Growth and characterization of c-plane AlGaN on γ-LiAlO2

This study demonstrates a pure c-plane AlGaN epilayer grown on a γ-LiAlO₂ (1 0 0) (LAO) substrate with an AlN nucleation layer grown at a relatively low temperature (LT-AlN) by metal-organic chemical vapor deposition (MOCVD). The AlGaN film forms polycrystalline film with m- and c-plane when the nucleation layer grows at a temperature ranging from 660 to 680 °C. However, a pure c-plane AlGaN film with an Al content of approximately 20% can be obtained by increasing the LT-AlN nucleation layer growth temperature to 700 °C. This is because the nuclei density of AlN increases as the growth temperature increases, and a higher nuclei density of AlN deposited on LAO substrate helps prevent the deposition of m-plane AlGaN. Therefore, high-quality and crack-free AlGaN films can be obtained with a (0 0 0 2) ω-rocking curve FWHM of 547 arcsec and surface roughness of 0.79 nm (root-mean-square) using a 700-°C-grown LT-AlN nucleation layer.     

TEM study of defects in AlxGa1−xN layers with different polarity

Transmission electron microscopy (TEM) studies of defects in Al_xGa_1?xN layers with various Al mole fractions (x=0.2, 0.4) and polarities were carried out. The samples were grown by ammonia molecular beam epitaxy on sapphire substrates and consisted of low-temperature AlN (LT-AlN) and high-temperature AlN (HT-AlN) buffer layers, a complex AlN/AlGaN superlattice (SL) and an Al_xGa_1?xN layer (x=0.2, 0.4). It was observed that at the first growth stages a very high density of dislocations is introduced in both Al-polar and N-polar structures. Then, at the interface of the LT-AlN and HT-AlN layers half-loops are formed and the dislocation density considerably decreases in Al-polar structures, whereas in the N-polar structures such a behavior was not observed.The AlN/AlGaN superlattice efficiently promotes the bend and annihilation of threading dislocations and respectively the decrease of the dislocation density in the upper Al_xGa_1?xN layer with both polarities.The lattice relaxation of metal-polar Al_0.2Ga_0.8N was observed, while N-polar Al_0.2Ga_0.8N did not relax. The dislocation densities in the N-polar Al_0.2Ga_0.8N and Al_0.4Ga_0.6N layers were 5.5×10⁹ cm^?2 and 9×10⁹ cm^?2, respectively, and in metal-polar Al_0.2Ga_0.8N and Al_0.4Ga_0.6N layers these were 1×10¹⁰ cm^?2 and 6×10⁹ cm^?2, respectively.Moreover, from TEM images the presence of inversion domains (IDs) in N-polar structures has been observed. The widths of IDs varied from 10 to 30 nm. Some of the IDs widen during the growth of the AlN buffer layers. The IDs formed hills on the surface of the N-polar structures.     

Electron microscopy analysis of dislocation behavior in HVPE-AlGaN layer grown on a stripe-patterned (0 0 0 1) sapphire substrate

Microstructures were investigated by transmission electron microscopy (TEM) and scanning electron microscopy (SEM) in order to clarify the dislocation behavior in AlGaN layers HVPE-grown on a stripe-patterned sapphire (0 0 0 1) substrate. SEM observation revealed very clearly the growth process: if AlGaN starting to grow from the side-wall of patterned substrate develops, a poly-crystalline region is formed up to the top surface of thin film. When the growth from the upper side (terrace) of patterned substrate is predominant, AlGaN becomes a single-crystalline layer with a flat surface. Threading dislocations (TDs) generated from the interface to the terrace propagate upwards, inclining to the wing regions. They are scarcely merged with one another. The AlGaN layer on the patterned substrate with a wider groove has a smaller density of dislocation to be about 1×10⁹ cm⁻². There are four types of dislocations: (1) TDs inclining toward 〈1 1¯ 0 0〉 normal to their Burgers vector B; (2) TDs inclining toward 〈2 1¯ 1¯ 0〉 on their slip-plane; (3) TDs inclining largely or horizontal dislocations (HDs) along 〈2 1¯ 1¯ 0〉 and (4) roundly curved HDs lying on (0 0 0 1) plane. Some TDs change the direction of inclination, suggesting that internal stress changed intricately during the growth.     

SEM Observation of Nucleation and Growth of Ag Crystallites on Graphite Substrate

“In-Situ” observation of nucleation and growth of Ag crystallites on graphite substrate by vapour deposition was carried out by scanning electron microscope (SEM). Irradiation of the SEM electron beam onto the substrate surface before and during deposition enhanced Ag nucleation. The density of the Ag crystallites was 10¹⁰/cm² in room temperature condensation, but decreased to 10⁹/cm² in high temperature condensation at 140 °C. When the substrate was heated after room temperature condensation, the density of the Ag crystallites decreased prominently. This means that coalescence of the Ag crystallites takes place as a result of their migration on the substrate.     

Improvement of crystal quality of AlN grown on sapphire substrate by MOCVD

The crystalline quality of aluminum nitride (AlN) epilayers grown on sapphire substrates by MOCVD was improved by increasing hydrogen flow rate during the high temperature growth process. The AlN epilayer exhibited a root mean square (rms) of roughness was 1.944 nm from the 2×2 µm² size atomic force microscopy (AFM) images. Full widths at half maximum (FWHMs) of (002) and (102) rocking curves of triple‐axis high resolution X‐ray diffraction (HRXRD) measurements were as narrow as 28.8 arc sec and 868 arc sec, respectively. The optical transmittance spectra showed a sharp absorption edge at a wavelength of 200 nm and strong Fabry‐Perot (FP) oscillations. It is proposed that the improvement in crystalline quality is due to the surface in the low‐temperature aluminum nitride (LT‐AlN) buffer layer is promoted to be stable Al‐polarity by the conditions of increasing hydrogen flow rate and ramping up the growth temperature. Addtionally, the parasitic reactions are effectively suppressed by increasing the hydrogen flow rate during the growth process of high temperature. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

TEM investigations of GaN layers grown on silicon and sintered GaN nano‐ceramic substrates

GaN nano‐ceramics were analyzed using transmission electron microscopy (TEM), showing that these ceramics are characterized by highly disoriented grains of the linear size of 100–150 nm. These GaN ceramics were used as substrates for GaN epitaxy in standard MOVPE conditions. For the comparison, MOVPE GaN layers on silicon substrates were grown using similar conditions. It is shown that MOVPE growth of GaN layers is highly anisotropic for both cases. However, the disorientation of the highly mismatched GaN layer on silicon is different from that characterizing GaN layer deposited on the ceramic substrate. In the latter case the disorientation is much higher, and three dimensional in nature, causing creation of polycrystalline structure having large number of the dislocations. In the case of the GaN layer grown on the silicon substrate the principal disorientation is due to rotation around c‐axis, causing creation of mosaic structure of edge dislocations. Additionally, it is shown that the typical grain size in AlN nucleation layer on Si is smaller, of order of 20 nm. These two factors contribute to pronounced differences in later stage of the growth of GaN layer on the ceramic. Due to high growth anisotropy an appropriately thick GaN layer can, eventually, develop flat surfaces suitable for construction of optoelectronic and electronic structures. As shown by the TEM data, this can be achieved only at the cost of creation of the relatively large density of dislocations and stacking faults. The latter defects were not observed for the GaN growth on Si substrates. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influence of AlN nucleation layer growth conditions on quality of GaN layers deposited on (0 0 0 1) sapphire

The influence of AlN nucleation layer (NL) growth conditions on the quality of GaN layer deposited on (0 0 0 1) sapphire by organometallic chemical vapor phase epitaxy (OMVPE) has been investigated by X-ray diffraction, atomic force microscopy and transmission electron microscopy. Growth pressure, temperature and time were varied in this study. Results indicate that there exists an optimal thickness of the NL is required for optimal growth. Both thin and thick NLs are not conducive to the growth of high-quality GaN layers. Arguments have been developed to rationalize these observations.     

Stress control by micropits density variation in strained AlGaN/GaN/SiN/AlN/Si(111) heterostructures

AlGaN/GaN heterostructures were deposited on Si utilizing in‐situ SiN masking layer as a mean to decrease stress present in the final heterostructures. Structures were grown under different V/III ratio using metalorganic vapour phase epitaxy (MOVPE). Additional approach was applied to obtain crack‐free heterostructures which was deposition of 15 nm low temperature AlN interlayer. Each of the heterostructure contained GaN layer of 2.4 μm total thickness. In‐situ SiN masking layer were obtained via introduction of SiH4 precursor into reactor under high temperature growth conditions for 100 s. In that manner, few monolayers of SixNx masking layer were deposited, which due to the partial coverage of AlN, played role of a mask leading to initial 3D growth mode enhancing longer coalescence of GaN buffer layer. To study surface morphology AFM images were observed. Three methods were used in order to obtain basal plane stress present in multilayer structures ‐ MicroRaman spectroscopy, XRD studies and optical profilometry. It was found that varying V/III precursors ratio during GaN layer growth characteristic for structures with the SiN mask approach formation of triangular micropits can be minimized. Outcomes for three different methods turned out to be coherent. It was found that certain amount of micropits on the surface can be advantageous lowering stress introduced during cooling after process to the AlGaN/GaN/SiN/AlN/Si(111) structure.     

Single‐crystal sapphire microstructure for high‐resolution synchrotron X‐ray monochromators

We report on the growth and characterization of sapphire single crystals for X‐ray optics applications. Structural defects were studied by means of laboratory double‐crystal X‐ray diffractometry and white‐beam synchrotron‐radiation topography. The investigations confirmed that the main defect types are dislocations. The best quality crystal was grown using the Kyropoulos technique. Therein the dislocation density was 10²–10³ cm⁻² and a small area with approximately 2*2 mm² did not show dislocation contrast in many reflections. This crystal has suitable quality for application as a backscattering monochromator. A clear correlation between growth rate and dislocation density is observed, though growth rate is not the only parameter impacting the quality.     

Investigation of void formation beneath thin AlN layers by decomposition of sapphire substrates for self-separation of thick AlN layers grown by HVPE

Void formation at the interface between thick AlN layers and (0 0 0 1) sapphire substrates was investigated to form a predefined separation point of the thick AlN layers for the preparation of freestanding AlN substrates by hydride vapor phase epitaxy (HVPE). By heating 50–200 nm thick intermediate AlN layers above 1400 °C in a gas flow containing H₂ and NH₃, voids were formed beneath the AlN layers by the decomposition reaction of sapphire with hydrogen diffusing to the interface. The volume of the sapphire decomposed at the interface increased as the temperature and time of the heat treatment was increased and as the thickness of the AlN layer decreased. Thick AlN layers subsequently grown at 1450 °C after the formation of voids beneath the intermediate AlN layer with a thickness of 100 nm or above self-separated from the sapphire substrates during post-growth cooling with the aid of voids. The 79 μm thick freestanding AlN substrate obtained using a 200 nm thick intermediate AlN layer had a flat surface with no pits, high optical transparency at wavelengths above 208.1 nm, and a dislocation density of 1.5×10⁸ cm⁻².     

Spatially resolved X‐ray diffraction as a tool for strain analysis in laterally modulated epitaxial structures

Spatially resolved X‐ray diffraction (SRXRD) is applied for micro‐imaging of strain in laterally modulated epitaxial structures. In GaAs layers grown by liquid phase epitaxial lateral overgrowth (ELO) on SiO₂‐masked GaAs substrates a downward tilt of ELO wings caused by their interaction with the mask is observed. The distribution of the tilt magnitude across the wings width is determined with μm‐scale spatial resolution. This allows measuring of the shape of the lattice planes in individual ELO stripes. If a large area of the sample is studied the X‐ray imaging provides precise information on the tilt of an individual wing and its distribution. In heteroepitaxial GaSb/GaAs ELO layers local mosaicity in the wing area is found. By the SRXRD the size of microblocks and their relative misorientation were analyzed. Finally, the SRXRD technique was applied to study distribution of localized strain in AlGaN epilayers grown by MOVPE on bulk GaN substrates with AlN mask. X‐ray mapping proves that by mask patterning strain in AlGaN layer can be easily engineered, which opens a way to produce thicker, crack‐free AlGaN layers with a higher Al content needed in GaN‐based laser diodes. All these examples show that high spatial and angular resolutions offered by SRXRD makes the technique a powerful tool to study local lattice distortions in semiconductor microstructures. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

AlGaN epitaxial lateral overgrowth on Ti-evaporated GaN/sapphire substrate

AlGaN growth using epitaxial lateral overgrowth (ELO) by metalorganic chemical vapor deposition on striped Ti, evaporated GaN on sapphire, has been investigated. AlGaN/AlN films growth on GaN/AlGaN superlattices (SLs) structure on the Ti masks, with various SLs growth temperature (1030, 1060 and 1090 °C) were grown. With increasing the growth temperature, AlGaN surface became flat. The AlGaN film had a cathodoluminescence peak around 345 nm. However, in secondary ion mass spectrometry (SIMS) measurement, Ti signal was detected on the top of AlGaN surface when GaN/AlGaN SLs was grown on Ti striped masks. By inserting the AlN blocking layer on SLs, Ti diffusion was stopped at the AlN layer, and the AlGaN crystalline quality was improved.     

Observation of individual dislocations in 6H and 4H SiC by means of back‐reflection methods of X‐ray diffraction topography

SiC crystals of high structural perfection were investigated with several methods of X‐ray diffraction topography in Bragg‐case geometry. The methods included section and projection synchrotron white beam topography and monochromatic beam topography. The investigated 6H and 4H samples contained in large regions dislocations of density not exceeding 10³ cm^‐2. Most of them cannot be interpreted as hollow core dislocations (micro‐ or nano‐pipes). The concentration of the latter was lower than 10² cm^‐2. The present investigation confirmed the possibility of revealing dislocations with all used methods. The quality of presently obtained Bragg‐case multi‐crystal and section images of dislocation enabled analysis based on comparison with numerically simulated images. The analysis confirmed the domination of screw‐type dislocations in the investigated crystals. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

The impact of an intermediate temperature buffer on the growth of GaN on an AlN template by hydride vapor phase epitaxy

The present study focused on the effect of an intermediate-temperature (IT; ∼900 °C) buffer layer on GaN films, grown on an AlN/sapphire template by hydride vapor phase epitaxy (HVPE). In this paper, the surface morphology, structural quality, residual strain, and luminescence properties are discussed in terms of the effect of the buffer layer. The GaN film with an IT-buffer revealed a relatively lower screw-dislocation density (3.29×10⁷ cm⁻²) and a higher edge-dislocation density (8.157×10⁹ cm⁻²) than the GaN film without an IT-buffer. Moreover, the IT-buffer reduced the residual strain and improved the luminescence. We found that the IT-buffer played an important role in the reduction of residual strain and screw-dislocation density in the overgrown layer through the generation of edge-type dislocations and the spontaneous treatment of the threading dislocation by interrupting the growth and increasing the temperature.     

Transmission electron microscopy investigation of AlN growth on Si(111)

AlN layers with a thickness of 250 nm were grown by plasma-assisted gas source molecular-beam epitaxy on Si(111) at substrate temperatures between 600 °C and 900 °C. The surface morphology and microstructure of the AlN layers were analyzed by scanning and transmission electron microscopy. Different defect types are observed in the AlN layers and at the AlN/Si(111) interfaces as a function of the temperature: inclusions of pure Al in the Si-substrate, crystallites of the cubic AlN phase, dislocations, stacking faults and inversion domain boundaries. The formation and concentration of the defects depends strongly on the substrate temperature during the growth. X-ray diffraction rocking curves for the (0002) reflection yield minimum full width at half maximum values for the sample grown at the 900 °C under Al-rich conditions indicating optimum structural quality. However, the discussion of the entity of defects will show that a more differentiated view is required to assess the overall quality of the AlN layers.     

Digitally alloyed modulated precursor flow epitaxial growth of AlxGa1−xN layers with AlN and AlyGa1−yN monolayers

We propose a new growth scheme of digitally alloyed modulated precursor flow epitaxial growth (DA-MPEG) using metalorganic and hydride precursors for the growth of Al_xGa_1−xN layers with high-Al content at relatively low temperatures. The growth of high-quality, high-Al content Al_xGa_1−xN layers (x_Al>50%) that are composed of AlN and Al_yGa_1−yN monolayers on AlN/sapphire template/substrates by DA-MPEG was demonstrated. The overall composition of the ternary Al_xGa_1−xN material by DA-MPEG can be controlled continuously by adjusting the Column III mole fraction of the atomic Al_yGa_1−yN sub-layer. X-ray diffraction and optical transmittance results show that the AlGaN materials have good crystalline quality. The surface morphology of DA-MPEG AlGaN samples measured by atomic force microscopy are comparable to high-temperature-grown AlGaN and are free from surface features such as nano-pits.     

Preparation of Ge-Si epitaxial alloys by sputtering

Ge-Si alloy layers have been epitaxially grown throughout the whole range of composition onto Ge substrates by the simultaneous getter sputtering from elemental Ge and Si sources. The epitaxial temperature was 550 to 830° C at growth rates of about 1 μm/h, depending on the Si atomic fraction in the range of 0.05 to 0.88. As the Si content in the alloy increases, the crystallinity of the layer decreases: Si-rich alloy layers contained microtwins. Hall measurements of alloy layers without intentional doping indicated p-type conductivity with Hall mobility of 600 cm²/V·sec at carrier concentration of 2 × 10¹⁶ cm^-3 for 25 at% Si in the alloy at room temperature. The observed temperature dependence of the hole mobility is indicative of alloy scattering.     

Effect of dislocation loops in macroscopically dislocation-free GaP substrates on the perfection of homo-epitactic deposits

Substrates and epitactic layers of GaP are etched under optimized conditions with the defect-revealing, preferential R-C etchant and subsequently examined using high-magnification (about 2500X) optical microscopy techniques. It is possible then to distinguish two new phenomena, viz. etch pits characteristic of dislocation loops in the substrate, and inclined dislocation dipoles in the layer. For layers grown on dislocation-free substrates we find that (i) the surface densities of both defects are equal (～5 × 10⁵cm^-2), and (ii) the average diameter of the dislocation loops in the substrate is roughly the same as the average distance between the two dislocations of the dislocation dipoles (0.5?1μm). Hence the perfection of these layers is determined by interfacial dislocation loops. Because the density of dislocation loops is only about a factor of two lower in highly (～1 × 10⁵ cm^-2) dislocated substrates, growth on these substrates results in layers which have even slightly lower dislocation density than layers grown on dislocation-free substrates. In the former case also single dislocations in the substrate propagate into the layer. Minority-carrier lifetime data indicate that minority-carrier recombination at dislocations is a restrictive factor for the luminescence quality of layers grown both on dislocation-free and highly-dislocated substrates.     

MOVPE of AlN-free hexagonal GaN/cubic SiC/Si heterostructures for vertical devices

The heterostructures of GaN/SiC/Si were prepared without using AlN or AlGaN buffer layers (AlN buffers) in the metalorganic vapor phase epitaxy of GaN on SiC. GaN (0 0 0 1) with specular surface was obtained. The AlN buffers are usually used in the conventional growth of GaN on SiC due to the poor nucleation of GaN on SiC. Instead, the nucleation of GaN was controlled by varying the partial pressure of H₂ in the carrier gas, the mixture of H₂ and N₂, during the low-temperature (600 °C) growth of GaN (LT-GaN). After the LT-GaN, the high-temperature (1000 °C) growth of GaN was performed using pure H₂ as the carrier gas. The epitaxial film of cubic SiC (1 1 1) on a Si (1 1 1) substrate was used as the SiC template. Increasing the partial pressure of H₂ in the carrier gas decreased the coverage of SiC surface by LT-GaN. It is suggested that the hydrogen atoms adsorbed on the surface of SiC is preventing the nucleation of GaN.     

Growth and characterization of highly c‐axis textured SrTiO3 thin films directly grown on Si(001) substrates by ion beam sputter deposition

Highly c‐axis textured SrTiO₃ (STO) thin films have been directly grown on Si(001) substrates using ion beam sputter deposition technique without any buffer layer. The substrate temperature was varied, while other parameters were fixed in order to study effect of substrate temperature on morphology and texture evolution of STO films. X‐ray diffraction, pole figure analysis, atomic force microscope, and high‐resolution electron microscopy were used to characterize and confirm quality and texture of the STO films. The experimental results show that optimum substrate temperature to achieve highly c‐axis textured films is at 700 °C. The full width at half maximum (FWHM) of 002_STO was found to be 2° and fraction of (011) orientation was as low as 1%. The surface morphology was Volmer‐Weber growth mode with a small roughness ∼1 nm. The lowest leakage current density (5.8 μA/cm² at 2 V) and the highest dielectric constant (ε_STO ∼ 98) were found for highly c‐axis textured films grown at 700 °C. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)