Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Preparation and properties of high performance epoxy–silsesquioxane hybrid resins prepared using a maleimide–alkoxysilane compound as a modifier

An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N‐(4‐hydroxyphenyl)maleimide and 3‐glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5–10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI = 30) to bisphenol‐A‐based epoxy resins. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5787–5798, 2005     

Functional off‐stoichiometry thiol‐ene‐epoxy thermosets featuring temporally controlled curing stages via an UV/UV dual cure process

We present a facile two‐stage UV/UV activation method for the polymerization of off‐stoichiometry thiol‐ene‐epoxy, OSTE+, networks. We show that the handling and processing of these epoxy‐based resins is made easier by introducing a material with a controlled curing technique based on two steps, where the first step offers excellent processing capabilities, and the second step yields a polymer with suitable end‐properties. We investigate the sequential thiol‐ene and thiol‐epoxy reactions during these steps by studying the mechanical properties, functional group conversion, water absorption, hydrolytic stability, and thermal stability in several different thiol‐ene‐epoxy formulations. Finally, we conclude that the curing stages can be separated for up to 24 h, which is promising for the usefulness of this technique in industrial applications. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 2604‐2615     

Bio‐based epoxy vitrimers: Reprocessibility,controllable shape memory,and degradability

The research activities in the development of recyclable and reprocessable covalently crosslinked networks, and the construction of polymers from renewable resources are both stemmed from the economical and environmental problems associated with traditional thermosets. However, there is little effort in combination of these two attractive strategies in material designs. This article reported a bio‐based vitrimer constructed from isosorbide‐derived epoxy and aromatic diamines containing disulfide bonds. The resulted dynamic epoxy resins showed comparable thermomechanical properties as compared to similar epoxy networks cured by traditional curing agent. Rheological tests demonstrated the fast stress relaxation of the dynamic network due to the rapid metathesis of disulfide bonds at temperature higher than glass transition temperature. This feature permitted the recycling and reprocessing of the fragmented samples for several times by hot press. The dynamic epoxy resins also exhibited shape‐memory effect, and it is demonstrated that the shape recovery ratio could be readily adjusted by controlling the stress relaxation in the temporary state at programming temperature. Moreover, the degradability of the dynamic epoxy resins in alkaline aqueous solution was also demonstrated. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 1790–1799     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Radical induced cationic frontal polymerization as a versatile tool for epoxy curing and composite production

Radical induced cationic frontal polymerization (RICFP) is an extremely powerful and elegant alternative curing technique that allows cationic bulk curing of epoxy resins with very little energy consumption, as well as curing in compartments that are not readily accessible. We recently introduced a bisphenol‐A diglycidylether (BADGE) based system that allows the bubble‐free photocuring of this widely used epoxy resin. In this article, we describe the high storage stability and possibilities to influence the curing speed via the initiator concentrations of different formulations. These properties allow the adjustment of the frontal polymerization to ones need. We also show that the (thermo)mechanical and electrical properties of frontal cured epoxy polymers compares favorably with those of state of the art material. Finally, different strategies to overcome the challenges on producing epoxy resin based mica composites via RICFP are presented. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3751–3759     

Curing of liquid crystalline epoxy resins with a biguanide

This work extends the authors' investigations on liquid crystalline epoxy resins prepared from diglycidyl ether of 4,4′-dihydroxybiphenyl (DGE-DHBP) and aliphatic dicarboxylic compounds (ADC) or difunctional aromatic compounds. Syntheses and properties of these liquid crystalline epoxy resins are described elsewhere. In this paper a study on the curing reaction of the above mentioned liquid crystalline epoxy resins is presented. Ortho-tolylbiguanide was applied as the curing agent. The curing reactions were investigated by differential scanning calorimetry, microscopic observations and IR spectroscopy. Depending upon the temperature program of curing, it was possible to obtain polymeric networks with liquid crystalline order. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2739–2745, 1997     

Preparation and properties of epoxy/amine hybrid resins from in situ polymerization

Homogeneous and transparent epoxy/amine hybrid resins were successfully obtained through the in situ curing of bisphenol A epoxy and hexakis(methoxymethyl)melamine with 2 wt % (3‐glycidoxypropyl)trimethoxysilane as a facial coupling agent. The hybrid resins showed good miscibility, high glass‐transition temperatures, good thermooxidative stability, and good flame retardance. The outstanding properties of the hybrid resins may lead to their use in high‐performance green electronic products. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1868–1875, 2004     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

New powder coatings with low curing temperature and enhanced mechanical properties obtained from DGEBA epoxy resins and Meldrum acid using erbium triflate as curing agent

New low curing temperature powder coatings obtained by copolymerization of epoxy resins with Meldrum acid (MA) initiated by erbium (III) trifluoromethanesulfonate have been formulated. Their mechanical and thermomechanical properties have been studied and compared with a commonly used industrial system (o-tolylbiguanide/epoxy resin) and with an already formulated epoxy powder coating homopolymerized by erbium trifluoromethanesulfonate. Systems containing low proportions of MA and initiated by erbium trifluoromethanesulfonate lead to a great reduction of curing conditions (temperature/time). Moreover, the new formulated systems present very good mechanical properties, adhesion, and impact resistance. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 2316–2327, 2007     

Effect of substituents on the curing of liquid crystalline epoxy resin

The synthesis of an aromatic ester based liquid crystalline epoxy resin (LCE) with a substituent in the mesogenic central group is described. Chlorine and methyl groups were introduced as substituents. The curing behaviors of three epoxy resins were investigated using diaminodiphenyl ester as the curing agent. The curing rate and heat of curing of LCE were measured with dynamic and isothermal DSC. The chlorine substituent accelerated the curing of LCE, while the methyl substituent decelerated the curing of LCE. The heat of curing of substituted LCE was diminished compared to LCE with no substituent. Glass transition temperature and elastic modulus of LCE decreased with increasing the size of the substituent. Three liquid crystalline epoxy resins based on aromatic ester mesogenic groups formed a liquid crystalline phase after curing, and the liquid crystalline phase was stable up to the decomposition temperature. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 911–917, 1998     

Using diethylphosphites as thermally latent curing agents for epoxy compounds

Diethylphosphite (DEP) and its derivative exhibited thermally latent properties for epoxy curing reactions through the formation of phosphonic acid as an active species from a reaction of ethanol elimination, which was observed with ¹H NMR and pyrolysis gas chromatography/mass spectrometry measurements. The thermally latent properties and curing reaction kinetics of the curing reaction of DEPs with diglycidyl ether of bisphenol A were studied with differential scanning calorimetry. The cured epoxy resins possessed a phosphorous element coming from the DEP derivatives, exhibiting improved flame retardancy. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 432–440, 2003     

Synthesis,characterization, thermal,and flame retardant properties of phosphate-based epoxy resins

A new phosphorus-containing oxirane bis-glycidyl phenylphosphate (BGPP), and a diamine, bis(4-aminophenyl)phenylphosphate (BAPP), were synthesized. Both of these two phosphorus-containing compounds lead to phosphate-containing epoxy resin via curing reaction. The kinetics of the curing reaction of BGPP with various curing agents, including BAPP, were studied. The introduction of electron-withdrawing group into the compounds increases the BGPP and decreases the BAPP reactivity in the curing reaction. The thermal and the weight loss behavior of the cured epoxy resins were studied by TGA. High char yields (32–52%) as well as high limiting oxygen index (LOI) values (34–49) of these phosphorylated resins were found, confirming the usefulness of these phosphorus-containing epoxy resins as flame retardants. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 565–574, 1997.     

Thermal cured epoxy resins using certain calixarenes and their esterified derivatives as curing agents

The acetyl esterified calixarene (CA) derivatives were prepared from calix[4]resorcinarene (CRA), and p‐tert‐butylcalixarene (BCA[n], n = 4, 6, 8), respectively. Using these CA derivatives as curing agents, the thermal curing reactions of two multifunctional epoxy resins (jER 828, 186 g/equiv., and ESCN, 193.7 g/equiv.) were investigated. The temperatures of glass transition (T_g) and decomposition (T) were measured by DSC and TGA, respectively. Based on the yields, T_gs, and T_ds of the thermal cured jER 828 epoxy resin with CRA‐E100, the curing conditions were optimized to be tetrabutylphosphonium bromide (TBPB) as catalyst in NMP at 160 °C for 15 h. Under this curing condition, the cured materials of jER 828 or ESCN using various CA derivatives as curing agents were prepared. Except for BCA4 derivatives, the yields of thermal curing reaction were higher than 90%. T_gs and Ts of the resultant cured materials were in the range of 113–248 °C and 363–404 °C, respectively. These results mean that the cured epoxy resins with excellent T_gs were successfully formed by using CA derivatives as curing agents. It was also found that the T_gs of cured epoxy resins were strongly affected by the degree of esterification of CA derivatives. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 1931–1942, 2010     

Novel flame‐retardant thermosets: Phosphine oxide‐containing diglycidylether as curing agent of phenolic novolac resins

Phosphorus‐containing novolac–epoxy systems were prepared from novolac resins and isobutyl bis(glycidylpropylether) phosphine oxide (IHPOGly) as crosslinking agent. Their curing behavior was studied and the thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured. The T_g and decomposition temperatures of the resulting thermosets are moderate and decrease when the phosphorous content increases. Whereas the phosphorous species decrease the thermal stability, at higher temperatures the degradation rates are lower than the degradation rate of the phosphorous‐free resin. V‐O materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3516–3526, 2004     

Storage stability and curing behavior of epoxy‐dicyandiamide systems with carbonyldiimidazole‐Cu (II) complexes as the accelerator

The reaction between carbonyldiimidazole (CDI) and copper (II) nitrate produces a new Cu (II) complex with nitrate as the counter anion. TGA, UV, and FTIR analyses confirmed that the coordination number of CDI in this complex is two. The acceleration effect of the complex in epoxy‐dicyandiamide (DICY) curing systems has been evaluated by DSC and TMA, and the increasing viscosity of the mixture was monitored during the storage. The results revealed that the complex is not only very effective for the acceleration of epoxy‐DICY systems, leading to a rapid gelation within 21 min at 120 °C, but it is also chemically stable at ambient temperature. This is reflected by the slow increase of viscosity of the accelerated curing systems stored at 35 °C, even over 56 days. In addition, the effects of the [Cu(CDI)₂]²⁺ complex with different counter anions, that is, bromide, chloride, nitrate, sulfate, phthalate, and acetate, were compared using a series of tests. By comparing with N,N‐dimethyl‐N′‐phenylurea (fenuron), the widely used latent accelerator for DICY‐epoxy curing systems, the complexes with bromide and nitride were found to be better, both regarding storage stability and for their acceleration effect. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 3470–3476     

Epoxy resin curing reaction studied by proton multiple‐quantum NMR

This study demonstrates that the curing reaction of thermosetting polymers, in particular, epoxy resins cured with aliphatic amines, can be characterized by different multiple‐quantum (MQ) NMR experiments performed in low‐field spectrometers. Measurements of the curing reaction at 40 °C, 70 °C, and 100 °C are carried out to obtain the kinetic parameters like induction time, vitrification time, polymerization rate, and activation energy being consistent with data obtained by other traditional and complementary techniques. Besides, it is demonstrated that ¹H MQ‐NMR spectroscopy is a successful approach to overcome the experimental challenge arising from the characterization of high dipolar‐coupled polymers to study the network structure and segmental dynamics of thermosetting polymer networks. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2015 , 53, 1324–1332