Preparation and Characterization of Nanostructured Ni-TiN Composite Films

在悬浮有TiN纳米颗粒的镍镀液中,采用直流电镀方法制备了Ni-TiN纳米复合镀层. 采用原子力显微镜、X射线衍射仪和透射电镜等手段对镀层结构、表面形貌、耐蚀性能、硬度和热稳定性等进行了研究,并且与传统镍镀层的相应性能进行了比较. 结果表明,复合镀层在耐腐蚀性、硬度和热稳定性等方面都比传统镍镀层有了显著提高;由于电流密度对阴极析氢和镍晶粒的成核/生长速率的影响,Ni-TiN纳米复合镀层的硬度随着电镀电流密度的增加而轻微减小.     

纳米微粒α—Al2O3化学复合镀层分形特性探讨

介绍了纳米微粒α－Ａｌ２Ｏ３化学复合镀层的制备过程及其对镀层硬度、分维度随镀复时间变化的测量结果，并应用分形理论对实验结果给予解释。     

纳米碳管复合凝胶玻璃结构及谱学性能研究

用物理掺杂工艺将纳米碳管引入二氧化硅凝胶玻璃基质,成功制备了纳米碳管复合凝胶玻璃,采用X射线衍射、透射电子显微镜、紫外-可见吸收光谱、红外光谱、拉曼光谱等测试方法对其结构和谱学性能进行了表征。结果表明,通过优化掺杂工艺能够实现纳米碳管与基质的均匀复合,纳米碳管本身的结构在掺杂过程中并未发生改变。纳米碳管的引入对二氧化硅凝胶玻璃基质的紫外-可见吸收光谱和红外光谱未产生显著影响。     

镀层微观结构对凝结换热的影响

通过研究Ni-P化学镀层管不同微观结构对凝结传热的影响,表明用化学镀表面改性的镀管相对于普通的碳钢管,具有明显促进珠状凝结的效果,在凝结过程中表现为珠膜共存状态,可以获得较好的换热性能。同时镀层对换热性能的改善与镀层中纳米相的含量相关,随着纳米相含量的降低,镀层的表面能也随着降低,换热效率得到增强。增加镀层的非晶度可以获得更好的珠状凝结的效果。     

甘氨酸在纳米碳管中的吸附及性质的分子模拟

采用分子力学、分子动力学方法模拟研究了甘氨酸分子在单壁纳米碳管中的吸附和扩散行为 ,并对甘氨酸分子在纳米碳管中的构象和能量进行了优化 .模拟计算结果表明 ,甘氨酸在纳米碳管中的构象发生了伸缩和扭转 ,这种构象的改变将会导致氨基酸生物性能的改变 ;纳米碳管对氨基酸分子具有较强的吸附作用 ,其中纳米碳管和甘氨酸分子之间的π -π相互作用增加了纳米碳管对氨基酸的吸附能 .模拟过程中氨基酸分子和纳米碳管之间的运动会保持很强的协同效应 ,使模拟体系构型在能量上处于最稳定的状态     

钛基底的纳米金刚石掺混纳米碳管的场发射特性

在纳米金刚石场发射的基础上, 研究了纳米金刚石掺混纳米碳管的场发射特性。采用电泳沉积法形成了纳米金刚石与纳米碳管的复合涂层, 经热处理后制备出阴极样品, 然后进行微观表征, 再进行场发射特性测试与发光测试。结果表明, 与未掺混的纳米金刚石阴极样品相比, 复合涂层阴极样品的场发射开启电场明显减小, 场发射电流提高, 在较低的电场下阳极表面荧光粉就可以发光, 但发光不均匀, 出现了"边沿发光"的现象。分析了纳米金刚石掺混纳米碳管场发射性能提高的机理, 是由于纳米碳管掺入之后, 涂层的电子输运能力得到增强, 涂层中有效发射体的数目增加。最后, 解释了"边沿发光"现象的成因。     

高纯单壁纳米碳管大量制备的新方法和工艺条件

在单壁纳米碳管大量制备方面提出了新方法和工艺条件.反复实验及电子显微镜分析表明,利用该方法和工艺条件,可以获得高产量、高纯度单壁纳米碳管.单根给定长度的含有金属的复合石墨阳极与阴极成一定角度在高温氦电弧中放电数分钟,即可获得1.0g以上含有60%左右的单壁纳米碳管的生成物.这为高纯单壁纳米碳管的规模化生产奠定了基础 关键词： 单壁纳米碳管 电弧放电 透射电子显微镜分析     

石墨烯碳纳米管复合结构渗透特性的分子动力学研究

采用经典分子动力学方法研究了压力驱动作用下水在石墨烯碳纳米管复合结构中的渗透特性.研究结果表明,水分子渗透通过石墨烯碳纳米管复合结构的渗透率明显高于石墨烯碳纳米管组合结构.水在石墨烯碳纳米管复合结构中的渗透率随着压强的升高而增大,随着电场强度的增大而减小.考虑了温度和复合结构中双碳管轴心距对水渗透性的影响规律.系统温度越高,水的渗透率越高;随着双碳管轴心距的增加,水的渗透率逐渐降低.通过计算分析水流沿渗透方向的能障分布,解释了各参数变化对水在石墨烯碳管复合结构中渗透特性的影响机理.研究结果将为基于石墨烯碳管复合结构的新型纳米水泵设计提供一定的理论依据.     

纳米碳管阵列场发射电流密度的理论数值优化

以纳米碳管阵列为研究对象,利用镜像悬浮球模型及Fowler-Nordheim电流密度公式,对纳米碳管阵列的场发射电流密度进行计算,进而综合考虑场发射增强因子及场发射电流密度对纳米碳管阵列场发射性能进行定量优化.参考碳管阵列场发射电流密度最大值及场发射增强因子,表明当纳米碳管阵列间距为碳管高度十分之一时,纳米碳管阵列的场发射性能得到优化.与以前的理论估算结果相比,优化的阵列间距进一步减小.当纳米碳管间距过大,场发射增强因子增加,而场发射电流密度会在更大程度上减小;当纳米碳管密度较大时,场发射增强因子受到静电 关键词： 纳米碳管 场发射 增强因子 电流密度     

微孔对单壁纳米碳管储氢性能的影响

用巨正则蒙特卡罗分子模拟方法研究了单壁纳米碳管中的微孔即单壁纳米碳管基本孔-内管腔和管间孔对单壁纳米碳管储氢性能的影响.与低温下氮气吸附实验结果的比较发现单壁纳米碳管的内管腔是吸附的主要位置.分析单壁纳米碳管内管腔中吸附势的叠加和利用效率，发现管径为2nm左右时单壁纳米碳管内管腔的储氢容量最高.当单壁纳米碳管阵列的管间距增加时，单壁纳米碳管的管间孔也会成为有效的氢吸附位. 关键词： Monte Carlo方法 单壁纳米碳管 储氢 微孔     

Preparation of Sn films deposited on carbon nanotubes

In this work carbon nanotubes were first grown on copper substrate by chemical vapor deposition method. The Sn deposits were then deposited on the surface of as-grown carbon nanotubes by three different methods: electroplating, electroless plating and displacing methods. The Sn deposits on CNTs surface were characterized by both scanning electron microscope and field emission scanning electron microscope. The compositions of Sn deposits were analyzed by energy dispersive X-ray spectroscope. The results showed that both electroless plating and displacing deposits can but the electroplating deposits cannot cover on the surface of CNTs. Besides C, Sn, Ni and Pd, the electroless deposits also contain element of oxygen and the displacing deposits also contain elements of copper and oxygen.     

碳纳米管增强镍磷基复合镀层研究

对CVD方法制备的碳纳米管进行表面改性处理，然后在液相中分散，利用化学共沉积方法形成碳纳米管镍磷基复合镀层，研究了碳纳米管表面改性后的红外谱、碳纳米管复合镀层的表面形貌、硬度及摩擦学行为.结果表明：碳纳米管的加入明显地提高镍磷复合镀层的硬度和改善了镍磷复合镀层的摩擦性能.硬度达到946HV，20N载荷时摩擦系数为0.7，增至80N时降为0.6；相同条件下与传统耐磨材料SiC增强的镍磷基复合镀层相比，具有更低的摩擦系数和磨损量. 关键词： 碳纳米管 表面改性 复合镀层 摩擦行为     

Preparation and properties of electroless Ni-P-SiO2 composite coatings

Dispersible SiO₂ nanoparticles were co-deposited with electroless Ni-P coating onto AISI-1045 steel substrates in the absence of any surfactants in plating bath. The resulting Ni-P/nano-SiO₂ composite coatings were heat-treated for 1 h at 200 °C, 400 °C, and 600 °C, respectively. The hardness and wear resistance of the heat-treated composite coatings were measured. Moreover, the structural changes of the composite coatings before and after heat treatment were investigated by means of X-ray diffraction (XRD), while their elemental composition and morphology were analyzed using an energy dispersive spectrometer (EDS) and a scanning electron microscope (SEM). Results show that co-deposited SiO₂ particles contributed to increase the hardness and wear resistance of electroless Ni-P coating, and the composite coating heat-treated at about 400 °C had the maximum hardness and wear resistance.     

Effects of ultrasonic irradiation on the properties of coatings obtained by electroless plating and electro plating

This paper deals with the effects of ultrasonic irradiation on electroless copper coating i.e. metallic deposition on non-conductive substrates and on electroplating on metallic substrates. Ultrasonic irradiation was both applied during activation (surface preparation for the electroless coating) and during plating steps in both cases. Several parameters were monitored, such as plating rates, practical adhesion, hardness, internal stress versus varying acoustic powers and frequencies. Optimum conditions for irradiation time, frequency and power were determined for each step. It appears clearly that ultrasound use affects deposit properties. Then, changes in the coating mechanisms can be discussed, and several parameters will be explored in this paper, to explain enhancement of deposit properties: increase in catalyst specific area, stirring dependence, surface energy evolution, dihydrogen desorption, structure of coating.     

The effect of pH on synthesizing Ni-decorated MWCNTs and its application for Sn-58Bi solder

Nickel-decorated multi-walled carbon nanotubes (Ni-MWCNTs) were synthesized using a colloidal method and an electroless plating method to form Ni nanoparticles on the surface of MWCNTs. The Ni electroless plating process was optimized with solutions at various pH (5, 6, 7, and 8) levels. The Ni-MWCNTs fabricated at pH 7 show the most stable Ni nanoparticles on the surface of the MWNCTs. After optimization of the Ni plating process, the Ni-MWCNTs/Sn-58Bi composite solder were fabricated with varying contents of (0, 0.05, 0.1 and 0.2 wt%) Ni-MWCNTs. The experimental results show that Ni-MWCNTs enhance the mechanical properties of Sn-58Bi solder. The shear strength of Sn-58Bi solder improves by about 14% with 0.1 wt% Ni-MWCNTs. Furthermore, the microstructure evolution after a high temperature storage test shows that Ni-MWCNTs have an effect on grain refining and interrupt growth of the Intermetallic compound layer. The distribution of Ni-MWCNTs could be recognized with the results of EPMA.     

Development of electroless Ni-Zn-P/nano-TiO2 composite coatings and their properties

Ni-Zn-P-TiO₂ composite coatings were successfully obtained on low carbon steel by electroless plating technique. Deposits were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy-dispersive analysis (EDS) studies. The hardness and microstructure of as plated and heat treated Ni-Zn-P and Ni-Zn-P-TiO₂ composite coatings were analyzed. The change in microstructure and higher hardness was noticed for heat treated composite. The corrosion resistance behavior of as plated and heat treated Ni-Zn-P and Ni-Zn-P-TiO₂ coatings was investigated by anodic polarization, Tafel plots and electrochemical impedance spectroscopic (EIS) studies in 3.5 wt% NaCl solution. The composite coating exhibited enhanced corrosion resistance property over Ni-Zn-P coating.     

Study of deposition patterns of plating layers in SiC/Cu composites by electro-brush plating

SiC reinforced copper composite coatings were prepared by electro-brush plating with micron-size silicon carbide (SiC) ranging from 1 to 5 μm on pure copper sheet in this paper. The micro-structural characterizations of SiC/Cu composite coatings were performed by optical microscope and Scanning Electron Microscope (SEM) coupled with spectrometer, to study co-deposition mechanism of SiC/Cu. It was found that there were three different patterns of SiC deposition in plating layers during electro-brush plating process, i.e. the particles could deposit inside copper grains, in grain boundaries, or in holes of the surface. To investigate deposition mechanism of each pattern, size of SiC and copper grains was compared. By comparison of size of copper grains and hard particles, SiC were either wrapped in copper grains or deposited in grain boundaries. Moreover, electro-brush plating layers at different brush velocities and current densities were obtained respectively, to analyze the microstructure evolution of the composite coatings. The hardness of plating layers was measured. The results indicated at the current density of 3 A/dm², the SiC/Cu coating was compact with SiC content at a high level and the hardness reached a maximum.     

The effect of carbon nanotubes on the corrosion and tribological behavior of electroless Ni-P-CNT composite coating

In this study, Ni-P-CNT composite coating was successfully deposited on the surface of copper by electroless plating. X-ray diffraction (XRD) analysis and scanning electron microscopy (SEM) were used to characterize the coatings. The wear behavior of the coatings was investigated using a pin-on-disk test rig and subsequently friction coefficient data were reported. The corrosion behavior of the Ni-P and Ni-P-CNT coated specimen were evaluated through polarization curves and electrochemical impedance spectroscopy (EIS) in 3.5 wt.% NaCl aqueous solution at the room temperature. The results indicated that the incorporation of carbon nanotubes (CNTs) in the coating improved both tribological behavior and corrosion resistance. These improvements have been attributed to superior mechanical properties, unique topological structure and high chemical stability of nanotubes.     

磁场辅助热处理金属化碳纳米管场发射性能

利用化学镀方法对多壁碳纳米管(multi-walled carbon nanotubes,MWNTs)表面金属化镀镍(MWNTs/Ni),采用丝网印刷制备MWNTs/Ni场发射阴极,并在磁场辅助下热处理所得阴极,研究磁场辅助热处理对MWNTs/Ni阴极的场发射性能的影响,经300mT磁场辅助热处理的MWNTs/Ni的场发射阴极开启场强约为0.80V·μm~(-1),场增强因子β约为16068,对单根MWNTs/Ni在磁场中的受力情况进行建模分析,实验结果表明:磁场辅助热处理有助于提高MWNTs/Ni在阴极表面的直立分布,提高了MWNTs/Ni的场发射性能。     

Microstructure and surface mechanical properties of pulse electrodeposited nickel

The surface of carbon steel was modified by electrochemical deposition of Ni in a standard Watt's bath using dc and pulse plating electrodeposition. The aim was to compare the microstructure and surface mechanical properties of the deposit obtained by both techniques. Materials characterization was conducted using field emission scanning electron microscope fitted with scanning transmission electron detector, atomic force microscope and X-ray diffractometer. Nanoindentation hardness, elastic modulus, adhesion, coefficients of friction and wear rates were determined for both dc and pulse electrodeposits. Experimental results indicate that pulse electrodeposition produced finer Ni grains compared to dc plating. Size of Ni grains increased with deposition. Both dc and pulse deposition resulted in grain growth in preferred (2 0 0) orientation. However, presence of Ni (1 1 1) grains increased in deposits produced by pulse deposition. Pulse plated Ni exhibited higher hardness, creep and coefficient of friction and lower modulus of elasticity compared to dc plated Ni.