Low dielectric thermoset. IV. Synthesis and properties of a dipentene‐containing cyanate ester and its copolymerization with bisphenol A dicyanate ester

A 2,6‐dimethylphenol‐dipentene dicyanate ester ( DPCY ) was synthesized from the reaction of 2,6‐dimethylphenol‐dipentene adduct and cyanogen bromide. The proposed structure was confirmed by Fourier transform infrared (FTIR), elemental analysis, mass, and nuclear magnetic resonance (NMR) spectra. DPCY was then cured by itself or cured with bisphenol A dicyanate ester ( BADCY ). Thermal properties of cured epoxy resins were studied using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermogravimetric analysis (TGA). These data are compared with those of BADCY . The cured DPCY exhibits a lower dielectric constant (2.61 at 1 MHz), dissipation factor (29.3 mU at 1 MHz), thermal stability (5% degradation temperature and char yield are 429 °C and 17.64%, respectively), glass transition temperature (246 °C by TMA and 258 °C by DMA), coefficient of thermal expansion (33.6 ppm before Tg and 134.1 ppm after Tg), and moisture absorption (0.95% at 48 h) than those of BADCY , but higher moduli (5.12 GPa at 150 °C and 4.60 GPa at 150 °C) than those of the bisphenol A system. The properties of cured cocyanate esters lie between cured BADCY and DPCY , except for moduli. Moduli of some cocyanate esters are even higher than those of cured BADCY and DPCY . A positive deviation from the Fox equation was observed for cocyanate esters. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3986–3995, 2004     

Synthesis and properties of a cyanate ester containing dicyclopentadiene(II)

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac (DCPDNO) was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant DCPDNO was reacted with cyanogen bromide into 2,6‐dimethyl phenol‐dicyclopentadiene cyanate ester (DCPDCY). The structures of the novolac and cyanate ester were confirmed with Fourier transform infrared spectroscopy, elemental analysis, mass spectrometry (MS), and nuclear magnetic resonance. For the purpose of increasing the mobility of residual DCPDCY during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of a monofunctional cyanate ester, 4‐tert‐butylphenol cyanate ester (4TPCY), was added to DCPDCY to form the cyanate ester copolymer. The synthesized DCPDCY was then cured with 4TPCY at various molar ratios. The thermal properties of the cured cyanate ester resins were studied with dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those of the commercial bisphenol A cyanate ester system. Compared with the bisphenol A cyanate ester system, the cured DCPDCY resins exhibited lower dielectric constants (2.52–2.67 at 1 GHz), dissipation factors (0.0054–0.0087 at 1 GHz), glass‐transition temperatures (261–273 °C), thermal stability (5% degradation temperature at 406–450 °C), thermal expansion coefficients (4.8–5.78 × 10^?5/°C before the glass‐transition temperature), and moisture absorption (0.8–1.1%). © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 671–681, 2005     

Reaction‐induced phase separation in epoxy/polysulfone/poly(ether imide) systems. II. Generated morphologies

Epoxy–aromatic diamine formulations are simultaneously modified with two immiscible thermoplastics (TPs), poly(ether imide) (PEI) and polysulfone (PSF), in concentrations ranging from 5 to 15 wt %. The epoxy monomer is based on diglycidyl ether of bisphenol A and the aromatic diamines (ADs) are either 4,4′‐diaminodiphenylsulfone (DDS) or 4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline) (MCDEA). Using phase diagrams developed in Part I of this series, thermal cycles are selected to generate different morphologies. It is found that, whatever the AD employed, a particulate morphology is obtained when curing blends that are initially homogeneous. In the case of DDS‐cured blends, a unimodal particle size distribution of PSF and PEI dispersed in a continuous epoxy‐rich phase is observed. By contrast, the MCDEA‐cured blends show a bimodal particle size distribution for all PSF/PEI relations that are analyzed. A completely different morphology, characterized by a distribution of irregular TP‐rich domains dispersed in an epoxy‐rich phase (double phase morphology), is obtained when curing blends that are initially immiscible. An X‐ray analysis of the different phases makes it possible to determine their qualitative composition. The dynamic mechanical behavior of fully cured blends is also discussed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3964–3975, 2004     

Facile,one‐pot synthesis of aromatic diamine‐based phosphinated benzoxazines and their flame‐retardant thermosets

Three aromatic diamine‐based, phosphinated benzoxazines ( 7–9 ) were prepared from three typical aromatic diamines—4,4′‐diamino diphenyl methane ( 1 ), 4,4′‐diamino diphenyl sulfone ( 2 ), and 4,4′‐diamino diphenyl ether ( 3 ) by a one‐pot procedure. To clarify the reaction mechanism, a two‐pot procedure was applied, in which the reaction intermediates ( 4–6 ) were isolated for characterization. The structures of intermediates and benzoxazines were confirmed by high resolution mass, IR, and 1D and 2D‐NMR spectra. In addition to self‐polymerization, ( 7–9 ) were copolymerized with cresol novolac epoxy (CNE). After curing, the homopolymers of P( 7–9 ) are brittle while the copolymers of ( 7–9 )/CNE are tough. Dynamic mechanical analysis shows the T_gs of ( 7–9 )/CNE copolymers are 187, 190, and 171 °C, respectively. Thermal mechanical analysis shows the CTEs of ( 7–9 )/CNE copolymers are 46, 38, and 46 ppm, respectively. All the ( 7–9 )/CNE copolymers belong to an UL‐94 V‐0 grade, demonstrating good flame retardancy. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Flame‐retardant epoxy resins with high glass‐transition temperatures from a novel trifunctional curing agent: Dopotriol

A novel phosphorus‐containing trifunctional novolac (dopotriol) was synthesized through the addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and rosolic acid. The structure of dopotriol was confirmed with NMR spectroscopy and elemental analyses. The dopotriol was blended with phenol novolac in the ratios of 10/0, 8/2, 6/4, 4/6, 2/8, and 0/10 to serve as a curing agent for diglycidyl ether of bisphenol A. Thermal properties, such as the glass‐transition temperature, thermal decomposition temperature, and flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The activity and activation energy of curing were studied with the methods of Kissinger and Ozawa by dynamic differential scanning calorimetry scans. The glass‐transition temperatures of the cured epoxy resins were 138–159 °C, increasing with the phosphorus content. This is rarely seen in the literature after the addition of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.87%. Similar dielectric properties and moisture absorption were observed for these phosphorus‐containing epoxy resins, and this implied that the addition of phosphorus to epoxy did not affect the dielectric properties and moisture absorption. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2862–2873, 2005     

Synthesis and properties of phosphorus-containing epoxy resins by novel method

Novel phosphorus-containing epoxy resins (1–3% phosphorus content) were synthesized by the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO) and the diglycidyl ether of bisphenol A and then cured with 4,4′-diaminodiphenyl sulfone or phenol novolac. Differential scanning calorimetry, high performance liquid chromatography, and epoxide equivalent weight titration were used to trace the reaction between the DOPO and the epoxy. The thermal stability and flame retardancy were checked by thermal gravimetric analysis, the limiting oxygen index, and the UL-94 vertical test. The glass transitions were measured by dynamic mechanical analysis. The relation between these properties (thermal stability, flame retardancy, and glass transition) and the DOPO contents (phosphorus content) were discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3903–3909, 1999     

Aromatic polybenzoxazoles containing ether–sulfone linkages

A series of poly(o‐hydroxy amide)s having both ether and sulfone linkages in the main chain were synthesized via the low‐temperature solution polycondensation of 4,4′‐[sulfonylbis(1,4‐phenylene)dioxy]dibenzoyl chloride and 4,4′‐[sulfonylbis(2,6‐dimethyl‐1,4‐phenylene)dioxy]dibenzoyl chloride with three bis(o‐aminophenol)s including 4,4′‐diamino‐3,3′‐dihydroxybiphenyl, 3,3′‐diamino‐4,4′‐dihydroxybiphenyl, and 2,2‐bis(3‐diamino‐4‐hydroxyphenyl)hexafluoropropane. Subsequent thermal cyclodehydration of the poly(o‐hydroxy amide)s afforded polyethersulfone benzoxazoles. Most of the poly(o‐hydroxy amide)s were soluble in polar organic solvents such as N‐methyl‐2‐pyrrolidone; however, the polybenzoxazoles without the hexafluoroisopropylidene group were organic‐insoluble. The polybenzoxazoles exhibited glass‐transition temperatures (T_g) in the range of 219–282 °C by DSC and softening temperatures (T_s) of 242–320 °C by thermomechanical analysis. Thermogravimetric analyses indicated that most polybenzoxazoles were stable up to 450 °C in air or nitrogen. The 10% weight loss temperatures were recorded in the ranges of 474–593 °C in air and 478–643 °C in nitrogen. The methyl‐substituted polybenzoxazoles had higher T_g's but lower T_s's and initial decomposition temperatures compared with the corresponding unsubstituted polybenzoxazoles. For a comparative purpose, the synthesis and characterization of a series of sulfonyl polybenzoxazoles without the ether group that derived from 4,4′‐sulfonyldibenzoyl chloride and bis(o‐aminophenol)s were also reported. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2262–2270, 2001     

New liquid‐crystal alignment agents based on fluorinated polyimides with trifluoromethyl‐substituted benzene or diphenylether in the side chain

Fluorinated copolyimides derived from 4,4′‐oxydiphthalic anhydride (ODPA) with 4,4′‐oxydianline (ODA) and trifluoromethyl‐containing aromatic diamines have been synthesized and characterized. The trifluoromethyl‐containing diamines include 2,4‐diamino‐3′‐trifluoromethylazobenzene, 2,4‐diamino‐1‐[(4′‐trifluoromethylphenoxy) phenyl] aniline, 3,5‐diamino‐1‐[(4′‐trifluoromethylphenoxy) phenyl] benzamide, 3,5‐diamino‐1‐[(3′‐trifluoromethyl) phenyl] benzamide, 1,4‐bis(4′‐aminophenoxy)‐2‐(3′‐trifluoromethylphenyl) benzene, 3,5‐diaminobenzenetrifluoride, 4,4′‐diamino‐4″‐(p‐trifluoromethyl phenoxy) triphenylamine, and 4‐[(4′‐trifluoromethylphenoxy) phenyl]‐2,6‐bis(4″‐aminophenyl)pyridine. Strong and flexible copolyimide films, produced by casting the polyamic acid solution followed by thermal imidization, exhibited great thermal stability and high mechanical properties. The polyimides had an ultraviolet–visible absorption cutoff at 330–340 nm and pretilt angles as high as 20° for nematic liquid crystals, making them great potential candidates for advanced liquid‐crystal display applications. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1583–1593, 2002     

Synthesis,characterization, and properties of novel epoxy resins and cyanate esters

We synthesized a novel epoxy (dopotep) and cyanate ester (dopotcy) based on a phosphorus‐containing triphenol (dopotriol). The proposed structures were confirmed by IR, mass spectra, NMR spectra, and epoxy‐equivalent‐weight titration. The synthesized dopotep or dopotcy was copolymerized with diglycidyl ether of bisphenol A (DGEBA), 6′,6‐bis(3‐phenyl‐3,4‐dihydro‐2H‐1,3‐benzoxazineyl)methane (F‐a), or dicyanate ester of bisphenol A (BADCY). Thus, copolymers based on DGEBA/dopotep/diphenylmethane (ddm), F‐a/dopotep, BADCY/dopotcy, and DGEBA/dopotcy were developed. The thermal properties, dielectric properties, and flame retardancy of these copolymers were investigated. The curing kinetics of dopotep/ddm and dopotep/diamino diphenylsulfone were studied with differential scanning calorimetry. The microstructure of DGEBA/dopotcy was studied with IR. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3487–3502, 2006     

Synthesis and characterization of polyimides from bis(3‐aminophenyl)‐4‐(1‐adamantyl)phenoxyphenyl phosphine oxide

A novel diamine, bis(3‐aminophenyl)‐4‐(1‐adamantyl)phenoxyphenyl phosphine oxide (mDAATPPO), was synthesized via the Williamson ether reaction of 4‐(1‐adamantyl)phenol and bis(3‐nitrophenyl)‐4‐fluorophenyl phosphine oxide, followed by reduction. The phenol group was prepared by the Friedel–Crafts reaction of 1‐bromoadamantane and phenol, whereas the phosphine oxide group was synthesized by the Grignard reaction of 1‐bromo‐4‐fluorobezene and diphenyl phosphinic chloride, followed by nitration. The monomer and its intermediate compounds were characterized with Fourier transform infrared, NMR, and melting‐point apparatus. The monomer was then used to prepare polyimides with 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride, 4,4′‐oxydiphthalic dianhydride, and pyromellitic dianhydride by the conventional two‐step synthesis: the preparation of poly(amic acid) followed by solution imidization. The molecular weights of the polyimides were controlled to 20,000 g/mol by off‐stoichiometry, and the synthesized polyimides were characterized with Fourier transform infrared, NMR, gel permeation chromatography, thermogravimetric analysis, and differential scanning calorimetry. In addition, the solubility, intrinsic viscosity, dielectric constant, and birefringence of the polyimides were evaluated. Novel polyimides with mDAATPPO exhibited good solubility, high glass‐transition temperatures (290–330 °C), excellent thermal stability (>500 °C), low dielectric constants (2.77–3.01), low refractive indices, and low birefringence values (0.0019–0.0030). © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2567–2578, 2006     

Synthesis and characterization of novel low‐dielectric cyanate esters

For the purpose of increasing the mobility of residual bisphenol A dicyanate ester (BADCY) during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of monofunctional phenol was added to BADCY to form an imidocarbonate, or a small quantity of monofunctional cyanate esters was added to form cyanate ester copolymers. The proposed structures were confirmed with Fourier transform infrared, elemental analysis, mass spectrometry, and NMR spectroscopy. The thermal properties of the cured cyanate esters were measured with dynamic mechanical analysis, thermogravimetric analysis, and dielectric analysis. These data were compared with those for the cured BADCY resin. The cured modified cyanate esters exhibited a lower dielectric constant, a lower dissipation factor, and lower moisture absorption than the cured BADCY system. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2589–2600, 2004     

Reaction‐induced phase separation in epoxy/polysulfone/poly(ether imide) systems. I. Phase diagrams

Epoxy–aromatic diamine formulations are simultaneously modified with two immiscible thermoplastics (TPs), poly(ether imide) (PEI) and polysulfone (PSF). The epoxy monomer is based on diglycidyl ether of bisphenol A and the aromatic diamines (ADs) are either 4,4′‐diaminodiphenylsulfone or 4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline). The influence of the TPs on the epoxy–amine kinetics is investigated. It is found that PSF can act as a catalyst. The presence of the TP provokes an increase of the gel times. Cloud‐point curves (temperature vs. composition) are shown for epoxy/PSF/PEI and epoxy/PSF/PEI/AD initial mixtures. Phase separation conversions are reported for the reactive mixtures with various TP contents and PSF/PEI proportions. On the basis of phase separation and gelation curves, conversion–composition phase diagrams at constant temperature are generated for both systems. These diagrams can be used to design particular cure cycles to generate different morphologies during the phase separation process, which is discussed in the second part of this series. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3953–3963, 2004     

Effect of ortho‐methylation on a bis(4‐cyanatocumyl)benezene low‐dielectric resin

A synthesis procedure for and characterization of a tetra‐ortho‐methyl substituted three‐ringed cyanate ester monomer, 4,4′‐[1,3‐phenylenebis(1‐methylethylidene)]bis[2,6‐dimethyl]phenylcyanato, and the corresponding cured resin are described with comparative characterization of the resin analogue without the ortho‐methyl substitutents. The othro‐methylation lowered the dielectric from 2.64 to 2.59 at 1 GHz and from 2.64 to 2.48 GHz at 15 GHz, whereas the tan δ was not significantly affected. Other physical properties also affected included a 40 °C decrease in the glass‐transition temperature, an increase in the thermal‐expansion coefficients, and a reduction in thermogravimetric stability. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 60–67, 2003     

Synthesis and characterization of novel poly(amide‐imide)s containing 1,3‐diamino mesitylene moieties

A series of poly(amide‐imide)s were prepared using a new monomer, 1,3‐bis(trimellitimido)‐2,4,6‐trimethyl benzene (BTB), with four different diamines: 1,4‐phenylene diamine (PDA), 2,4‐diamino mesitylene (DAM), 2,2′‐dimethyl‐4,4′‐diamino biphenyl (DMDB), and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFDB). They were prepared by the condensation method in N‐methyl‐2‐pyrrolidinone (NMP) solvent using triphenyl phosphate and pyridine as condensing agents. The synthesized poly(amide‐imide)s were characterized by Fourier transform infrared and ¹H NMR techniques. Films were prepared and characterized using DSC, thermogravimetric analysis (TGA), a prism coupler, and a film dielectric property analyzer. DSC measurement showed that the glass‐transition temperatures of the polymers were in the range of 259–327 °C. TGA analysis showed 5% weight loss, in the range of 472–514 °C. The refractive index varied from 1.6004 to 1.6586 in the following increasing order: BTB‐TFBM < BTB‐DAM < BTB‐DMDB < BTB‐PDA. For the poly(amide‐imide) films, the birefringence varied in the range of 0.0319–0.0580, in the following increasing order: BTB‐DAM < BTB‐TFBM < BTB‐DMDB < BTB‐PDA. The capacitance method showed that the dielectric constant of poly(amide‐imide) varied with the diamine structure; no difference was found by the optical method. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 137–143, 2004     

Curing studies of epoxy resins with phosphorus‐containing amines

The curing system of diglycidyl ether of bisphenol A (DGEBA) with two phosphorus‐containing amine compounds—bis(3‐aminophenyl)methyl phosphine oxide and bis(4‐aminophenyl)‐bis(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl)methane—was studied with differential scanning calorimetry under isothermal and nonisothermal conditions and compared with the DGEBA/diamino diphenyl methane system. The isoconversional method was used to evaluate the dependence of the effective activation energy on the extent of conversion. Modulated differential scanning calorimetry and dynamic mechanical thermal analysis were used to study the phenomena of vitrification and gelation. The thermal and flame‐retardant properties were evaluated, and the limiting oxygen index values of the phosphorylated resins, above 30, confirmed that phosphorus‐containing epoxy resins are effective flame retardants. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1676–1685, 2006     

Novel epoxy nanocomposite of low Dk introduced fluorine‐containing POSS structure

A nanoporous additives, polyhedral oilgomeric silisesquioxane containing eight functional hexafluorine groups, octakis(dimethylsiloxyhexafluoropropyl ether)silsesquioxane (OF) has been synthesized and blended with the UV‐cured epoxy resin. The OF containing (10%) epoxy has significantly lower dielectric constant (2.65) than the plain epoxy (3.71). The incorporation of fluorine containing additives is well‐known to reduce dielectric constant due to lower its polarizability. In addition, the presence of the bulky POSS structure is able to create additional free space or pores and further reduces the dielectric constant of the epoxy matrix. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 502–510, 2007     

Synthesis of a novel epoxy resin containing diphenylether moiety and thermal properties of its cured polymer with phenol novolac

A new type of epoxy resin containing 4,4′-diphenylether moiety in the backbone (2) was synthesized, and was confirmed by gel permeation chromatography, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. In addition, in order to evaluate the influence of 4,4′-diphenylether moiety in the structure, epoxy resins having 4,4′-biphenylene moiety (4) and having 1,4-phenylene moiety (6) in place of 4,4′-diphenylether moiety were synthesized. The cured polymer obtained through the curing reaction between the new diphenylether-containing epoxy resin and phenol novolac was used for making a comparison of its thermal and physical properties with those obtained from 4, 6, and bisphenol-A (4,4′-isopropylidenediphenol) type epoxy resin. The cured polymer obtained from 2 showed markedly higher anaerobic char yield at 700°C of 44.0 wt %, higher fracture toughness, and higher mechanical strength and modulus. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3687–3693, 1999     

Negative‐type photosensitive poly(phenylene ether) based on poly(2,6‐dimethyl‐1,4‐phenylene ether), a crosslinker,and a photoacid generator

A negative‐type photosensitive poly(phenylene ether) (PSPPE) based on poly(2,6‐dimethyl‐1,4‐phenylene ether) (PPE), a novel crosslinker 4,4′‐methylene‐bis [2,6‐bis(methoxymethyl)phenol] (MBMP) having good compatibility with PPE, and diphenylidonium 9,10‐dimethoxy anthracene‐2‐sulfonate (DIAS) as a photoacid generator (PAG) has been developed. This resist consisting of PPE (73 wt %), MBMP (20 wt %) and DIAS (7 wt %) showed a high sensitivity (D_0.5) of 58 mJ/cm² and a contrast (γ_0.5) of 9.5 when it was exposed to i‐line (365 nm wavelength light), postexposure baked at 145 °C for 10 min, and developed with toluene at 25 °C. A fine negative image featuring 6 μm line‐and‐space pattern was obtained on the film exposed to 300 mJ/cm² of i‐line by a contact‐printed mode. The resulting polymer film cured at 300 °C for 1 h under nitrogen had a low dielectric constant (ε = 2.46) comparable to that of PPE and a higher T_g than that of PPE. In addition, the cured PSPPE film was pretty low water absorption (<0.05%) as same as PPE. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4949–4958, 2008     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002