Preparation and properties of molecular‐weight‐controlled polyimides derived from 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene and 4,4′‐oxydiphthalic anhydride

A series of molecular‐weight‐controlled fluorinated aromatic polyimides were synthesized through the polycondensation of a fluorinated aromatic diamine, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, with 4,4′‐oxydiphthalic anhydride in the presence of phthalic anhydride as the molecular‐weight‐controlling and end‐capping agent. Experimental results demonstrated that the resulting polyimides could melt at temperatures of 250–300 °C to give high flowing molten fluids, which were suitable for melt molding to give strong and flexible polyimide sheets. Moreover, the aromatic polyimides also showed good solubility both in polar aprotic solvents and in common solvents. Polyimide solutions with solid concentrations higher than 25 wt % could be prepared with relatively low viscosity and were stable in storage at the ambient temperature. High‐quality polyimide films could be prepared via the casting of the polyimide solutions onto glass plates, followed by baking at a relatively low temperature. The molten behaviors and organosolubility of the molecular‐weight‐controlled aromatic polyimides depended significantly on the polymer molecular weights. Both the melt‐molded polyimide sheets and the solution‐cast polymer films exhibited outstanding combined mechanical and thermal properties. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1997–2006, 2006     

Synthesis and properties of poly(amic acid)s and polyimides based on 2,2′,6,6′‐biphenyltetracarboxylic dianhydride

Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2′,6,6′‐biphenyltetracarboxylic dianhydride (2,2′,6,6′‐BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2′,6,6′‐BPDA and 4,4′‐(1,3‐phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass‐transition temperatures (T_g)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385–6393, 2006     

Nanoindentation studies of polyimide thin films with various internal linkages in the diamine component

Polyimide thin films were synthesized from 3,3′,4,4′‐biphenyltetracarboxylic acid dianhydride (BPDA) and four different diamines (p‐phenylene diamine, 4,4′‐oxydiphenylene diamine, 4,4′‐biphenylene diamine, and 4,4′‐sulfonyldiphenylene diamine). The nanoindentation behavior of the resulting polyimides, namely, poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA), poly(4,4′‐biphenylene biphenyltetracarboximide) (BPDA‐BZ), poly(4,4′‐oxydiphenylene biphenyltetracarboximide) (BPDA‐ODA), and poly(4,4′‐sulfonyldiphenylene biphenyltetracarboximide) (BPDA‐DDS), were investigated. Also, the morphological properties were characterized with a prism coupler and wide‐angle X‐ray diffraction and were correlated to the nanoindentation studies. The nanoindentation behavior and hardness varied quite significantly, depending on the changes in the chemical and morphological structures. The hardness of the polyimide thin films increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐BZ < BPDA‐PDA. For all the polyimide thin films, except that of BPDA‐BZ, the hardness decreased with an increase in the load. The birefringence, a measure of the molecular in‐plane orientation, increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐PDA < BPDA‐BZ. The X‐ray diffraction studies revealed that the crystallinity of the polyimide thin films varied with the changes in the chemical structure. The studies showed that the indentation response with an applied load and the hardness by nanoindentation for the BPDA‐based polyimides were closely related to the morphological structure. The nanoindentation and birefringence results revealed that the mechanical properties of the polyimide thin films were dependent on the crystallinity, which arose because of the chain order along the chain axis and the molecular packing order. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 861–870, 2004     

Water sorption and activation energy in polyimide thin films

The water sorption behavior and the activation energy were investigated for various chemical structure polyimide thin films; BPDA‐PDA, BPDA‐ODA, PMDA‐ODA, and 6FDA‐ODA. The activation energy for the water diffusion varied in the range of 5.53 to 9.27kcal/mol, and was in the increasing order: BPDA‐PDA < BPDA‐ODA < PMDA‐ODA < 6FDA‐ODA. BPDA‐PDA and BPDA‐ODA polyimide films showed relatively well‐ordered morphological structure, which results in relatively low diffusion coefficient and high activation energy. It was found that the diffusion coefficient and the activation energy are significantly related to the in‐plane orientation, crystallinity, and packing order in the polyimide thin films. The morphological structure was predominant factors for the water diffusion coefficient and activation energy in the polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2714–2720, 2000     

Synthesis and characterization of polyimides derived from (3‐amino‐2,4,6‐trimethylphenyl)‐(3′‐aminophenyl)methanone and aromatic dianhydrides

A series of new polyimides were prepared via the polycondensation of (3‐amino‐2,4,6‐trimethylphenyl)‐(3′‐aminophenyl)methanone and aromatic dianhydrides, that is, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropane dianhydride. The structures of the polyimides were characterized by Fourier transform infrared and NMR measurements. The properties were evaluated by solubility tests, ultraviolet–visible analysis, differential scanning calorimetry, and thermogravimetric analysis. The two different meta‐position‐located amino groups with respect to the carbonyl bridge in the diamine monomer provided it with an unsymmetrical structure. This led to a restriction on the close packing of the resulting polymer chains and reduced interchain interactions, which contributed to the solubility increase. All the polyimides except that derived from BPDA had good solubility in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, N,N‐dimethylformamide, and dimethyl sulfone, and in common organic solvents, such as cyclohexanone and chloroform. In addition, these polyimides exhibited high glass‐transition values and excellent thermal properties, with an initial thermal decomposition temperature above 470 °C and glass‐transition temperatures in the range of 280–320 °C. The polyimide films also exhibited good transparency in the visible‐light region, with transmittance higher than 80% at 450 nm and a cutoff wavelength lower than 370 nm. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1291–1298, 2006     

Synthesis and characterization of novel fluorinated polyimides derived from 4,4′‐[2,2,2‐trifluoro‐1‐(3‐trifluoromethylphenyl)ethylidene]diphthalic anhydride and aromatic diamines

A novel fluorinated aromatic dianhydride, 4,4′‐[2,2,2‐trifluoro‐1‐(3‐trifluoromethyl‐phenyl)ethylidene]diphthalic anhydride (TFDA) was synthesized by coupling of 3′‐trifluoromethyl‐2,2,2‐trifluoroacetophenone with o‐xylene under the catalysis of trifluoromethanesulfonic acid, followed by oxidation of KMnO₄ and dehydration. A series of fluorinated aromatic polyimides derived from the novel fluorinated aromatic dianhydride TFDA with various aromatic diamines, such as p‐phenylenediamine (p‐PDA), 4,4′‐oxydianiline (ODA), 1,4‐bis(4‐aminophenoxy)benzene (p‐APB), 1,3‐bis(4‐amino‐phenoxy)benzene (m‐APB), 4‐(4‐aminophenoxy)‐3‐trifluoromethylphenylamine (3FODA) and 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene (6FAPB), were prepared by polycondensation procedure. All the fluorinated polyimides were soluble in many polar organic solvents such as NMP, DMAc, DMF, and m‐cresol, as well as some of low boiling point organic solvents such as CHCl₃, THF, and acetone. Homogeneous and stable polyimide solutions with solid content as high as 35–40 wt % could be achieved, which were prepared by strong and flexible polyimide films or coatings. The polymer films have good thermal stability with the glass transition temperature of 232–322 °C, the temperature at 5% weight loss of 500–530 °C in nitrogen, and have outstanding mechanical properties with the tensile strengths of 80.5–133.2 MPa as well as elongations at breakage of 7.1–12.6%. It was also found that the polyimide films derived from TFDA and fluorinated aromatic diamines possess low dielectric constants of 2.75–3.02, a low dissipation factor in the range of 1.27–4.50 × 10^?3, and low moisture absorptions <1.3%. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 4143–4152, 2004     

Role of the in‐plane orientation of polyimide films in graphitization

Poly(amide acid) labeled with perylenetetracarboxydiimide (PEDI) was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), p‐phenylenediamine (PDA), and diamino‐PEDI. Poly(amide acid) was then reacted with sodium hydride and various kinds of alkyl iodides for transformation into various poly(amide ester)s. The cast films were imidized while fixed on glass substrates to give BPDA/PDA polyimide films. The degree of in‐plane molecular orientation (f) of the polyimides and their precursors, poly(amide acid) and poly(amide ester)s, were determined via measurements of the visible dichroic absorption at an incidence angle for a rodlike dye (PEDI) bound to the main chain. All precursor films showed relatively low degrees of in‐plane orientation. After imidization of the precursors fixed on glasses, however, striking spontaneous in‐plane orientation behavior was observed. The f value for polyimide film from a poly(amide acid) precursor was as high as 0.7–0.8. The f value for polyimide film from a methyl ester precursor, however, was lowered to 0.4–0.5, but it increased with the increasing size of the alkyl groups. Good correlations of the in‐plane orientation of the polyimide films with the tensile modulus of the films and the in‐plane orientation of the graphitized films were observed. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 3011–3019, 2001     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′‐oxydiphenylene pyromellitimide) (PMDA‐ODA) and pseudo‐rodlike poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt % cyclohexyl‐2‐pyrrolidone (CHP; bp = 307 °C) and 80 wt % n‐methyl‐2‐pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA‐PDA having high chain rigidity, but relatively low in the semiflexible PMDA‐ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2879–2890, 2000     

Synthesis and characterization of high refractive index polyimides derived from 2,5‐Bis(4‐Aminophenylenesulfanyl)‐3,4‐Ethylenedithiothiophene and aromatic dianhydrides

The authors describe the synthesis and characterization of the polyimide (PI) series containing a 2,5‐bis(4‐aminophenylenesulfanyl)‐3,4‐ethylenedithiothiophene (APSEDTT) moiety in their main chain. The APSEDTT monomer with high sulfur content was prepared and polymerized with several aromatic dianhydrides such as 4,4′‐[p‐thio bis(phenylenesulfanyl)]diphthalic anhydride (3SDEA), 4,4′‐biphthalic anhydride (BPDA), and 4,4′‐oxydiphthalic anhydride (ODPA) by the traditional two‐step polycondensation procedure. All PIs exhibited high transparency, higher than 75% at 550 nm for a thickness of about 20 μm and good thermal properties such as thermal decomposition temperatures (T_10%) in the range of 409–521 °C. In addition, the PIs have extraordinarily excellent optical properties in refractive index and birefringence as originally designed. In particular, the PI derived from APSEDTT and 3SDEA showed a high refractive index (1.7586), and a low birefringence (0.0087) because of their very high sulfur content (27.7%). © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 944–950     

Preparation and characterization of novel polyimide‐silica hybrids

Polyimide‐silica (PI‐SiO₂) hybrids were prepared from a novel polyimide (PI), derived from pyromellitic dianhydride (PMDA), 1,6‐bis(4‐aminophenoxy)hexane (synthesized) and 4,4′‐oxydianiline. SiO₂ networks (5–30 wt%) were generated through sol–gel process using either tetraethylorthosilicate (TEOS) or a mixture of 3‐aminopropyltriethoxysilane‐PMDA‐based coupling oligomers (APA) and TEOS. Thin, free standing hybrid films were obtained from the respective mixtures by casting and curing processes. The hybrid films were characterized using Fourier transform infrared, ²⁹Si nuclear magnetic resonance (NMR), field emission scanning electron microscopy (FE‐SEM), energy dispersive X‐ray spectrometry and atomic force microscopy (AFM) techniques. ²⁹Si NMR results provide information about formation of organically modified silicate structures that were further substantiated by FE‐SEM and AFM micrographs. Contact angle measurements and thermogravimetric thermograms reveal that the addition of APA profoundly influences surface energy, interfacial tension, thermal stability and the residual char yield of modified hybrids in comparison to those obtained by mixing only TEOS. It was found that reduced particle size, efficient dispersion and improved interphase interactions were responsible for the eventual property enhancement. Copyright © 2012 John Wiley & Sons, Ltd.     

Preparation of polyimide/silica hybrid material by sol–gel process under basic catalysis: Comparison with acid conditions

Hybrid polyimide/silica materials were prepared from polyimides bearing reactive functions along the polymer backbone, which can react with. The silica phase was formed by sol–gel process using ammonium hydroxide catalyst. Silica fillers prepared under basic conditions were compared with materials prepared using chlorhydric acid. The synthesized hybrid materials were characterized by TGA, IRTF, and NMR. The density of the different systems was also measured. The morphology of these hybrid systems were investigated by both scanning and transmission electron microscope. Thermal properties of the composites were also evaluated by DSC and DMA. The morphology of silica fillers highly depends on the catalyst, on the reaction conditions of the sol–gel process, and the linking formation with the polyimide. It results that optimized conditions lead to homogeneous hybrid films containing 12 wt % of silica particles of about 20 nm. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 1891–1902, 2008     

Analysis of dimensionally stable copolyimide with a low‐level residual stress

Copolyimide thin film, which has low‐level stress and stress relaxation induced by water sorption, was characterized for potential applications as an encapsulant, a stress‐relief buffer, and in interlayer dielectrics. The polyimides examined were poly(p‐phenylene pyromellitimide) (PMDA‐PDA) and poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA) as well as their random copolyimides with various compositions. These copolyimide films exhibited good combinations of physical and mechanical properties with low thermal expansion coefficients, residual stress, and moisture‐induced stress–relaxation behavior by appropriately selecting the ratios of the dianhydride component. For these polyimides, the residual stress increased in the range of −8.1–7.5 MPa, whereas stress relaxation induced by water uptake decreased in the range of 10.3–4.7 MPa with increasing BPDA contents, respectively. The major factor in determining the magnitude of the stress behavior induced by both the thermal mismatch and water uptake in films should be the morphological factors such as chain rigidity, chain orientation, crystallinity, and microvoids. Their morphological structures were examined by wide angle X‐ray diffraction and a prism coupler, and the thermal properties were measured using a dynamic mechanical thermal analyzer as well as thermomechanical analysis. Overall, the candidate for the low level stress buffer application from the PMDA/BPDA‐PDA copolyimide was the 30/70 (= PMDA/BPDA in molar ratio) copolyimide. This copolyimide showed no residual stress after curing at 400 °C and relatively insensitive stress relaxation to ambient humidity. © 2001 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 796–810, 2001     

Two‐sided comb poly(amic ester)–poly(propylene oxide) graft copolymers as porous polyimide precursors

New step‐growth graft block copolymers were synthesized. These two‐sided comb copolymers consisted of a poly(amic ester) (PAE) backbone and pendant poly(propylene oxide) (PPO) grafts. The copolymers were made via a macromonomer approach, in which the 4,6‐bischlorocarbonyl isophthalic acid bis[poly(propylene oxide)] ester macromonomer was synthesized through the reaction of hydroxyl‐terminated PPO oligomers with pyromellitic dianhydride and oxalyl chloride. This macromonomer was subsequently used in step‐growth polymerization with comonomers 4,6‐bischlorocarbonyl isophthalic acid diethyl ester, 2,5‐bischlorocarbonyl terephthalic acid diethyl ester, and 2,2‐bis[4‐ (4‐aminophenoxy)phenyl] hexafluoropropane, and this yielded PPO‐co‐PAE graft copolymers. Accordingly, we report the synthesis and characterization of the PPO oligomer, the PPO macromonomer, and their corresponding PPO‐co‐PAE graft copolymers. Graft copolymers with PPO concentrations of 3–26 wt % were synthesized. These polymers were thermally cured to produce polyimide/PPO composites. The thermolysis of these polyimide/PPO composites yielded porous polyimide films with porosities ranging of 4–22.5%. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2266–2275, 2005     

Unique fluorescence behavior of perylenetetracarboxydiimides in polyimide systems

Perylenetetracarboxydiimide (PEDI) molecularly dispersed in polyamic acid (PAA) and polyimide (PI) films has unique fluorescence properties. An originally strong fluorescence of PEDI is efficiently quenched in the PAA films. The systematic variation of the chain structure of the PAA matrices revealed that the aromatic amide groups in the PAA chains function as a quencher. When a PAA derived from 3,4,3′4′-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA), BPDA/PDA, was used as a matrix polymer, the fluorescence of the dye dispersed in the film increased abruptly as imidization of the matrix proceeds. But annealing at temperatures higher than 320°C in the step-heating process caused a gradual decrease in the fluorescence intensity. The decreased intensity results from the dye–PDA units interactions intensified by the denser molecular packing of the matrix polymer chains. PEDI shows significant dependence of the fluorescence intensity on the chain structure of the PI matrices. In the various PI films containing a fixed diamine component, the dye fluorescence intensity reduces linearly with an increase in the intramolecular charge transfer ability of the PI matrices. From the result, we propose a fluorescence quenching mechanism through multistep electron transfer processes. The BPDA/PDA polyimide matrix leads to a strong PEDI fluorescence whereas the pyromellitic dianhydride (PMDA)-based PI matrices do not. For the blends composed of these PIs, the fluorescence of PEDI bound into the main chains provides a valuable indicator of the miscibility on the molecular level. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 827–840, 1998     

Synthesis of autophotosensitive hyperbranched polyimides based on 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride and 1,3,5‐tris(4‐aminophenoxy)benzene via end capping of the terminal anhydride groups by ortho‐alkyl aniline

Benzophenone‐containing, anhydride‐terminated hyperbranched poly(amic acid)s were end‐capped by ortho‐alkyl aniline in situ and then chemically imidized, yielding autophotosensitive hyperbranched polyimides. The polyimides were soluble in strong polar solvents, such as N‐methyl‐2‐pyrrolidone, N‐dimethylformamide, dimethylacetamide, and dimethyl sulfoxide. Thermogravimetric analysis revealed their excellent thermal stability, with a 5 wt % thermal loss temperature in the range of 527–548 °C and a10 wt % thermal loss temperature in the range of 562–583 °C. The strong absorption of the polyimide films in ultraviolet–visible spectra at 365 nm indicated that the hyperbranched polyimides were patternable. Highly resolved images with a line width of 6 μm were developed by ultraviolet exposure of the polymer films. A well‐defined image with lines as thin as 3 μm was also patterned, but the lines were rounded at the edges. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2026–2035, 2003     

Acrylic polymer/silica hybrids prepared by emulsifier‐free emulsion polymerization and the sol–gel process

Acrylic polymer/silica hybrids were prepared by emulsifier‐free emulsion polymerization and the sol–gel process. Acrylic polymer emulsions containing triethoxysilyl groups were synthesized by emulsifier‐free batch emulsion polymerization. The acrylic polymer/silica hybrid films prepared from the acrylic polymer emulsions and tetraethoxysilane (TEOS) were transparent and solvent‐resistant. Atomic force microscopy studies of the hybrid film surface suggested that the hybrid films did not contain large (e.g., micrometer‐size) silica particles, which could be formed because of the organic–inorganic phase separation. The Si? O? Si bond formed by the cocondensation of TEOS and the triethoxysilyl groups on the acrylic polymer increased the miscibility between the acrylic polymer component and the silica component in the hybrid films, in which the nanometer‐size silica domains (particles) were dispersed homogeneously in the acrylic polymer component. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 273–280, 2006     

Synthesis and properties of organosoluble polyimides based on 4,4′‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzophenone

A novel, fluorinated diamine monomer with the ether–ketone group, 4,4′‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzophenone ( 2 ), was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 4,4′‐dihydroxybenzophenone in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C. Flourinated polyimides (PIs) 5a – f and copolyimides (co‐PIs) 5c / a – f were synthesized from 2 and various commercial aromatic dianhydrides via thermal or chemical imidization. PIs 5a – f had inherent viscosities ranging from 0.72 to 1.22 dL/g. Besides the chemical imidization of 5c ( C ), the 5 ( C ) series were soluble in amide‐type solvents and even in less polar solvents, but PIs 5a – f prepared via thermal imidization were insoluble. PI films 5a – f exhibited tensile strengths ranging from 92 to 112 MPa, elongations at break from 8 to 15%, and initial moduli from 2.0 to 2.1 GPa. The glass‐transition temperatures of the 5 series were in the range of 232–278 °C, and the 10% weight‐loss temperatures were above 535 °C, with more than a 50% char yield at 800 °C in nitrogen. In comparison of the PI 5 series with the analogous non‐fluorinated PIs 6 series based on 4,4′‐bis(4‐aminophenoxy)benzophenone, the 5 series revealed better solubility, lower color intensity, dielectric constant, and moisture absorption. Their PI films had cutoff wavelengths between 370 and 410 nm, b* values ranging from 9.6 to 58.3, dielectric constants of 3.05–3.64 (1 MHz), with moisture absorption in the range of 0.08–0.38 wt %. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 222–236, 2004     

Preparation of novel,high‐modulus,swollen‐ or jungle‐gym‐type polyimide gels end‐crosslinked with 1,3,5‐tris(4‐aminophenyl)benzene

A novel preparation approach for high‐performance polyimide gels that are swollen or have a jungle‐gym‐type structure is proposed. A new rigid and symmetric trifunctional amine, 1,3,5‐tris(4‐aminophenyl)benzene (TAPB), was synthesized as a crosslinker. Three different kinds of amic acid oligomers derived from pyromellitic dianhydride (PMDA), 4,4′‐oxydiphthalic anhydride (ODPA), p‐phenylenediamine (PDA), and 4,4′‐oxydianiline (ODA) were end‐crosslinked with TAPB at a high temperature to make polyimide networks with different structures. Transparent polyimide gels were obtained from the ODPA–ODA/TAPB series with high compression moduli of about 1 MPa at their equilibrium swollen states in N‐methylpyrrolidone. Microscopic phase separation occurred during the gelation–imidization process when polyimide networks were generated from PMDA–PDA/TAPB and PMDA–ODA/TAPB. After these opaque polyimide networks were dried, a jungle‐gym‐like structure was obtained for the PMDA–PDA/TAPB and PMDA–ODA/TAPB series; that is, there was a high void content inside the networks (up to 70%) and little volume shrinkage. These polyimide networks did not expand but absorbed the solvent and showed moduli as high as those of solids. Therefore, using the highly rigid crosslinker TAPB combined with the flexible monomers ODPA and ODA and the rigid monomers PMDA and PDA, we prepared swollen, high‐performance polyimide gels and jungle‐gym‐type polyimide networks, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2501–2512, 2002     

The molecular structure of poly(biphenyl dianhydride-p-phenylenediamine) polyimide thin films by infrared spectroscopy: Thickness dependence of structure in the nano- to micrometer range

The molecular structure of poly[biphenyl dianhydride-p-phenylenediamine] (BPDA–PDA) polyimide in ultrathin (3–300 nm) films on silicon has been characterized by polarized infrared spectroscopy in conjunction with ellipsometry and X-ray reflectivity measurements. In spite of the high degree of crystalline packing of the polymer chains, the results show that an unexpected and significant content of imide rings exhibit local structural perturbations, including out-of-plane twisting. Further, the fraction of perturbed rings increases with increasing film thickness while, in contrast, the high degree of in-plane uniaxial film symmetry and planar stacking of the chains remain constant with thickness. These results reveal a new structural aspect of localized ring disorder that arises within the otherwise well-ordered, chain-stacked structure of BPDA–PDA polyimide films. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 1247–1260, 1998