Two‐ and three‐dimensional growth modes of nitride layers

Heteroepitaxial three dimensional (3D) and two dimensional (2D) growth modes of nitride layers on sapphire substrates are discussed. It is shown that the 3D or 2D growth mode of AlGaN layers depends predominantly on the growth conditions of the underneath low temperature (LT) nucleation layer. Commonly described in literature 3D growth mode is achieved on LT GaN or AlN nucleation layer grown relatively fast. Successive growth of secondary layer at high temperature begins from separated sites, where individual 3D crystallites are formed. Threading dislocations present in crystallites bend on their facets, which reduces the quantity of dislocations. However, slight crystallographic misorientations between crystallites lead to the creation of new dislocations during coalescence of the crystallites. As a result, edge and mix dislocations appear at similar densities of about 10⁹ cm^‐2. Modification of growth conditions of LT AlN nucleation layer, especially reduction of their growth rate, leads to drastic changes in properties of the layer. Successive growth of secondary AlGaN layer at high temperature starts evenly on whole surface retaining atomic flatness. Thus growth at high temperature occurs only by 2D mode. Therefore, it is possible to grow a very thin AlGaN layers directly on top of LT nucleation layer. Such layers contain large number (10¹⁰ cm^‐2) of edge dislocations, and relatively small number (less then 10⁸ cm^‐2) of mix dislocations. It is also shown that the decisive factor determining the growth mode of AlN nucleation layer is a growth of the first few atomic layers on substrate surface. The slow growth of these few first atomic layers decide about the 2D growth mode, and the fast one about the 3D one. The model explaining this difference is presented as well. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

X-ray diffraction study and quantitative measurements of high dislocation densities in superlattices and single crystal layers of heteroepitaxial systems with pronounced lattice mismatch

Plastic deformation in a single-crystal layer of the In_0.12Ga_0.88As/(111)InP solid solution is identified by the methods of X-ray diffractometry (XRD) and the double-crystal pseudorocking curves (DCPRC). X-ray topographs showed the generation of three intersecting systems of straight dislocations in the layer. In a one-layer ZnSe/GaAs structure and multilayer ZnSe/ZnSe_{1 − x} S_x/ZnSe/GaAs structures, the elastic and plastic strains were detected by the combined XRD-DCPRC method. The major components of the thermoelastic and plastic-deformation tensors were determined as ε_xx = ε_yy = 3.5 × 10⁻³ and ε_zz = 2.35 × 10⁻³. Using these data, the dislocation densities were determined as N _d ∼ 2.5 × 10⁸ cm⁻² and N _d ∼ 3 × 10¹⁰ cm⁻² for the 7 μm-thick ZnSe and 1 μm-thick InAs layers, respectively. In a superlattice of the Al_xGa_{1 − x} As/GaAs/⋯/GaAs-type with a large lattice parameter, the plastic deformation was detected. X-ray topography confirmed that the dislocation density in this superlattice equals ∼10⁵ cm⁻². __________ Translated from Kristallografiya, Vol. 45, No. 2, 2000, pp. 326–331. Original Russian Text Copyright ? 2000 by Kuznetsov.     

Misfit Strain Relaxation by Dislocations in InAs Islands and Layers Epitaxially Grown on (001)GaAs Substrates by MOVPE

The misfit dislocation configurations in InAs islands as well as in more or less continuous layers grown on (001) oriented GaAs substrates were studied by weak-beam and high-resolution electron microscopy. The islands are confined by {101} and {111} facets where the aspect ratio (height/lateral extension) can be affected by the growth conditions. It is possible to grow well-defined islands as well as relatively continuous layers by MOVPE under As-stabilized conditions. At constant deposition parameters the growth is characterized by islands of different sizes (but with constant aspect ratio) in various strain states depending on their dislocation content. Coherently strained islands without any dislocation can be observed for heights up to 23 ML InAs, or otherwise, up to a maximal island extension of about 12 nm (for the particular aspect ratio ≈︂0.585). With further increase of island height and lateral extension, the introduction of dislocations becomes favourable. Independent of the island size, the layer thickness and the dislocation density, a residual elastic strain of about ε^r = —0.8% remains after relaxation. This means, about 88% of the total misfit strain of ε = —6.686 × 10^—2 were compensated by Lomer dislocations. These sessile Lomer dislocations lie in the island interior only, where single 60° dislocations were observed exclusively in their near-edge regions. With increasing island size and/or layer thickness some close-spaced 60° dislocations occur additionally within the interfacial region. The Lomer dislocations that are always located 4 monolayers (ML) above the InAs/GaAs interfacial plane result from the well-known fusion of two 60° slip dislocations. These 60° dislocations have been nucleated 7 … 8 ML above the interface at surface steps on the {111} facets confining the islands. Based on our experimental observations a new mechanism is proposed that explains the origin of these 60° dislocations. Their further fusion to sessile Lomer dislocations that compensate the misfit strain most efficiently occurs in the way as commonly accepted.     

X-ray reflectometry of the specific features of structural distortions of He+-implanted Si(001) surface layers

The structural changes in the surface layers of silicon substrates, implanted by helium ions with energies from 2 to 5 keV and doses to 6 × 10¹⁵–5 × 10¹⁷ cm^?2, has been studied by high-resolution X-ray reflectometry. The damaged layer is found to have a total thickness comparable with the total ion path length (estimated from the SRIM model) and a multilayer structure: a strongly amorphized layer with reduced density, a porous (incapsulated) layer, and a deformed layer. The thickness of sublayers, their density ρ(z), and the mean strain (～5 × 10^?3) have been determined. The characteristic pore size is estimated to be 5–20 nm. It is shown that the presence of a nanoporous layer facilitates the formation of diffuse scattering, which can be used to diagnose layers by high-resolution X-ray reflectometry.     

Reduction of grown-in dislocation density in Ge Czochralski-grown from the B2O3-partially-covered melt

Germanium (Ge) single crystals with an extremely low density of grown-in dislocations were grown by the Czochralski (CZ) technique with boron oxide (B₂O₃) liquid. Because attachment of particles floating on the melt surface to a growing Ge crystal leads to generation of dislocations during the growth, partial covering of the Ge melt surface with B₂O₃ liquid was attempted. Such attachment of particles was drastically suppressed or the particles were caught by the introduction of B₂O₃ liquid, and a particle-free Ge melt was realized in the central region of the melt surface. Ge single crystals were successfully grown from such melt, the grown-in dislocation density being 0–1×10³ cm⁻², which was remarkably lower than that in Ge crystals grown by a conventional CZ technique. The contaminations by B and O atoms of the grown crystal detected by SIMS analysis were very low. These Ge crystals have the potential for application to be applied as high-quality, dislocation-free substrates of GaAs solar cells for various usages including in space.     

TEM study of defects in AlxGa1−xN layers with different polarity

Transmission electron microscopy (TEM) studies of defects in Al_xGa_1?xN layers with various Al mole fractions (x=0.2, 0.4) and polarities were carried out. The samples were grown by ammonia molecular beam epitaxy on sapphire substrates and consisted of low-temperature AlN (LT-AlN) and high-temperature AlN (HT-AlN) buffer layers, a complex AlN/AlGaN superlattice (SL) and an Al_xGa_1?xN layer (x=0.2, 0.4). It was observed that at the first growth stages a very high density of dislocations is introduced in both Al-polar and N-polar structures. Then, at the interface of the LT-AlN and HT-AlN layers half-loops are formed and the dislocation density considerably decreases in Al-polar structures, whereas in the N-polar structures such a behavior was not observed.The AlN/AlGaN superlattice efficiently promotes the bend and annihilation of threading dislocations and respectively the decrease of the dislocation density in the upper Al_xGa_1?xN layer with both polarities.The lattice relaxation of metal-polar Al_0.2Ga_0.8N was observed, while N-polar Al_0.2Ga_0.8N did not relax. The dislocation densities in the N-polar Al_0.2Ga_0.8N and Al_0.4Ga_0.6N layers were 5.5×10⁹ cm^?2 and 9×10⁹ cm^?2, respectively, and in metal-polar Al_0.2Ga_0.8N and Al_0.4Ga_0.6N layers these were 1×10¹⁰ cm^?2 and 6×10⁹ cm^?2, respectively.Moreover, from TEM images the presence of inversion domains (IDs) in N-polar structures has been observed. The widths of IDs varied from 10 to 30 nm. Some of the IDs widen during the growth of the AlN buffer layers. The IDs formed hills on the surface of the N-polar structures.     

Characterization of deep levels in a-plane GaN epi-layers grown using various growth techniques

To study the correlation between defects and deep levels in a-plane GaN films grown on r-plane sapphire substrates, transmission electron microscopy (TEM) and deep level transient spectroscopy (DLTS) have been performed on three types of a-plane GaN samples grown using modified two-step growth (sample I), SiN_x interlayer (sample II), and patterned insulator on sapphire substrate (sample III). From the microstructure evolution in cross-sectional TEM images, it was shown that combination of growth techniques is highly efficient in the reduction of dislocation densities. Average dislocation densities of samples I, II, and III were about 2.2×10⁹ cm^?2, 1.1×10⁹ cm^?2, and 3.4×10⁸ cm^?2, respectively. The trap a_t E_c–E_t～0.13 eV (E1) was observed in only sample I, and three electron traps at 0.28–0.33 eV (E2), 0.52–0.58 eV (E3), and 0.89–0.95 eV (E4) from the conduction band edge were measured common to all the samples. The analysis of trap properties indicated that E2 and E3 trap levels are strongly associated with the partial dislocations in a-plane GaN films.     

Specific features of the formation of dislocation structure in gallium arsenide single crystals obtained by the Czochralski method

The influence of the deviation of seed orientation from the [100] direction on the formation of a dislocation structure of gallium arsenide single crystals grown by the Czochralski method has been revealed. The intensive multiplication of dislocations and formation of a block structure occur at deviation by an angle of more than 3° in the region that is radially shifted to one of crystal sides. The linear density of dislocations in the walls changes from 1 × 10⁴ cm^–1 in low-angle boundaries to 6 × 10⁴ cm^–1 in subboundaries.     

Determination of the types and densities of dislocations in GaN epitaxial layers of different thicknesses by optical and atomic force microscopy

The change in the dislocation density on the surface of GaN epitaxial layers, which were grown by hydride vapor-phase epitaxy on sapphire substrates with c and r orientations, has been investigated by optical and atomic force microscopy (AFM). It is shown that the observed decrease in the density of threading dislocations with an increase in the layer thickness is related to the annihilation of mixed dislocations. The experimental and theoretical data on the change in the density of mixed dislocations with an increase in the epitaxial-layer thickness are in good correspondence.     

Optical birefringence images of dislocations in large gallium phosphide crystals

The optical birefringence induced by the strain field of a dislocation has been used to follow dislocation lines through large gallium phosphide crystals. Dislocations could be seen whether their lines were parallel to the imaging light beam or were steeply inclined to it. The images obtained so far suggest that it would be possible to resolve individual dislocations in crystals that contain ?5 × 10⁵ dislocations per cm².     

GaAs LPE growth and its application to FET

Residual impurities and deep levels in the LPE GaAs layers grown by a sliding boat method were studied. Residual impurities were investigated by monitoring oxygen and water vapor contents in the exhaust gas during heat treatment. The results are satisfactorily explained by assuming oxygen as a dominant residual impurity. Electron traps with a density higher than 5 × 10¹² cm^-3 were not observed in the LPE layers, whereas in VPE layers, 0.82 eV electron traps were always observed. LPE double layers (high purity buffer layer and active layer) were fabricated into FET's. GaAs FET's with a 1 μm gate showed no hysteresis loops in the I–V characteristics and had fairly good high-frequency characteristic (f_max = 70 GHz, NF = 2.4 dB at 10.4 GHz).     

Investigation of void formation beneath thin AlN layers by decomposition of sapphire substrates for self-separation of thick AlN layers grown by HVPE

Void formation at the interface between thick AlN layers and (0 0 0 1) sapphire substrates was investigated to form a predefined separation point of the thick AlN layers for the preparation of freestanding AlN substrates by hydride vapor phase epitaxy (HVPE). By heating 50–200 nm thick intermediate AlN layers above 1400 °C in a gas flow containing H₂ and NH₃, voids were formed beneath the AlN layers by the decomposition reaction of sapphire with hydrogen diffusing to the interface. The volume of the sapphire decomposed at the interface increased as the temperature and time of the heat treatment was increased and as the thickness of the AlN layer decreased. Thick AlN layers subsequently grown at 1450 °C after the formation of voids beneath the intermediate AlN layer with a thickness of 100 nm or above self-separated from the sapphire substrates during post-growth cooling with the aid of voids. The 79 μm thick freestanding AlN substrate obtained using a 200 nm thick intermediate AlN layer had a flat surface with no pits, high optical transparency at wavelengths above 208.1 nm, and a dislocation density of 1.5×10⁸ cm⁻².     

Study of the amorphization of surface silicon layers implanted by low-energy helium ions

The structural changes in surface layers of Si(001) substrates subjected to plasma-immersion implantation by (2–5)-keV helium ions to a dose of D = 6 × 10¹⁵–5 × 10¹⁷ cm^–2 have been studied by highresolution X-ray diffraction, Rutherford backscattering, and spectral ellipsometry. It is found that the joint application of these methods makes it possible to determine the density depth distribution ρ(z) in an implanted layer, its phase state, and elemental composition. Treatment of silicon substrates in helium plasma to doses of 6 × 10¹⁶ cm^–2 leads to the formation of a 20- to 30-nm-thick amorphized surface layer with a density close to the silicon density. An increase in the helium dose causes the formation of an internal porous layer.     

Study of the possibility of growing germanium single crystals under low temperature gradients

The possibility of growing germanium single crystals under low temperature gradients in order to produce a dislocation-free material has been studied. Germanium crystals with a dislocation density of about 100–200 cm^?2 have been grown in a system with a weight control of crystal growth at maximum axial gradients of about 1.5 K/cm.     

X-ray diffraction characterization of epitaxial CVD diamond films with natural and isotopically modified compositions

Comparative investigations of homoepitaxial diamond films with natural and modified isotopic compositions, grown by chemical vapor deposition (CVD) on type-Ib diamond substrates, are carried out using double-crystal X-ray diffractometry and topography. The lattice mismatch between the substrate and film is precisely measured. A decrease in the lattice constant on the order of (Δa/a)_relax ～ (1.1–1.2) × 10^–4 is recorded in isotopically modified ¹³С (99.96%) films. The critical thicknesses of pseudomorphic diamond films is calculated. A significant increase in the dislocation density due to the elastic stress relaxation is revealed by X-ray topography.     

Preparation of Ge-Si epitaxial alloys by sputtering

Ge-Si alloy layers have been epitaxially grown throughout the whole range of composition onto Ge substrates by the simultaneous getter sputtering from elemental Ge and Si sources. The epitaxial temperature was 550 to 830° C at growth rates of about 1 μm/h, depending on the Si atomic fraction in the range of 0.05 to 0.88. As the Si content in the alloy increases, the crystallinity of the layer decreases: Si-rich alloy layers contained microtwins. Hall measurements of alloy layers without intentional doping indicated p-type conductivity with Hall mobility of 600 cm²/V·sec at carrier concentration of 2 × 10¹⁶ cm^-3 for 25 at% Si in the alloy at room temperature. The observed temperature dependence of the hole mobility is indicative of alloy scattering.     

Defect Structure of Strained Heteroepitaxial In(1—x)Al(x)P Layers Deposited by MOVPE on (001) GaAs Substrates

Weak-beam, large angle convergent beam electron diffraction and high resolution transmission electron microscope experiments have revealed, that after strain relaxation due to plastic deformation dislocation networks can be observed in In_(1—x)Al_(x)P heteroepitaxial layers grown on (001) GaAs substrates under compressive stress. The 60° slip dislocations are mostly dissociated into partials of Shockley type whereas in the particular case of layers grown under tension twins are predominantly formed by successive nucleation and slip of 90° Shockley partials on adjacent {111} glide planes lying inclined to the (001) surface. When a few 90° Shockley partials pile up during extension of twins, then planar incoherent twin boundaries with {112} coincidence planes have been formed during strain relaxation. Due to the space group symmetry ((InAl)P belongs to the space group F4-3m) there is a striking asymmetry in defect formation, i.e. defect nucleation and slip on the planes (111) and (1-1-1) slip of the [1-10] zone are preferred to nucleation and slip on the {111} planes of the [110] zone. Apparently, the occupacy of the atomic sites in the dislocation core with either group-III or group-V atoms is responsible for this behaviour. The nature of the defects implies that their spontaneous nucleation should have taken place at the growing surface. Under tensile strain the 90° Shockley partial is nucleated first and the 30° one trails. Under compressive strain this sequence is reversed. It is evident, for dissociated dislocations lying at the interface always the 30° partial, i.e. the partial with less mobility or with higher friction force, is detained near or directly in the interface. Thus, in layers grown under tension the stacking fault associated with the dissociated 60° dislocation lies inside the GaAs substrate. For layers grown under compression it is located inside the ternary layer.     

Thermally activated stress relief in garnet layers grown by liquid phase epitaxy

The lattice misfit of (Lu, Tb)₃Fe₅O₁₂ epitaxial layers grown in compression on Gd₃Ga₅O₁₂ substrates has been found to decrease as a result of annealing at temperatures between 1000 and 1300°C. The deformation rate is thermally activated and depends on the degree of compressive misfit stress at the annealing temperature, the layer thickness and the reducing nature of the anneal atmosphere. Layers which were in tension at the annealing temperature (obtained by using Y₃Fe₅O₁₂ as the substrate material) did not exhibit stress relief. The process has been found to occur nonhomogeneously by the formation of regions of almost total relief which grow and multiply with continued annealing. The shape symmetry of these regions is consistent with dislocation climb in {112} planes. The results are interpreted in terms of a mechanism involving dislocation climb loops (∽1μm diameter) which develop as a result of the formation of oxygen vacancies.     

Characterization of defects in GaP and GaAsP graded heterojunctions by transmission electron microscopy

Misfit dislocations are observed in graded heterojunctions GaAs_1?xP_x by electron microscopy. Results are in agreement with previous work concerning the nature of the dislocations (Lomer and 60° dislocations) and their density dependence on the phosphorus gradient. The discussion concerns the formation of Lomer dislocations and the possibility of reducing the density of inclined dislocations which reach the surface of the epitaxial layer. GaP substrates, S-doped, are examined by transmission electron microscopy. Numerous defects such as Frank loops, perfect loops, helical dislocations and precipitates are observed. A GaP homoepitaxial layer realized on this substrate is free from these defects but exhibits stacking faults. A zinc diffusion does not produce additional defect but a 1000 Å thick amorphous layer is observed a at the surface.     

Growth of low defect density GaP layers on Si substrates within the critical thickness by optimized shutter sequence and post-growth annealing

We have developed a growth procedure for realizing a low defect density GaP layer on an Si substrate. The growth procedure consists of two parts. One is the post-growth annealing for the annihilation of stacking faults (SFs). We have investigated an annihilation mechanism with molecular beam epitaxy grown GaP layers. 1-monolayer-thick SFs typically generate from the GaP/Si interface in a non-annealed GaP layer. In a 700 °C annealed GaP layer, generation points of these SFs tend to shift toward the GaP surface. In a 730 °C annealed GaP layer, SFs density is effectively decreased. These results suggest that SFs are annihilated through the climb motion of two partial dislocations during the post-growth annealing. Another one is the optimized shutter sequence for migration enhanced epitaxy. We have revealed that it is effective for the suppression of both three-dimensional growth and melt-back etching to increase in a stepwise manner the number of supplied Ga atoms per cycle. As a result, the generation of threading dislocations and pits is remarkably suppressed. A root mean square surface roughness of 0.13 nm is obtained within the critical thickness. We have estimated etch pit density (EPD) to be ∼7×10⁵ cm⁻² with a GaPN/GaP/Si structure. To the best of our knowledge, this value is same as that of commercially available GaP substrates and is the lowest one in the EPD of GaP/Si heteroepitaxy.