Au/(SiO2/Si/SiO2)纳米双势垒/n+-Si结构的电致发光研究

利用射频磁控溅射方法,在n⁺-Si衬底上淀积SiO₂/Si/SiO_{2纳米双势垒单势阱结构,其中Si层厚度为2至4nm,间隔为0.2nm,邻近n⁺-S i衬底的SiO2层厚度固定为1.5nm,另一SiO2层厚度固定为3nm.为了 对比研究,还制备了Si层厚度为零的结构,即SiO2(4.5nm)/n⁺-Si 结构.在经过600℃氮气下退火30min,正面蒸上半透明Au膜,背面也蒸Au作欧姆接触后,所 有样品都在反向偏置(n^＋-Si的电压高于Au电极的电压)下发光,而在正向偏压 下不发光.在一定的反向偏置下,电流和电致发光强度都随Si层厚度的增加而同步振荡,位 相相同.所有样品的电致发光谱都可分解为相对高度不等的中心位于2.26eV(550nm)和1.85eV (670nm)两个高斯型发光峰.分析指出该结构电致发光的机制是：反向偏压下的强电场使Au/( SiO2/Si/SiO2)纳米双势垒/n⁺-Si结构发生了雪崩击穿 ,产生大量的电子-空穴对,它们在纳米SiO2层中的发光中心(缺陷或杂质)上复 合而发光. 关键词： 电致发光 纳米双势垒 高斯型发光峰 雪崩击穿}     

Local structure of porous silicon studied by means of X-ray emission spectroscopy

2,3 X-ray emission spectra of porous silicon (P-Si) and of spark-processed silicon (sp-Si). Both types of Si-structure display strong photoluminescence in the visible range of the spectrum. Porous samples were prepared by anodization of n^-- and p⁺-Si-wafers. Whereas for the P-Si processed from p⁺-Si the presence of some amorphous silicon is detected, the X-ray emission spectra of porous Si prepared from n^--Si display a higher content of SiO₂. For spark-processed Si the Si L_2,3 X-ray emission spectra reveal a much stronger degree of oxidation which extends to depths larger than 10000 Å. Furthermore, the chemical state of silicon atoms of sp-Si measured at the center of the processed area is close to that of silicon dioxide, and it has an influence on the photoluminescence energy. Specifically, green photoluminescent sp-Si shows a higher degree of oxidation than the blue luminescent specimen. However, the depth of oxidation consistently decreases in areas with weak or no PL. Possible origins of the observed photoluminescence are discussed. Accepted: 6 March 1997     

Electrically stimulated movement of edge dislocations in silicon in the temperature range 300–450 K

The movement of edge dislocations and the related acoustic emission of Si (111) carrying a direct current of density 0.5?5×10⁵ A/m² in the [110] direction are studied in the temperature range T=300–450 K. It is shown that the basic mechanism of dislocation movement is the electric wind determining the magnitude of the effective charge (per atom of the dislocation line) Z _eff=0.06 (n-Si) and ?0.01 (p-Si). Matching theory with experimental data has made it possible to determine the main contribution of edge dislocations to the acoustic-emission response of the silicon samples under investigation. The characteristic transition frequencies of dislocations in n-and p-Si from one metastable state into another are found to be f _max=0.1–0.5 Hz. The numerical values of the diffusion coefficient for atoms in the dislocation impurity atmosphere are estimated as 3.2×10^?18 m²/s (n-Si) and 1.5×10^?18 m²/s (p-Si).     

Room temperature electroluminescence from ZnO/Si heterojunction devices grown by metal-organic chemical vapor deposition

Heterojunction light-emitting diodes with ZnO/Si structure were fabricated on both high-resistivity (p) and low-resistivity (p⁺) Si substrates by metal-organic chemical vapor deposition technology. Fairly good rectifications were observed from the current-voltage curves of both heterojunctions. Ultraviolet (UV) and blue-white electroluminescence (EL) from ZnO layer were observed only from ZnO/p⁺-Si heterojunction under forward bias at room temperature (RT), while strong infrared (IR) EL emissions from Si substrates were detected from both ZnO/p-Si and ZnO/p⁺-Si heterojunctions. The UV and IR EL mechanisms have been explained by energy band structures. The realization of RT EL in UV-visible and IR region on Si substrate has great applicable potential for Si-based optoelectronic integrated circuits.     

Properties of magnesium silicate doped with chromium in porous silicon

Forsterite doped with Cr⁴⁺ ions is prepared in silicon-based structures according to a simple technique. These structures are of interest due to the characteristic luminescence in the near-IR range. Forsterite is synthesized by impregnation of porous silicon layers on n⁺-Si and p⁺-Si substrates with subsequent annealing in air. A photoluminescence response at a wavelength of 1.15 μm is observed at room temperature in porous silicon layers doped with magnesium and chromium for which the optimum annealing temperature is close to 700°C. The photoluminescence spectrum of porous silicon on the p⁺-Si substrate contains a broad band at a wavelength of approximately 1.2 μm. This band does not depend on the annealing temperature and the magnesium and chromium content and is most likely associated with the presence of dislocations in silicon. The experimental EPR data and eletrical properties of the structures are discussed. It is found that layers of pure porous silicon and chromium-doped porous silicon on n⁺-Si subtructures exhibit indications of discrete electron tunneling.     

Impurity distribution and electrical characteristics of boron-doped Si1−x Ge x /Si p +/N heterojunction diodes produced using pulsed UV-laser-induced epitaxy and Gas-immersion laser doping

A two-step pulsed UV-laser process which independently controls the metallurgical and electrical junction depth of a Si_1–x Ge _x /Si heterojunction diode has been implemented. Pulsed Laser-Induced Epitaxy (PLIE) combined with Gas-immersion Laser Doping (GILD) are used to fabricate boron-doped heteroepitaxial p ⁺/N Si_1–x Ge _x /Si layers and diodes. Borontrifluoride is used as the gaseous dopant source in the GILD process step. Boron incorporation and activation are investigated as a function of laser energy fluence and the number of laser pulses using SIMS and Halleffect measurements. The dose of incorporated dopant is on the order of 10¹³ cm^–2 per pulse. The B profiles obtained are flat except for a peak at the interface resulting from segregation effects. The B and Ge distributions are compared with shifts in the turn-on voltage of p ⁺/N Si_1–x /Si heterojunction diodes produced by the process. The GILD/PLIE process is spatially selective with the resulting diodes fabricated being quasiplanar. Hole mobilities in the heavily doped Si_1–x Ge _x films are found to be slightly lower than in comparable Si films.Presently at the Oregon Graduate Institute, Beaverton, OR 97006, USA     

Magnetoresistivity and acoustoelectronic effects in a tilted magnetic field in <Emphasis Type="Italic">p</Emphasis>-Si/SiGe/Si structures with an anisotropic <Emphasis Type="Italic">g</Emphasis> factor

Magnetoresistivity ρ _xx and ρ _xy and the acoustoelectronic effects are measured in p-Si/SiGe/Si with an impurity concentration p = 1.99 × 10¹¹ cm⁻² in the temperature range 0.3–2.0 K and an tilted magnetic field up to 18 T. The dependence of the effective g factor on the angle of magnetic field tilt θ to the normal to the plane of a two-dimensional p-Si/SiGe/Si channel is determined. A first-order ferromagnet-paramagnet phase transition is observed in the magnetic fields corresponding to a filling factor ν = 2 at θ ≈ 59°–60°.     

Electronic properties of the metal/organic interlayer/inorganic semiconductor sandwich device

In this study, we prepared a Metal(Al)/Organic Interlayer(Congo Red=CR)/Inorganic Semiconductor (p-Si) (MIS) Schottky device formed by coating of an organic film on p-Si semiconductor wafer. The Al/CR/p-Si MIS device had a good rectifying behavior. By using the forward bias I-V characteristics, the values of ideality factor (n) and barrier height (Φ_b) for the Al/CR/p-Si MIS device were obtained as 1.68 and 0.77 eV, respectively. It was seen that the Φ_b value of 0.77 eV calculated for the Al/CR/p-Si MIS device was significantly higher than value of 0.50 eV of the conventional Al/p-Si Schottky diodes. Modification of the interfacial potential barrier of the Al/p-Si diode was achieved by using a thin interlayer of the CR organic material. This was attributed to the fact that the CR organic interlayer increased the effective barrier height by influencing the space charge region of Si. The interface-state density of the MIS diode was found to vary from 1.24×10¹³ to 2.44×10¹² eV⁻¹ cm⁻².     

Study of resonant tunneling in Au nanoclusters on the surface of SiO2/Si thin films using the combined scanning tunneling microscopy and atomic-force microscopy technique

The morphology and electronic properties of Au nanoclusters on the surface of SiO₂ thin films on n ⁺-Si substrates are studied using the combined scanning tunneling microscopy (STM) and atomic-force microscopy (AFM) technique. The peaks associated with the resonant tunneling of electrons from the states of the valence band of the probe material to the states of the conduction band of the substrate material through Au nanoclusters are observed on the current-voltage characteristics for the contact of a p ⁺-Si AFM probe with Au nanoclusters. Experimental results are interpreted by calculating the tunnel transparency of the SiO₂/Au/SiO₂ double barrier structure in a strong electric field.     

Phase interactions in TiN<Subscript>x</Subscript>(TiB<Subscript>x</Subscript>)-<Emphasis Type="Italic">n</Emphasis>-Si-<Emphasis Type="Italic">n</Emphasis><Superscript>+</Superscript>-Si contacts and their thermal degradation due to rapid thermal annealing

The temperature stability of TiN_x(TiB_x)-n-Si-n ⁺-Si, Au-TiN_x(TiB_x)-n-Si-n ⁺-Si, and Au-Ti(Mo)-TiN_x(TiB_x)-n-Si-n ⁺-Si Schottky-barrier contacts subjected to rapid thermal annealing in hydrogen at temperatures T=400, 600, and 800°C is studied. It is shown that structural and morphological transformations and the related degradation of electrophysical characteristics in interstitial alloys (titanium nitrides and borides) start at 600°C. Reasons for the degradation of the barrier properties of titanium borides and nitrides are discussed.     

Formation of the buffer layer of silicon suboxides SiOx in the Si/SiO2 low-dimensional heterosystem after Si+ ion implantation: Si L2, 3 X-ray emission spectra

Nanosized heterostructures n-Si/SiO₂ with different thicknesses of the oxide film (20, 500 nm) after implantation by Si⁺ ions with energies of 12 and 150 keV have been investigated using Si L _{2, 3} X-ray emission spectroscopy (the Si 3d3s → Si 2p _{1/2, 3/2} electronic transition). The ion-beam modification of the interface has been revealed and studied for the heterostructure with a silicon dioxide thickness of 20 nm. An analysis of the Si L _{2, 3} X-ray emission spectra has demonstrated that the Si⁺ ion implantation leads to the self-ordering of the structure of the initially amorphous SiO₂ film 20 nm thick due to the effect of high doses. A mechanism of ion-beam modification of the insulator-semiconductor interface has been proposed. No substantial transformation of the atomic and electronic structures of the heterostructure with a silicon dioxide thickness of 500 nm has been revealed after the ion implantation.     

Temperature behaviour of optical properties of Si+-implanted SiO2

Silicon nanocrystals were prepared by Si⁺-ion implantation and subsequent annealing of SiO₂ films thermally grown on a c-Si wafer. Different implantation energies (20-150 keV) and doses - cm ^-2 ) were used in order to achieve flat implantation profiles (through the thickness of about 100 nm) with a peak concentration of Si atoms of 5, 7, 10 and 15 atomic%. The presence of Si nanocrystals was verified by transmission electron microscopy. The samples exhibit strong visible/IR photoluminescence (PL) with decay time of the order of tens of μs at room temperature. The changes of PL in the range 70-300 K can be well explained by the exciton singlet-triplet splitting model. We show that all PL characteristics (efficiency, dynamics, temperature dependence, excitation spectra) of our Si⁺-implanted SiO₂ films bear close resemblance to those of a light-emitting porous Si and therefore we suppose similar PL origin in both materials. Received 1st September 1998 and Received in final form 7 September 1999     

Electroluminescence from nano-crystalline Si/ SiO2 structures embedded in pn junctions

Phosphorous-doped and boron-doped amorphous Si thin films as well as amorphous SiO₂/Si/ SiO₂ sandwiched structures were prepared in a plasma enhanced chemical vapor deposition system. Then, the p–i–n structures containing nano-crystalline Si/ SiO₂ sandwiched structures as the intrinsic layer were prepared in situ followed by thermal annealing. Electroluminescence spectra were measured at room temperature under forward bias, and it is found that the electroluminescence intensity is strongly influenced by the types of substrate. The turn-on voltages can be reduced to 3 V for samples prepared on heavily doped p-type Si (p⁺-Si) substrates and the corresponding electroluminescence intensity is more than two orders of magnitude stronger than that on lightly doped p-type Si (p-Si) and ITO glass substrates. The improvements of light emission can be ascribed to enhanced hole injection and the consequent recombination of electron–hole pairs in the luminescent nanocrystalline Si/ SiO₂ system.     

Effects of oxygen plasma pre-treatments on the characteristics of n-ZnO/p-Si heterojunction diodes

We examine the effects of the oxygen plasma pre-treatments on the material properties of n-ZnO grown on p-Si and characterize the electrical properties of n-ZnO/p-Si heterojunction diodes. The lattice spacing of ZnO becomes larger when the ZnO thin film is grown on the oxygen plasma pre-treated Si substrate. This might be relevant to the growth of (101) ZnO onto the ultra-thin SiO₂ interfacial layer, which is formed during the oxygen plasma pre-treatment onto the Si substrate. The formation of SiO₂ gives rise to the increase in the donor-like defect Zn interstitial, and the increased grain size improves the carrier mobility. Because of all the above, the differential conductance at the on-state is increased for the n-ZnO/p-Si heterojunction diode.     

n+-Si与p-Si衬底上含纳米硅的SiO2膜电致发光

对于Au/富Si-SiO₂/p-Si和Au/富Si-SiO₂／n⁺-Si这两种结构，研究并比较了它们的电致发光特性．对于前者，当正向偏压大于4V时发射红光，而加反向偏压时不发光；对于后者，加正向偏压不发光，而当反向偏压大于3.5V时发射红光．着重讨论了Au/富Si-SiO₂/n⁺-Si的电致发光机制 关键词：     

Effects of Si doping on the structural and electrical properties of Ge2Sb2Te5 films for phase change random access memory

The effects of Si doping on the structural and electrical properties of Ge₂Sb₂Te₅ film are studied in detail. Electrical properties and thermal stability can be improved by doping small amount of Si in the Ge₂Sb₂Te₅ film. The addition of Si in the Ge₂Sb₂Te₅ film results in the increase of both crystallization temperature and phase-transition temperature from face-centered cubic (fcc) phase to hexagonal (hex) phase, however, decreases the melting point slightly. The crystallization activation energy reaches a maximum at 4.1 at.% and then decreases with increasing dopant concentration. The electrical conduction activation energy increases with the dopant concentration, which may be attributed to the increase of strong covalent bonds in the film. The resistivity of Ge₂Sb₂Te₅ film shows a significant increase with Si doping. When doping 11.8 at.% of Si in the film, the resistivity after 460 °C annealing increases from 1 to 11 mΩ cm compared to the undoped Ge₂Sb₂Te₅ film. Current-voltage (I-V) characteristics show Si doping may increase the dynamic resistance, which is helpful to writing current reduction of phase-change random access memory.     

Discrete tunneling of holes in porous silicon

It is pointed out that in the partial oxidation of porous silicon (PS) formed on heavily doped crystals, the topology of the pores can result in the formation of an anisotropic material with strings of nanometersized silicon granules embedded in insulating silicon dioxide SiO₂. In this range of granule sizes the correlation effects in the tunneling of electrons (holes) are strong on account of their Coulomb interaction. This should be manifested as discrete electron and hole tunneling at temperatures comparable to room temperature. The room-temperature current-voltage characteristics of n ⁺-PSp ⁺-p ⁺ diode structures with a PS interlayer on p ⁺-Si, which exhibit current steps on the forward and reverse branches, are presented. The current steps are attributed to discrete hole tunneling along the silicon strings in SiO₂. Pis’ma Zh. éksp. Teor. Fiz. 67, No. 10, 794–797 (25 May 1998)     

Powerful diode nanosecond current opening switch made of <Emphasis Type="Italic">p</Emphasis>-silicon (<Emphasis Type="Italic">p</Emphasis>-SOS)

The nanosecond semiconductor diode-based opening switch (SOS-diode) capable of switching currents with densities up to several tens of kiloamperes per cubic centimeter represents a p⁺p’Nn⁺ silicon structure fabricated by the deep simultaneous diffusion doping (to about 200 μm) of n-Si by Al and B from one side and P from the other. In the SOS mode, first a short pulse of forward current passes through the diode and then a fast-growing pulse of reverse voltage is applied. A resulting pulse of reverse current carries away injected holes and thereby forms a plasma front in the p’ layer, which moves toward the p’N junction. When the hole concentration in the flow exceeds the dopant concentration in the p’ layer, a space charge region arises in this layer, the resistivity of the diode increases sharply, and the current switches to a load connected parallel to the diode. Early results concerning an alternative configuration of the SOS diode are presented. Here, the diode was made by the rapid simultaneous diffusion of B and P from the opposite sides of a p-Si wafer to a depth of 60-80 μm. If a short pulse of forward current is passed through such a p⁺pn⁺ structure and a pulse of reverse voltage is then applied, a plasma front arising in the p⁺ region moves toward the p⁺p interface through the heavily doped (i.e., low-resistivity) p⁺ region. Having crossed this interface, the front passes into a low-doped region, where the hole concentration in the flow becomes much higher than the dopant concentration and a space charge region causing the current to pass to the load forms at once. It is shown experimentally that, all other things being the same, the time of current breaking in the p-SOS-diode is roughly twice as short as in the conventional n-SOS-diode, switched currents are considerably lower, and the fabrication technique of p-SOS-diodes is much simpler. Ways of optimizing the design of the semiconductor structure of the p-SOS-diode to further raise the speed are outlined.     

Low contact resistance of n+-Si/Ti/WNx/Al submicron contact structures

+ -Si/Ti/WN_x/Al multi-layer metallization scheme. The contact resistance has been strongly related to the plasma nitridation of the Ti surface because the contact resistance of n⁺-Si/Ti/WN_x/Al with contact size of 0.49 μm² about 100–130 Ω, whereas without the nitridation of the Ti surface the contact resistance rises up to 200–390 Ω. ¹⁹F (p,αγ) nuclear resonance analysis and Auger electron spectroscopy reveal that F adatoms on the Ti surface are successfully removed by the 30 s nitridation and as a result, the low contact resistance can be achieved. Received: 16 July 1996/Accepted: 5 November 1996