Atomic-level investigation of Al and Ni thin film growth on Ni(1 1 1) surface: Molecular dynamics simulation

Using molecular dynamics (MD) simulation, the structural characteristics of Al and Ni thin film growth on Ni(1 1 1) substrate according to the incident energy of adatoms were investigated. In case of Al on Ni(1 1 1), Al adatoms were grown basically through the layer-by-layer growth mode. On the other hand, Ni thin films on Ni(1 1 1) surface at low incident energy were shown to favor island growth. The steering effect due to atomic attraction, which results in rougher surface, was significantly observed at low incident energy. The growth mode of Ni film was, however, changed to follow layer-by-layer growth mode for the incident energy of 6 eV. The different aspects of surface morphology between Al and Ni deposition on Ni(1 1 1) surface could be successfully explained by the surface diffusion and impact cascade diffusion.     

Study of Ni/Si(1 0 0) solid-state reaction with Al addition

The characteristics of Ni/Si(1 0 0) solid-state reaction with Al addition (Ni/Al/Si(1 0 0), Ni/Al/Ni/Si(1 0 0) and Al/Ni/Si(1 0 0)) is studied. Ni and Al films were deposited on Si(1 0 0) substrate by ion beam sputtering. The solid-state reaction between metal films and Si was performed by rapid thermal annealing. The sheet resistance of the formed silicide film was measured by four-point probe method. The X-ray diffraction (XRD) was employed to detect the phases in the silicide film. The Auger electron spectroscopy was applied to reveal the element profiles in depth. The influence of Al addition on the Schottky barrier heights of the formed silicide/Si diodes was investigated by current-voltage measurements. The experimental results show that NiSi forms even with the addition of Al, although the formation temperature correspondingly changes. It is revealed that Ni silicidation is accompanied with Al diffusion in Ni film toward the film top surface and Al is the dominant diffusion species in Ni/Al system. However, no Ni_xAl_y phase is detected in the films and no significant Schottky barrier height modulation by the addition of Al is observed.     

Effect of substrate and annealing on the structural and optical properties of ZnO:Al films

ZnO:Al thin films with c-axis preferred orientation were deposited on glass and Si substrates using RF magnetron sputtering technique. The effect of substrate on the structural and optical properties of ZnO:Al films were investigated. The results showed a strong blue peak from glass-substrate ZnO:Al film whose intensity became weak when deposited on Si substrate. However, the full width at half maxima (FWHM) of the Si-substrate ZnO:Al (0 0 2) peaks decreased evidently and the grain size increased. Finally, we discussed the influence of annealing temperature on the structural and optical properties of Si-substrate ZnO:Al films. After annealing, the crystal quality of Si-substrate ZnO:Al thin films was markedly improved and the intensity of blue peak (∼445 nm) increased noticeably. This observation may indicate that the visible emission properties of the ZnO:Al films are dependent more on the film crystallinity than on the film stoichiometry.     

Abnormal reduction of coercivity on magnetic cobalt–platinum alloy films

Ultrathin Co–Pt alloy films as substrate were studied by the surface magneto-optical Kerr effect. As the growth of Ni, the films show uniquely high polar Kerr responses without any in-plane signals. The coercivity decreased until the thickness of Ni film was higher than 5 ML. A new surface structure was discovered at 7–10 ML Ni/Co–Pt films by the low-energy electron diffraction. Interestingly, polar Kerr signal and coercivity of the 10 ML Ni/Co–Pt(1 1 1) template film reduced rapidly as Co films were further deposited onto only about 1–2 ML. Then the films show a canted magnetization with a rollback hysteresis in the polar configuration during the growth of Co. Coercivity of the 7 ML Co/Ni/Co–Pt film was found unusually down to almost 100 Oe.The corresponding magic number at around 7 ML of Co in the abnormal reduction of coercivity may be attributed to the cluster formations of Co.     

Alloying of cold-sprayed Al-Ni composite coatings by post-annealing

A new cold spray coating technique for thick Al coating with finely dispersed Al-Ni intermetallic compounds was tested. For easy powder preparation and high yield, rather than using of Al/compound mixture feed stock, the spraying of pure Al and Ni powders mixture followed by post-annealing was suggested. The powder composition of Al and Ni was 75:25, and 90:10 (wt.%) to expect full consumption of pure Ni into intermetallic compounds. After Al-Ni composite coatings, the Ni particles were finely dispersed and embedded in the Al matrix with a good coating yield. Above 450 °C of post-annealing temperature, the Al₃Ni and Al₃Ni₂ phases were observed in the cold-sprayed Al-Ni coatings. The Ni particles in the Al matrix were fully consumed via compounding reaction with Al at 550 °C of the annealing temperature.     

Reaction kinetics of α-CuInSe2 formation from an In2Se3/CuSe bilayer precursor film

The reaction pathway and kinetics of α-CuInSe₂ formation from a glass/In₂Se₃/CuSe polycrystalline bilayer precursor film were investigated using time-resolved, in situ high-temperature X-ray diffraction. Bilayer glass/In₂Se₃/CuSe precursor films were deposited on thin glass substrates in a migration enhanced molecular beam epitaxial deposition system. These films were then temperature ramp annealed or isothermally soaked while monitoring the phase evolution. The initial In₂Se₃ and CuSe reactant phases were directly transformed to α-CuInSe₂ without any detectable intermediate phase. Kinetic parameters were estimated using the Avrami and parabolic diffusion controlled reaction models. The parabolic reaction model fitted the experimental data better than the Avrami model over the entire temperature range (230-290 °C) of the set of isothermal experiments, with an estimated activation energy of 162 (±5) kJ/mol.     

Synthesis process of nanowired Al/CuO thermite

Al/CuO nanothermites were fabricated by thermal oxidation of copper layer at 450 °C for 5 h and by aluminum thermal evaporation: thermal evaporation allows producing thin layer less than 2 μm in size. The copper has been deposited by electroplating or thermal evaporation depending on the required thickness. The obtained diameter of Al/CuO nanowires is 150-250 nm. Al/CuO nanowires composite were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), differential scanning calorimetry (DSC) and differential thermal analysis (DTA). Two distinct exothermic reactions occurred at 515 and 667 °C and total energy release of this thermite is 10 kJ/cm³.     

Fabrication and characterization of Pt intermediate transparent and conducting ITO/Pt/ITO multilayer films

Platinum intermediate transparent and conducting ITO/metal/ITO (IMI) multilayered films were deposited by RF and DC magnetron sputtering on polycarbonate substrates without intentional substrate heating. Changes in the microstructure and optoelectrical properties of the films were investigated with respect to the thickness of the intermediate Pt layer in the IMI films. The thickness of Pt film was varied from 5 to 20 nm.In XRD measurements, neither ITO single-layer films nor IMI multilayer films showed any characteristic diffraction peaks for In₂O₃ or SnO₂. Only a weak diffraction peak for Pt (1 1 1) was obtained in the XRD spectra. Thus, it can be concluded that the Pt-intermediated films in the IMI films did not affect the crystallinity of the ITO films. However, equivalent resistivity was dependent on the presence and thickness of the Pt-intermediated layer. It decreased as low as 3.3×10⁻⁴ Ω cm for ITO 50 nm/Pt 20 nm/ITO 30 nm films. Optical transmittance was also strongly influenced by the Pt-intermediated layer. As Pt thickness in the IMI films increased, optical transmittance decreased to as low as 30% for ITO 50 nm/Pt 20 nm/ITO 30 nm films.     

High-temperature application of the low-emissivity Au/Ni films on alloys

The 200 nm-thickness Ni film was imposed as the diffusion barrier layer between the Au film and the alloy substrate to improve the low-emissivity durability of the Au film at high temperature. The results show that the Au/Ni multilayer films still kept low emissivity after working at 600 °C for 200 h. It was concluded that the Ni interlayer effectively retarded the diffusion between gold film and the metal alloy below 600 °C.     

Highly porous nickel oxide thin films prepared by a hydrothermal synthesis method for electrochromic application

We report NiO nanowall thin films prepared by a facile hydrothermal synthesis method and their electrochromic application. The as-prepared porous nanowall NiO thin films show a highly porous structure built up by many interconnected nanoflakes with a thickness of about 30 nm. The electrochromic performances of the NiO films are characterized by means of UV–vis spectroscopy and cyclic voltammetry (CV) measurements. The effect of the annealing temperature on electrochromic properties is discussed. The NiO nanowall film annealed at 300 °C exhibits much better electrochromic performance than those counterparts annealed at higher temperature. The film annealed at 300 °C exhibits a noticeable electrochromism with reversible color changes from transparent to brown dark and presents a transmittance variation with 77% at 550 nm. The NiO nanowall film also shows good reaction kinetics with fast switching speed, and the coloration and bleaching times are 3 s and 4 s, respectively. The improved electrochromic performances are due to the porous morphological characteristics with fast ion and electron transfer resulting in fast reaction kinetics and high color contrast.     

Metallic thin film depth measurements by X-ray microanalysis

In this study, a low-cost technique, energy dispersive spectroscopy (EDS), was used to explore the application of X-ray microanalysis in depth determination of metallic films. Al, Ni and Au films with varied thicknesses from 50 to 400 nm were deposited on silicon (Si) substrates by magnetron sputtering. Electron beam energies ranging from 4 to 30 keV were applied while other parameters were kept constant to determine the electron beam energy required to penetrate the films. The effect of the atomic number of the metallic films on the penetration capability of the electron beam was investigated. Based on the experimental results, mathematical models for Al, Ni and Au films were established and the interaction volume was simulated using a Monte Carlo program. The simulations are in good agreement with the experimental results. Al/Ni/Au multilayers were also studied.     

P/Si-TiO2 transparent films with high anatase stability and photocatalytic activity

The anatase-TiO₂ transparent films, containing 3 mol% of Si and P elements (as dopants), were synthesized using a process combining the sol-gel method and spin-coating technique. Effects of relative ratio of dopants and calcination temperature on phase transformation, grain growth, surface morphology, light transmittance, band-gap energy and photocatalytic activity of the P/Si-TiO₂ films were examined and their results were compared with those of the undoped-TiO₂ and Si-TiO₂ films. The P/Si-TiO₂ films calcined at temperature between 600 and 900 °C adhered strongly to the surface of fused-silica substrate and were composed of anatase-TiO₂ monophase. The photocatalytic activities of the films were measured and represented using a characteristic time constant (τ) for the methylene blue (MB) photodegradation. The small τ stands for high photocatalytic ability of the film. The P/Si-TiO₂ film, containing equalmolar Si and P dopants, calcined at 800 °C gave the best performance in photocatalysis; this film had τ=5.7 h and decomposed about 90 mole% of MB in the water after 12 h of the 365-nm UV light irradiation.     

Effect of humidity and UV-assistance on the preparation of erbium doped alumina by aerosol MOCVD process

The effect of deposition temperature, relative humidity of carrier gas and UV-assistance on the growth of Erbium-doped aluminium oxide films has been studied. The films were prepared from aluminium acetylacetonate (Al(C₅H₇O₂)₃) and erbium (III) Tris(2,2,6,6-tetramethyl-3,5-heptanedionate) (Er(TMHD)₃) by UV and aerosol-assisted metal-organic chemical vapour deposition, using air with controlled humidity as carrier gas. Amorphous transparent films were deposited between 350 and 460 °C. It was observed that UV assistance allows a large decrease down to 5 kJ/mol of the activation energy of the deposition reaction for deposition temperatures lower than 420 °C. More over, depositing under high air humidity induced higher deposition rate, lower level of organic contamination and higher film density. Under these conditions Er-doped aluminium oxide films with a refractive index value of 1.71 were obtained at 460 °C.     

Surface structure and energy of B2 type intermetallic compound NiAl

The surface structure and energies for 22 surfaces of NiAl, an ordered intermetallic compound of B2 structure, have been studied by using embedded atom method. The results show that, for alternating Ni and Al surfaces with odd numbers of the sum of their three Miller indices, the energy difference between the Ni terminated surface and Al terminated surface increase linearly with increasing the interlayer distance. So from surface energy minimization, the Al terminated surface is favorable for each alternating Ni and Al surface. This is in agreement with experimental results. However, the energy of the (1 1 0) surface belonged to the other kind of the surface consisted of stoichiometric atomic layers and with even numbers of the sum of their three Miller indices, is the lowest in all two kinds of the surfaces. Therefore the (1 1 0) texture of NiAl appears mostly in the experiments.     

Structural features of natural and acids modified chrysotile nanotubes

The structural features of the natural chrysotile have been studied by transmission electron microscopy, scanning electron microscopy, energy-dispersive X-ray spectrometry, thermogravimetric and low-temperature nitrogen adsorption techniques. The chrysotile fibers are present as nanotubes of cylindrical morphology of various forms (rectilinear cylinders, cylinders with cup-like ends, tube twins, cylinder-in-cylinder and cone-in-cone tubes) with the outer diameters of 15-30 nm and the inner ones of 2-6 nm. The surface areas of the raw and the acid leached chrysotile samples obtained by nitrogen adsorption are 15.3 and 63.6 m²/g with the average pore diameter 9.8 and 3.9 nm, respectively. The inner and the outer surfaces of the chrysotile nanotubes are evaluated by the geometric method as 16 and 80 m²/g. The thermogravimetric analysis reveals two main phases of mass loss associated with dehydration and dehydroxylation (with two overlaying steps) processes. The first phase is attributed to the dehydration reaction at low temperature range 293-450 K with activation energy in the range 22-32 kJ/mol. The second phase occurs between 798 and 985 K with activation energy 249-298 kJ/mol for the raw sample and 130-146 kJ/mole for the acid treated one.     

Ion irradiation induced Al-Ti interaction in nano-scaled Al/Ti multilayers

Interactions induced in Al/Ti multilayers by implantation of Ar ions at room temperature were investgated. Initial structures consisted of (Al/Ti) × 5 multilayers deposited by d.c. ion sputtering on Si(1 0 0) wafers, to a total thickness of ∼250 nm. They were irradiated with 200 keV Ar⁺ ions, to the fluences from 5 × 10¹⁵ to 4 × 10¹⁶ ions/cm². It was found that ion irradiation induced a progressed intermixing of the multilayer constituents and Al-Ti nanoalloying for the highest applied fluence. The resulting nanocrystalline structure had a graded composition with non-reacted or interdiffused Al and Ti, and γ-AlTi and AlTi₃ intermetallic phases. Most intense reactivity was observed around mid depth of the multilayers, where most energy was deposited by the impact ions. It is presumed that Al-Ti chemical reaction is triggered by thermal spikes and further enhanced by chemical driving forces. The applied processing can be interesting for fabrication of tightly bond multilayered structures with gradual changes of their composition and properties.     

UV assisted low temperature nitridation and post deposition oxidation technique for hafnium oxide gate dielectric

An evaluation of a low temperature method (∼400 °C) for synthesis of nitrogen incorporated hafnia gate dielectric has been reported. This method is based on metal film growth in ammonia ambient and subsequent oxidation under ultraviolet (UV) irradiation. X-ray photoelectronic spectroscopy confirmed the presence of nitrided interface layer with a thickness of ∼12 ?. Equivalent oxide thickness values of around 11.5 ? and leakage current densities lower than 1 × 10⁻⁴ A/cm² at an operation voltage (−1 V) were achieved. The post deposition ultraviolet oxidation process was performed to check the interface oxidation resistance. The interface growth rate showed that as the interface bonding characteristics changed from Si-N to Si-O predominant bonding system of nitrogen incorporated films, the activation energy for oxygen diffusion changed from 18.0 kJ/mol to 9.8 kJ/mol and the activation energy of undoped hafnia films was 2.3 kJ/mol in every growth region.     

Effect of annealing temperature on the optical and electrical properties of amorphous As45.2Te46.6In8.2 thin films

The optical absorption of the As-prepared and annealed As_45.2Te_46.6In_8.2 thin films are studied. Films annealed at temperatures higher than 453 K show a decrease in the optical energy gap (E_o). The value of E_o increases from 1.9 to 2.43 eV with increasing thickness of the As-prepared films from 60 to 140 nm. The effect of thickness on high frequency dielectric constant (?_∞) and carrier concentration (N) is also studied. The crystalline structures of the As_45.2Te_46.6In_8.2 thin films resulting from heat treatment of the As-prepared film at different elevated temperatures is studied by X-ray diffraction. An amorphous-crystalline transformation is observed after annealing at temperatures higher than 453 K. The electrical conductivity at low temperatures is found due to the electrons transport by hopping among the localized states near the Fermi level. With annealing the films at temperatures higher than 473 K (the crystallization onset temperature) for 1 h, the electrical conductivity increases and the activation energy decreases, which can be attributed to the amorphous-crystalline transformations.     

Epitaxial growth of Al on Si(1 1 1) with Cu buffer layers

The structure of thin Al films grown on Si(1 1 1) with thin Cu buffer layers has been investigated using synchrotron radiation photoemission spectroscopy. A thin Cu(1 1 1) layer between the Si(1 1 1) substrate and an Al film may enhance quantum well effects in the Al film significantly. The strength of quantum well effects has been investigated qualitatively with respect to the thickness of the Cu buffer layer and to the Al film thickness. Deposition of Cu on Si(1 1 1)7 × 7 leads to formation of a disordered silicide layer in an initial regime before a well-ordered Cu(1 1 1) film is formed after deposition of the equivalent of 6 layers of Cu. In the regime below 6 layers of Cu the disorder is transferred to Al layers subsequently grown on top. The initial growth of up to 8 layers of Al on a well-ordered Si/Cu(1 1 1) layer leads to a disordered film due to the lattice mismatch between the two metals. When the Cu buffer layer and the Al over-layer are above 6 and 8 layers, respectively the Al film shows sharp low energy electron diffraction patterns and very sharp quantum well peaks in the valence band spectra signalling good epitaxial growth.