Micro-Raman mapping on layers for crystalline silicon thin-film solar cells

Micro-Raman mappings have been used for characterization of our layers system developed for thin-film silicon solar cells. For the cubic SiC barrier layer a preferential orientation of the grains in 〈1 1 1〉 direction normal to the substrate was revealed. A high density of stacking faults resulted in the splitting of transversal optical (TO)-phonon modes, usually only observed in several non-cubic SiC polytypes. Within the silicon layers, which were obtained by zone melting recrystallization (ZMR) and subsequent epitaxial growth, a high residual stress of about 625 MPa was measured near the boundary towards the SiC layer. Outside of this boundary no residual stress could be detected, in spite of commonly found twin boundaries. Thus the main origin of residual stress in the silicon layers is due to the different expansion coefficients of the respective layers, while grain boundaries have no dominant effect.     

Growth of boron nitride films on w‐AlN (0001), 4° off‐cut 4H‐SiC (0001), W (110) and Cr (110) substrates by Chemical Vapor Deposition

Boron Nitride is a promising group 13–group 15 compound material that exhibits various interesting properties like wide band gap, chemical stability, attractive mechanical properties and other. The growth behavior of this material has not been investigated in sufficient details to tailor properties of the resulting films. In this work we present the results on the growth of turbostratic boron nitride (t‐BN) thin films at a relatively high growth rate of 3 μm/h with the aim to investigate the potential use of boron trichloride in combination with ammonia as precursors for growth. Deposition experiments were conducted in a vertical cold wall high temperature chemical vapor deposition reactor in the temperature range 1000°C–1700°C depending on the substrate used. Templates of w‐AlN (0001), 4° off‐cut 4H‐SiC (0001), Cr (110) and W (110) were employed as substrates for the BN growth. As‐grown BN layers were characterized by Scanning Electron Microscopy, X‐Ray Diffraction, Electron Diffraction and Raman Spectroscopy. The results indicate that temperature and N/B ratio have a great influence on the crystallinity of the deposited films. For AlN and SiC substrates, a temperature of 1600°C and N/B ratio in range between 3 and 7.5 were identified as the best parameters for the growth of a 2 μm thick t‐BN layer with a spacing between basal planes of about 3.36 Å compare to the 3.33 Å spacing between basal planes of hexagonal or rhombohedral BN (h‐BN or r‐BN). For Cr and W substrates which have a lower mismatch with h‐BN (1 and 8.8 %), layers of t‐BN were deposited at much lower temperature (1000°C–1150°C) with a spacing between basal planes of 3.5 Å and morphology similar to that observed on SiC substrates. We obtained t‐BN layers with in plane strong disorder but out of plane orientation (c‐axis normal to the surface).     

Bulk and epitaxial growth of silicon carbide

Silicon carbide (SiC) is a wide bandgap semiconductor having high critical electric field strength, making it especially attractive for high-power and high-temperature devices. Recent development of SiC devices relies on rapid progress in bulk and epitaxial growth technology of high-quality SiC crystals. At present, the standard technique for SiC bulk growth is the seeded sublimation method. In spite of difficulties in the growth at very high temperature above 2300 °C, 150-mm-diameter SiC wafers are currently produced. Through extensive growth simulation studies and minimizing thermal stress during sublimation growth, the dislocation density of SiC wafers has been reduced to 3000–5000 cm⁻² or lower. Homoepitaxial growth of SiC by chemical vapor deposition has shown remarkable progress, with polytype replication and wide range control of doping densities (10¹⁴–10¹⁹ cm⁻³) in both n- and p-type materials, which was achieved using step-flow growth and controlling the C/Si ratio, respectively. Types and structures of major extended and point defects in SiC epitaxial layers have been investigated, and basic phenomena of defect generation and reduction during SiC epitaxy have been clarified. In this paper, the fundamental aspects and technological developments involved in SiC bulk and homoepitaxial growth are reviewed.     

Vapour phase growth of epitaxial silicon carbide layers

After a brief overview of different epitaxial layer growth techniques, the homoepitaxial chemical vapour deposition (CVD) of SiC with a focus on hot-wall CVD is reviewed. Step-controlled epitaxy and site competition epitaxy have been utilized to grow polytype stable layers more than 50 μm in thickness and of high purity and crystalline perfection for power devices. The influence of growth parameters including gas flow, C/Si ratio, growth temperature and pressure on growth rate and layer uniformity in thickness and doping are discussed. Background doping levels as low as 10¹⁴ cm⁻³ have been achieved as well as layers doped over a wide n-type (nitrogen) and p-type (aluminium) range.

Furthermore the status of numerical process simulation is mentioned and SiC substrate preparation is described. In order to get flat and damage free epi-ready surfaces, they are prepared by different methods and characterised by atomic force microscopy and by scanning electron microscope using channelling patterns. For the investigation of defects in SiC high purity CVD layers are grown. The improvement of the quality of bulk crystal substrates by micropipe healing and so-called dislocation stop layers can further decrease the defect density and thus increase the yield and performance of devices. Due to its high growth rate functionality and scope for the use of multi-wafer equipment hot-wall CVD has become a well-established method in SiC-technology and has therefore great industrial potential.     

Experimental investigation of different configurations for the seeded growth of SiC crystals via a VLS mechanism

The growth of SiC crystals or epilayers from the liquid phase has already been reported for many years. Even if the resulting material can be of very high structural quality and the possibility to close micropipes was demonstrated, handling the liquid phase still is a challenge. Moreover, it is highly difficult to stabilize the C dissolution front and then to stabilize the growth front over a long growth time. Based on the Vapour‐Liquid‐Solid (VLS) mechanism, we present a new configuration for the growth of SiC single crystal which should allow first to simplify the liquid handling at high temperature and second to precisely control the crystal growth front. The process consists in a modified top and bottom seeded solution growth method, in which the liquid is held under electromagnetic levitation and fed from the gas phase. 3C‐SiC crystals exhibiting well‐faceted morphology were successfully obtained at 1100‐1200 °C with exceptional growth rates, varying from 1 to 1.5 mm/h in Ti‐Si melt. It was shown that the nucleation density decreases simultaneously with increasing propane partial pressure. At 1200‐1400 °C, thick homoepitaxial 6H‐SiC layers were successfully obtained in Co‐Si and Ti‐Si melts, with growth rate up to 200 µm/h. Large terraces with smooth surfaces are observed suggesting a layer by layer growth mode, and the influence of the system pressure was demonstrated. It was shown that the terrace size decrease simultaneously with increasing propane partial pressure which suggests the beginning of a two dimensional to three dimensional growth mode transition. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Growth surface topography of kaolinite-group minerals and their simulation based on the regular sequence of enantiomorphic layers

The regularities of manifestation of polytypism in a number of kaolinite-group minerals (kaolinite, dickite, halloysite, and nacrite) have been investigated by transmission electron microscopy and vacuum decoration. Growth patterns of elementary layers with a thickness of 7 Å, individual for each polytype, were observed on (001) faces of microcrystals. Specific features of the growth patterns of polytypes have been revealed by comparing them with simulated patterns constructed based on a packing of regularly alternating right- and left-handed (enantiomorphic) kaolinite layers. The new approach to the consideration of the polytypism of kaolinite minerals is substantiated by the absence of symmetry elements in the 7-Å-thick layer, which determines their structure; the formation of enantiomorphic forms of kaolinite; the presence of grazing-reflection planes in the growth patterns; and the structure of polytypes with a two-layer period. Packing of enantiomorphic layers may yield eight structures, two of which correspond to the right- and left-handed forms of kaolinite, one is for dickite, two are for halloysite, and three are for nacrite. It is shown that the simulated and real growth patterns of these minerals are in good correspondence.     

A narrow process window for the preparation of polytypes of microcrystalline silicon carbide thin films by hot-wire CVD method

Effects of deposition conditions on the structure of microcrystalline silicon carbide (μc-SiC) films prepared by hot-wire chemical vapor deposition (hot-wire CVD) method have been investigated. It is found from X-ray diffraction patterns of the film that a diffraction peak from crystallites from hexagonal polytypes of SiC is observed in addition to those of 3 C-SiC crystallites. This result is obtained in the film under a narrow deposition conditions of SiH₃CH₃ gas pressure of 8 Pa, the H₂ gas pressure of 80–300 Pa and the total gas pressure of 40–300 Pa under fixed substrate and filament temperatures employed in this study. Furthermore, the grain size of hexagonal crystallites (about 20 nm) on c-Si substrates becomes larger than that of 3 C-SiC crystallites (about 10 nm) for the films deposited under the total gas pressure of 36–88 Pa. The fact that microcrystalline hexagonal SiC can be deposited under limited deposition conditions could be interpreted in the context of a result for c-SiC polytypes prepared by thermal CVD method.     

Observation of individual dislocations in 6H and 4H SiC by means of back‐reflection methods of X‐ray diffraction topography

SiC crystals of high structural perfection were investigated with several methods of X‐ray diffraction topography in Bragg‐case geometry. The methods included section and projection synchrotron white beam topography and monochromatic beam topography. The investigated 6H and 4H samples contained in large regions dislocations of density not exceeding 10³ cm^‐2. Most of them cannot be interpreted as hollow core dislocations (micro‐ or nano‐pipes). The concentration of the latter was lower than 10² cm^‐2. The present investigation confirmed the possibility of revealing dislocations with all used methods. The quality of presently obtained Bragg‐case multi‐crystal and section images of dislocation enabled analysis based on comparison with numerically simulated images. The analysis confirmed the domination of screw‐type dislocations in the investigated crystals. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Silica films on silicon carbide: a review of electrical properties and device applications

This paper reviews the present knowledge on silica films (SiO₂) on silicon carbide (SiC). First, kinetic of thermal oxidation of SiC is described, and the effects of a great number of parameters (various SiC polytypes, substrate type, substrate orientation…) are discussed. Mainly, thermal oxides grown on SiC are close to stoichiometric silica and the oxidation rate depends on the terminal face of the SiC monocrystal. The next four sections discuss the electrical properties of the oxide, and of the oxide/SiC interface, and especially the effects of materials and technological process on the interface state density and the effective oxide charge (Section 5), and the origin of the interface states are discussed in detail ( Section 6). Oxides grown on n-type SiC have electrical properties (in terms of dielectric strength, leakage currents, interface trap, and oxide charges) measured by means of metal-oxide-semiconductor (MOS) structures, similar to oxides grown on silicon. Until recently, p-type SiC MOS structures have had a large equivalent oxide charge and larger interface state densities in spite of many efforts, compared to silicon MOS structures. It seems nevertheless that recent studies have improved the SiO₂/SiC interfacial quality. Aluminum, carbon and alkali species are the main suspected contaminants. Finally, Section 7 presents the applications of oxide films in SiC-based devices: MOS capacitors and MOS field effect transistors (MOSFETs) for microelectronics, MOSFETs for power electronics, and some applications using silica layers as a passivation layer. In spite of a smaller than required carrier mobility in the inversion layer, MOS field effect transistors (MOSFETs) have been demonstrated to operate up to 650°C and integrated circuits based on NMOS and PMOS technologies have been successfully operated up to 300°C. Vertical power MOSFETs are also of importance but their performances are still limited by a specific on-resistance larger than device requirements. The effect of charges present in the oxide on the electrical properties of high voltage diodes is also briefly discussed.     

Polytypism in MX2 Compounds: A Case of Mixed Equilibrium Phases

Classical polytypism in MX₂-type compounds has been investigated. It has been established that polytypism can be understood, not as the case of independent stacking of A, B, or C layers but in terms of basic structural units, the most stable and only equilibrium phases of the given compounds. Other polytypes are formed only as a result of various equivalent positions that these units can take a given cell height. A criterion to predict whether a given compound would exhibit polytypism is also suggested. Several problems in applying ANNNI and other spin models to polytypism have been pointed out and a modified Hamiltonian is suggested.     

显微激光拉曼光谱法鉴别SiC晶体的多型体结构

利用显微激光拉曼光谱法对掺氮6H-SiC单晶中的寄生多型体进行了鉴别,结果表明其中有4H-SiC和15R-SiC两种寄生多型体.不同SiC多型体的纵光学声子与等离子体激元的耦合模(LOPC模)表明:在掺氮6H-SiC单晶的生长条件下,6H-SiC的掺氮效应与4H-SiC存在明显差别,而与15R-SiC的掺氮效应相似.     

Synthesis of bamboo‐like SiC whiskers from waste silica fume

A process for the utilization of wasted silica fume is proposed in this work. Silicon carbide (SiC) whiskers several tens of micrometers in length and with a bamboo‐like morphology have been successfully synthesized by a carbothermal reduction process using purified silica fume as the silicon source. The morphology and structure of SiC whiskers were investigated by X‐ray diffraction, Raman spectroscopy, scanning electron microscopy, and high‐resolution transmission electron microscopy. Studies found that the as‐synthesized whiskers were grown as single‐crystalline β‐SiC along the (111) growth direction. The whiskers consisted of hexagonal stems randomly decorated with larger‐diameter knots along their whole length. On the basis of the characterization results, a vapor–solid process was discussed as a possible growth mechanism of the β‐SiC whiskers.     

Properties of n-type hydrogenated nanocrystalline cubic silicon carbide films deposited by VHF-PECVD at a low substrate temperature

n-Type hydrogenated nanocrystalline cubic silicon carbide (nc-3C–SiC:H) films have been deposited by very high-frequency plasma-enhanced chemical vapor deposition at a low substrate temperature of about 360 °C to apply this material to the window layer of heterojunction crystalline silicon (HJ-c-Si) solar cells. We investigated the effect of in situ doping on deposition rate, crystalline volume fraction and dark conductivity to optimize properties of the material. We also fabricated HJ-c-Si solar cells with a n-type nc-3C–SiC:H window layer. The solar cells shows high internal quantum efficiency of 0.90 at a wavelength of 400 nm, indicating that n-type nc-3C–SiC:H deposited by VHF-PECVD is a promising candidate of the window layer of HJ-c-Si solar cells.     

Anodic oxide films on silicon carbide

Anodic oxide films were grown on SiC using various electrolytes. The obtained oxide films were compared and some of their electrophysical properties were investigated. Anodic oxidation of SiC was shown to be useful for precise removal of layers as well as for identification of the polar faces of SiC crystals. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Growth of highly oriented crystalline α-Fe/AlN/Fe3N trilayer structures on Si(1 1 1) substrates by molecular beam epitaxy

We have realized highly oriented nitride-based α-Fe/AlN/Fe₃N ferromagnetic hybrid structures on Si(1 1 1) substrates by molecular beam epitaxy using AlN/SiC intermediate layers. A two-step hysteresis loop, typically observed in magnetic tunneling junctions, was clearly observed in magnetization versus magnetic field measurements. This result indicates the formation of ferromagnetic α-Fe and Fe₃N layers separated by 8-nm-thick AlN layers over approximately 1 cm² area, and also shows the difference in coercive field between the two ferromagnetic layers.     

PVT法生长4H-SiC晶体及多型夹杂缺陷研究进展

作为第三代半导体材料的典型代表,碳化硅因具备宽的带隙、高的热导率、高的击穿电场以及大的电子迁移速率等性能优势,被认为是制作高温、高频、高功率以及高压器件的理想材料之一,可有效突破传统硅基功率半导体器件的物理极限,并被誉为带动“新能源革命”的绿色能源器件。作为制造功率器件的核心材料,碳化硅单晶衬底的生长是关键,尤其是单一4H-SiC晶型制备。各晶型体结构之间有着良好的结晶学相容性和接近的形成自由能,导致所生长的碳化硅晶体容易形成多型夹杂缺陷并严重影响器件性能。为此,本文首先概述了物理气相传输(PVT)法制备碳化硅晶体的基本原理、生长过程以及存在的问题,然后针对多型夹杂缺陷的产生给出了可能的诱导因素并对相关机理进行解释,进一步介绍了常见的碳化硅晶型结构鉴别方式,最后对碳化硅晶体研究作出展望。     

4H-SiC晶体表面形貌和多型结构变化研究

利用光学显微镜、显微拉曼光谱仪研究了4H-SiC晶体表面形貌和多型分布.显微镜观察结果显示4H-SiC小面生长螺蜷线呈圆形,沿<11(2-)0>方向容易出现裂缝.裂缝两侧有不同的生长形貌.拉曼光谱结果显示缺陷两侧为不同的晶型,裂缝实际为晶型转化的标志.纵切片观察发现,在4H-SiC和15R-SiC多型交界处产生平行于<11(2-)0>方向裂缝;15R-SiC多型一旦出现,其径向生长方向平行于<11(2-)0>方向,轴向生长方向平行于<000(1-)>方向.     

Growth of AlN films on SiC substrates by RF-MBE and RF-MEE

Epitaxial AlN films have been grown on SiC substrate by molecular beam epitaxy (MBE) and migration-enhanced epitaxy (MEE) using radio frequency (RF) plasma-excited nitrogen. In the RF-MBE growth, the growth rates have been found to be almost constant and the crystal quality improved with increasing the substrate temperature up to 850°C. Further increases of substrate temperature decreased the growth rate and degraded the crystal quality. Using the optimum substrate temperature of 850°C and optimizing the shutter open time, smooth AlN films with atomic force microscope roughness as low as 0.2 nm have been grown by RF-MEE growth.     

Complex boron redistribution kinetics in strongly doped polycrystalline‐silicon/nitrogen‐doped‐silicon thin bi‐layers

We have investigated the complex behaviour of boron (B) redistribution process via silicon thin bi‐layers interface. It concerns the instantaneous kinetics of B transfer, trapping, clustering and segregation during the thermal B activation annealing. The used silicon bi‐layers have been obtained by low pressure chemical vapor deposition (LPCVD) method at 480 °C, by using in‐situ nitrogen‐doped‐silicon (NiDoS) layer and strongly B doped polycrystalline‐silicon (P⁺) layer. To avoid long‐range B redistributions, thermal annealing was carried out at relatively low‐temperatures (600 °C and 700 °C) for various times ranging between 30 min and 2 h. To investigate the experimental secondary ion mass spectroscopy (SIMS) doping profiles, a redistribution model well adapted to the particular structure of two thin layers and to the effects of strong‐concentrations has been established. The good adjustment of the simulated profiles with the experimental SIMS profiles allowed a fundamental understanding about the instantaneous physical phenomena giving and disturbing the complex B redistribution profiles‐shoulders. The increasing kinetics of the B peak concentration near the bi‐layers interface is well reproduced by the established model.     

Investigation on the regeneration of Z‐cut KDP crystals

The regeneration of Z‐cut KDP crystals is explored by analyzing the growth of thin surface layers formed. The structural defects and crystalline perfection of the thin surface layers are evaluated by white‐beam synchrotron radiation topography and high‐resolution X‐Ray diffraction respectively. It shows that the thin surface layers have the same crystal structure as KDP crystal. There are large numbers of defects in thin surface layers and the crystalline quality is very poor. The growth velocity of thin surface layers is firstly accurately measured by a newly‐designed in‐situ crystal growth observation setup. It is found that the growth velocity of the thin surface layers strongly depends on the flow rate of the growth solution. The hindering effect of pyrophosphate (K₄P₂O₇) on the growth of the thin surface layers is discussed. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)