640 × 512 pixel narrow-band, four-band, and broad-band quantum well infrared photodetector focal plane arrays

A 9 μm cutoff 640 × 512 pixel hand-held quantum well infrared photodetector (QWIP) camera has been demonstrated with excellent imagery. A noise equivalent differential temperature (NEDT) of 10.6 mK is expected at a 65 K operating temperature with f/2 optics at a 300 K background. This focal plane array has shown background limited performance at a 72 K operating temperature with the same optics and background conditions. In this paper, we discuss the development of this very sensitive long-wavelength infrared camera based on a GaAs/AlGaAs QWIP focal plane array and its performance in quantum efficiency, NEDT, uniformity, and operability. In the second section of this paper, we discuss the first demonstration of a monolithic spatially separated four-band 640 × 512 pixel QWIP focal plane array and its performance. The four spectral bands cover 4–5.5, 8.5–10, 10–12, and 13.5–15 μm spectral regions with 640 × 128 pixels in each band. In the last section, we discuss the array performance of a 640 × 512 pixel broad-band (10–16 μm full-width at half-maximum) QWIP focal plane.     

Development of a 4–15 μm infrared GaAs hyperspectral QWIP imager

In the on-going evolution of GaAs quantum well infrared photodetectors (QWIPs) we have developed a four band, 640 × 512, 23 μm × 23 μm pixel array which we have subsequently integrated with a linear variable etalon (LVE) filter providing over 200 spectral bands across the 4–15.4 μm wavelength region. This effort was a collaboration between NASA’s Goddard Space Flight Center (GSFC), the Jet Propulsion Laboratory (JPL) and the Army Research Laboratory (ARL) sponsored by the Earth Science Technology Office of NASA. The QWIP array was fabricated by graded molecular beam epitaxial (MBE) growth that was specifically tailored to yield four distinct bands (FWHM): Band 1; 4.5–5.7 μm, Band 2; 8.5–10 μm, Band 3; 10–12 μm and Band 4; 13.3–14.8 μm. Each band occupies a swath that comprises 128 × 640 elements. The addition of the LVE (which is placed directly over the array) further divides the four “broad” bands into 209 separate spectral bands ranging in width from 0.02 μm at 5 μm to 0.05 μm at 15 μm. The detector is cooled by a mechanical cryocooler to 46 K. The camera system is a fully reflective, f/4.2, 3-mirror system with a 21° × 25° field of view. The project goals were: (1) develop the 4 band GaAs QWIP array; (2) develop the LVE and; (3) implement a mechanical cryocooler. This paper will describe the efforts and results of this undertaking with emphasis on the overall system characteristics.     

Development of a 1K × 1K, 8–12 μm QWIP array

In the on-going evolution of GaAs quantum well infrared photodetectors (QWIPs) we have developed a 1,024 × 1,024 (1K × 1K), 8–12  μm infrared focal plane array (FPA). This 1 megapixel detector array is a hybrid using an L3/Cincinnati Electronics silicon readout integrated circuit (ROIC) bump bonded to a GaAs QWIP array fabricated jointly by engineers at the Goddard Space Flight Center (GSFC) and the Army Research Laboratory (ARL). We have integrated the 1K × 1K array into an SE-IR based imaging camera system and performed tests over the 50–80 K temperature range achieving BLIP performance at an operating temperature of 57 K. The GaAs array is relatively easy to fabricate once the superlattice structure of the quantum wells has been defined and grown. The overall arrays costs are currently dominated by the costs associated with the silicon readout since the GaAs array fabrication is based on high yield, well-established GaAs processing capabilities. One of the advantages of GaAs QWIP technology is the ability to fabricate arrays in a fashion similar to and compatible with silicon IC technology. The designer’s ability to easily select the spectral response of the material from 3 μm to beyond 15 μm is the result of the success of band-gap engineering and the Army Research Lab is a leader in this area. In this paper we will present the first results of our 1K × 1K QWIP array development including fabrication methodology, test data and imaging capabilities.     

Towards dualband megapixel QWIP focal plane arrays

Mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) 1024 × 1024 pixel quantum well infrared photodetector (QWIP) focal planes have been demonstrated with excellent imaging performance. The MWIR QWIP detector array has demonstrated a noise equivalent differential temperature (NEΔT) of 17 mK at a 95 K operating temperature with f/2.5 optics at 300 K background and the LWIR detector array has demonstrated a NEΔT of 13 mK at a 70 K operating temperature with the same optical and background conditions as the MWIR detector array after the subtraction of system noise. Both MWIR and LWIR focal planes have shown background limited performance (BLIP) at 90 K and 70 K operating temperatures respectively, with similar optical and background conditions. In addition, we have demonstrated MWIR and LWIR pixel co-registered simultaneously readable dualband QWIP focal plane arrays. In this paper, we will discuss the performance in terms of quantum efficiency, NEΔT, uniformity, operability, and modulation transfer functions of the 1024 × 1024 pixel arrays and the progress of dualband QWIP focal plane array development work.     

Uncooled microbolometer detector: Recent developments at Ulis

Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Therefore, to answer these markets, a 35 μm pixel-pitch uncooled IR detector technology has been developed enabling high performance 160 × 120 and 384 × 288 arrays production. Besides a wide-band version from uncooled 320 × 240/45 μm array has been also developed in order to address process control and more precisely industrial furnaces control. The ULIS amorphous silicon technology is well adapted to manufacture low cost detector in mass production. After some brief microbolometer technological background, we present the characterization of 35 μm pixel-pitch detector as well as the wide-band 320 × 240 infrared focal plane arrays with a pixel pitch of 45 μm. Information on the new 640 × 480 array with a pixel pitch of 25 μm is also presented.     

Monolithically integrated near-infrared and mid-infrared detector array for spectral imaging

A multi-band focal plane array sensitive in near-infrared (near-IR) and mid-wavelength infrared (MWIR) is been developed by monolithically integrating a near-infrared (1–1.5 μm) p–i–n photodiode with a mid-infrared (3–5 μm) QWIP. This multiband detector involves both intersubband and interband transitions in III–V semiconductor layer structures. Each detector stack absorbs photons within the specified wavelength band, while allowing the transmission of photons in other spectral bands, thus efficiently permitting multiband detection. Monolithically grown material characterization data and individual detector test results ensure the high quality of material suitable for near-infrared/QWIP dual-band focal plane array.     

Effect of finite pixel size on optical coupling in QWIPs

We study the optical coupling in quantum well photodetectors, focusing on finite size effects. We introduced a finite-element model of the detector and we show experimentally that the optical coupling efficiency is strongly dependent on the pixel size and that in very small detectors diffraction dominates the grating coupling. A 640 × 512 QWIP focal plane array was characterized to show that the optical response of thinned samples may depend on the substrate thickness noticeably. These results are in much closer agreement with predictions obtained with our model than using standard techniques.     

Demonstration of 640 × 512 pixels long-wavelength infrared (LWIR) quantum dot infrared photodetector (QDIP) imaging focal plane array

We have exploited the artificial atom-like properties of epitaxially grown self-assembled quantum dots (QDs) for the development of high operating temperature long wavelength infrared (LWIR) focal plane arrays (FPAs). QD infrared photodetectors (QDIPs) are expected to outperform quantum well infrared detectors (QWIPs) and are expected to offer significant advantages over II–VI material based FPAs. We have used molecular beam epitaxy (MBE) technology to grow multi-layer LWIR dot-in-a-well (DWELL) structures based on the InAs/InGaAs/GaAs material system. This hybrid quantum dot/quantum well device offers additional control in wavelength tuning via control of dot-size and/or quantum well sizes. DWELL QDIPs were also experimentally shown to absorb both 45° and normally incident light. Thus we have employed a reflection grating structure to further enhance the quantum efficiency. The most recent devices exhibit peak responsivity out to 8.1 μm. Peak detectivity of the 8.1 μm devices has reached 1 × 10¹⁰ Jones at 77 K. Furthermore, we have fabricated the first long-wavelength 640 × 512 pixels QDIP imaging FPA. This QDIP FPA has produced excellent infrared imagery with noise equivalent temperature difference of 40 mK at 60 K operating temperature.     

Optimization of corrugated-QWIPs for large format, high quantum efficiency, and multi-color FPAs

Previously, we demonstrated a large format 1024 × 1024 corrugated quantum well infrared photodetector focal plane array (C-QWIP FPA). The FPA has a cutoff at 8.6 μm and is BLIP at 76 K with f/1.8 optics. The pixel had a shallow trapezoidal geometry that simplified processing but limited the quantum efficiency QE. In this paper, we will present two approaches to achieve a larger QE for the C-QWIPs. The first approach increases the size of the corrugations for more active volume and adopts a nearly triangular pixel geometry for larger light reflecting surfaces. With these improvements, QE is predicted to be about 35% for a pair of inclined sidewalls, which is more than twice the previous value. The second approach is to use Fabry–Perot resonant oscillations inside the corrugated cavities to enhance the vertical electric field strength. With this approach, a larger QE of 50% can be achieved within certain spectral regions without using either very thick active layers or anti-reflection coatings. The former approach has been adopted to produce two FPAs, and the preliminary experimental results will be discussed. In this paper, we also describe using voltage tunable detector materials to achieve multi-color capability for these FPAs.     

1/f Noise QWIPs and nBn detectors

The low-frequency noise is a ubiquitous phenomenon and the spectral power density of this fluctuation process is inversely proportional to the frequency of the signal. We have measured the 1/f noise of a 640 × 512 pixel quantum well infrared photodetector (QWIP) focal plane array (FPA) with 6.2 μm peak wavelength. Our experimental observations show that this QWIP FPA’s 1/f noise corner frequency is about 0.1 mHz. With this kind of low frequency stability, QWIPs could unveil a new class of infrared applications that have never been imagined before. Furthermore, we present the results from a similar 1/f noise measurement of bulk InAsSb absorber (lattice matched to GaSb substrate) nBn detector array with 4.0 μm cutoff wavelength.     

Detector and readout performance goals for quantum well and strained layer superlattice focal plane arrays imaging under tactical and strategic backgrounds

Advancements in III–V semiconductor based, Quantum-well infrared photodetector (QWIP) and Type-II Strained-Layer Superlattice detector (T2SLS) technologies have yielded highly uniform, large-format long-wavelength infrared (LWIR) QWIP FPAs and high quantum efficiency (QE), small format, LWIR T2SLS FPAs. In this article, we have analyzed the QWIP and T2SLS detector level performance requirements and readout integrated circuit (ROIC) noise levels for several staring array long-wavelength infrared (LWIR) imaging applications at various background levels. As a result of lower absorption QE and less than unity photoconductive gain, QWIP FPAs are appropriate for high background tactical applications. However, if the application restricts the integration time, QWIP FPA performance may be limited by the read noise of the ROIC. Rapid progress in T2SLS detector material has already demonstrated LWIR detectors with sufficient performance for tactical applications and potential for strategic applications. However, significant research is needed to suppress surface leakage currents in order to reproduce performances at pixel levels of T2SLS FPAs.     

Quantum well infrared photodetector simultaneously working in two atmospheric windows

We have demonstrated a two-contact quantum well infrared photodetector (QWIP) exhibiting simultaneous photoresponse in both the mid- and the long-wavelength atmospheric windows of 3–5 μm and of 8–12 μm. The structure of the device was achieved by sequentially growing a mid-wavelength QWIP part followed by a long-wavelength QWIP part separated by an n-doped layer. Compared with the conventional dual-band QWIP device utilizing three ohmic contacts, our QWIP is promising to greatly facilitate two-color focal plane array (FPA) fabrication by reducing the number of the indium bumps per pixel from three to one just like a monochromatic FPA fabrication and to increase the FPA fill factor by reducing one contact per pixel; another advantage may be that this QWIP FPA boasts broadband detection capability in the two atmospheric windows while using only a monochromatic readout integrated circuit. We attributed this simultaneous broadband detection to the different distributions of the total bias voltage between the mid- and long-wavelength QWIP parts.     

640×512制冷探测器非线性响应分析

由于制冷探测器焦平面制作工艺的缺陷,使其各部分组分不会完全相同,从而导致焦平面在进行光电转换时各个位置的光电流大小存在差异.本文以国产640×512中波凝视型制冷热像仪整机研制项目为基础,通过对探测器接收红外辐射并转换为光电流的过程中主要参量与焦平面材料Hg1-xCdxTe中组分x的关系进行分析,推导出探测器焦平面光电流与组分x的关系模型.在探测器能够正常工作的宽温度范围内利用黑体面源对探测器进行照射,采集各个温度点下探测器输出数据,并对本探测器整体响应特性及单个像素点的响应特性进行分析.根据影响光电流的最主要的参量变化情况,提出了双指数曲线模型来描述实际响应数据,并通过大量的数据和图表分析,证明了该模型能够提高对探测器实际响应描述的精确程度,对实际的工程应用具有指导意义.     

Large format voltage tunable dual-band QWIP FPAs

Third generation thermal imagers with dual/multi-band operation capability are the prominent focus of the current research in the field of infrared detection. Dual band quantum-well infrared photodetector (QWIP) focal plane arrays (FPAs) based on various detection and fabrication approaches have been reported. One of these approaches is the three-contact design allowing simultaneous integration of the signals in both bands. However, this approach requires three In bumps on each pixel leading to a complicated fabrication process and lower fill factor.If the spectral response of a two-stack QWIP structure can effectively be shifted between two spectral bands with the applied bias, dual band sensors can be implemented with the conventional FPA fabrication process requiring only one In bump on each pixel making it possible to fabricate large format dual band FPAs at the cost and yield of single band detectors. While some disadvantages of this technique have been discussed in the literature, the detailed assessment of this approach has not been performed at the FPA level yet. We report the characteristics of a large format (640 × 512) voltage tunable dual-band QWIP FPA constructed through series connection of MWIR AlGaAs–InGaAs and LWIR AlGaAs–GaAs multi-quantum well stacks, and provide a detailed assessment of the potential of this approach at both pixel and FPA levels. The dual band FPA having MWIR and LWIR cut-off wavelengths of 5.1 and 8.9 μm provided noise equivalent temperature differences as low as 14 and 31 mK (f/1.5) with switching voltages within the limits applicable by commercial read-out integrated circuits. The results demonstrate the promise of the approach for achieving large format low cost dual band FPAs.     

Optimization of light polarization sensitivity in QWIP detectors

The current development of QWIPs (Quantum Well Infrared Photodetectors) at III–V Lab led to the production of 20 μm pitch, mid-format and full TV-format LWIR starring arrays with excellent performances, uniformity and stability. At the present time III–V Lab, together with TOL (Thales Optronics Ltd.) and SOFRADIR (Société Française de Détecteurs Infrarouges), work on the demonstration of a 20 μm pitch, 640 × 512 LWIR focal plane array (FPA) which detects the incident IR light polarization. Manufactured objects present a strong linear polarization signature in thermal emission. It is of high interest to achieve a detector able to measure precisely the degree of linear polarization, in order to distinguish artificial and natural objects in the observed scene.In this paper, we present a theoretical investigation of the optical coupling in polarization sensitive pixels. The QWIP modeling is performed by the Finite Difference Time Domain (FDTD) method. The aim is to optimize the sensitivity to light polarization as well as the performance of the detector.     

THALES long wave QWIP thermal imagers

THALES have developed for volume manufacture high performance low cost thermal imaging cameras based on the THALES Research Technology (TRT) third generation gallium arsenide long wave QWIP array. Catherine XP provides 768 × 575 CCIR video resolution and Catherine MP provides 1280 × 1024 SXGA video resolution. These compact and rugged cameras provide 24 h passive observation, detection, recognition, identification (DRI) in the 8–12 μm range, providing resistance to battlefield obscurants and solar dazzle, and are fully self contained with standard power and communication interfaces. The cameras have expansion capabilities to extend functionality (for example, automatic target detection) and have network battlefield capability. Both cameras benefit from the high quantum efficiency and freedom from low frequency noise of the TRT QWIP, allowing operation at 75 K, low integration times and non interruptive non uniformity correction. The cameras have successfully reached technology readiness level 6/7 and have commenced environmental qualification testing in order to complete the development programmes. These latest additions to the THALES Catherine family provide high performance thermal imaging at an affordable cost.     

1024 × 1024 Format pixel co-located simultaneously readable dual-band QWIP focal plane

This paper reports the first demonstration of the megapixel-simultaneously-readable and pixel-co-registered dual-band quantum well infrared photodetector (QWIP) focal plane array (FPA). The dual-band QWIP device was developed by stacking two multi-quantum-well stacks tuned to absorb two different infrared wavelengths. The full width at half maximum (FWHM) of the mid-wave infrared (MWIR) band extends from 4.4 to 5.1 μm and the FWHM of a long-wave infrared (LWIR) band extends from 7.8 to 8.8 μm. Dual-band QWIP detector arrays were hybridized with custom fabricated direct injection read out integrated circuits (ROICs) using the indium bump hybridization technique. The initial dual-band megapixel QWIP FPAs were cooled to 70 K operating temperature. The preliminary data taken from the first megapixel QWIP FPA has shown system NEΔT of 27 and 40 mK for MWIR and LWIR bands, respectively.     

High performance two-color one megapixel CMOS ROIC for QWIP detectors

FLIR Systems, Inc. has designed and fabricated the ISC0501 CMOS readout integrated circuit (ROIC) for quantum well infrared photodetectors (QWIPs). The ISC0501 is a two-color 1024 × 1024 format array with a 30 μm pixel pitch. The ROIC contains a separate analog signal path for each wavelength band. Separate signal paths allow the two-colors to have optimized detector biases, integration times, offsets and gains. This architecture also allows both colors to simultaneously sample a scene and readout the pixel data. This paper will describe the interface, design and features of the ROIC as well as a summary of the characterization test results. A sample image is included from a focal plane array (FPA) built by the Jet Propulsion Laboratory (JPL) using the ISC0501 ROIC with QWIP detectors designed by JPL.     

Pixels array matching for optical readout microcantilever array sensing system

An approach based on pixels array matching is proposed for optical readout bimaterial microcantilever focal plane array (FPA) sensing system, by which the CCD's pixel array can match the low resolution FPA properly. Compared with the old method, it has the following three advantages: (1) reduces the impact on the infrared imaging quality due to the bending deformation of the microcantilever pixels; (2) decreases the background noise and lower the infrared imaging system's noise equivalent temperature difference; (3) increases the imaging system's frame rate. A microcantilever FPA infrared imaging system with a programmable smart camera was developed to demonstrate the effectiveness of the approach. In addition, the approach can be applied to a similar optical readout micro-array sensing system whose resolution is lower than the CCD.     

The theory and experiment of very-long-wavelength 256×1 GaAs/Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>As quantum well infrared detector linear arrays

The 256×1 linear array of multiple quantum wells infrared photodetector (QWIP) is designed and fabricated for the peak response wavelength at λ _P = 14.6 μm. The response spectral width is bigger than 2.2 μm. The two-dimensional (2D) diffractive coupling grating has been formed on the top QWIP photosensitive pixel for coupling the infrared radiation to the infrared detective layers. The performance of the device at V _B = 3 V and T = 45 K has the responsibility 4.28×10⁻² (A/W), the blackbody detectivity D _b* = 5.14×10⁹ (cm·Hz^1/2/W), and the peak detectivity D _λ * = 4.24× 10¹⁰ (cm·Hz^1/2/W). The sensor pixels are connected with CMOS read out circuit (ROC) hybridization by indium bumps. When integral time is 100 μs, the linear array has the effective pixel of QWIP FPA N _ef of 99.2%, the average responsibility (V/W) of 3.48×10⁶ (V/W), the average peak detectivity D _λ * of 8.29×10⁹ (cm·Hz^1/2/W), and the non-uniformity U_R of 5.83%. This device is ready for the thermal image application. Supported by the National Natural Science Foundation of China (Grant No. 10374095)