X-ray analysis of multilayer In<Subscript>0.52</Subscript>Al<Subscript>0.48</Subscript>As/In<Subscript>0.53</Subscript>Ga<Subscript>0.47</Subscript>As/In<Subscript>0.52</Subscript>Al<Subscript>0.48</Subscript>As HEMT heterostructures with InAs nanoinsert in quantum well

In_0.52Al_0.48As/In_0.53Ga_0.47As/In_0.52Al_0.48As HEMT heterostructures on InP substrates with elastically strained InAs insert in combined quantum well (QW) have been investigated using a combination of X-ray methods: double-crystal X-ray diffraction, X-ray reflectivity, and reciprocal space mapping. This approach has provided detailed complementary information about the layered and real crystal structures of the samples. The data obtained have made it possible to perform structural analysis of the multilayer systems and compare their characteristics with specified technological parameters, due to which the HEMT growth technology can be corrected and improved.     

Structural and electrical properties of quantum wells with nanoscale InAs inserts in InyAl1 ? yAs/InxGa1 ? xAs heterostructures on InP substrates

A complex study of the effect ofintroduction of nanoscale InAs inserts of different thicknesses into an In_0.53Ga_0.47As quantum well on the electrical properties and structural features of In_0.50Al_0.50As/In_0.53Ga_0.47As/In_0.50Al_0.50As nanoheterostructures with bilateral δ-Si doping grown on InP substrates has been performed. The layers of nanoheterostructures with a weak lattice mismatch are found to be equally (cube-on-cube) oriented. The introduction of a nanoscale InAs insert leads to an increase in mobility. At an insert thickness of about 1.8 nm, the effect of increasing mobility is saturated due to structural deterioration. The segregation of the second (apparently, wurtzite) phase is revealed; this process, as well as the formation of other defects in the nanoheterostructure layers, is due to local strains caused by variations of the indium content in the layers.     

Stacking pattern of multi-layer InAs quantum wires embedded in In0.53Ga0.47−xAlxAs matrix layers grown lattice-matched on InP substrate

Multi-layer InAs quantum wires were grown on, and embedded in In_0.53Ga_0.47−xAl_xAs (with x=0, 0.1, 0.3 and 0.48) barrier/spacer layers lattice matched to an InP substrate. Correlated stacking of the quantum wire arrays were observed with aluminum content of 0 and 0.1. The quantum wire stacks became anti-correlated as the aluminum content was increased to 0.3 and 0.48. The origin of such stacking pattern variation was investigated by finite element calculations of the chemical potential distribution for indium on the growth front surface of the capping spacer layer. It is shown that the stacking pattern transition is determined by the combined effect of strain and surface morphology on the growth front of the spacer layers.     

Gettering Properties of Praseodymium in GaAs,In0.53Ga0.47As,and InP Grown by Liquid Phase Epitaxy

The incorporation of praseodymium (Pr) into GaAs, In_0.53Ga_0.47As, and InP during liquid-phase epitaxy were investigated by double crystal x-ray diffraction, Hall effect, low temperature photoluminescence (PL) measurements. The lattice mismatch slightly vary with Pr concentration in the growth melts. Examinations of the electrical property illustrate that the lower carriers concentrations and a higher mobilities are obtain from Pr-doped epilayers than undoped sample (In_0.53Ga_0.47As and InP). The PL spectra (15-K) show that the intensity of the impurity related peaks decreases and the near-band-to-band luminescence intensity increase. They also reveal that the impurities are gettered by Pr ions during LPE growth. Thus, for the purpose of purification, proper amount of Pr in the growth melts is suggested. No intra-4f-shell transition line is observed from the Pr-doped GaAs, In_0.53Ga_0.47As, and InP layers.     

Raman and photoluminescence analyses of the crystalline InAlAs layer grown on InP substrate

Photoluminescence and Raman measurements are used to characterize the In_xAl_1-xAs (0.48 < × <0.573)epilayers grown on InP substrate by molecular beam epitaxy. It is found that as In composition, x, deviates too much from 0.52, misfit dislocations may be introduced. These dislocations will dramatically reduce the radiative efficiency of the InAlAs epilayers. Raman spectra become broader and more asymmetry due to alloy potential fluctuations as the mismatch becomes large.     

The electrical and structural properties of InyGa1 ? yAs/InxAl1 ? xAs/InP quantum wells with different InAs content

In _x Al_{1 − x} As/In _y Ga_{1 − y} As/In _x Al_{1 − x} As/InP HEMT structures has been investigated with a change in the InAs molar fraction both in the quantum well and the buffer layer. The electrical parameters of the samples are measured at different temperatures. The structural parameters of the layers and the characteristics of the interfaces between them are determined by double-crystal X-ray diffraction. An increase in the Hall mobility and electron concentration, as well as in the structural quality of the samples, is observed alongside an increase in the InAs molar fraction in the quantum well. It is established that high electron mobility is retained at small (to 5%) mismatches between the buffer layer and substrate.     

AlGaAs/InGaP interfaces in structures prepared by MOVPE

Al_0.3Ga_0.7As/In_1−xGa_xP structures were prepared by low-pressure MOVPE. Lattice matched and strained ones with top In_1−xGa_xP layers as well as reverse ones with top Al_0,3Ga_0,7As layers were examined. The structures were studied by photoluminescence, X-ray and atomic force microscope (AFM) methods. An additional photoluminescence peak from the Al_0.3Ga_0.7As/In_1−xGa_xP interface was observed in our samples and it was attributed to a type-II band offset. A conduction band offset of 0.121 eV was measured in the Al_0.3Ga_0.7As/In_0.485Ga_0.515P lattice-matched structure and a linear dependence of the conduction band offset on In_1−xGa_xP composition, with a zero offset in the Al_0.3Ga_0.7As/In_0.315Ga_0.685P structure, was determined. The valence band discontinuity had a nearly constant value of 0.152 eV.     

Metamorphic InAs(Sb)/InGaAs/InAlAs nanoheterostructures grown on GaAs for efficient mid-IR emitters

High-efficiency semiconductor lasers and light-emitting diodes operating in the 3–5?μm mid-infrared (mid-IR) spectral range are currently of great demand for a wide variety of applications, in particular, gas sensing, noninvasive medical tests, IR spectroscopy etc. III-V compounds with a lattice constant of about 6.1?Å are traditionally used for this spectral range. The attractive idea to fabricate such emitters on GaAs substrates by using In(Ga,Al)As compounds is restricted by either the minimum operating wavelength of ～8?μm in case of pseudomorphic AlGaAs-based quantum cascade lasers or requires utilization of thick metamorphic In_xAl_1-xAs buffer layers (MBLs) playing a key role in reducing the density of threading dislocations (TDs) in an active region, which otherwise result in a strong decay of the quantum efficiency of such mid-IR emitters. In this review we present the results of careful investigations of employing the convex-graded In_xAl_1-xAs MBLs for fabrication by molecular beam epitaxy on GaAs (001) substrates of In(Ga,Al)As heterostructures with a combined type-II/type-I InSb/InAs/InGaAs quantum well (QW) for efficient mid-IR emitters (3–3.6?μm). The issues of strain relaxation, elastic stress balance, efficiency of radiative and non-radiative recombination at T?=?10–300?K are discussed in relation to molecular beam epitaxy (MBE) growth conditions and designs of the structures. A wide complex of techniques including in-situ reflection high-energy electron diffraction, atomic force microscopy (AFM), scanning and transmission electron microscopies, X-ray diffractometry, reciprocal space mapping, selective area electron diffraction, as well as photoluminescence (PL) and Fourier-transformed infrared spectroscopy was used to study in detail structural and optical properties of the metamorphic QW structures. Optimization of the growth conditions (the substrate temperature, the As₄/III ratio) and elastic strain profiles governed by variation of an inverse step in the In content profile between the MBL and the InAlAs virtual substrate results in decrease in the TD density (down to 3?×?10⁷ cm^?2), increase of the thickness of the low-TD-density near-surface MBL region to 250–300?nm, the extremely low surface roughness with the RMS value of 1.6–2.4?nm, measured by AFM, as well as rather high 3.5?μm-PL intensity at temperatures up to 300?K in such structures. The obtained results indicate that the metamorphic InSb/In(Ga,Al)As QW heterostructures of proper design, grown under the optimum MBE conditions, are very promising for fabricating the efficient mid-IR emitters on a GaAs platform.     

Study of structural properties of In<Subscript>x</Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>As/In<Subscript>y</Subscript>Al<Subscript>1−<Emphasis Type="Italic">y</Emphasis></Subscript>As heterosystems on InP substrates

The structural properties of In_xGa_1?xAs/In_yAl_1?yAs samples on InP substrates are studied as functions of growth conditions by the method of high-resolution diffractometry. The results obtained and the photoluminescence spectroscopy data are used to optimize the technology of preparation of high-quality heterostructures with sharp interfaces. The parameters of the two-dimensional electron gas of such heterostructures measured at 77 and 300 K are comparable with the best world standards in this field, so these heterostructures may be used to manufacture transistors and integral amplifiers operating at the frequency 40 GHz and even higher.     

Composition latching phenomenon and lattice mismatch effects in LPE-grown In1−xGaxAs on InP substrate

We describe the possible composition range of In_1?xGa_xAs grown directly on InP substrates by LPE, the expansion of the range by use of In_0.53Ga_0.47As as a buffer layer, and the composition latching phenomenon in which only an x = 0.445 ± 0.005 layer is grown from the melt of any solidus composition between 0.40 and 0.45. This phenomenon does not occur on the larger composition side relative to the lattice matching compostition of x = 0.47, but only on the smaller side. The effects of the growth temperature, cooling rate, and step-cooling interval on this phenomenon, and the effects of the lattice mismatch on the crystal perfection and surface morphology are also described.     

Optical properties of self-assembled InAs/InAlAs/InP quantum wires with different InAs deposited thickness

We report on the photoluminescence (PL) properties of InAs/InAlAs/InP quantum wires (QWRs) with various InAs deposited thickness. The PL linewidth of the QWRs decreases with increasing InAs deposited thickness due to the different thicknesses of the QWRs and defects in the samples. The defects and lateral composition modulation of the InAlAs layers play an important role in the temperature-dependent PL properties of the samples.     

Facilitating growth of InAs–InP core–shell nanowires through the introduction of Al

InAs nanowires were grown on GaAs substrates by the Au-assisted vapour–liquid–solid (VLS) method in a gas source molecular beam epitaxy (GSMBE) system. Passivation of the InAs nanowires using InP shells proved difficult due to the tendency for the formation of axial rather than core–shell structures. To circumvent this issue, Al_xIn_1?xAs or Al_xIn_1?xP shells with nominal Al composition fraction of x=0.20, 0.36, or 0.53 were grown by direct vapour–solid deposition on the sidewalls of the InAs nanowires. Characterisation by transmission electron microscopy revealed that the addition of Al in the shell resulted in a remarkable transition from the VLS to the vapour–solid growth mode with uniform shell thickness along the nanowire length. Possible mechanisms for this transition include reduced adatom diffusion, a phase change of the Au seed particle, and surfactant effects. The InAs–AlInP core-shell nanowires exhibited misfit dislocations, while the InAs–AlInAs nanowires with lower strain appeared to be free of dislocations.     

Low-Temperature epitaxial growth of InGaAs films on InP(100) and InP(411)<Emphasis Type="Italic">A</Emphasis> substrates

The structural and electrical characteristics of In_0.53Ga_0.47As epitaxial films, grown in the low-temperature mode on InP substrates with (100) and (411)A crystallographic orientations at flow ratios of As4 molecules and In and Ga atoms of γ = 29 and 90, have been comprehensively studied. The use of InP(411)A substrates is shown to increase the probability of forming two-dimensional defects (twins, stacking faults, dislocations, and grain boundaries), thus reducing the mobility of free electrons, and As_Ga point defects, which act as donors and increase the free-electron concentration. An increase in γ from 29 to 90 leads to transformation of single-crystal InGaAs films grown on (100) and (411)A substrates into polycrystalline ones.     

Shorter wavelength emission with InAs quantum dots growth directly on large bandgap quaternary (In0.68Ga0.32As0.7P0.3) barriers for high current injection efficiency

We present the growth of stacked layers of InAs quantum dots directly on high bandgap In_0.68Ga_0.32As_0.7P_0.3 (λ_g=1420 nm) barriers. The quaternary material is lattice matched to InP forming a double hetero-structure. Indium flux, number of InAs stacked layers and InGaAsP inner separation layer thickness were investigated. Photoluminescence (PL) and atomic force microscopy (AFM) analysis indicate the occurrence of gallium diffusion and the arsenic/phosphorus (As/P) exchange with the InGaAsP barriers. As a result, shorter wavelength emission is observed, making the structures suitable for telecom applications.     

InGaAs/InAlAs in-plane superlattices grown on slightly misoriented (110) InP substrates by molecular beam epitaxy

InGaAs/InAlAs in-plane superlattices (IPSLs) composed of InAs/GaAs and InAs/AlAs monolayer superlattices were grown using molecular beam epitaxy. The substrates were misoriented (110) InP tilting 3° toward the [00 ] direction. We grew half monolayers of AlAs and GaAs and single monolayers of InAs alternately, keeping regular arrays of single monolayer steps. The structures were evaluated by transmission electron microscopy (TEM). In a transmission electron diffraction pattern from the ( 10) cross-section, we observed two types of superstructure spot pairs double-positioned in the [001] direction, indicating the formation of the intended IPSL structures. In a cross-sectional TEM dark-field image, we observed the InGaAs/InAlAs superlattice structures formed almost in the [001] direction. The mean period of the superlattices was approximately 4 nm, which was comparable to the terrace width expected from the substrate tilt angle. However, IPSL structures were not completely formed, i.e., the lateral interfaces meandered along the growth direction, and partial disorderings were often observed. The photoluminescence spectrum from the IPSL had a peak corresponding to the InGaAs (2 nm thick)/InAlAs (2 nm thick) superlattice in addition to a peak corresponding to the In_0.5Al_0.25Ga_0.25As alloy.     

Electrophysical characteristics and structural parameters of metamorphic HEMT nanoheterostructures In0.7Al0.3As/In0.7Ga0.3As/In0.7Al0.3As containing superlattices with different numbers of periods in the metamorphic buffer

The results of studying the electrophysical characteristics and structural parameters of metamorphic In_0.7Al_0.3As/In_0.7Ga_0.3As/In_0.7Al_0.3As HEMT nanoheterostructures epitaxially grown on GaAs (100) substrates have been presented. A linear metamorphic buffer with inserted unbalanced superlattices characterized by different numbers of periods is used. Transmission electron microscopy has shown that an increase in the number of superlattice periods from 5 to 30 promotes the improvement of the crystal structure. In this case, the electrophysical parameters of metamorphic HEMT nanoheterostructures are also significantly improved.     

Electrical and structural characteristics of metamorphic In0.38Al0.62As/In0.37Ga0.63As/In0.38Al0.62As HEMT nanoheterostructures

The influence of the metamorphic buffer design and epitaxial growth conditions on the electrical and structural characteristics of metamorphic In_0.38Al_0.62As/In_0.37Ga_0.63As/In_0.38Al_0.62As high electron mobility transistor (MHEMT) nanoheterostructures has been investigated. The samples were grown on GaAs(100) substrates by molecular beam epitaxy. The active regions of the nanoheterostructures are identical, while the metamorphic buffer In _x Al_{1 ? x} As is formed with a linear or stepwise (by Δ _x = 0.05) increase in the indium content over depth. It is found that MHEMT nanoheterostructures with a step metamorphic buffer have fewer defects and possess higher values of two-dimensional electron gas mobility at T = 77 K. The structures of the active region and metamorphic buffer have been thoroughly studied by transmission electron microscopy. It is shown that the relaxation of metamorphic buffer in the heterostructures under consideration is accompanied by the formation of structural defects of the following types: dislocations, microtwins, stacking faults, and wurtzite phase inclusions several nanometers in size.     

Structural and electrophysical analysis of MHEMT In0.70Al0.30As/In0.75Ga0.25As nanoheterostructures with different strain distributions in metamorphic buffer

A complex structural and electrophysical analysis of MHEMT In_0.70Al_0.30As/In_0.75Ga_0.25As nanoheterostructures grown on (100)GaAs substrates using two radically new designs of metamorphic buffer (providing different internal-strain distributions) has been performed. The lattice parameters of the constant-composition layers entering the metamorphic buffer have been determined by X-ray diffraction using symmetric and asymmetric (400) and (422) reflections. It is shown that, having chosen a proper design of metamorphic buffer in nanoheterostructures on GaAs substrates, it is possible to obtain electron mobility and concentration comparable with those for nanoheterostructures on InP substrates. The compositions of smoothing layers, determined from the peaks on rocking curves, are found agree well with the process values.     

Organometallic vapor phase epitaxy growth of upright metamorphic multijunction solar cells

We demonstrate an integrated metamorphic AlGaInP/AlGaInAs/GaInAs/Ge 4 J solar cell on Ge substrate using organometallic vapor phase epitaxy (OMVPE). A step graded GaInAs buffer was grown right after the Ge subcell was formed to change the lattice constant from that of Ge to that of Ga_0.8In_0.2As lattice constant followed by a 1.14 eV Ga_0.8In_0.2As subcell, a 1.5 eV (AlGa)_0.8In_0.2As subcell, and a 1.85 eV Al_xGa_0.32?xIn_0.68P subcell. Transmission electron microscope (TEM) study shows the threading dislocation density (TDD) is about 6×10⁶ cm^?2. The X-ray diffraction reciprocal space map (RSM) shows that the structure is 100% relaxed. Bandgap dependent (Al_xGa_1?x)_0.32In_0.68P subcell performance is systematically investigated. As the Al_xGa_0.32?xIn_0.68P cell bandgap goes up to 1.9 eV, the external quantum efficiency (EQE) goes down significantly. Theoretical simulation shows that the decrease of diffusion length causes the lower EQE, which indicates the material quality degrades with the increasing Al content. Integrated 4 J solar cells are fabricated and characterized with spectral response and tested under the AM1.5D terrestrial spectrum at both 1 sun and 2000 suns.     

InAlAs/InGaAs/InP sub-micron HEMTs grown by CBE

The InAlAs/InGaAs/InP high electron mobility transistor (HEMT) lattice matched to InP offers excellent high frequency, low noise operation for MMICs and low-noise amplifiers. The InP channel in the InP/InAlAs HEMT offers the advantages of improved high field velocity and higher breakdown voltages (the potential for higher power applications) over InGaAs channel HEMTs. InAlAs has been grown for the first time by CBE using TMAA producing InGaAs/InAlAs and InP/InAlAs HEMTs. Sub-micron InGaAs/InAlAs HEMTs with planar Si doping have been fabricated with f_t values of 150 GHz and f_max values of 160 GHz. This device showed excellent pinch-off charateristics, with a maximum transconductance of 890 mS/mm. The planar doped InGaAs channel HEMT had a higher f_t than a similar uniformly doped device. However, the non-optimized structure of the planar doped device resulted in a large output conductance of 120 mS/mm, limiting f_max for that device. A sub-micron InP channel device was grown with a quantum well channel and double-sided planar Si doping. A sheet charge density of 4.4×10¹² cm^-2 and associated room temperature mobility of 2800 cm²/V·s were achieved; however, the saturation current was low. The most likely causes for this are diffusion of the planar doping beneath the channel and the poor quality of the InP on InAlAs interface at the bottom of the quantum well channel.