Guide for Authors

The effects of epoxidized natural rubber (ENR) on the curing behaviors and adhesive strengths of an epoxy (diglycidyl ether of bisphenol-A) and dicyandiamide/2-methyl imidazole system are studied with differential thermal calorimetry (DSC), scanning electron microscopy (SEM), and Instron tensile testing instrument. From DSC analyses of specimens prepared with unsealed aluminum pans, it is obtained that the reaction exotherm, the time to maximal curing rate, the glass transition temperature, the rate constant, and the reaction order of the epoxy system change with respect to the content of ENR added because of the reaction of ENR with the epoxy system. The results obtained from SEM micrographs indicate that the particle size of the rubber phase increases with increasing the curing temperature and the ENR content. The volume fraction of the separated rubber phase also follows the similar trend except at the high curing temperature which implying that the dissolution of epoxy resin in the ENR phase also depends on the curing temperature and the amount of ENR present. The lap shear strengths of specimens prepared with etched aluminum substrates increase with increasing the curing temperature because of a better cure at a higher temperature, but decrease with increasing the ENR content resulting from an adverse effect of ENR on the mechanical properties of the cured resins.     

Preparation and characterization of bismaleimide/1,3-dicyanatobenzene modified epoxy intercrosslinked matrices

An intercrosslinked network of cyanate ester (CE)-bismaleimide (BMI) modified epoxy matrix system was made by using epoxy resin, 1,3-dicyanatobenzene and bismaleimide (N,N^′-bismaleimido-4,4^′-diphenyl methane) with diaminodiphenylmethane as curing agent. BMI-CE-epoxy matrices were characterised using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. The matrices, in the form of castings, were characterised for their mechanical properties such as tensile strength, flexural strength and unnotched Izod impact test as per ASTM methods. Mechanical studies indicated that the introduction of cyanate ester into epoxy resin improves the toughness and flexural strength with reduction in tensile strength and glass transition temperature, whereas the incorporation of bismaleimide into epoxy resin influences the mechanical and thermal properties according to its percentage content. DSC thermograms of cyanate ester as well as BMI modified epoxy resin show an unimodal reaction exotherm. Electrical properties were studied as per ASTM method and the morphology of the BMI modified epoxy and CE-epoxy systems were studied by scanning electron microscope.     

THE MECHANISM OF CURE REACTION OF 4,4''''-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4''''-DIAMINODIPHENYL METHANE EPOXY

The cure reaction of tetraglycidyl 4,4'-diaminodiphenyl methane (TGDDM) epoxy resin with 4,4'-diaminodiphenyl methane (DDM) has been studied by using DSC. Instead of one exothermic peak, two exothermic peaks, indicative of a complex reaction mechanism, are shown in the DSC curve of TGDDM-DDM mixtures in nonisothermal cure experiments when the content of DDM is lower than stoichiometric ratio. The result of the kinetic analysis of the cure reaction shows that the activation energy of the lower temperature exotherm peak is about 56 kJ/mol and that of the higher temperature exotherm peak is about 136 kJ/mol. The lower temperature cure reaction peak can be attributed to the primary amine-epoxide and secondary amine-epoxide reactions, and the higher temperature cure reaction peak can be attributed to the epoxide-hydroxy reaction under catalysis of tertiary amine in the TGDDM epoxy resin. Because the network density of the cured epoxy resin is determined by these two reactions, the content of DDM has little effect on the glass transition temperature of cured epoxy resin.     

基于松香酸酐的环氧树脂体系固化动力学及TTT图绘制

研制了基于松香酸酐固化剂的生物质环氧树脂体系,采用全动态DSC法研究了树脂体系的固化反应动力学,通过半经验的唯象模型拟合得到了固化反应参数,活化能Ea为59.68 kJ/g,指前因子A0为1.28×1015s-1,反应级数n为2.483,由此建立了体系固化温度/时间/固化度间的关系;采用恒温DSC及DMA方法测试玻璃化转变温度,应用DiBenedetto经验方程拟合得到了玻璃化转变温度与固化度间的关系.应用锥板旋转黏度计测试了树脂体系不同温度下的凝胶时间,通过线性回归分析得到了凝胶时间与温度之间的关系.由唯象模型和DiBenedetto方程分别计算得到凝胶时的固化度为0.386,玻璃化转变温度为26.22°C.由上述工作绘制了基于松香酸酐生物质树脂体系的TTT(time-temperature-transition diagram)固化图,可确定树脂体系在不同温度任意时间下的状态.     

酸酐固化环氧树脂/蒙脱土复合材料的等温固化动力学

用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程，考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响. 实验表明， 环氧树脂的固化过程包含自催化机理，加入蒙脱土没有改变固化反应机理. 用Kamal方程对该体系的固化过程进行拟合，得到反应级数m、n，反应速率常数k1、k2，总反应级数(m + n)在2.4～3.0之间. MMT的加入使环氧树脂体系的k1、k2有所降低，而OMMT的加入对体系的k1、k2影响较为复杂，加入蒙脱土对环氧树脂固化体系的活化能影响较小.     

2-乙基-4-甲基咪唑固化环氧树脂体系动力学模型

由2-乙基-4-甲基咪唑(2,4-EMI)固化双酚A二缩水甘油醚型环氧树脂(DGEBA)的等温差示扫描量热(DSC)实验结果发现固化反应分两阶段进行,催化聚合反应有一诱导期.由DSC测试结果求得催化聚合反应的速率常数.从反应机理出发,以诱导期为边界,建立两阶段的微观固化动力学模型.从扩散的角度在模型中引入临界固化度(αc)和扩散因子,进一步建立扩散控制固化动力学模型,对不同2,4-EMI含量和固化温度(Tc)的体系,计算得到αc.研究发现扩散因素对固化动力学影响较大,固化反应前期由化学动力学控制,后期由扩散因素控制;αc主要由体系的玻璃化转变决定,Tc越高,体系玻璃化转变时对应的固化度越大,cα越大.     

升温与等温法非模型动力学研究环氧树脂固化反应

基于DSC数据,采用以Vyazovkin积分法为基础的升温法非模型动力学和等温法非模型动力学对双酚A型环氧树脂E51/4,4′-二氨基二苯基砜(DDS)体系及多官能度环氧树脂AG80/DDS体系的固化过程进行了研究,并结合玻璃化转变温度的变化和原位红外测试技术,对比分析了升温与等温条件下的固化反应规律.结果表明,与传统的模型拟合法相比,非模型动力学更适合定量预测树脂固化反应过程,并能为固化过程中反应机理变化的研究提供重要依据;等温法非模型动力学能够更好地预测两种树脂体系在不同恒温条件下的固化反应历程,并且升温法与等温法非模型动力学所得到的反应活化能-固化度之间的变化关系不同,表明不同温度条件下树脂的反应机理不同,这与升温和恒温条件下玻璃化效应及环氧官能团的变化规律相吻合.     

Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

Cure state detection for pre-cured carbon-fibre epoxy prepreg (CFC) using Temperature-Modulated Differential Scanning Calorimetry (TMDSC)

Carbon-fibre prepregs have found widespread use in lightweight applications. They are based on a carbon-fibre fabric impregnated with reactive epoxy resin. Prepreg materials are generally pre-cured so that they have a higher molecular weight than typical resins in order to reduce resin flow, which facilitates storage and later processing properties.The measurements were carried out using commercially available materials and follow the published DMA investigations of the same material [1]. TMDSC was used to find the correlation between curing conditions, the degree of cure and glass transition temperature. TMDSC has the advantage over standard DSC that it enables better determination of the glass transition temperature, which is often accompanied by an exothermic curing reaction, and thus overshadowed. The influence of the amplitude of temperature modulation was tested in preliminary experiments. For non-cured material a glass transition temperature of approximately 0 °C was determined; whereas for the totally cured material it was approximately 230 °C. The changes in degree of cure, temperature of actual glass transition and post-reaction are given as a function of curing time at 180 °C. The correlation between actual glass transition temperature and degree of cure is derived.     

Toughening of a highly cross-linked epoxy resin by reactive blending with bisphenol A polycarbonate. I. FTIR spectroscopy

A highly cross-linked thermosetting epoxy resin was modified by a reactive blending process carried out in the presence of bisphenol A polycarbonate (PC). Prior to the curing process the PC component was dissolved at high temperature in the uncured epoxy matrix. FTIR investigation of this reactive mixture demonstrated the occurrence of physical and chemical interactions among the blend components. Isothermal kinetic measurements performed by FTIR spectroscopy showed that the presence of PC does not affect the overall curing mechanism but decreases both the initial reaction rate and the final conversion of reactants. © 1994 John Wiley & Sons, Inc.     

Effect of stoichiometry and diffusion on an epoxy/amine reaction mechanism

The bulk phase kinetics of an epoxy (DGEBA) /amine (DDS) thermoset have been studied using DSC, FTIR, and ¹³C-NMR. In the absence of catalyst, the reaction was found to involve a main exothermic reaction between epoxide and amine hydrogen and a side reaction between tertiary amine formed in the main reaction and epoxide. The main reaction was exothermic while the side reaction had no discernable exotherm. Etherification did not occur to any significant extent. Since only the main reaction is exothermic, DSC was very useful for studying the main reaction kinetics. FTIR was used for determining whether epoxide and amine hydrogen were consumed at different rates as a way of following the side reaction. An IR band previously unused by other investigators was used to monitor the amine hydrogen concentration. NMR confirmed the above mechanism by identifying the formation of a quaternary ammonium ion/alkoxide ion pair as a reaction product of tertiary amine and epoxide. This mechanism has been successfully fit to a rate law valid over the entire extent of reaction. The rate constant for the epoxy/amine addition reaction was found to depend on hydroxide concentration (extent), reaction temperature, and glass transition temperature and included contributions from uncatalyzed and autocatalyzed parts. The side reaction (quaternary ammonium ion formation) formed weak bonds which did not affect the overall system T_g. Both reactions were second order. The rate constants for the main reaction first increase with increasing extent due to autocatalysis by hydroxide before decreasing due to the diffusion limit caused by gelation and vitrification. © 1995 John Wiley & Sons, Inc.     

Cure behavior and thermal stability of an epoxy: new bismaleimide blends for composite matrices

A new bismaleimide (BMI) resin was synthesized to formulate epoxy(tetraglycidyl diaminodiphenyl methane; TGDDM) – bismaleimide thermoset blends for composite matrix applications. 4,4′-diaminodiphenyl methane (DDM) was used as an amine curing agent for the TGDDM. A Fourier transform infrared (FTIR) spectroscopy was employed to characterize the new BMI resin. Cure behavior of the epoxy–BMI blends was studied using a differential scanning calorimeter (DSC). DSC thermograms of the thermoset blends indicated two exothermic peaks. The glass transition temperature of the thermoset blends decreased with BMI content. Thermogravimetric analysis (TGA) was carried out to investigate thermal degradation behavior of the cured epoxy–BMI thermoset blends. The new BMI resin reacted partially with the DDM and weak intercrosslinking polymer networks were formed during cure of the thermoset blends.     

电子束辐射固化环氧树脂的动态力学分析——树脂化学结构、分子量及其分布的影响

应用不同化学结构、分子量及其分布的环氧树脂进行了电子束辐射固化实验 ,对固化物进行了动态力学分析 ,研究了不同样品凝胶含量、内耗tanδ及动态模量的变化规律 .分析结果表明环氧树脂辐射反应活性与其化学结构有很大关系 ,酚醛型环氧树脂的辐射反应活性高 ,固化后高温模量及玻璃化温度较高 ,而脂环族环氧树脂反应活性小 .在低辐射剂量下 ,环氧树脂的固化度随分子量增大略有下降 ,但固化物的玻璃化温度随分子量增加而升高 .增大辐射剂量 ,树脂固化度的提高受分子量大小的影响很小 ,分子量较大样品的网络均匀程度有所提高 ,在较高反应程度下 ,玻璃化温度主要受固化度影响 .树脂固化程度也是决定其模量高低的主要因素 ,而在固化程度相近的情况下 ,分子量的影响作用很大 .在同样辐射剂量下 ,分子量分布宽的树脂固化反应程度高 ,但交联网络均匀性低 .     

Evaluation of processing temperature in the production of fibre reinforced epoxy composites

A group of cyanoethylated amine (CEA) has been synthesized by carefully reacting triethylenetetramine with varying proportions of acrylonitrile. Such CEAs were utilized as hardener for the curing of epoxy resin. The effect of cyanoethylation of amine on their curing reaction with epoxy resin has been studied by differential scanning calorimeter (DSC). The processing temperature for the fabrication of composite is estimated from the DSC analysis with an approach to satisfy the logical selection of temperature for application of pressure during processing of a composite structure. The exotherm of such curing reaction (?H _ex) and the degree of cyanoethylation (CEt) of the amine follow the relation ?H _ex ?=?(324?C68.40?CEt)?J?g^?1.     

稀释剂对耐高温环氧树脂性能的影响

采用3,4-环氧环己基甲基-3,4-环氧环己基甲酸酯(2010P)作为N,N,N',N'-四环氧丙基-4,4'-二氨基二苯甲烷环氧树脂(AG-80)/六氢苯酐(HHPA)固化体系的稀释剂。 通过粘度、拉伸、高温剪切、示差扫描量热法(DSC)以及高倍显微镜等技术手段及方法,考察稀释剂含量对环氧树脂的粘度、力学性能和热性能的影响,研究了稀释剂与环氧树脂之间的相互作用。 结果表明,2010P可以显著提高树脂的流动性。 随着2010P含量的增加,体系的拉伸强度会呈现先上升后下降的趋势,在质量分数25%时达到最大值。 DSC结果显示,2010P的加入会降低AG-80的玻璃化转变温度,但适量的加入可以进一步提高AG-80环氧树脂在高温条件下的粘接性能。 当2010P的质量分数为30%时,树脂在200 ℃的剪切强度可达到13.78 MPa。     

Calorimetric investigation of polymerization reactions. III. Curing reaction of epoxides with amines

The curing reactions of epoxy resin with aliphatic diamines and the reaction of phenyl glycidyl ether with butylamine as a model for the curing reactions were investigated with a differential scanning calorimeter (DSC) operated isothermally. The heat of reaction of phenyl glycidyl ether with butylamine is equal to 24.5 ± 0.6 kcal/mole. The rate of reaction was followed over the whole range of conversion for both model and curing reactions. The reactions are accelerated by the hydrogen-bond donor produced in the system. The rate constants based on the third-order kinetics were determined and discussed for the model reaction and for the chemically controlled region of curing reactions. The activation energies for these rate constants are 13-14 kcal/mole. At a later stage of conversion, the curing reactions become controlled by diffusion of functional groups. The final extent of conversion is short of completion for most isothermally cured and even for postcured samples because of crosslinking. It was quantitatively indicated that the final conversion of isothermal cure corresponds to the transition of the system from a viscous liquid to a glass on the basis of the theory of glass transition temperature of crosslinked polymer systems.     

环氧树脂/反应性聚碳酸酯/叔胺体系的表面结构与性能

环氧树脂/反应性聚碳酸酯/叔胺体系的表面结构与性能;环氧树脂; 胺化聚碳酸酯; 形态结构     

Deep Eutectic Ionic Liquids as Epoxy Resin Curing Agents

Epoxy compositions based on low-molecular bisphenol A type resin and deep eutectic solvents from choline chloride (ChCl) and guanidine derivatives or urea were prepared and investigated. Pot life at room temperature and curing process at dynamic mode were studied using DSC and rheometry while DES basic ratio was changed in a range of 3–9 wt. part/100 wt. part of epoxy resin (phr). Thermomechanical properties (glass transition and tan δ) of the cured epoxy materials (DES content up to 20 phr) using DMTA and their thermal resistance on the basis of thermogravimetric measurements were evaluated. The curing mechanism, i.e., ratio of polyaddition reaction to catalytic polymerization, was evaluated considering changeable guanidine derivative content in relation to epoxy resin.     

环氧树脂/桐油酸酐/蒙脱土纳米复合材料固化动力学

环氧树脂/桐油酸酐/蒙脱土纳米复合材料固化动力学;固化反应;DSC     

Effect of Non-Woven Carbon Nanofiber Mat Presence on Cure Kinetics of Epoxy Nanocomposites

Summary : An investigation was carried out into the cure kinetics of carbon nanofiber (CNF) mat-epoxy nanocomposites, composed of bisphenol-A based epoxy resin and diethylene triamine as a curing agent. It was observed that the rate of cure reaction for CNF mat-epoxy nanocomposites was higher than that for neat epoxy resin at low curing temperatures and the presence of the CNF mat produced the maximum influence at a certain curing temperature and time. At high curing temperature and long curing times, the effect of CNF mat on the cure rate was insignificant. The CNF mat-epoxy composite exhibited somewhat lower value of activation energy than that of the neat epoxy system at the beginning of the curing stage. The weight fraction of CNF mat also affected the cure reaction of epoxy nanocomposites at the same curing temperature. As the amount of CNF mat increased, the cure rate was higher at the same cure time. However, at high CNF mat loading, the cure reaction was retarded since the amount of epoxy and hardener decreased dramatically at high CNF contents together with the hindering effect of the CNF mat on the diffusion of epoxy resin and the curing agent, leading to lower crosslinking efficiency. Although the curing efficiency of epoxy nanocomposites dropped at high CNF mat content, the glass transition temperature (T_g) was still high due to the ultra-high strength of the CNF mat. The cure kinetics of CNF mat-epoxy nanocomposites was in good agreement with Kamal's model.