苯并夺氮唑对铜和铁缓蚀作用的拉曼光谱研究

本文利用现场拉曼光谱研究了中性含氯离子溶液中苯并三氮唑在铜和铁电极表面的吸附以及成膜行为，结果表明苯并三氮唑能强烈地化学吸附于铜电极和铁电极表面，形成类似［Ｍｎ（ＢＴＡ）ｐ］的配合物膜，一定程度上阻止了膜内外物质的交换，对金属起缓蚀作用。另一方面两种金属表面配合物膜均具有电位依赖性：在铜电极表面，当外加电位由－０．５Ｖ负移至－０．９时，发生了由［Ｃｕ（Ｉ）（ＢＴＡ）］ｎ向［Ｃｕ（Ｉ）Ｃｌ（ＢＴＡＨ     

AES和XPS研究Cu-Sn-P镀层表面PMTA复合膜

本文运用ＡＥＳ和ＸＰＳ分析了不同缓蚀剂对Ｃｕ－Ｓｎ－Ｐ仿金镀层表面进行处理所形成的配合物保护膜的组成,并采用加速腐蚀实验和ＬＳＶ研究了这些不同保护膜的抗腐蚀能力。结果表明：采用１＝苯基－５－巯基四氮唑（ＰＭＴＡ）钝化处理后,不仅增强了镀层耐盐溶液和酸性气体的腐蚀能力,又不影响镀层表面的金黄色外观,其防变色效果优于苯并三氮唑（ＢＴＡ）、２－巯基苯并噻唑（ＭＢＴ）和２－氨基嘧啶（２－ＡＰ０。ＰＭＴＡ／     

新型卟啉吡啶季铵盐与铜(Ⅱ)显色反应的研究

本文研究了在不使用表面活性剂情况下,新型卟啉试剂溴化５－［４－（４－吡啶丁氧基）苯基］－１０,１５,２０－三（４－甲氧基苯基）卟啉与铜（Ⅱ）的显色反应。结果表明,ｐＨ＝５－７时,铜（Ⅱ）与此卟啉形成了稳定配合物,其表观摩尔吸光系数为２．３７×１０５Ｌ·ｍｏｌ－１·ｃｍ－１,铜浓度在０－１．２μｇ／１０ｍＬ范围内服从比耳定律。配合物组成的摩尔比为Ｃｕ∶卟啉吡啶季铵盐＝１∶２,本方法应用于环境水样中铜的测定,结果满意     

Eu(p-PBA)_3phen1/2H_2O的高分辨光谱和Raman光谱Eu(p-PBA)3phen1/2H2O的高分辨光谱和Raman光谱*张颖唐波金林培(北京师范大学化学系,北京100875)吕少哲黄世华(中国科学院激发

配合物Ｅｕ（ｐ－ＰＢＡ）３ｐｈｅｎ１／２Ｈ２Ｏ（ｐ－ＰＢＡ：对苯基苯甲酸酸根离子；ｐｈｅｎ：邻菲咯啉）在紫外光激发下，能发出很强的红色荧光．以Ｅｕ（Ⅲ）离子为光谱探针，７７Ｋ下测得其高分辨激发和发射光谱，选择激发配合物的５Ｄ０能级，得到两组不同的发光光谱，表明配合物中Ｅｕ（Ⅲ）离子有两种不同的化学环境．配合物的喇曼光谱中，羧基阴离子的反对称伸缩振动和对称伸缩振动谱带是明显分裂和带肩峰的宽带，说明配合物中羧基同时存在多种配位方式     

KH_2PO_4和（CH_3NHCH_2COOH）_3CaCl_2在高压下的状

在活塞圆筒式Ｐ～Ｖ关系测量装置上，研究了ＫＨ＿２ＰＯ＿４（ＫＤＰ）和（ＣＨ＿３ＮＨＣＨ＿２ＣＯ－ＯＨ）＿３ＣａＣＩ＿２［Ｔｒｉｓ－ｓａｒｃｏｓｉｎｅｃａｌｃｉｕｍｃｈｌｏｒｉｄｅ（ＴＳＣＣ）］在室温下、４．５ＧＰａ内的ｐ～Ｖ关系。实验结果表明：ＫＤＰ在２．１ＧＰａ左右有一个相变；ＴＳＣＣ在０．８ＧＰａ和３．２ＧＰａ左右各有一个相变。本工作还给出了它们在相变前后的状态方程，以及它们的格临爱森参数γＯ、体积模量Ｂ＿ｏ和Ｂ＿ｏ的压力导数Ｂ＿ｏ。     

用￣1H NMR法研究［Co（Xacac）＿2（Me－en）］ClO＿4的重氢化

应用￣１ＨＮＭＲ技术推定了新合成的二（３－取代Ｘ基－２，４－戊二酮）．Ｎ－甲基乙二胺合钴（Ⅲ）配合物：［Ｃｏ（Ｘａｃａｃ）＿２（Ｍｅ－ｅｎ）］ＣｌＯ＿４（Ｘ＝ＣＨ＿３、Ｃｌ、ＮＯ＿２）的Δ（Ｒ）∧（Ｓ）和Δ（Ｓ）∧（Ｒ）异构体的空间构型，测定了各配合物异构体手性配位氮原子上的重氢化速率常数ｋ＿Ｄ值（３４．０℃）．结果表明，取代基Ｘ对ｋ＿Ｄ值有着显著影响。     

苯甲酰丙酮—乙二胺HALF—UNIT席夫碱的铜（Ⅱ）络合物合成及波谱研究

由苯甲酰丙酮与乙二胺缩合成了一种新的Ｈａｌｆ－ｕｎｉｔ席夫碱，进一步与邻菲罗啉或２，２＇－联吡啶合成了两个铜（Ⅱ）的络合物，［Ｃｕ（ｂｚａｃｅｎ）（）ｐｈｅｎ）］ＣｌＯ４，［Ｃｕ（ｂｚａｃｅｎ）（ｂｉｐｙ）］ＣｌＯ４。     

Eu2（DBM）6 4,4‘—BIPY的合成,光谱及铕（Ⅲ）格位

合成了配合物Ｅｕ２（ＤＢＭ）６４，６｀－ＢＩＰＹ，ＩＲ和Ｒａｍａｎ光谱都证实了配合物的生成，７７Ｋ正派激发高分辨激光激发光谱和荧光光谱表明配合物存在＾５Ｄ０能级能量差别为１５ｃｍ＾－１的两种Ｅｕ（Ⅲ）格位，两种Ｅｕ（Ⅲ）离子均不位于对称中心，由＾５Ｄ０→＾７Ｄ０．１，２跃迁荧光光谱峰数判断，两种Ｅｕ（Ⅲ）格位的区域对称性均为Ｃ１或Ｃ２或Ｃ，两种格位Ｅｕ（Ⅲ）离子的发光寿命分别为０．３７ｍｓ和０．３     

H2O／KDEHP（75%）—HDEHP（25%）／n—HEPTANE微乳体系表面活性剂？…

利用傅里叶变换拉曼光谱和傅里叶变换红外光谱对Ｈ２Ｏ／ＫＤＥＧＰ（７５％）－ＨＤＥＨＰ（２５％）／ｎ＝ＨＥＰ－ＴＡＮＥ微乳体系的表面活性剂疏水链和极性头基与水分子的相互作用进行了研究。结果表明：当加水量由Ｗ０＝１增加至４３时,表面活性有性头基［ＰＯ２］＾－的反对称伸缩振动由１２３３ｃｍ＾－１移至１２０７ｃｍ＾－１,其对称伸缩振动由１０９４ｃｍ＾－１移至１０８９ｃｍ＾－１。表面活性剂疏水链的堆结构也发     

Bi1.8Pb0.2Sr2Ca2Cu3O高温超导体的I—V特性研究

我们测量了Ｂｉ１．８Ｐｂ０．２Ｓｒ２Ｃａ２Ｃｕ３Ｏ高温超导体在磁场下不同温度的等温Ｉ－Ｖ曲线。观测到在等温ｌｇＩ－ｌｇＶ曲线上会同时存在正曲率和负曲率，这是通常的Ａｎｄｅｒｓｏｎ－Ｋｉｎ磁通蠕动模型和涡旋玻璃态的标度理论Ｖ∝ｅｘｐ［－（Ｊ０／Ｊ）＾Ｈ］所不能解释的。我们在蠕动模型的基础上，考虑到磁通运动时的耗散对激活能会有一个动力学的贡献，对上述现象进行了解释，并与实验进行了对比。     

Effect of sulfide pollution on the stability of the protective film of benzotriazole on copper

Benzotriazole (BTAH) is an excellent inhibitor for the corrosion of copper and many of its alloys in unpolluted media. Protection is attributed to the formation of a film of Cu(I)BTA. Injection of sulfide ions into a benzotriazole inhibited salt water damages the protective Cu(I)BTA film very rapidly, increases the corrosion rate and leads to the formation of copper sulfide. This effect is quite marked at a sulfide concentration as low as 10⁻⁵ M (about 0.3 ppm sulfur) in the presence of 10⁻² M BTAH, which is 1000-fold greater than that of the sulfide ion. The intensity of sulfide attack increases with its concentration.Prolonged pre-passivation of copper in the BTAH protected medium even at high concentration does not markedly improve the resistance of the protective film to sulfide attack. This finding is contrary to a well-documented phenomenon in unpolluted media where the inhibiting efficiency of BTAH increases with the time of immersion and the concentration of the inhibitor. X-ray photoelectron spectroscopy (XPS) reveals the presence of both sulfide and BTAH on the corroded surface indicating that sulfide attack is localized.     

Benzotriazole as an inhibitor of brass corrosion in chloride solution

The current research explores the formation of protective layers on copper, zinc and copper-zinc (Cu-10Zn and Cu-40Zn) alloys in chloride solution containing benzotriazole (BTAH), by use of electrochemical techniques, atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). Electrochemical reactions and surface products formed at the open circuit potential and as a function of the potential range are discussed. The addition of benzotriazole to aerated, near neutral 0.5 M NaCl solution affects the dissolution of copper, zinc, Cu-10Zn and Cu-40Zn alloys. The research also compares the inhibition efficiency and Gibbs adsorption energies of the investigated process. Benzotriazole, generally known as an inhibitor of copper corrosion is also shown to be an efficient inhibitor for copper-zinc alloys and zinc metal. The surface layer formed on alloys in BTAH-inhibited solution comprised both oxide and polymer components, namely Cu₂O and ZnO oxides, and Cu(I)-BTA and Zn(II)-BTA polymers. The formation of this mixed copper-zinc oxide polymer surface film provides an effective barrier against corrosion of both metal components in chloride solution.     

Synchrotron infrared reflectance microspectroscopy study of film formation and breakdown on copper

This work demonstrates the utility of synchrotron infrared reflectance microspectroscopy in the far‐ and mid‐IR for the determination of the composition of electrogenerated surface films formed during the general and localized corrosion of copper in alkaline and bicarbonate solutions. Back‐reflection geometry has been employed to identify the anodic film formed on copper in 0.1 M NaOH solution at 0.3 V (versus a Ag/AgCl reference) to be mainly CuO. In 0.01 M NaHCO₃ solution general corrosion occurs with passive film formation below 0.2 V. The surface film at 0.2 V consisted mainly of bicarbonate, copper carbonate dihydroxide or malachite [CuCO₃·Cu(OH)₂], Cu(OH)₂ and possibly some CuO. At higher potentials the passive film breaks down and localized corrosion occurs leading to the formation of pits. The composition of the surface films inside the pits formed at 0.6 V was found to be essentially the same as that outside but the relative amount of Cu(OH)₂ appears to be higher.     

Shell‐isolated nanoparticle enhanced Raman spectroscopy (SHINERS) investigation of benzotriazole film formation on Cu(100), Cu(111), and Cu(poly)

Benzotriazole (BTAH) is well known as an effective corrosion inhibitor for Cu because of its ability to make a coordination polymer film on the surface that provides a barrier to Cu oxidation. BTA⁻ film formation was investigated on single‐crystal and polycrystalline Cu surfaces with shell‐isolated nanoparticle enhanced Raman spectroscopy (SHINERS) using silica‐encapsulated Au nanoparticles. Potential‐dependent spectra display reversible film formation on polycrystalline Cu and irreversible film formation on single‐crystal Cu. Grain boundaries leading to smaller BTA⁻‐Cu oligomers are proposed to be the reason for cathodic degradation of the BTA⁻ polymeric films on polycrystalline Cu. Copyright © 2011 John Wiley & Sons, Ltd.     

苯并三唑表面配位化学的电化学现场拉曼光谱研究

用电化学现场表面增强拉曼光谱(SERS)研究了非水体系中苯并三唑(BTAH)在银电极表面的吸附及成膜行为,结果表明非水体系中BTAH的吸附行为随电位变化而不同。较负区间主要以中性分子形式吸附;中间电位区间主要以BTA-吸附并不可逆成膜。采用直接电化学合成技术模拟电极表面过程制备了苯并三唑与Cu, Ag, Fe, Ni和Zn等金属的配合物,并研究了中性配体三苯基膦(pph₃)对其配位过程的影响,所得产物的元素分析以及拉曼光谱研究表明pph₃的加入影响了Cu和Ag与BTAH的配位过程,并出现在最终产物中,而对BTAH与Ni, Fe和Zn的配位过程未产生影响,产物未出现pph₃。     

苯并三氮唑缓蚀铜粉中含氧量的测定

研究了不同条件下苯并三氮唑的紫外吸收光谱,最大吸收峰为273 nm,常温下吸收强度不受温度影响,浓度线性范围为0～2.2 μg ·mL-1,检出限为0.02 μg ·mL-1,摩尔吸光系数为5.41×104 L·mol-1·cm-1;建立了苯并三氮唑缓蚀铜粉中含氧量的测定方法。鉴于缓蚀铜粉由金属铜、铜氧化物和苯并三氮唑保护膜组成,用盐酸-H₂O₂分解样品后,分别以EDTA配位滴定和紫外光谱法测定化学缓蚀铜粉中铜和苯并三氮唑含量,差减求出该铜粉含氧量。方法经济,仪器简单,操作方便,标准偏差=1.7%,变异系数为7.6%。结合国家标准方法,通过电解铜粉在成膜前后含氧量分析比较,提出的方法测定结果令人满意。     

Synthesis and magnetic properties of Cu-coated Fe composite nanoparticles

The Fe/Cu nanocomposites with iron as core and copper as shell have been successfully synthesized by a two-step reduction method. A spherical nanoparticle of γ-Fe was first fabricated by the reduction of ferrous chloride, and then the Fe particle was coated by nanocrystalline Cu through the reduction of copper sulfate. The thickness of copper shell has been tuned by varying the initial concentration of copper sulfate. The morphology, crystalline structure, chemical composition and magnetic properties of the products were investigated by using transmission electron microscopy (TEM), X-ray diffraction (XRD), energy dispersive X-ray spectroscopy (EDS) and vibrating sample magnetometer (VSM). It was found that the saturation magnetization (M_s) values of the Fe/Cu core–shell particles are varied owing to the different thickness of copper layer. Though the M_s value of the Fe/Cu nanocomposite is lower than that of pure iron nanoparticles, the higher M_s value (22.411 emu/g) of the Fe/Cu composites is also investigated. The result of the thermogravimetric analysis (TGA) showed the enhanced antioxidation capacity of the Fe/Cu nanocomposites. This kind of nanocomposites combined the excellent magnetism of iron and the electronic, thermal conductivity of copper, suggesting potential application as a novel electromagnetic material.     

Study of chemisorption on copper low-index and stepped surfaces

Adsorption of CHCl₃, O₂, and hydrocarbons has been studied on Cu(111) and stepped surfaces using LEED, AES, and UPS at room temperature. We find that ordered Cl overlayers form upon Cu(111), Cu[3(111) × (100)], and Cu[5(111) × (100)] surfaces upon exposure to CHCl₃. Exposure to O₂ results in rearrangement of the Cu[5(111) × (100)] surface to hill-and-valley regions with large (111) areas, whereas Cu[2(111) × (100)] is stable for the same exposure. The photoemission spectra show new energy levels due to C1 above and below the Cu d band region and a small splitting of the halogen p orbitals. Effects consistent with interaction with the Cu d band are observed. Similar effects are observed with oxygen adsorption. The initial rate of Cl or O₂ chemisorption as measured by photoemission is proportional to the density of steps on these surfaces. Apparently, structural effects play an important role in chemisorption on metals (such as copper) with low density of states at the Fermi energy.     

Potential dependence of cuprous/cupric duplex film growth on copper electrode in alkaline media

The duplex oxide film potentiostatically formed on copper in concentrated alkaline media has been investigated by XRD, XPS, negative-going voltammetry and cathodic chronopotentiometry. The interfacial capacity was also measured using fast triangular voltage method under quasi-stationary condition. The obvious differences in the thickness, composition, passivation degree and capacitance behavior were observed between the duplex film formed in lower potential region (−0.13 to 0.18 V versus Hg|HgO electrode with the same solution as the electrolyte) and that formed in higher potential region (0.18-0.60 V). Cuprous oxides could be formed and exist stably in the inner layer in the both potential regions, and three cupric species, soluble ions and Cu(OH)₂ and CuO, could be independently produced from the direct oxidation of metal copper, as indicated by three pairs of redox voltammetric peaks. One of the oxidation peaks appeared only after the scan was reversed from high potential and could be attributed to CuO formation upon the pre-accumulation of O²⁻ ions within the film under high anodic potentials. A new mechanism for the film growth on the investigated time scale from 1 to 30 min is proposed, that is, the growth of the duplex film in the lower potential region takes place at the film|solution interface to form a thick Cu(OH)₂ outer layer by field-assisted transfer of Cu²⁺ ions through the film to solution, whereas the film in the higher potential region grows depressingly and slowly at the metal|film interface to form Cu₂O and less CuO by the transfer of O²⁻ ions through the film to electrode.