Preparation of composition-controlled silicon oxynitride films by sputtering; deposition mechanism,and optical and surface properties

Silicon oxynitride films have been grown on silicon by current-controlled reactive sputtering. The content of oxygen in the films could be well controlled by regulating the sputtering current under the reactive gas of Ar+ N₂ with an oxygen content of around 3%. The atomic ratio of oxygen to nitrogen in the silicon oxynitride film became larger with increasing sputtering current. It has been found that electron irradiation of the silicon substrate induces adsorption of oxygen and nitrogen. The degree of oxygen adsorption was about ten times larger than that of nitrogen. This phenomenon is a key mechanism in controlling the film composition. The adsorptive mechanism might be explained by the phenomenon of surface activation by the electron bombardment. Utilizing this technique, wettability by germanium of silicon oxynitride films could be controlled by varying their oxygen and nitrogen contents. A better wetting condition was obtained from films with large atomic ratio of nitrogen to oxygen in the silicon oxynitride film.     

Electronic structure of GaN(0001)‐2 × 2 thin films grown by PAMBE

Gallium nitride thin films were grown on silicon carbide (0001) by plasma‐assisted molecular beam epitaxy (PAMBE). The samples were cooled down in nitrogen plasma and characterized in situ by reflection high energy electron diffraction (RHEED), photoelectron spectroscopy (XPS/UPS), and atomic force microscopy (AFM) revealing stoichiometric and smooth GaN films virtually free of contaminations. We present valence band data obtained by UPS with strong emission from surface states inside the fundamental band gap. These states and the observed 2 × 2 surface reconstruction are highly sensitive towards residual molecules. Once these surface states have disappeared the original state could not be recovered by surface preparation methods underlining the necessity of in situ investigations on as‐grown surfaces. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Optical characterization of oxynitride films in the visible-ultraviolet range

Oxynitride optical properties in the visible-ultraviolet spectral range are very interesting, due to their use in electronic device manufacturing. This paper presents spectra of refractive index and extinction coefficient of oxynitride films deposited on silicon with different composition, as derived from spectroscopic ellipsometry measurements on the basis of an effective medium approach. These data evidence the presence of a Si-rich layer on the oxynitride/silicon interface. Electronic polarizability and energy gap of all compounds were evaluated. Moreover, absolute reflectance of the samples was derived from optical functions and compared with the measured value.     

Purely quadratic dispersion of surface plasmon in Ag/Ni(111): the influence of electron confinement

Surface plasmon dispersion in nanoscale thin Ag films deposited onto the Ni(111) surface was investigated by angle‐resolved electron energy loss spectroscopy. We found that the dispersion curve contains only the quadratic term. The vanishing of the linear term was ascribed to the presence in the film of Ag 5sp‐related quantum well states. Screening effects enhanced by electron confinement in Ag quantum well states push the position of the centroid of the induced charge of the surface plasmon less inside the interface compared to other Ag systems, rendering null the linear coefficient of the dispersion curve. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Deposition of silicon oxynitride films by ion beam sputtering at room temperature

Silicon oxynitride films, possessing various compounds of SiO₂ and Si₃N₄, were deposited by ion beam sputtering at room temperature. This technique can easily and precisely control the refractive index and composition of the silicon oxynitride film. Properties of these films, such as the refractive index, the extinction coefficient, the surface roughness, and so on were measured in this study.     

Optical and hydrophobic properties of co-sputtered chromium and titanium oxynitride films

The chromium and titanium oxynitride films on glass substrate were deposited by using reactive RF magnetron sputtering in the present work. The structural and optical properties of the chromium and titanium oxynitride films as a function of power variations are investigated. The chromium oxynitride films are crystalline even at low power of Cr target (≥60 W) but the titanium oxynitride films are amorphous at low target power of Ti target (≤90 W) as observed from glancing incidence X-ray diffraction (GIXRD) patterns. The residual stress and strain of the chromium oxynitride films are calculated by sin² ψ method, as the average crystallite size decreases with the increase in sputtering power of the Cr target, higher stress and strain values are observed. The chromium oxynitride films changes from hydrophilic to hydrophobic with the increase of contact angle value from 86.4° to 94.1°, but the deposited titanium oxynitride films are hydrophilic as observed from contact angle measurements. The changes in surface energy were calculated using contact angle measurements to substantiate the hydrophobic properties of the films. UV-vis and NIR spectrophotometer were used to obtain the transmission and absorption spectra, and the later was used for determining band gap values of the films, respectively. The refractive index of chromium and titanium oxynitride films increases with film packing density due to formation of crystalline chromium and titanium oxynitride films with the gradual rise in deposition rate as a result of increase in target powers.     

High‐density guided growth of silicon nanowires in nanoporous alumina on Si(100) substrate: Estimation of activation energy

High‐density growth of silicon nanowires confined within a nanoporous alumina template is carried out. The growth rate is measured for several temperatures. An incubation time is observed and measured. The activation energy of this system is calculated and compared to that of growth on a free silicon surface. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Investigation of heteroepitaxial diamond films by atomic force and scanning tunneling microscopy

We report on Atomic Force Microscopy (AFM) and Scanning Tunneling Microscopy (STM) investigations on chemical vapour deposited heteroepitaxial diamond films. Besides the good macroscopic crystal morphology a statistical tilt up to ±5.2° of the oriented crystallites has been found relative to the silicon substrates. By optimizing the process conditions, however, the crystal tilt of the films can be reduced, resulting in an improved film perfection. On crystallite (001)-surfaces a substructure of growth facets or islands has been found and high resolution STM images have established a 2×1 surface reconstruction on these growth facets. AFM and SEM were applied to study the morphology of diamond nuclei initially grown on the silicon substrate. Strong island like (Volmer-Weber) growth has been found, with a nucleus height to diameter ratio of 1:1. While the islands are growing in size with respect to time of nucleation, its aspect ratio does not change, due to the high surface free energy of the diamond relative to silicon.     

Electrical properties of thin PECVD silicon oxynitride films

Thin silicon oxynitride films with excellent uniformity were prepared by plasma enhanced CVD. Oxygen incorporation leads to improved breakdown behavior and to reduction of the film conductivity compared to PECVD silicon nitride layers. Thin PECVD silicon oxynitride films deposited on single crystal and poly-Si exhibit good insulation properties in both cases.     

Rapid determination of surface roughness of polycrystalline silicon following frontside and backside excimer laser irradiation

Excimer-laser crystallization (ELC) is the most commonly employed technology for fabricating low-temperature polycrystalline silicon (LTPS). Investigations on the surface roughness of polycrystalline silicon (poly-Si) thin films have become an important issue because the surface roughness of poly-Si thin films is widely believed to be related to its electrical characteristics. In this study, we develop a simple optical measurement system for rapid surface roughness measurements of poly-Si thin films fabricated by frontside ELC and backside ELC. We find that the incident angle of 20° is a good candidate for measuring the surface roughness of poly-Si thin films. The surface roughness of polycrystalline silicon thin films can be determined rapidly from the reflected peak power density measured by the optical system developed using the prediction equation. The maximum measurement error rate of the optical measurement system developed is less than 9.71%. The savings in measurement time of the surface roughness of poly-Si thin films is up to 83%. The method of backside ELC is suggested for batch production of low-temperature polycrystalline silicon thin-film transistors due to the lower surface roughness of poly-Si films and higher laser-beam utilization efficiency.     

Dispersion and thermal resistivity in silicon nanofilms by molecular dynamics

On nanoscale, thermal conduction is affected by system size. The reasons are increased phonon scattering and changes in phonon group velocity. In this paper, the in-plane thermal resistivity of nanoscale silicon thin films is analyzed by molecular dynamics (MD) techniques. Modifications to the dispersion relation are calculated directly with MD methods at high temperature. The results indicate that the dispersion relation starts to change for very thin films, at around two nanometers. The reasons are band folding and phonon confinement. Thermal resistivity is analyzed by the direct non-equilibrium method, and the results are compared to kinetic theory with modified dispersion relations. Thermal resistivity is affected by both surface scattering and dispersion. Moreover, in thin films, the characteristic vibrational frequency decreases, which in standard anharmonic scattering models indicates a longer relaxation time and affects the resistivity. The results indicate that in very thin films, the resistivity becomes highly anisotropic due to differences in surface scattering. In two cases, surface scattering was found to be the most important mechanism for increasing thermal resistivity, while in one case, phonon confinement was found to increase resistivity more than surface scattering.     

Passivation of defect states in Si-based and GaAs structures

Formation of defect states on semiconductor surfaces, at its interfaces with thin films and in semiconductor volumes is usually predetermined by such parameters as semiconductor growth process, surface treatment procedures, passivation, thin film growth kinetics, etc. This paper presents relation between processes leading to formation of defect states and their passivation in Si and GaAs related semiconductors and structures. Special focus is on oxidation kinetics of yttrium stabilized zirconium/SiO₂/Si and Sm/GaAs structures. Plasma anodic oxidation of yttrium stabilized zirconium based structures reduced size of polycrystalline silicon blocks localised at thin film/Si interface. Samarium deposited before oxidation on GaAs surface led to elimination of EL2 and/or ELO defects in MOS structures. Consequently, results of successful passivation of deep traps of interface region by CN⁻ atomic group using HCN solutions on oxynitride/Si and double oxide layer/Si structures are presented and discussed. By our knowledge, we are presenting for the first time the utilization of X-ray reflectivity method for determination of both density of SiO₂ based multilayer structure and corresponding roughnesses (interfaces and surfaces), respectively.     

Preparation and characterizations of amorphous nanostructured SiC thin films by low energy pulsed laser deposition

Amorphous silicon carbide (SiC) thin films were deposited on silicon substrates by pulsed laser ablation at room temperature. Thicknesses and surface morphology of the thin films were characterized using optical profilers, atomic force and field emission scanning electron microscopy. Nanohardnes, modulus and scratch resistance properties were determined using XP nanoindenter. The results show that crack free, smooth and nanostructured thin films can be deposited using low laser energy densities.     

Formation of niobium oxynitrides by rapid thermal processing (RTP)

The potential of rapid thermal processing (RTP) for the preparation of thin films of niobium oxynitrides was investigated. The 200 and 500 nm niobium films were deposited via sputtering on oxidized silicon(1 0 0)- and on sapphire(1 −1 0 2)-substrates. At first, oxidation of niobium films in molecular oxygen and then nitridation in ammonia using an RTP-system was performed. The films were characterized before and after the oxidation and nitridation processes by X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM) and secondary ion mass spectrometry (SIMS). The influence of the two different substrates, amorphous SiO₂ and single crystalline sapphire on the reactivity of the niobium films was studied in dependence of temperature, time of reaction and film thickness. The existence of niobium oxynitride formation was verified for some of the films. In some of the experiments, crack formation in the films or even delamination of the Nb-films from the substrates was observed.     

X‐ray absorption near‐edge structure anomalous behaviour in structures with buried layers containing silicon nanocrystals

Substructure and phase composition of silicon suboxide films containing silicon nanocrystals and implanted with carbon have been investigated by means of the X‐ray absorption near‐edge structure technique with the use of synchrotron radiation. It is shown that formation of silicon nanocrystals in the films' depth (more than 60 nm) and their following transformation into silicon carbide nanocrystals leads to abnormal behaviour of the X‐ray absorption spectra in the elementary silicon absorption‐edge energy region (100–104 eV) or in the silicon oxide absorption‐edge energy region (104–110 eV). This abnormal behaviour is connected to X‐ray elastic backscattering on silicon or silicon carbide nanocrystals located in the silicon oxide films depth.     

Optical characterization of laser-induced crystallized silicon films

Optical absorption coefficient spectra of thin silicon films were precisely investigated using a simple reflectance system with total reflectance mirrors placed on the rear side of samples in order to cancel an interference effect in a range between 1.1 eV and 3 eV. The absorption coefficient decreased according to crystallization as the laser energy increased and it got similar to that of single crystalline silicon in the range of 1.7 eV 3 eV. However, the absorption coefficient was higher than 10² cm^–1 in the photon energy lower than 1.3 eV. This probably results from band tail states caused by defect states localized at grain boundaries in the crystallized films. 2.5%-phosphorus doped laser crystallized silicon films had a high optical absorption coefficient ( > 10⁴ cm^–1) in the low photon energy range (1.1 eV 1.7 eV) caused by free carriers produced from the dopant atoms activated in the silicon films. The experimental results gave the carrier density of 1.3 × 10²¹ cm³ and the carrier mobility of 20 cm²/Vs.     

Effect of microstructure of MgO buffer layer on BaTiO3 grown on silicon substrates

MgO ultrathin films were grown on Si(1 0 0) substrates as buffer layers for the growth of ferroelectric BaTiO₃ thin films by laser molecular beam epitaxy (L-MBE). The deposition process of MgO buffer layers grown on silicon was in situ monitored by reflection high-energy electron diffraction (RHEED). The structure of BaTiO₃ films fabricated on MgO buffers was investigated by X-ray diffraction. Biaxially textured MgO was obtained at high laser energy density, but when the laser energy was lowered, MgO buffer was transformed to the form of texture with angular dispersion with the increase of the film thickness. BaTiO₃ films grown on the former buffer were completely (0 0 1) textured, while those on the latter were (0 0 1) preferred orientated. Furthermore, the fabricated MgO buffers and BaTiO₃ films had atomically smooth surface and interface. All these can reveal that the quality of textured MgO buffer is a key factor for the growth of BaTiO₃ films on silicon.     

Structural analysis of silicon dioxide and silicon oxynitride filmsproduced using an oxygen plasma

Plasma grown silicon dioxide and oxynitride layers are shown to represent, for microelectronic applications, a good alternative method to conventional thermally grown layers. Fast growth rates, together with good electrical properties are demonstrated, at low process temperatures. Growth kinetics of SiO₂ layers synthesized both in RF and microwave plasma anodization systems are presented for a wide range of substrate temperatures in the range (90-560°C). Structural properties of the films can be affected during preparation, due to radiation from the plasma and particle bombardment. For the SiO₂ layers obtained by RF anodization at 300°C, these surface structural features were investigated by scanning electron microscopy; bulk and interface dielectric properties of the layers were analyzed by spectroellipsometry. The results were correlated with electrical properties and data coming from the growth kinetics. It was found that the properties of the layers, both structural and electrical, are strongly dependent on the growth regime (linear or parabolic). Silicon oxynitride films produced by plasma anodization of silicon nitride layers are investigated by spectroellipsometry and Auger electron spectroscopy. These results are correlated with electrical measurements and used to explain the changes in film properties     

Study on the orientation of silver films by ion-beam assisted deposition

Low energy ion beam assisted deposition (IBAD) was employed to prepare Ag films on Mo/Si (100) substrate. It was found that Ag films deposited by sputtering method without ion beam bombardment were preferred (111) orientation. When the depositing film was simultaneously bombardment by Ar⁺ beam perpendicular to the film surface at ion/atom arrival ratio of 0.18, the prepared films exhibited weak (111) and (200) mixed orientations. When the direction of Ar⁺ beam was off-normal direction of the film surface, Ag films showed highly preferred (111) orientation. Monte Carlo method was used to calculate the sputtering yields of Ar⁺ ions at various incident and azimuth angles. The effects of channeling and surface free energy on the crystallographic orientation of Ag films were discussed.     

Influence of radiofrequency power on compositional, structural and optical properties of amorphous silicon carbonitride films

The silicon carbonitride (SiCN) films were deposited on n-type Si (1 0 0) and glass substrates by the radiofrequency (RF) reactive magnetron sputtering of polycrystalline silicon target under mixed reactive gases of acetylene and nitrogen. The films have been characterized by energy dispersive spectrometer (EDS), atomic force microscope (AFM), X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR) and ultraviolet-visible spectrophotometer (UVS). The influence of RF power on the compositional, morphological, structural and optical properties of the SiCN films was investigated. The SiCN films deposited at room temperature are amorphous, and the C, Si and O compositions except N in the films are sensitive to the RF power. The surface roughness and optical band gap decrease as the RF power increases. The main bonds in the SiCN films are C-N, N-H_n, C-H_n, C-C, CN, Si-H and Si-C, and the intensities of the CN, Si-H and C-H_n bonds increase with increment of the RF power. The mechanisms of the influence of RF power on the characteristics of the films are discussed in detail.