Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system

Phenyl bisthioureas: 4,4′-(bisthiourea)diphenylmethane (DTM), 4,4′-(bisthiourea)diphenyl ether (DTE), and 4,4′-(bisthiourea)diphenyl sulfone (DTS) were synthesized and used as curing agents for the epoxy resin diglydicyl ether bisphenol A (DGEBA). Synthesized phenyl bisthioureas were characterized using FT-IR and ¹H-NMR analysis. For comparison studies the epoxy system was also cured using the conventional aromatic amine 4,4′-diaminodiphenyl ether (DDE). Curing kinetics of epoxy/amine system was studied by dynamic and isothermal differential scanning calorimeter (DSC). Curing kinetic was evaluated based on model-free kinetics (MFK) and ASTM E 698 model, and the activation energy was compared with DDE. Curing system of phenyl bisthiourea link (DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS) shows two exothermic peaks, while that of the conventional aromatic amines showed only a single peak. The initial exothermic peak is due to the primary nitrogen of the thiourea group, and the exotherm at higher temperature is due to the presence of thiourea groups. Glass transition temperature (T _g) of DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS cured resins were lowered by 323 K when compared to the widely used diaminodiphenyl ether (DDE) cured resin. Oxidation induction temperature measurement performed on DSC suggests that the DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS system cured resins has better oxidative stability when compared to cured DGEBA/DDE resin system.     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Epoxy‐amine reticulates observed by infrared spectrometry. II. Modifications of structure and of hydration abilities after irradiation in a dry atmosphere

This article is part of a series of articles devoted to the study of the responsibilities of both humidity and irradiation in the aging process of amine‐cured epoxy resins. The basic technique used in this study is infrared spectrometry. In a previous article we have observed, with this technique, hydration of two kinds of epoxy resins, which are widely used in the nuclear industry. In this article the same technique is used to observe the same resins, which have been previously submitted to ionizing radiations. It allows us to determine the effects these radiations have on these resins at molecular level and how they consequently modify their hydration mechanisms. It could thus be established that irradiation by electrons almost does not induce modifications on resins cured with aromatic diamines, which results in their hydration capacity being only slightly changed. Irradiation by γ rays induces stronger modifications, which reflect themselves in a greater capacity of absorption of water and different ways of fixing H₂O molecules. Epoxy resins cured with alkyl diamines are more sensitive to irradiation and, after it, absorb a greater amount of H₂O molecules. After irradiation, steric conditions, which hinder H₂O molecules to bind on other H₂O molecules, apparently become less severe. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 329–340, 2000     

The temperature‐dependent ballistic performance and the ductile‐to‐brittle transition in polymer networks

The temperature dependence of the ballistic impact performance of a series of transparent polymer networks is evaluated. A systematic series of homogeneous epoxy/propylene‐oxide‐based thermosets, a nanoscale phase‐separated epoxy/dual amine thermoset, and two homogeneous, completely aliphatic materials synthesized via ring‐opening metathesis polymerization are examined. The Vogel temperature (T_o) and the Kauzmann temperature (T_K) are critical parameters for scaling the temperature‐dependent ballistic impact performance of each class of materials. The ductile‐to‐brittle transition temperature in a series of propylene‐oxide amine‐cured epoxies occurs at the material T_K, corresponding to a sharp drop in fracture toughness and ballistic impact performance. Two aliphatic, ring‐opening metathesis polymerized materials are found to exhibit no clear transition from purely ductile to purely brittle behavior, but the temperature dependence is still scaled to a single curve when normalized by T_o. The cooperatively rearranging region (CRR) or the volume of this region is related to the breadth of temperatures over which these materials exhibit purely ductile deformation both quasi‐statically and at higher rates. The temperature‐dependent performance is discussed in the context of the configurational entropy. The breadth of the ductility window is related to the size of the CRR, calculated from calorimetric measurements at the resin T_g. Published 2019. This article is a U.S. Government work and is in the public domainin the USA. J. Polym. Sci., Part B: Polym. Phys. 2019 , 57, 511–523     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Thermosets containing benzoxazole units: Liquid‐crystalline behavior and thermal conductivity

A series of liquid‐crystalline (LC) thermosetting monomers containing benzoxazole (BO) units were synthesized to evaluate the thermal conductivities (λ) of their cured resins. A BO‐containing bisnadiimide system showed LC behavior during the heating process. However, the thermal cure of the bisnadiimide provided a film without optical anisotropy; consequently, the cured film exhibited normal levels of thermal diffusivity (α) and thermal conductivity (λ). The disappearance of the optically anisotropic ordered structures during thermal curing is likely related to the temperature gaps between the cure reaction ranges and LC ranges (T_cure‐T_LC gap). In addition, epoxy resins consisting of bisepoxides and BO‐containing diamines were investigated because of their high flexibility in terms of molecular design that can be used to reduce the T_cure‐T_LC gap. The combination of a terephthalylidene‐type bisepoxide and BO‐containing diamine with a controlled flexible chain length resulted in the smallest T_cure‐T_LC gap among the epoxy resin systems examined herein. The cured epoxy resin film exhibited an appreciably increased λ value (0.257 W m^?1 K^?1) in the Z direction. This indicated the importance of the T_cure‐T_LC gap for enhancing the α and λ values of the cured films. This epoxy resin system was cured under a continuous DC electric field during polarizing optical microscopy. A prompt response with deformation of the LC domains was observed in harmony with temporal ON/OFF switching of the DC power supply. As expected, the cured film exhibited a significantly enhanced λ value (0.488 W m^?1 K^?1) in the Z direction.     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Thermal properties and toughness performance of hyperbranched‐polyimide‐modified epoxy resins

An amine‐terminated hyperbranched polyimide (HBPI) was prepared by the condensation polymerization of a commercially available triamine monomer with a dianhydride monomer. The effects of the HBPI content on the thermal and mechanical interfacial properties of diglycidyl ether of bisphenol A (DGEBA) epoxy resins were investigated with several techniques. The thermogravimetric analysis results showed that the thermal stability of the DGEBA/HBPI blends did not obviously change as the HBPI content increased. The glass‐transition temperature (T_g) of the DGEBA/HBPI blends increased with the addition of HBPI. Improvements in the critical stress intensity factor (K_IC) and impact strength of the blends were observed with the addition of HBPI. The K_IC value and impact strength were 2.5 and 2 times the values of the neat epoxy resins with only 4 wt % HBPI. The fractured surfaces were studied with scanning electron microscopy to investigate the morphology of the blends, and they showed that shear deformation occurred to prevent the propagation of cracks in the DGEBA/HBPI blends. These results indicated that a toughness improvement was achieved without a decrease in the thermal stability or T_g. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3348–3356, 2006     

Dynamic mechanical properties of epoxy‐phenolic mixtures

The dynamic‐mechanical properties of different mixtures formed by an epoxy resin (DGEBA type) and a phenolic resin (resole type) cured by trietylenetetramine and/or p‐toluensulphonic acid at different concentrations have been studied by means of dynamic mechanical thermal analysis (DMTA). All samples were cured by pressing at 90 °C during 6 h. The mechanical studies were performed between ?100 to 300 °C at a heating rate of 2 °C/min. This study was also carried out for the epoxy‐TETA and phenolic‐p‐toluensulphonic acid systems. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1548–1555, 2005     

Preparation and shape memory behavior of novel heat-resistance epoxy networks containing phthalide cardo structure

Heat-resistance epoxy shape memory (SM) materials were prepared based on diglycidylether of bisphenol A (DGEBA) epoxy resin with the mixture of 4,4′-diaminodiphenylether (DDM) and phthalide-containing aromatic amine (PBMI-DDM), which was synthesized by Michael addition of 3,3-bis[4-(4-maleimido phenoxy)phenyl] -phthalide (PBMI) and DDM, in different molar ratios as curing agents. The chemical structure of PBMI-DDM was confirmed by Fourier transform infrared (FTIR) and nuclear magnetic resonance (NMR) spectra. The dynamical mechanical behavior and high-temperature tensile properties, and the influence of PBMI-DDM content and number of cycles on SM performance were investigated in detail. With increasing PBMI-DDM content, the glass transition temperatures (T_g) decreased, damping loss factors increased, and shape recovery ratio (R_r) and shape fixity ratio (R_f) were improved significantly. R_r and R_f of the pure PBMI-DDM cured epoxy resins are both lager than 90% with a deformation strain above 15%. The T_g and activation energies (△E) of α-relaxation for the epoxy system with unstable SM performance are constantly increased with SM cycles due to the adjustment and rearrangement of network chains.     

Synthesis and characterization of liquid‐crystalline epoxy and its blend with conventional epoxy

Terephthaloyl chloride was reacted with 4‐hydroxy benzoic acid to get terephthaloylbis(4‐oxybenzoic) acid, which was characterized and further reacted with epoxy resin [diglycidyl ether of bisphenol A (DGEBA)] to get a liquid‐crystalline epoxy resin (LCEP). This LCEP was characterized by Fourier transform infrared spectrometry, ¹H and ¹³C NMR spectroscopy, differential scanning calorimetry (DSC), and polarized optical microscopy (POM). LCEP was then blended in various compositions with DGEBA and cured with a room temperature curing hardener. The cured blends were characterized by DSC and dynamic mechanical analysis (DMA) for their thermal and viscoelastic properties. The cured blends exhibited higher storage moduli and lower glass‐transition temperatures (tan δ_max, from DMA) as compared with that of the pure DGEBA network. The formation of a smectic liquid‐crystalline phase was observed by POM during the curing of LCEP and DGEBA/LCEP blends. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 3375–3383, 2003     

Calorimetric studies on an anhydride‐cured epoxy resin from diglycidyl ether of bisphenol‐A and diglycidyl ether of poly(propylene glycol). I. Onset of diffusion control during isothermal polymerization

Calorimetric studies on a series of anhydride‐cured epoxy resins, in which the epoxy oligomer is a mixture of diglycidyl ether of bisphenol‐A (DGEBA) and diglycidyl ether of poly(propylene glycol) (DGEPPG) in different mole ratios, were carried out. DGEPPG is a flexible epoxy oligomer that was used to tune glass transition temperature for the fully reacted epoxy resin. Conversion versus time curves for the systems with different DGEBA/DGEPPG mole ratios (not including the neat DGEPPG system) were found to overlap with each other in mass‐controlled reaction regime, indicating similar reactivities of epoxy groups in both epoxy oligomers. Onset of diffusion‐controlled reaction regime for different systems was estimated by fitting the conversion versus time data using a phenomenological kinetic equation, as well as from direct comparison of the conversion versus time curves. For the systems (i.e., 0, 10, and 30% DGEPPG) that vitrify during reaction, the crossover from mass‐controlled to diffusion‐controlled reaction occurs close to the onset of the vitrification, where T_g is about 25–30 K below the reaction temperature. For the system (i.e., 50% DGEPPG system) that does not vitrify during the reaction, such crossover still occurs when the T_g of the mixture reaches a value about 25 K below the reaction temperature. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 2155–2165, 2008     

Vanillin‐derived phosphorus‐containing compounds and ammonium polyphosphate as green fire‐resistant systems for epoxy resins with balanced properties

Flame retardants from vanillin when utilized together with ammonium polyphosphate (APP) yield excellent synergistic flame retardancy toward epoxy resins. Bisphenol A epoxy resins have been widely used due to their excellent mechanical properties, chemical resistance, electrical properties, adhesion, etc., while they are flammable. Environment‐friendly and bio‐based flame retardants have captured increasing attention due to their ecological necessity. In this paper, 3 bio‐based flame retardants were synthesized from abundant and more importantly renewable vanillin, and their chemical structures were determined by ¹H NMR and ¹³C NMR. They were used together with APP (an environment‐friendly commercial flame retardant) to improve the fire resistance of bisphenol A epoxy resin. With the addition APP content of 15 phr, the modified bisphenol A epoxy resin could reach UL‐94V0 rating during vertical burning test and limit oxygen index values of above 35%, but reducing APP content to 10 phr, the flame retardancy became very poor. With the total addition content of 10 phr, the epoxy resins modified by 7 to 9 phr APP and 1 to 3 phr bio‐based flame retardants with epoxy groups or more benzene rings showed excellent flame retardancy with UL‐94V0 rating and limit oxygen index values of around 29%. The T_gs of the epoxy resins could be remained or even increased after introducing bio‐based flame retardants, as the control; those of APP alone‐modified epoxy resins compromised a lot. The green synergistic flame‐retardant systems have a great potential to be used in high‐performance materials.     

Preparation, characterization and curing properties of epoxy-terminated poly(alkyl-phenylene oxide)s

A series of dihydroxyl telechelic poly(alkyl-phenylene oxide)s (1) have been synthesized by oxidative polymerization of alkylphenols with various aromatic diols using manganese or copper amine catalysts. The novel telechelic derivatives (1) were epoxidized with epichlorohydrin yielding a series of new epoxidized poly(alkyl-phenylene oxide)s (EPPO, 2) and the structures, properties were studied by nuclear magnetic resonance spectroscopy (NMR), differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA) and gel permeation chromatography (GPC). The 1:1 blends of diglycidyl ether of bisphenol-A (DGEBA) with EPPO resins were cured with three curing agents and the effects of chemical structure change on thermal property of the curing matrixes were discussed. Incorporation of EPPOs to DGEBA epoxy system resulted in a significant increase in its glass transition temperature (T_g), thermal stability and flame resistance. The T_g values and char yields arising from a DDM-cured epoxy resin are usually higher than those of dicyandiamide (DICY) or 2-methylimidazole (2-MI) analogues and the reactivity of epoxy blends with three curing agents presents an increase in the order of 2-MI, DDM and DICY. In general, the tetramethylbisphenol-A (TMBPA)-derived polymer exhibits the lowest T_g, char yield and dielectric constant among PPO derivatives whereas the biphenol polymers usually results in higher T_g and char yield due to its rigid rod structure.     

Morphology,toughness mechanism,and thermal properties of hyperbranched epoxy modified diglycidyl ether of bisphenol A (DGEBA) interpenetrating polymer networks

New hyperbranched poly(trimellitic anhydride‐triethylene glycol) ester epoxy (HTTE) is synthesized and used to toughen diglycidyl ether of bisphenol A (DGEBA) 4,4′‐diaminodiphenylmethane (DDM) resin system. The effects of content and generation number of HTTE on the performance of the cured systems are studied in detail. The impact strength is improved 2–7 times for HTTE/DGEBA blends compared with that of the unmodified system. Scanning electron microscopy (SEM) of fracture surface shows cavitations at center and fibrous yielding phenomenon at edge which indicated that the particle cavitations, shear yield deformation, and in situ toughness mechanism are the main toughening mechanisms. The dynamic mechanical thermal analyzer (DMA) analyses suggest that phase separation occurred as interpenetrating polymer networks (IPNs) for the HTTE/DGEBA amine systems. The IPN maintains transparency and shows higher modulus than the neat epoxy. The glass transition temperature (T_g) decreases to some extent compared with the neat epoxy. The T_g increases with increase in the generation number from first to third of HTTE and the concentrations of hard segment. The HTTE leads to a small decrease in thermal stability with the increasing content from TGA analysis. The thermal stability increases with increase in the generation number from first to third. Moreover, HTTE promotes char formation in the HTTE/DGEBA blends. The increase in thermal properties from first to third generation number is attributed to the increase in the molar mass and intramolecular hydrogen bridges, the increasing interaction of the HTTE/DGEBA IPNs, and the increasing crosslinking density due to the availability of a greater number of end hydroxyl and end epoxide functions. Copyright © 2008 John Wiley & Sons, Ltd.     

Copolymer networks from carboxyl‐containing polyaryletherketone and diglycidyl ether of bisphenol‐A: Preparation and properties

This article presents a new type of epoxy‐toughening system, in which high‐T_g polyaryletherketone (PEK‐L) containing one carboxyl group per repeating unit was utilized to randomly copolymerize with epoxy resin (DGEBA) to form crosslinking network. Compared to the neat epoxy resin, the PEK‐L/DGEBA copolymers showed simultaneous enhancement in flexural strains at break by 282%, G_IC value by 193%, and flexural strength by 14%. The reason was attributed to the uniform three‐dimensional copolymer network interweaved by PEK‐L and DGEBA segments through strong covalent bonds. The copolymerization process were monitored and examined by FTIR spectra. The effect of copolymer composition on the thermal and mechanical properties as well as toughening mechanism were also investigated and discussed in detail. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2010     

Influence of silica fillers during the electron irradiation of DGEBA/TETA epoxy resins, part III: Solid-state NMR investigations

The influence of silica fillers on chemical modifications of diglycidyl ether of bisphenol A/triethylene tetramine (DGEBA/TETA) epoxy resins induced by electron beam irradiation has been studied by ¹³C CP-MAS (Cross Polarisation and Magic Angle Spinning) NMR. Four kinds of silica filler were investigated: a pure micrometric silica, a treated micrometric silica, a pure nanometric silica and a treated nanometric silica. On the unirradiated epoxy resins, the magnetization transfer curves reveal structural differences due to the kind of silica fillers. A decrease of the epoxy network rigidity in the presence of nanometric silica fillers is shown. During irradiation, the formation of phenolic ends and enamine functions is confirmed. The slowing of the magnetization transfer of the pure and treated micrometric silica filled epoxy resin reveals an important decrease of the rigidity of these resins. On the pure and treated nanometric silica filled epoxy resins, reactions of the reactive species created by the irradiation in the epoxy resin and the silica particles surface are shown.     

Syntheses of conductive adhesives based on epoxy resin and polyanilines by using N‐tert‐butyl‐5‐methylisoxazolium perchlorate as a thermally latent curing reagent

Conductive composites consisted of epoxy resin and polyanilines (PANIs) doped with dodecylbenzenesulfonic acid ( 1 ), dodecylsulfonic acid (2), di(2‐ethylhexyl)sulfosuccinic acid (3), and HCl were synthesized by use of N‐tert‐butyl‐5‐methylisoxazolium perchlorate (5) under various reaction conditions. It was found that the composites with PANI doped with acid 2 (PANI‐2) prepared by curing with 10 mol % of reagent 5 at 80 °C for 12 h showed high electroconductivity along with the low conducting percolation threshold (3 wt % of PANI‐2). Furthermore, the composite with even ?10 wt % of PANI‐2 exhibited ?10^?1 S/cm of electroconductivity. The UV–vis and IR measurements indicated that the conductive emeraldine salt form of PANI‐2 in the composite was maintained after the curing reaction. The thermal stability was studied by TGA and DSC measurements, and then, the T_d10 and T_g of the composite with 5 and 10 wt % of PANI‐2 were found to be similar to those with the cured epoxy resin itself. In addition, the similar investigation with an oxetane resin instead of the epoxy resin was also carried out. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 718–726, 2006