. The GMR takes a maximum of 5.2% at room temperature and 9.4% at 13 K and 5700 Gs when the resistivity of the sample is 4×10⁵–7×10⁵ μΩ cm. The temperature dependence of resistivities and GMR were discussed especially. A temperature dependence of conductance ρ∼exp[T₁/(T+T₀)] was found, which indicates the dominant conduction mechanism is fluctuation-induced tunneling. A linear relationship of GMR versus T was observed, GMR=a–kT, in applied magnetic field 5700 Gs. The remarkable character of temperature dependence of GMR should be due to the special microstructure that the clusters are monodispersed in the films.     

Temperature dependence of the current-voltage characteristics of the Al/Rhodamine-101/p-Si(1 0 0) contacts

The current-voltage (I-V) characteristics of Al/Rhodamine-101/p-Si/Al contacts have been measured at temperatures ranging from 280 to 400 K at 20 K intervals. A barrier height (BH) value of 0.817 eV for the Al/Rh101/p-Si/Al contact was obtained at the room temperature that is significantly larger than the value of 0.58 eV of the conventional Al/p-Si Schottky diode. While the barrier height Φ_b0 decreases the ideality factors (n) become larger with lowering temperature. The high values of n depending on the sample temperature may be ascribed to decrease of the exponentially increase rate in current due to space-charge injection into Rh101 thin film at higher voltage. Therefore, at all temperatures, it has been seen that the I-V characteristics show three different regions, the ohmic behavior at low voltages, and the space charge limited current with an exponential distribution of traps at high voltages.     

Dielectric and interfacial properties of InP plasma-grown oxides

Methods of dielectric analysis have been employed to investigate the frequency dispersion of InP-oxide dielectric in MOS and MOM devices. The Cole-Cole empirical method has indicated a wide range of relaxation time for the interfacial polarization. This has been interpreted in terms of a model of carrier injection from the gate metal into the oxide gap states. The model is proposed in conjunction with the anomalous hysteresis in the MOM C-V characteristics and could be applied to other MIS systems.Formerly with the department of Engineering, Cambridge University, U.K.     

Spin-injection efficiency and magnetoresistance in a hybrid ferromagnetic-semiconductor trilayer with interfacial barriers

We present a self-consistent model of spin transport in a ferromagnetic (FM)-semiconductor (SC)-FM trilayer structure with interfacial barriers at the FM-SC boundaries. The SC layer consists of a highly doped n²⁺ AlGaAs-GaAs 2DEG while the interfacial resistance is modeled as delta potential (δ) barriers. The self-consistent scheme combines a ballistic model of spin-dependent transmission across the δ-barriers, and a drift-diffusion model within the bulk of the trilayer. The interfacial resistance (R_I) values of the two junctions were found to be asymmetric despite the symmetry of the trilayer structure. Transport characteristics such as the asymmetry in R_I, spin-injection efficiency and magnetoresistance (MR) are calculated as a function of bulk conductivity σ_s and spin-diffusion length (SDL) within the SC layer. In general a large σ_s tends to improve all three characteristics, while a long SDL improves the MR ratio but reduces the spin-injection efficiency. These trends may be explained in terms of conductivity mismatch and spin accumulation either at the interfacial zones or within the bulk of the SC layer.     

Temperature-Dependent Transport Properties in Oxide p-n Junction above Room Temperature

Oxide p-n junctions ofp-SrIn_0.1Ti_0.9O₃/n-SrNb_0.01Ti_0.99O₃ (SITO/SNTO) are fabricated by laser molecular beam epitaxy. The current-voltage characteristics of the SITO/SNTO p-n junction are investigated mainly in the temperature range of 300--400K. The SITO/SNTO junction exhibited good rectifying behaviour over the wholetemperature range. Our results indicate a possibility of application of oxide p-n junction in higher temperatures in future electronic devices.     

Spectroscopy and imaging of metal-organic interfaces using BEEM

Charge injection from metal electrodes to organics is a subject of intense scientific investigation for organic electronics. Ballistic electron emission microscopy (BEEM) enables spectroscopy and imaging of buried interfaces with nanometer resolution. Spatial non-uniformity of carrier injection is observed for both Ag-PPP (poly-paraphenylene) and Ag-MEHPPV (poly-2-methoxy-5-2-ethyl-hexyloxy-1,4-phenylenevinylene) interfaces. BEEM current images are found to correlate only marginally with the surface topography of the Ag film.     

Investigation of the low frequency dispersion of InP-oxide using a new Cole-Cole double-arc distribution

A new relaxation time distribution has been developed for double arc Cole-Cole plots in order to study the dispersion relation of InP-oxide. As suggested by a carrier injection model, the low frequency dispersion most likely originates from remaining In at the interface. The presence of In is a direct consequence of the Al electrode formation where the vapor-deposited electrode reacts with the InPO₄.     

A generalized formula to determine the relaxation time distribution in dielectrics

The distribution of relaxation times is derived for dielectrics with constants featuring general functions in the - plane. A simple algorithm to determine the distribution parameters is also suggested. The algebraic method adopted enables translation of the algorithm into software to facilitate an efficient processing of data. The new distribution developed here could have an effective use in studies of dispersion in dielectrics and interfaces.     

A generalized representation for dielectric dispersion

The generalized formulation for dielectric dispersion is extended for dielectrics exhibiting strongly overlapping arcs in the- complex plane. Subsequently, a novel network representation is developed whereby Negative Impedance Converters (NICs) are employed along with passive R-C elements. Satisfactory agreement is obtained in comparing the experimental results with those calculated using the new formulation.     

Annealing effect on tunneling magnetoresistance in MgO-based magnetic tunnel junctions with FeMn exchange-bias layer

MgO-based magnetic tunnel junctions were fabricated, with a thin pinned CoFeB layer in the unbalanced synthetic antiferromagnet part of the stack FeMn/CoFe/Ru/CoFeB. Inverted and normal tunneling magnetoresistance (TMR) values occur at low and high annealing temperatures (T_a), respectively. The TMR ratio remains inverted up to T_a=300 °C and it becomes normal around T_a=350 °C. The exchange bias of FeMn disappears at high T_a. The sign reversal of the TMR ratio is mainly attributed to the disappearance of the exchange bias due to manganese diffusion during the annealing process.