The effect of etching time of porous silicon on solar cell performance

Porous silicon (PS) layers based on crystalline silicon (c-Si) n-type wafers with (1 0 0) orientation were prepared using electrochemical etching process at different etching times. The optimal etching time for fabricating the PS layers is 20 min. Nanopores were produced on the PS layer with an average diameter of 5.7 nm. These increased the porosity to 91%. The reduction in the average crystallite size was confirmed by an increase in the broadening of the FWHM as estimated from XRD measurements. The photoluminescence (PL) peaks intensities increased with increasing porosity and showed a greater blue shift in luminescence. Stronger Raman spectral intensity was observed, which shifted and broadened to a lower wave numbers of 514.5 cm⁻¹ as a function of etching time. The lowest effective reflectance of the PS layers was obtained at 20 min etching time. The PS exhibited excellent light-trapping at wavelengths ranging from 400 to 1000 nm. The fabrication of the solar cells based on the PS anti-reflection coating (ARC) layers achieved its highest efficiency at 15.50% at 20 min etching time. The I-V characteristics were studied under 100 mW/cm² illumination conditions.     

Optically pumped InGaN/GaN MQW lift-off lasers grown on silicon substrates

Chemical etching and removal of the silicon substrate was used for the creation of optically pumped lift-off InGaN/GaN multiple quantum well (MQW) lasers from heterostructures grown on silicon substrate by MOVPE. Luminescence and laser properties of these heterostructures on silicon substrates as well as those of MQWs lifted-off from their substrate by chemical etching were investigated. The lowest value of the lasing threshold of the lift-off lasers at room temperature was about 205 kW/cm² for a laser wavelength of 463 nm and about 360 kW/cm² for a wavelength of 475 nm. It was shown theoretically that the reduction of internal losses, caused by the absence of absorption in the substrate (resulting from its removal) is most significant for the high order modes having lower values of mirror losses and can lead to a 50% reduction of the threshold (or material gain in InGaN necessary to achieve the threshold).     

Nanoporous silicon fabricated at different illumination and electrochemical conditions

The properties of porous silicon prepared at different illumination and electrochemical conditions were studied. The preparation procedure was based on the electrochemical etching in HF containing electrolyte. In the dissolution of n-type silicon, an external source of light is necessary to obtain a sufficient holes flux density. Here, illumination was applied from the backside of the wafer (the side not immersed in the electrolyte), from topside (the side immersed in the electrolyte), and for the highly doped silicon, etching proceeds without illumination. The electrolyte contains HF in the range 2–50 wt%. The highest current density flows with topside assisted illumination. Backside illumination and etching in the dark resulted in a reduction in the current density. In the dark the current density significantly increased at a higher anodic bias. These conditions gave rise to pores formation with a diameter from 20 nm up to 3 μm. The smallest pore size was obtained for highly doped n-Si (111) wafers, etched without illumination. The present paper confirms the possibility of porous silicon formation in the dark and with backside illumination, these being alternative methods for topside assisted illumination etching methods.     

Annealing and amorphous silicon passivation of porous silicon with blue light emission

The photoluminescence (PL) of the annealed and amorphous silicon passivated porous silicon with blue emission has been investigated. The N-type and P-type porous silicon fabricated by electrochemical etching was annealed in the temperature range of 700-900 °C, and was coated with amorphous silicon formed in a plasma-enhanced chemical vapor deposition (PECVD) process. After annealing, the variation of PL intensity of N-type porous silicon was different from that of P-type porous silicon, depending on their structure. It was also found that during annealing at 900 °C, the coated amorphous silicon crystallized into polycrystalline silicon, which passivated the irradiative centers on the surface of porous silicon so as to increase the intensity of the blue emission.     

镶嵌于多孔硅微腔中8-羟基喹啉铝的窄峰发射

利用浸渍法将8羟基喹啉铝(Alq₃)镶嵌到多孔硅微腔中,制备了多孔硅微腔—Alq₃镶嵌膜,研究了多孔硅微腔对镶嵌其中的Alq₃自发发射的微腔效应,观察到了光谱窄化、发光强度增强等现象。镶嵌于多孔硅微腔中的Alq₃荧光光谱的半峰全宽只有15nm,而非微腔样品,即镶嵌于普通的单层多孔硅中Alq₃荧光谱半峰全宽在85nm以上。并且有微腔时Alq₃发光强度比没有微腔时Alq₃发光强度增强一个数量级。随机改变微腔中Bragg反射镜高折射率层的几何厚度可使高反射区展宽,从而更加有效地抑制了多孔硅本身的发光模,使发光色度更纯,但由于峰值透射率减小,导致共振峰强度有所减小。多孔硅微腔有机镶嵌膜有可能成为进一步发展Alq₃在电致发光器件方面应用的一条新途径。     

Growth of isotopically enriched Si nanowires

The isotopically enriched silicon (²⁸Si) nanowires have been fabricated by using the floating-zone (FZ) melting vapour method. The growth of the nanowires was performed in the top area, 1.52 cm from the floating melting zone (2 mm width) of a raw material bar under a flow of Ar gas. Field emission scanning electron microscopy and transmission electron microscopy analyses revealed that the nanowires of isotopically enriched ²⁸Si crystalline had diameters ranging from 2050 nm and lengths of several hundreds of micrometres. The special structure of the tip of the isotopically enriched ²⁸Si nanowires was observed.     

Nanostructured Au/Si substrate for organic molecule SERS detection

Nanoparticles of noble metals, such as gold and silver, exhibit unique and tunable optical properties on account of their surface plasmon resonance. In particular, gold nanoparticles on silicon substrates are attractive for future nanoscale sensors and optical devices due to their resistance to oxidation and due to their electrical and optical properties. In this study, we developed a nanostructured gold/macroporous silicon (Au/PS) substrate capped with 11-mercaptoundecanoic acid (11-MUA) with ultra-sensitive detection properties achieved in characterization, an approach based on surface-enhanced Raman scattering (SERS). Surface-enhanced Raman scattering allows us to detect substances at a low concentration level and to observe structural details of a thiol molecule bonded to small film thicknesses. Raman measurements were carried out at 514 nm and 785 nm. In order to emphasize the effect of the Si microstructuration on the efficiency of this new substrate (Au/PS) proposed for SERS experiments, the same molecule (11-MUA) was adsorbed on it as well as on gold/atomically flat silicon (Au/Si) and on commercial Klarite (Mesophotonics) substrates. Systematic studies realized by Raman spectroscopy, electron microscopy, and X-ray spectroscopy show the influence of silicon substrate texturing and metallic deposition conditions, including time and temperature on the optical phenomena.     

Stable ultraviolet photoluminescence emission in n-type porous silicon

This very paper is focusing on the investigation of porous silicon preparation with n-type silicon wafer by means of electrochemical anodization in the dark and, particularly, on its stable ultraviolet photoluminescence emission. A lateral electrical potential was applied, for this purpose, on silicon wafers, driving the electrons away and letting holes appear on the surface of the silicon wafer to enhance the electrochemical etching process. Characterizations have been made with scanning electronic microscope, fluorescence spectrophotometer and Fourier transform infrared spectroscope. An ultraviolet photoluminescence emission of 370 nm is found in the as-prepared n-type porous silicon, which seems to be well associated with the formation of oxygen-related species (twofold coordinated silicon defect) during the anodic oxidation. The result characterized by photo-bleaching performance indicates that the ultraviolet photoluminescence emission is so stable—only 7% reduction within 3600 s. Meanwhile the morphology of as-prepared n-type porous silicon is investigated.     

High sensitivity of palladium on porous silicon MSM photodetector

In this work, the nanocrystalline porous silicon (PS) is prepared through the simple electrochemical etching of n-type Si (1 0 0) under the illumination of a 100 W incandescent white light. SEM, AFM, Raman and PL have been used to characterize the morphological and optical properties of the PS. SEM shows uniformed circular pores with estimated sizes, which range between 100 and 500 nm. AFM shows an increase in its surface roughness (about 6 times compared to c-Si). Raman spectra of the PS show a stronger peak with FWHM=4.3 cm⁻¹ and slight blueshift of 0.5 cm⁻¹ compared to Si. The room temperature photoluminescence (PL) peak corresponding to red emission is observed at 639.5 nm, which is due to the nano-scaled size of silicon through the quantum confinement effect. The size of the Si nanostructures is estimated to be around 7.8 nm from a quantized state effective mass theory. Thermally untreated palladium (Pd) finger contact was deposited on the PS to form MSM photodetector. Pd/PS MSM photodetector shows lower dark (two orders of magnitude) and higher photocurrent compared to a conventional Si device. Interestingly, Pd/PS MSM photodetector exhibits 158 times higher gain compared to the conventional Si device at 2.5 V.     

Correlations between microstructure of plasma-modified gold nanoclusters and their optical properties

Gold nanoclusters with diameters up to 50 nm were grown in sandwich structures consisting in 15 nm of plasma deposited silicon nitride, 1 nm of gold grown by sputtering and 15 nm of plasma deposited silicon nitride (SiN/Au/SiN). Previous to the last step, ammonia plasma treatments of the gold surface were carried out with time as the main variable. The resulting structures were analyzed by high resolution transmission electron microscopy and spectroscopic ellipsometry. As a result of plasma treatments, island-like structures of as-grown gold clusters evolve to near spherical-shape features with decreasing diameter as the plasma treatment time rises. Ellipsometric spectra were modeled based on the Bruggeman effective medium approximation and the influence of size and shape of nanoparticles on the optical properties were calculated.     

Porous silicon layers prepared by electrochemical etching for application in silicon thin film solar cells

In this paper, multilayer structures of porous silicon were fabricated by using electrochemical etching and characterized for its optical properties and surface morphology. Samples of monolayer of porous silicon were grown to study the characteristics of porous layer formation with respect to applied current density, etching time and hydrofluoric acid concentrations. Photoluminescence peaks of red emission at wavelength 695 and 650 nm were observed from multilayer porous silicon structures. By atomic force microscopy measurement, hillocks like surface were clearly observed within the host material, which confirmed the formation of pores.     

Photoluminescence studies of porous silicon microcavities

Narrow photoluminescence peaks with a full-width at half-maximum of 14–20 nm are obtained from porous silicon microcavities (PSM) fabricated by the electrochemical etching of a Si multilayer grown by molecular beam epitaxy. The microcavity structure contains an active porous silicon layer sandwiched between two distributed porous silicon Bragg reflectors; the latter were fabricated by etching a Si multilayer doped alternatively with high and low boron concentrations. The structural and optical properties of the PSMs are characterised by scanning electron microscopy and photoluminescence (PL). The wavelength of the narrow PL peaks could be tuned in the range of 700–810 nm by altering the optical constants.     

太阳电池中新腐蚀液实现纳米黑硅表面的一步腐蚀制备

通过引入添加剂,调节腐蚀溶液的pH值,实现了一步法制备黑硅表面. 在取得低表面反射率的同时,减小了黑硅层的腐蚀深度,对于16 min腐蚀的黑硅层,其表面加权平均反射率可达5%(300～1200 nm),但腐蚀深仅约为200 nm. 减小腐蚀深度能够降低黑硅太阳电池的表面复合速率,从而提高太阳电池性能,尤其是开路电压及填充因子. 以新腐蚀液制备的黑硅为衬底,在常规太阳电池产线上制备大面积p-Si黑硅太阳电池,实现了15.63%的转换效率,具有高的开路电压(624.32 mV)和填充因子(77.88%),改进了大面积黑硅太阳电池的性能.     

Micro-photoluminescence of GaN quantum dots embedded in 100 nm wide cylindrical AlN pillars

Individual pillars were etched from a sample embedding a single plane of GaN/AlN quantum dots, deposited by molecular beam epitaxy on a sapphire substrate. Pillars with diameters ranging from 0.1 to 5 μm were fabricated by electron-beam lithography and SiCl₄ reactive ion etching. The PL from a single pillar could be measured by using a confocal microscope, with a spatial resolution of 600 nm. We report an intense PL signal from pillar diameters as small as 0.1 μm at room temperature. By increasing the power of the excitation laser from 0.05 to 200 μW, we induced a blue-shift of the PL energy peak from 2.38 to 2.86 eV, accompanied by a substantial broadening of the PL line. This is explained by the photo-induced screening of the internal electric field, which is close to 10 MV/cm in GaN/AlN heterostructures. Finally we report and tentatively explain a photodarkening effect, i.e., the progressive decrease of the PL intensity over two orders of magnitude, after one hour of continuous laser excitation. However, this effect does not seem to be correlated to the etching process.     

High-Q factor single mode circular photonic crystal nano-resonator

In this work, the analysis, fabrication and optical characterization of a two-dimensional circular photonic crystal (2D-CPC) nano-resonator based on an air/GaAs/air slab waveguide are presented. Four InAs/InGaAs quantum dots (QDs) stacked layers emitting around 1300 nm at room temperature were embedded in a GaAs waveguide layer grown on an Al_0.7Ga_0.3As layer and GaAs substrate. The patterning of the structure and the membrane release were achieved by using electron beam lithography, ICP plasma etching and selective wet etching of the AlGaAs sacrificial layer. The micro-luminescence spectrum recorded from the fabricated nano-cavity shows a narrow optical transition at the resonance wavelength of about 1282 nm with a FWHM and Q-factor of 6.2 Å and more than 2000, respectively.     

An ultra‐black silicon absorber

An ultra‐black (A > 99%) broadband absorber concept on the basis of a needle‐like silicon nanostructure called Black Silicon is proposed. The absorber comprises Black Silicon established by inductively coupled plasma reactive ion etching (ICP‐RIE) on a highly doped, degenerated silicon substrate. Improved absorbers also incorporate an additional oxide capping layer on the nanostructures and reach an absorptance of A > 99.5% in the range of 350 to 2000 nm and A ∼ 99.8% between 1000 and 1250 nm. Fabrication of the absorbers is consistent with CMOS standards and requires no lithography. (Picture: Kasper, Friedrich‐Schiller‐University Jena)     

Transport properties of nanoperforated Nb thin films

Porous silicon, obtained by electrochemical etching, has been used as a substrate for the growth of nanoperforated Nb thin films. The films, deposited by UHV magnetron sputtering, inherited from the Si substrates their structure, made of holes of 10 nm diameter and of 20 and 40 nm spacing, which provide an artificial pinning lattice. Commensurability effects between the Abrikosov vortex lattice and the artificial array of holes were investigated by transport measurements.     

NOISE AND SENSITIVITY IN POLYSILICON PIEZORESISTIVE CANTILEVERS

Piezoresistive cantilevers with dimensions of 200×50×1.8μm³ have been fabricated from polycrystalline silicon using reactive ion etching (RIE) and back etching processes. Full Wheatstone bridges have been designed symmetrically on-chip, with two resistors placed on the cantilevers and two resistors on the substrate. The differential measurements of the two cantilevers can reduce the thermal shift of the signal in the system and the external noise in the laboratory. The characteristics of the fabricated cantilevers have been analysed by measuring the noise and the sensitivity. The measured noise spectra show that the 1/f noise is the dominant noise source at low frequencies. With the linear relation between 1/f noise and bias voltages, the Hooge factor (α) was calculated to be 0.0067. The 1/f noise was explained in terms of a lattice scattering model, which occurs in the depletion region of the grains. The displacement sensitivity of the cantilevers ((ΔR)/Rz^-1) was calculated to be 1×10^-6nm^-1 by measuring the resistance change and the vertical deflection of the cantilever. The gauge factor of the piezoresistive cantilever was calculated to be 19. At a 3 V bias voltage and 1000 Hz measurement bandwidth, 1 nm of minimum detectable deflection has been obtained.     

Study of porous silicon structure by Raman scattering

In this paper, the effect of etching time on light emitting porous silicon has been studied by using Raman scattering. Enhancement of Raman intensity by increasing the porosity is observed. Also there is a red shift, about 4 cm⁻¹, from the Raman peak of crystalline silicon to that of porous silicon. The phonon confinement model suggests the existence of spherical nanocrystalline silicon with diameter around 7 nm. But SEM images show that the samples have a sheetlike structure that confines phonons in one dimension. This should not cause any shift in their Raman spectra. It is suggested that the observed Raman peak shift is due to the spherical nanocrystals on the surface of these sheets.     

Defect removal after low temperature annealing of boron implantations by emitter etch‐back for silicon solar cells

Ion implantation offers new possibilities for silicon solar cell production, e.g. single side doping that can be structured in‐situ with shadow masks. While phosphorus implantations can easily be annealed at low temperature, the annealing of boron implantations is challenging. In this study, we use low energy implantations of boron (1 keV and 5 keV) with a projected range of 5.6 nm and 21.2 nm that form defects causing charge carrier recombination after a low temperature anneal (950 °C, 30 min). An ozone‐based wet chemical etching step is applied to remove this near surface damage. With increasing chemical etch‐back the electrical quality (i.e. emitter saturation current density, J_0e) improves continuously. The calculated limit for J_0e was reached with an abrasion of 35 nm for 1 keV and 85 nm for 5 keV implantations, showing that the relevant defects causing charge carrier recombination are located very close to the surface, corresponding to the as‐implanted profile depth. This emitter etch‐back allows for the fabrication of defect free boron doping profiles with good sheet resistance uniformity (standard deviation <2%). With the resulting characteristics (sheet resistance <100 Ω/sq, surface doping concentration >5 × 10¹⁹ cm^–3, J_0e < 30 fA/cm²), these boron profiles are well suited for silicon solar cells. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)