工业级纳米绒面多晶硅太阳电池的制备及其性能研究

基于产线工艺制备了纳米绒面多晶硅太阳电池,并表征其光电转换性能。研究结果表明：相对传统微米绒坑,纳米绒面能够提升多晶硅太阳电池的短路电流,相应的光电转换效率绝对值提升大于0.4%,产线均值光电转换效率超过了19.1%。结合漫反射光谱和外量子效率测试结果,改进的光电转换的原因归结为纳米绒面能够有效地诱捕短波和长波太阳光子,增强短波和长波太阳光响应。本研究证实纳米绒面多晶硅太阳电池可利用产线工艺制备且具有较高的光电转换效率,能够实现产业化。     

Direct laser printing for high efficiency silicon solar cells fabrication

Silicon solar cells still require cost reduction and improved efficiency to become more competitive. New architectures can provide a significant increase in efficiency, but today most of the approaches need additional fabrication steps. In this context, laser processing offers a unique way to replace technological steps like photolithography that is not compatible with the requirements of the photovoltaic industry. In particular laser induced thermal effects can be used to activate or re-organise dopants at the silicon surface to design new emitter geometries. In this paper dopant diffusion using a nanosecond UV laser on phosphorous-doped silicon emitters is studied. The presence of a phosphosilicate glass underneath a silicon nitride layer leads to a local decrease of the emitter sheet resistance from 100 Ω/sq to 20 Ω/sq. Laser induced damage, phosphorus diffusion profile and electrical shunt are assessed in the perspective of selective emitter silicon solar cells fabrication compatible with electrochemical metal contacts deposition.     

Characteristics of silicon solar cell emitter with a reduced diffused phosphorus inactive layer

The diffusion of phosphorus using a phosphorous oxychloride (POCl₃) source in silicon has been used widely in crystalline silicon solar cells. The thermal diffusion process in the furnace consists of two steps: pre-deposition and drive-in. The phosphorous doping profile via thermal diffusion often exhibits high concentrations in the surface-near emitter, which result in a recombination increase. This layer, called the dead layer, should be inhibited in order to fabricate high efficiency silicon solar cells. In this paper, the amount of the POCl₃ flow rate was varied during the pre-deposition process in order to minimize the dead layer, and the characteristics of the phosphosilicate glass (PSG) and emitter were analyzed. From the secondary ion mass spectroscopy (SIMS) and electrochemical capacitance–voltage profiler (ECV) measurements, the emitter formed using a POCl₃ flow rate of 1000 sccm contained the least amount of inactive dopant and resulted in reasonable performance in the silicon solar cell. As the POCl₃ flow rate increased, the doped silicon wafer included electrically inactive P near the surface, which functions as a defect degrading the electrical performance of the emitter. As a result of this, the removal of the dead layer containing the inactive P was attempted through dipping the doped wafer in a HF solution. After this process, the emitter saturation current density and implied V_oc were improved. The completed solar cells and their external quantum efficiencies at a short wavelength also demonstrated improved performance. A quantitative analysis of the emitter can provide a deeper understanding of methods to improve the electrical characteristics of the silicon solar cell.     

Solar cells with porous silicon: modification of surface-recombination velocity

Laser-induced transient-grating measurements were performed to monitor the influence of porous silicon on the surface recombination of a highly doped n⁺-silicon emitter of solar cells. With this technique, photocarrier diffusion and recombination with a time resolution of some tens of picoseconds can be studied. Using pulses of the second- and third-harmonic radiation from an Nd³⁺:YAG laser (quantum energy 2.34 and 3.51 eV, respectively), two different-depth regions of the emitter were excited. Using a kinetic model, which includes carrier diffusion and recombination at the surface and in the bulk of the emitter, surface-recombination velocities in a series of samples typical for each successive operation of solar-cell technology with different surface-doping level and surface preparation were evaluated. From the analysis, we conclude that porous silicon formed on the emitter passivates the surface of the silicon layer, i.e. reduces the rate of surface recombination at the porous silicon–crystalline silicon interface. Ytterbium as a co-dopant of the emitter increases the surface-recombination velocity. Received: 26 June 2000 / Accepted: 4 December 2000 / Published online: 26 April 2001     

Surface passivation schemes for high‐efficiency n‐type Si solar cells

An effective passivation on the front side boron emitter is essential to utilize the full potential of solar cells fabricated on n‐type silicon. However, recent investigations have shown that it is more difficult to achieve a low surface recombination velocity on highly doped p‐type silicon than on n‐type silicon. Thus, the approach presented in this paper is to overcompensate the surface of the deep boron emitter locally by a shallow phosphorus diffusion. This inversion from p‐type to n‐type surface allows the use of standard technologies which are used for passivation of highly doped n‐type surfaces. Emitter saturation current densities (J_0e) of 49 fA/cm² have been reached with this approach on SiO₂ passivated lifetime samples. On solar cells a certified conversion efficiency of 21.7% with an open‐circuit voltage (V_oc) of 676 mV was achieved. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Efficient implementation of multiple drive-in steps in thermal diffusion of phosphorus for PERC solar cells

N-type phosphorus diffusion in silicon using phosphorus oxychloride, POCl₃, has been widely used in the production of p-type silicon solar cells. The thermal diffusion process in a furnace generally involves two steps: pre-deposition and drive-in. The phosphorous doping by thermal diffusion often shows high surface concentrations, leading to an increase in charge recombination, which should be inhibited in order to fabricate high efficiency silicon solar cells. In this study, we investigate the influence of 3 drive-in steps at sequentially increasing temperatures during the POCl₃ diffusion on the emitter performance. As a result, it was found that the kink region was made shorter while maintaining surface concentration for a good metal contact without losing its passivation quality. This result is attributed to the higher active dopant concentration of the 3 drive-in step samples, leading to a lower series resistance and higher fill factor in the PERC solar cells. The results show that slight changes in the PSG process conditions can contribute to the improvement of high efficiency solar cells.     

Optimized emitter contacting on multicrystalline silicon thin film solar cells

We present an optimized contacting scheme for multicrystalline silicon thin film solar cells on glass based on epitaxially crystallized emitters with a thin Al₂O₃ layer and a silver back reflector. In a first step a 6.5 µm thick amorphous silicon absorber layer is crystallized by a diode laser. In a second step a thin silicon emitter layer is epitaxially crystallized by an excimer laser. The emitter is covered by an Al₂O₃ layer with a thickness ranging from 1.0 nm to 2.5 nm, which passivates the surface and acts as a tunnel barrier. On top of the Al₂O₃ layer a 90–100 nm thick silver back reflector is deposited. The Al₂O₃ layer was found to have an optimal thickness of 1.5 nm resulting in solar cells with back reflector that achieve a maximum open‐circuit voltage of 567 mV, a short‐circuit current density of 27.9 mA/cm², and an efficiency of 10.9%. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

n‐type silicon solar cells with surface‐passivated screen‐printed aluminium‐alloyed rear emitter

Aluminium‐doped p‐type (Al‐p⁺) silicon emitters fabricated by means of a simple screen‐printing process are effectively passivated by plasma‐enhanced chemical‐vapour deposited amorphous silicon (a‐Si). We measure an emitter saturation current density of only 246 fA/cm², which is the lowest value achieved so far for a simple screen‐printed Al‐p⁺ emitter on silicon. In order to demonstrate the applicability of this easy‐to‐fabricate p⁺ emitter to high‐efficiency silicon solar cells, we implement our passivated p⁺ emitter into an n⁺np⁺ solar cell structure. An independently confirmed conversion efficiency of 19.7% is achieved using n‐type phosphorus‐doped Czochralski‐grown silicon as bulk material, clearly demonstrating the high‐efficiency potential of the newly developed a‐Si passivated Al‐p⁺ emitter. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Crystalline silicon solar cells with high resistivity emitter

The paper presents a part of research targeted at the modification of crystalline silicon solar cell production using screen-printing technology. The proposed process is based on diffusion from POCl₃ resulting in emitter with a sheet resistance on the level of 70 Ω/□ and then, shaped by high temperature passivation treatment. The study was focused on a shallow emitter of high resistivity and on its influence on output electrical parameters of a solar cell. Secondary ion mass spectrometry (SIMS) has been employed for appropriate distinguishing the total donor doped profile. The solar cell parameters were characterized by current-voltage characteristics and spectral response (SR) methods. Some aspects playing a role in suitable manufacturing process were discussed. The situation in a photovoltaic industry with emphasis on silicon supply and current prices of solar cells, modules and photovoltaic (PV) systems are described. The economic and quantitative estimation of the PV world market is shortly discussed.     

Effect of surface morphology on screen printed solar cells

Surface texturing is well known as one of the major paths to improving the efficiency of silicon solar cells by increasing the short circuit current through effective photon trapping. However, the effects of the pyramids created after surface texturing on the other properties remain obscure. In this work, we studied the effect of the surface morphologies on the formation of both the emitter layer and metal electrode using the screen printing method, which is a cost-effective method of fabricating silicon solar cells. Various textured surfaces, such as with large, small, sharp or smooth pyramids, were investigated in comparison with a flat surface. The contact resistance was measured from a TLM patterned cell by I–V measurement under dark conditions and SEM, TEM and UV–vis spectrophotometer were used to evaluate the surfaces.     

Light‐induced degradation and regeneration of multicrystalline silicon Al‐BSF and PERC solar cells

Light‐induced degradation (LID) is a well‐known problem faced by p‐type Czochralski (Cz) monocrystalline silicon (mono‐Si) wafer solar cells. In mono‐Si material, the physical mechanism has been traced to the formation of recombination active boron‐oxygen (B–O) complexes, which can be permanently deactivated through a regeneration process. In recent years, LID has also been identified to be a significant problem for multicrystalline silicon (multi‐Si) wafer solar cells, but the exact physical mechanism is still unknown. In this work, we study the effect of LID in two different solar cell structures, aluminium back‐surface‐field (Al‐BSF) and aluminium local back‐surface‐field (Al‐LBSF or PERC (passivated emitter and rear cell)) multi‐Si solar cells. The large‐area (156 mm × 156 mm) multi‐Si solar cells are light soaked under constant 1‐sun illumination at elevated temperatures of 90 °C. Our study shows that, in general, PERC multi‐Si solar cells degrade faster and to a greater extent than Al‐BSF multi‐Si solar cells. The total degradation and regeneration can occur within ～320 hours for PERC cells and within ～200 hours for Al‐BSF cells, which is much faster than the timescales previously reported for PERC cells. An important finding of this work is that Al‐BSF solar cells can also achieve almost complete regeneration, which has not been reported before. The maximum degradation in Al‐BSF cells is shown to reduce from 2% (relative) to an average of 1.5% (relative) with heavier phosphorus diffusion.     

19.4%‐efficient large‐area fully screen‐printed silicon solar cells

We demonstrate industrially feasible large‐area solar cells with passivated homogeneous emitter and rear achieving energy conversion efficiencies of up to 19.4% on 125 × 125 mm² p‐type 2–3 Ω cm boron‐doped Czochralski silicon wafers. Front and rear metal contacts are fabricated by screen‐printing of silver and aluminum paste and firing in a conventional belt furnace. We implement two different dielectric rear surface passivation stacks: (i) a thermally grown silicon dioxide/silicon nitride stack and (ii) an atomic‐layer‐deposited aluminum oxide/silicon nitride stack. The dielectrics at the rear result in a decreased surface recombination velocity of S_rear = 70 cm/s and 80 cm/s, and an increased internal IR reflectance of up to 91% corresponding to an improved J_sc of up to 38.9 mA/cm² and V_oc of up to 664 mV. We observe an increase in cell efficiency of 0.8% absolute for the cells compared to 18.6% efficient reference solar cells featuring a full‐area aluminum back surface field. To our knowledge, the energy conversion efficiency of 19.4% is the best value reported so far for large area screen‐printed solar cells. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

钙钛矿/硅叠层太阳电池中平面a-Si:H/c-Si异质结底电池的钝化优化及性能提高

最近,旋涂法制备的钙钛矿/平面硅异质结高效叠层太阳电池引起人们广泛关注,主要原因是相比于绒面硅衬底制备的钙钛矿/硅叠层太阳电池,其制备工艺简单、制备成本低且效率高.对于平面a-Si:H/c-Si异质结电池, a-Si:H/c-Si界面的良好钝化是获得高转换效率的关键,进而决定了钙钛矿/硅异质结叠层太阳电池的性能.本文主要从硅片表面处理、a-Si:H钝化层和P型发射极等方面展开研究,通过对硅片表面的氢氟酸(HF)浸泡时间和氢等离子体预处理气体流量、a-Si:H钝化层沉积参数、钝化层与P型发射极(I/P)界面富氢等离子体处理的综合调控,获得了相应的优化工艺参数.对比研究了p-a-Si:H和p-nc-Si:H两种缓冲层材料对I/P界面的影响,其中高电导、宽带隙的p-nc-Si:H缓冲层既能够降低I/P界面的缺陷态,又可以增强P型发射层的暗电导率,提高了前表面场效应钝化效果.通过上述优化,制备出最佳的P-type emitter layer/aSi:H(i)/c-Si/a-Si:H(i)/N-type layer (inip)结构样品的少子寿命与implied-Voc分别达到2855μs和709 mV,表现出良好的钝化效果.应用于平面a-Si:H/c-Si异质结太阳电池,转换效率达到18.76%,其中开路电压达到681.5 mV,相对于未优化的电池提升了34.3 mV.将上述平面a-Si:H/c-Si异质结太阳电池作为底电池,对应的钙钛矿/硅异质结叠层太阳电池的开路电压达到1780 mV,转换效率达到21.24%,证明了上述工艺优化能够有效地改善叠层太阳电池中的硅异质结底电池的钝化及电池性能.     

The impacts of LPCVD wrap-around on the performance of n-type tunnel oxide passivated contact c-Si solar cell

In this paper, Tunnel Oxide Passivated Contact (TOPCon) silicon solar cells with the industrial area (244.32 cm²) are fabricated on N-type silicon substrates. Both the ultra-thin tunnel oxide layer and phosphorus doped polycrystalline silicon (polysilicon) thin film are prepared by the LPCVD system. The wrap-around of polysilicon is observed on the surface of borosilicate glass (BSG). The polysilicon wrap-around can form a leakage current path, thus degrades the shunt resistance of solar cells, and leads to the degradation of solar cell efficiency. Different methods are adopted to treat the polysilicon wrap-around and improve shunt resistance of solar cells. The experimental results indicate that a chemical etching method can effectively solve the problem of polysilicon wrap-around and improve the performance of solar cells. Finally, a conversion efficiency of 22.81% has been achieved by our bifacial TOPCon solar cells, with V_oc of 702.6 mV, J_sc of 39.78 mA/cm² and FF of 81.62%.     

Passivation of black silicon boron emitters with atomic layer deposited aluminum oxide

The nanostructured surface – also called black silicon (b‐Si) – is a promising texture for solar cells because of its extremely low reflectance combined with low surface recombination obtained with atomic layer deposited (ALD) thin films. However, the challenges in keeping the excellent optical properties and passivation in further processing have not been addressed before. Here we study especially the applicability of the ALD passivation on highly boron doped emitters that is present in crystalline silicon solar cells. The results show that the nanostructured boron emitters can be passivated efficiently using ALD Al₂O₃ reaching emitter saturation current densities as low as 51 fA/cm². Furthermore, reflectance values less than 0.5% after processing show that the different process steps are not detrimental for the low reflectance of b‐Si. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Investigation of rapid thermal oxide/ silicon nitride passivation stack of n+ emitter

To anticipate the initial phosphorus diffusion parameters of silicon solar cells process fabrication, we report in this paper an overview of our experiments on silicon n⁺-emitters passivation by means of rapid thermal silicon oxide/silicon nitride stack. The process-induced changes have been evaluated and explained. We found that 900 °C and 80 s were the appropriate process parameters to grow 10 nm silicon oxide. Investigation of the effect of this oxidation on n⁺ multicrystalline silicon emitters revealed a large decrease (more than 25%) of the sheet resistance and around 12% increase of the junction depth. The experiments also revealed that the passivation effect of the optimal silicon oxide/silicon nitride stack is efficient only for higher emitter quality. In addition, we found that this stack reduces the surface reflection more than the optimal single silicon nitride layer.     

Efficient interdigitated back‐contacted silicon heterojunction solar cells

We present back‐contacted amorphous/crystalline silicon heterojunction solar cells (IBC‐SHJ) on n‐type substrates with fill factors exceeding 78% and high current densities, the latter enabled by a SiN_x /SiO₂ passivated phosphorus‐diffused front surface field. V_oc calculations based on carrier lifetime data of reference samples indicate that for the IBC architecture and the given amorphous silicon layer qualities an emitter buffer layer is crucial to reach a high V_oc, as known for both‐side contacted silicon heterojunction solar cells. A back surface field buffer layer has a minor influence. We observe a boost in solar cell V_oc of 40 mV and a simultaneous fill factor reduction introducing the buffer layer. The aperture‐area efficiency increases from 19.8 ± 0.4% to 20.2 ± 0.4%. Both, efficiencies and fill factors constitute a significant improvement over previously reported values. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

激光精密刻蚀技术在硅太阳电池制备工艺中的应用

依据光学谐振腔的图解分析与设计方法,对以Nd:YAG固体激光器作光源的激光切割机进行了设计改进,实现了高亮度激光输出.并利用该设备对硅太阳电池进行了激光精密切割试验,使埋栅太阳电池电极槽达到了平均宽度为150±5 μm,槽深100±10 μm的设计指标.在发射结卷包太阳电池所用的硅衬底片上进行激光精密穿孔,目前最小孔径为20 μm.通过应用激光精密刻蚀技术,现将埋栅太阳电池光电转换效率提高到了21%,接近该领域的世界先进水平.     

Analysis of the current linearity at low illumination of high‐efficiency back‐junction back‐contact silicon solar cells

The relation between current and illumination intensity of three structures of high‐efficiency back‐junction back‐contact silicon solar cells was analyzed. Both, n‐type cells with non‐diffused front surface and p‐type cell with floating n‐emitter show a pronounced non‐linearity due to strong illumination dependence of the passivation quality of the non‐diffused surface and the floating junction respectively. Quantum efficiency (QE) of this cell type drops significantly for the illumination lower than 0.5 suns. In contrast the QE of n‐type cells with n⁺‐front surface field (FSF) is linear. Low illumination current characteristics of all three of the analyzed structures could be well described by physical models. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

On the mechanism of potential‐induced degradation in crystalline silicon solar cells

Multicrystalline standard p‐type silicon solar cells, which undergo a potential induced degradation, are investigated by different methods to reveal the cause of the degradation. Microscopic local ohmic shunts are detected by electron‐beam‐induced current measurements, which correlate with the sodium distribution in the nitride layer close to the Si surface imaged by time‐of‐flight secondary ion mass spectroscopy. The results are compatible with a model of the formation of a charge double layer on or in the nitride, which inverts the emitter. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)