纤维状填料/HDPE复合体系的导电渗流与流变渗流行为的关系

研究了纤维状导电材料不锈钢纤维(SSF)填充高密度聚乙烯(HDPE)导电复合体系的导电渗流与流变渗流行为之间的关系,并与颗粒状导电颗粒炭黑(CB)/HDPE导电复合体系进行了比较.发现当SSF含量极低(0.3vol%)时,SSF/HDPE体系即发生导电渗流现象,且导电渗流转变区域极窄;而仅当SSF含量达到4.8vol%时,该复合体系才表现出流变渗流现象,这一结果与CB/HDPE体系及纳米级导电纤维填充体系截然不同.此外,通过正温度系数效应的研究发现SSF形成的导电通路稳定性高于CB/HDPE体系.我们认为,SSF/HDPE体系呈现的这些特点均与SSF较大的直径及长径比且其导电通路及流变渗流网络的形成机理不同有关.     

聚丙烯/石墨纳米复合材料的导电性能研究

磨盘碾磨固相剪切复合技术(S3C)是制备聚合物 石墨导电复合材料的有效途径,所得聚丙烯 膨胀石墨复合材料具有纳米插层复合结构,石墨纳米片层的相互搭接可形成导电网络,具有纳米间隙的石墨插层结构可形成隧道电流,从而大幅度降低复合体系的导电逾渗阈值,在低填充量实现聚合物复合材料高电导性,与熔体共混相比,导电逾渗阈值由4 .3vol%降低到0 . 5 5vol% ,在石墨含量为4 .0 1vol%时,电导率提高10个数量级.     

低剪切混合方法制备炭黑/聚丙烯纳米复合材料及其电性能研究

采用一种在低剪切应力场下纳米复合材料的加工方法,制备得到纳米炭黑(CB)粒子在聚丙烯(PP)中以纳米尺度分散的聚合物导电复合材料.扫描电镜观察表明CB粒子在纳米复合材料中以纳米尺度存在,并均匀的分布在PP基体中.电性能测试发现,通过这种低剪切混合方法得到的纳米复合材料具有非常低的导电逾渗阈值(vc=2.49vol%)和较高的临界电阻指数(t=5.82),很大的偏离了普适逾渗理论.基于隧道逾渗模型对体系的电导率进行了模拟,并对CB的分散状态与导电网络的关系进行了分析.发现当纳米CB粒子以纳米尺度分散于基体中时,并不遵从接触导电机理,而是隧道逾渗机理在CB/PP纳米复合材料中起主导作用.     

粒子填充HDPE复合体系动态流变行为研究

研究了炭黑(CB)和石墨(GP)填充高密度聚乙烯(HDPE)复合体系的动态流变行为.发现高填料含量时出现似固体行为,并认为它归因于无机粒子网络逾渗结构的形成.在相同聚合物基体条件下,粒子种类和粒子几何参数(粒子形状、大小、粒径分布)对低频区域流变行为、流变参数的逾渗行为和逾渗阈值(φ_c)有决定性影响,且种类的影响相比于粒子几何参数更为显著.此外,高表面活性及高比表面积(大径厚比、小尺寸)粒子填充体系具有较低的φ_c.     

流变-导电同步测试法研究炭黑填充高密度聚乙烯的等温结晶行为

采用流变-导电同步测试法,研究炭黑(CB)填充高密度聚乙烯(HDPE)在124.3～125.3℃范围的等温结晶行为,发现应变、频率与预降温速率均显著影响等温结晶过程中动态流变与导电行为.动态储能模量(G')与电阻均在结晶过程中发生显著变化.其中,CB粒子在熔体中发生扩散,造成原有逾渗网络结构破坏,导致复合体系电阻在结晶诱导期内增大.随结晶度增加,G'在结晶诱导期附近开始显著增大,其临界时间对应1%～2%相对结晶度;同时,CB粒子在无定形区相互聚集而形成渗流网络结构,使得复合体系电阻显著降低.电阻的变化被认为与CB粒子在熔体中的迁移以及在HDPE晶体生长过程中的聚集行为有关,且比依时性动态流变行为更敏感.     

镍/聚氨酯复合材料的导电网络在拉伸中的演变

一种独特的电性能形变敏感行为—镍/聚氨酯复合材料的电阻率在20%拉伸应变下呈现近6个数量级的降低,导致该行为的填料网络演变机理仍不清晰.针对该现象,本文通过交流阻抗分析考察了2种具有不同拉伸敏感特性的镍/聚氨酯复合材料体系在不同应变下各种微观参数对频率的依赖性.采用尼奎斯特曲线拟合得到的数据及参数计算了团聚体电阻、团聚体之间电阻在拉伸下的变化,以此推测了2种复合材料体系在拉伸时导电网络不同的变化模式.结果表明,对于27.5 vol%填料含量的复合材料,在拉伸时由于团聚体维度发生变化使得逾渗在拉伸下发生,即拉伸逾渗现象.而25 vol%填料含量的复合材料由于填料含量远低于逾渗区域,即使团聚体维度发生变化也没有连续的导电网络产生.本工作为导电高分子复合材料在拉伸时导电网络的变化提供了新的理解,并为拉伸敏感导电高分子复合材料的网络研究提供新的思路.     

加工工艺对气相生长碳纤维填充聚苯乙烯复合体系导电逾渗与动态流变特性的影响

研究了加工工艺对气相生长碳纤维(VGCF)填充聚苯乙烯(PS)复合体系导电逾渗与动态流变特性的影响.结果表明,低转速、短时间混合有利于VGCF形成较为完善的逾渗网络结构,其复合体系逾渗阈值低、导电性能好.使用作者提出的两相模型描述VGCF/PS复合体系的流变特性,发现低转速、短时间(30 r/min、5 min)混合条...     

电响应聚合物薄膜的表面图案化

研究了炭黑(CB)和石墨(GP)填充高密度聚乙烯(HDPE)复合体系的动态流变行为.发现高填料含量时出现似固体行为,并认为它归因于无机粒子网络逾渗结构的形成.在相同聚合物基体条件下,粒子种类和粒子几何参数(粒子形状、大小、粒径分布)对低频区域流变行为、流变参数的逾渗行为和逾渗阈值(φc)有决定性影响,且种类的影响相比于粒子几何参数更为显著.此外,高表面活性及高比表面积(大径厚比、小尺寸)粒子填充体系具有较低的φc.     

加工工艺对炭黑填充聚合物双基体复合材料导电性能的影响

制备了炭黑(CB)填充高密度聚乙烯(HDPE)/乙烯-醋酸乙烯酯共聚物(EVA)双基体复合材料,研究了加料顺序、混合时间对复合材料导电性能的影响.结果表明,CB主要分布在HDPE相中;采用CB首先填充EVA然后与HDPE混合,或采用EVA/HDPE共混物与CB混合的加工策略,均可获得导电性较优的导电复合材料.然而,混合过程显著影响CB填充双基体复合材料的导电性.采用EVA/HDPE共混物与CB混合法加工复合材料,导电性受相形态演化影响较小.     

MWCNTs与疏水纳米SiO_2填充PMMA/PS共混物的导电与动态流变行为

以多壁碳纳米管(MWCNTs)为导电填料、疏水纳米二氧化硅(SiO2)为非导电填料,填充不相容聚甲基丙烯酸甲酯(PMMA)/聚苯乙烯(PS)(1/1,V/V)共混物,制备(PMMA/SiO2)/(PS/MWCNTs)四元导电高分子复合材料(CPC),研究其导电逾渗与动态流变行为,并与PMMA/(PS/MWCNTs)三元CPC进行对比.发现三元、四元CPC具有类似的导电逾渗行为,且逾渗阈值显著低于PS/MWCNTs二元CPC.在四元CPC中,SiO2粒子可细化相区尺寸,提高熔体模量,但不影响熔体热处理过程中的依时性动态导电逾渗行为.MWCNTs与SiO2均显著影响熔体热处理中的依时性模量逾渗行为,分别缩短、延长四元CPC相粗化起始时间,但均延长相粗化时间区间.     

Preparing iPP/HDPE/CB functionally gradient materials: influence factors of components and processing

In this work, gradient materials with low electrical resistivity were prepared by compounding isotactic polypropylene (iPP)/high density polyethylene (HDPE) blends with carbon black (CB) through extruding and injection molding. Contact angle measurements and morphology measurements showed that the CB particles were selectively located in HDPE phase and the final composites had a gradient structure that the HDPE/CB phase exhibited different morphologies in the skin layer and core layer of the composites under different processing procedures. The main factors influencing the formation of the functional gradient materials (FGM), including screw speed during extruding, iPP types and CB contents were discussed. They affect the phase morphology by shear stress, the restoration of HDPE phase, and the viscosity ratio of polymer blends, respectively. In conclusion, iPP/HDPE/CB FGM could be formed easily in the composites blending with the iPP type with narrow molecular weight distribution (MWD) and higher CB content extruded at higher screw speed. The electrical properties of iPP/HDPE/CB composites were studied and the results showed that screw speed in extrusion significantly influenced the percolation curve and electrical property of the final composites. Copyright © 2011 John Wiley & Sons, Ltd.     

Enhancing the conductivity of isotactic polypropylene/polyethylene/carbon black composites by oscillatory shear

The influence of oscillatory shear on the conductivity of the isotactic polypropylene/polyethylene/carbon black composites is studied. It is found that the oscillatory shear under high strain amplitude can enhance the conductivity of the ternary composites with a HDPE/CB concentration in the percolation region. This is related to the fact that the high-strain oscillatory shear can improve the continuity of the conductive HDPE/CB phase in the composites. This finding has not been previously reported, and it may be used in industry to improve the conductivity of the ternary conductive composites with a low filler loading.     

相变过程对等规聚丙烯/炭黑复合材料中填料网络的影响

采用柔和混合方法制备出炭黑(CB)填充等规聚丙烯(iPP)复合材料,CB在iPP熔体中可以进行团聚而形成填料网络,采用动态流变-电阻同步测试的方法,研究原位结晶-熔融过程对所形成网络的影响.实验结果表明,经历原位结晶-熔融后复合材料中可以被动态流变实验检测到的填料网络消失,这是由于结晶和熔融过程中都会影响填料网络结构,而熔融过程中网络的破坏更为显著.相变后网络的重建过程说明,相变过程不能完全破坏熔体中形成的团聚结构,填料网络容易重新形成.     

CB/HDPE导电复合体系中Kerner-Nielson方程修正及电渗流与粘弹渗流的相关性

随着导电填料含量的增加,聚合物导电复合材料的电导率呈现非连续的递增.当填料含量达到渗流阈值并导致渗流现象出现时,导电填料相互聚集并形成网络,体系电导率急剧增大,关于此类电渗流现象已有很多报道^[1～4].填充类导电复合材料的结构和性能与其粘弹性密切相关.近年来,由于炭黑填充使得许多光学方法失效,流变学方法受到了广泛重视.最新的研究发现,非均相结构的出现和演化对浓度的依赖性有着特征流变响应,是一种粘弹渗流现象^[5～7].     

iPP/HDPE/CB复合材料的制备及反常的温度-电阻效应

本文利用普通熔融挤出法制备了iPP/HDPE/CB复合材料, 分别采用注射成型及压制成型方法得到测试试样. 通过研究复合材料体积电阻率随温度的变化, 考察注塑试样和压制试样的PTC特性及复合材料形态结构与试样PTC特性之间的关系.     

Effect of compounding procedure on morphology and crystallization behavior of isotactic polypropylene/high‐density polyethylene/carbon black ternary composites

The effect of compounding procedure on morphology and crystallization behavior of isotactic polypropylene/high‐density polyethylene/carbon black (iPP/HDPE/CB) composite was investigated. iPP/HDPE/CB composites were prepared by four compounding procedures (A: iPP + HDPE + CB; B: iPP/HDPE + CB; C: HDPE/CB + iPP; D: iPP/CB + HDPE). Scanning electron microscopy observation showed that CB particles are mainly distributed in HDPE in all composites, and the phase morphology of composites was obviously affected by a compounding procedure. The size of the HDPE/CB domains in the composites prepared by procedures A and D decreased with the increase in CB content, whereas that of HDPE/CB in the composites prepared by procedures B and C rarely changed with the increase in CB content. The crystallization behaviors of the composites were significantly affected by their phase morphology, which resulted from the variation of compounding procedure. The isothermal crystallization rate of iPP in the composites prepared by procedures A and D was obviously increased, which may originate from the small HDPE/CB droplets dispersed in the iPP phase. The non‐isothermal crystallization curves of composites prepared by procedure D represented two peaks because the iPP component in these composites had the fastest crystallization rate, whereas the curves of composites prepared by other compounding sequences only exhibited one peak. Moreover, the crystallinity of HDPE almost increased by one time with the incorporation of only 1 phr CB because the CB particles selectively located in the HDPE phase, and the crystallinity of HDPE decreased with the further increase of CB content because of the strong restriction of CB on the HDPE chains. Copyright © 2011 John Wiley & Sons, Ltd.     

Relationship between electrical resistivity and particle dispersion state for carbon black filled poly (ethylene-<Emphasis Type="Italic">co</Emphasis>-vinyl acetate)/poly (<Emphasis Type="SmallCaps">L</Emphasis>-lactic acid) blend

It is known that the electrical volume resistivity of insulating polymers filled with conductive fillers suddenly decreases at a certain content of filler. This phenomenon is called percolation. Therefore, it is known that controlling resistivity in the semi-conductive region for carbon black (CB) filled composites is very difficult. When poly (ethylene-co-vinyl acetate) (EVA) is used as a matrix, the percolation curve becomes gradual because CB particles disperse well in EVA. In this study, the relationship between the dispersion state of CB particles and electrical resistivity for EVA/poly (L-lactic acid) (PLLA) filled with CB composite was investigated. The apparent phase separation was seen in the SEM photograph. It was predicted that the CB particles located into the EVA phase in the light of thermodynamical consideration, which was estimated from the wetting coefficient between polymer matrix and CB particles. The total surface area per unit mass of dispersed CB particles in the polymer blend matrix was estimated from small-angle X-ray scattering and the volume resistivity decreased with increasing CB content. The values of the surface area of CB particles in CB filled EVA/PLLA (25/75 wt%) and EVA/PLLA (50/50 wt%) polymer blends showed a value similar to that of the CB filled EVA single polymer matrix. In electrical volume resistivity measurement, moreover, the slopes of percolation curves of EVA/PLLA (25/75 wt%) and EVA/PLLA (50/50 wt%) filled with CB composite are similar to that of EVA single polymer filled with CB composite. As a result, it was found that CB particles selectively locate in the EVA phase, and then the particle forms conductive networks similar to the networks in the case of EVA single polymer used as a matrix.