QWIP focal plane arrays on InP substrates for single and dual band thermal imagers

Alternative material systems on InP substrate provide certain advantages for mid-wavelength infrared (MWIR), long-wavelength infrared (LWIR) and dual band MWIR/LWIR quantum well infrared photodetector (QWIP) focal plane arrays (FPAs). While InP/InGaAs and InP/InGaAsP LWIR QWIPs provide much higher responsivity when compared to the AlGaAs/GaAs QWIPs, AlInAs/InGaAs system facilitates completely lattice matched single band MWIR and dual band MWIR/LWIR FPAs.We present an extensive review of the studies on InP based single and dual band QWIPs. While reviewing the characteristics of InP/InGaAs and InP/InGaAsP LWIR QWIPs at large format FPA level, we experimentally demonstrate that the cut-off wavelength of AlInAs/InGaAs QWIPs can be tuned in a sufficiently large range in the MWIR atmospheric window by only changing the quantum well (QW) width at the lattice matched composition. The cut-off wavelength can be shifted up to ～5.0 μm with a QW width of 22 Å in which case very broad spectral response (Δλ/λ_p = ～30%) and a reasonably high peak detectivity are achievable leading to a noise equivalent temperature difference as low as 14 mK (f/2) with 25 μm pitch in a 640 × 512 FPA. We also present the characteristics of InP based two-stack QWIPs with wavelengths properly tuned in the MWIR and LWIR bands for dual color detection. The results clearly demonstrate that InP based material systems display high potential for dual band MWIR/LWIR QWIP FPAs needed by third generation thermal imagers.     

Competitive technologies of third generation infrared photon detectors

Hitherto, two families of multielement infrared (IR) detectors are used for principal military and civilian infrared applications; one is used for scanning systems (first generation) and the other is used for staring systems (second generation). Third generation systems are being developed nowadays. In the common understanding, third generation IR systems provide enhanced capabilities like larger number of pixels, higher frame rates, better thermal resolution as well as multicolour functionality and other on-chip functions. In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well IR photoconductors (QWIPs) are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. However, the metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an attractive to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25 μm.     

QWIP detectors and thermal imagers

Standard GaAs/AlGaAs QWIPs (Quantum Well Infrared Photodetector) are now well established for long wave infrared (LWIR) detection. The main advantage of this technology is the duality with the technology of commercial GaAs devices. The realization of large FPAs (up to 640×480) drawing on the standard III–V technological process has already been demonstrated. The second advantage widely claimed for QWIPs is the so-called band-gap engineering, allowing the custom design of the quantum structure to fulfill the requirements of specific applications such as multispectral detection. QWIP technology has been growing up over the last ten years and now reaches an undeniable level of maturity. As with all quantum detectors, the thermal current, particularly in the LWIR range, limits the operating temperature of QWIPs. It is very crucial to achieve an operating temperature as high as possible and at least above 77 K in order to reduce volume and power consumption and to improve the reliability of the detection module. This thermal current offset has three detrimental effects: noise increase, storage capacitor saturation and high sensitivity of FPAs to fluctuations in operating temperature. For LWIR FPAs, large cryocoolers are required, which means volume and power consumption unsuitable for handheld systems. The understanding of detection mechanisms has led us to design and realize high performance ‘standard’ QWIPs working near 77 K. Furthermore, a new in situ skimmed architecture accommodating this offset has already been demonstrated. In this paper we summarize the contribution of THALES Research & Technology to this progress. We present the current status of QWIPs in France, including the latest performances achieved with both standard and skimmed architectures. We illustrate the potential of our QWIPs through features of Thales Optronique's products for third thermal imager generation. To cite this article: E. Costard et al., C. R. Physique 4 (2003).     

Material considerations for third generation infrared photon detectors

In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well photoconductors are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. The metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an alternative to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25 μm. In this context the material properties of type II superlattices are considered more in detail.     

Detector and readout performance goals for quantum well and strained layer superlattice focal plane arrays imaging under tactical and strategic backgrounds

Advancements in III–V semiconductor based, Quantum-well infrared photodetector (QWIP) and Type-II Strained-Layer Superlattice detector (T2SLS) technologies have yielded highly uniform, large-format long-wavelength infrared (LWIR) QWIP FPAs and high quantum efficiency (QE), small format, LWIR T2SLS FPAs. In this article, we have analyzed the QWIP and T2SLS detector level performance requirements and readout integrated circuit (ROIC) noise levels for several staring array long-wavelength infrared (LWIR) imaging applications at various background levels. As a result of lower absorption QE and less than unity photoconductive gain, QWIP FPAs are appropriate for high background tactical applications. However, if the application restricts the integration time, QWIP FPA performance may be limited by the read noise of the ROIC. Rapid progress in T2SLS detector material has already demonstrated LWIR detectors with sufficient performance for tactical applications and potential for strategic applications. However, significant research is needed to suppress surface leakage currents in order to reproduce performances at pixel levels of T2SLS FPAs.     

Demonstration of 640 × 512 pixels long-wavelength infrared (LWIR) quantum dot infrared photodetector (QDIP) imaging focal plane array

We have exploited the artificial atom-like properties of epitaxially grown self-assembled quantum dots (QDs) for the development of high operating temperature long wavelength infrared (LWIR) focal plane arrays (FPAs). QD infrared photodetectors (QDIPs) are expected to outperform quantum well infrared detectors (QWIPs) and are expected to offer significant advantages over II–VI material based FPAs. We have used molecular beam epitaxy (MBE) technology to grow multi-layer LWIR dot-in-a-well (DWELL) structures based on the InAs/InGaAs/GaAs material system. This hybrid quantum dot/quantum well device offers additional control in wavelength tuning via control of dot-size and/or quantum well sizes. DWELL QDIPs were also experimentally shown to absorb both 45° and normally incident light. Thus we have employed a reflection grating structure to further enhance the quantum efficiency. The most recent devices exhibit peak responsivity out to 8.1 μm. Peak detectivity of the 8.1 μm devices has reached 1 × 10¹⁰ Jones at 77 K. Furthermore, we have fabricated the first long-wavelength 640 × 512 pixels QDIP imaging FPA. This QDIP FPA has produced excellent infrared imagery with noise equivalent temperature difference of 40 mK at 60 K operating temperature.     

Large format voltage tunable dual-band QWIP FPAs

Third generation thermal imagers with dual/multi-band operation capability are the prominent focus of the current research in the field of infrared detection. Dual band quantum-well infrared photodetector (QWIP) focal plane arrays (FPAs) based on various detection and fabrication approaches have been reported. One of these approaches is the three-contact design allowing simultaneous integration of the signals in both bands. However, this approach requires three In bumps on each pixel leading to a complicated fabrication process and lower fill factor.If the spectral response of a two-stack QWIP structure can effectively be shifted between two spectral bands with the applied bias, dual band sensors can be implemented with the conventional FPA fabrication process requiring only one In bump on each pixel making it possible to fabricate large format dual band FPAs at the cost and yield of single band detectors. While some disadvantages of this technique have been discussed in the literature, the detailed assessment of this approach has not been performed at the FPA level yet. We report the characteristics of a large format (640 × 512) voltage tunable dual-band QWIP FPA constructed through series connection of MWIR AlGaAs–InGaAs and LWIR AlGaAs–GaAs multi-quantum well stacks, and provide a detailed assessment of the potential of this approach at both pixel and FPA levels. The dual band FPA having MWIR and LWIR cut-off wavelengths of 5.1 and 8.9 μm provided noise equivalent temperature differences as low as 14 and 31 mK (f/1.5) with switching voltages within the limits applicable by commercial read-out integrated circuits. The results demonstrate the promise of the approach for achieving large format low cost dual band FPAs.     

Advantages of QWIP technology in infrared thermal cameras

Standard GaAs/AlGaAs quantum well infrared photodetectors(QWIP)have been seriously considered as atechnological choice for the 3~(rd) generation of thermal imagers in the long wave infrared band(LWIR)for some time.Alternative technology like MCT(HgCdTe)was the technology choice of the 2~(nd) generation because of its high quantum efficiency.In the paper,measurements on the QWIP technology will be presented and a comparison with alternative technology will be done.     

1024 × 1024 Format pixel co-located simultaneously readable dual-band QWIP focal plane

This paper reports the first demonstration of the megapixel-simultaneously-readable and pixel-co-registered dual-band quantum well infrared photodetector (QWIP) focal plane array (FPA). The dual-band QWIP device was developed by stacking two multi-quantum-well stacks tuned to absorb two different infrared wavelengths. The full width at half maximum (FWHM) of the mid-wave infrared (MWIR) band extends from 4.4 to 5.1 μm and the FWHM of a long-wave infrared (LWIR) band extends from 7.8 to 8.8 μm. Dual-band QWIP detector arrays were hybridized with custom fabricated direct injection read out integrated circuits (ROICs) using the indium bump hybridization technique. The initial dual-band megapixel QWIP FPAs were cooled to 70 K operating temperature. The preliminary data taken from the first megapixel QWIP FPA has shown system NEΔT of 27 and 40 mK for MWIR and LWIR bands, respectively.     

Towards dualband megapixel QWIP focal plane arrays

Mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) 1024 × 1024 pixel quantum well infrared photodetector (QWIP) focal planes have been demonstrated with excellent imaging performance. The MWIR QWIP detector array has demonstrated a noise equivalent differential temperature (NEΔT) of 17 mK at a 95 K operating temperature with f/2.5 optics at 300 K background and the LWIR detector array has demonstrated a NEΔT of 13 mK at a 70 K operating temperature with the same optical and background conditions as the MWIR detector array after the subtraction of system noise. Both MWIR and LWIR focal planes have shown background limited performance (BLIP) at 90 K and 70 K operating temperatures respectively, with similar optical and background conditions. In addition, we have demonstrated MWIR and LWIR pixel co-registered simultaneously readable dualband QWIP focal plane arrays. In this paper, we will discuss the performance in terms of quantum efficiency, NEΔT, uniformity, operability, and modulation transfer functions of the 1024 × 1024 pixel arrays and the progress of dualband QWIP focal plane array development work.     

Characterization of LWIR diodes on InAs/GaSb Type-II superlattice material

Long wavelength infrared (LWIR) focal plane arrays (FPAs) built on Type-II strained layer InAs/GaSb superlattice materials are emerging as an alternative to LWIR HgCdTe. We have made progress in the development of this technology in a collaborative effort between Raytheon Vision Systems and Jet Propulsion Laboratory, resulting in successful devices with LWIR cutoff wavelengths. We report here two investigations related to wafer processing and superlattice material characteristics. The critical interface between the superlattice and the silicon dioxide passivation was examined at the atomic scale by high resolution transmission electron microscopy (HRTEM), showing a conformal coating on an InAs/GaSb mesa sidewall, which undulates with the superlattice periodicity due to differential etching. Electron energy loss spectroscopy (EELS) showed that oxides of the superlattice elements were present but minimal, and some occasional arsenic precipitates were observed at the passivation interface. Our previous analysis of the current–voltage curves was extended further to reveal the minority carrier lifetimes responsible for producing the generation–recombination (GR) and the diffusion dark currents. Lifetimes at 78 K were found to be 6 and 20 ns in the GR and diffusion processes, respectively. Lifetimes from both mechanisms track together with temperature. A HgCdTe diode was analyzed in the same manner for comparison.     

QWIP Status at THALES

Since 2002, the THALES Group has been manufacturing sensitive arrays using QWIP technology based on GaAs and related III–V compounds, at the Alcatel-Thales-III-V Lab (formerly part of THALES Research and Technology Laboratory).In the past researchers claimed many advantages of QWIPs. Uniformity was one of these and has been the key parameter for the production to start. Another widely claimed advantage for QWIPs was the so-called band-gap engineering and versatility of the III–V processing allowing the custom design of quantum structures to fulfil the requirements of specific applications such as very long wavelength (VLWIR) or multi-spectral detection. In this presentation, we give the status of our LWIR QWIP production line, and also the current status of QWIPs for MWIR (<5 μm) and VLWIR (>15 μm) arrays.As the QWIP technology cannot cover the full electromagnetic spectrum, we develop other semiconductor compounds for SWIR and UV applications. We present here the status of our 320 × 256 SWIR module with InGaAs photodiodes.     

Infrared radiation transmission through GaAs/AlGaAs quantum well infrared photodetector

This paper discusses experimental and theoretical studies of the efficiency of optical coupling in GaAs/AlGaAs multiple-quantum-well-infrared photodetectors (QWIPs) via optical diffraction grating. Optical responsivity has been studied to compare the effectiveness of different grating structures fabricated by chemical wet and reactive ion etching (RIE) methods. By the unique measurement of infrared radiation transmission spectrum of the QWIP system, we have clearly demonstrated the optical interference effect in the GaAs/ AlGaAs active MQW layer and the potential utilization of the interference effect in designing and optimizing QWIP systems has been discussed. An optical grating processed by the RIE technique is advantageous due to its accurate control over the feature size of optical apertures.     

Demonstration of large format mid-wavelength infrared focal plane arrays based on superlattice and BIRD detector structures

We have demonstrated the use of bulk antimonide based materials and type-II antimonide based superlattices in the development of large area mid-wavelength infrared (MWIR) focal plane arrays (FPAs). Barrier infrared photodetectors (BIRDs) and superlattice-based infrared photodetectors are expected to outperform traditional III–V MWIR and LWIR imaging technologies and are expected to offer significant advantages over II–VI material based FPAs. We have used molecular beam epitaxy (MBE) technology to grow InAs/GaSb superlattice pin photodiodes and bulk InAsSb structures on GaSb substrates. The coupled quantum well superlattice device offers additional control in wavelength tuning via quantum well sizes and interface composition, while the BIRD structure allows for device fabrication without additional passivation. As a demonstration of the large area imaging capabilities of this technology, we have fabricated mid-wavelength 1024 × 1024 pixels superlattice imaging FPAs and 640 × 512 MWIR arrays based on the BIRD concept. These initial FPA have produced excellent infrared imagery.     

Development of a 1K × 1K, 8–12 μm QWIP array

In the on-going evolution of GaAs quantum well infrared photodetectors (QWIPs) we have developed a 1,024 × 1,024 (1K × 1K), 8–12  μm infrared focal plane array (FPA). This 1 megapixel detector array is a hybrid using an L3/Cincinnati Electronics silicon readout integrated circuit (ROIC) bump bonded to a GaAs QWIP array fabricated jointly by engineers at the Goddard Space Flight Center (GSFC) and the Army Research Laboratory (ARL). We have integrated the 1K × 1K array into an SE-IR based imaging camera system and performed tests over the 50–80 K temperature range achieving BLIP performance at an operating temperature of 57 K. The GaAs array is relatively easy to fabricate once the superlattice structure of the quantum wells has been defined and grown. The overall arrays costs are currently dominated by the costs associated with the silicon readout since the GaAs array fabrication is based on high yield, well-established GaAs processing capabilities. One of the advantages of GaAs QWIP technology is the ability to fabricate arrays in a fashion similar to and compatible with silicon IC technology. The designer’s ability to easily select the spectral response of the material from 3 μm to beyond 15 μm is the result of the success of band-gap engineering and the Army Research Lab is a leader in this area. In this paper we will present the first results of our 1K × 1K QWIP array development including fabrication methodology, test data and imaging capabilities.     

Trade-offs and difficulties of the vertical photoconductor: a novel device structure suitable for HgCdTe two-dimensional infrared focal plane arrays

Recently Siliquini and Faraone [J.F. Siliquini, L. Faraone, Infrared Phys. Technol. 38 (1997) 205] have proposed vertical photoconductive device (PC) based two-dimensional long wavelength infrared region focal plane arrays (LWIR FPAs). In this note, we examine some trade-offs and difficulties of this proposed structure.     

QWIP or other alternative for third generation infrared systems

Choosing the right detector technology for third generation thermal imaging systems is directly derived from the requirements of these new generation infrared imaging systems.

It is now evident that third generation thermal imager will still need the higher resolution capabilities as well as capabilities in multispectral detection and polarization sensitivity. Four technologies candidates are analyzed; the field-proved HgCdTe (MCT), uncooled microbolometer technology, antimonide based materials and quantum well infrared photodetectors (QWIP). Taking into account the risks, maturity and technologies barrier of each technology, we claim that for non-strategic applications (not low background conditions), QWIP technology is the most favorite. The ternary and superlattice antimonide based materials group seems to be theoretically the best alternative, but are not recommended due to its immaturity and the high risk involved in this technology (passivation, doping control, etc.). We anticipate large penetration of the uncooled detectors to the low-end and medium-end market. The HgCdTe will still be in progress due to the inertia of the large funding and the strategic importance of this detectors technology.     

Photoluminescence and dark current of p-doped InGaAs/AlxGa1−xAs strained multiple quantum wells

We report the temperature dependence of the photoluminescence spectra and current-voltage (I_d-V) characteristics of p-doped In_0.15Ga_0.85As/AlGaAs quantum well infrared photodetectors (QWIPs) with different barrier heights grown by molecular beam epitaxy (MBE). The dark current at low temperatures is found to be about three orders of magnitude lower than that reported for the n- and p-doped QWIPs made of other material systems. The PL spectra show two emission peaks which correspond to an intersubband absorption and are tunable by changing the mole fraction of Al. The low energy emission peak of the In_0.15Ga_0.85As/Al_0.45Ga_0.55As QWIP is found to be much lower in intensity than that of the high one, due possibly to excess Al which may result in defects or imperfection at/or near well-barrier interfaces.     

Progress in Symmetric and Asymmetric Superlattice Quantum Well Infrared Photodetectors

Herein, two challenges are addressed, which quantum well infrared photodetectors (QWIPs), based on III‐V semiconductors, face, namely: photodetection within the so‐called “forbidden gap”, between 1.7 and 2.5 microns, and room temperature operation using thermal sources. First, to reach this forbidden wavelength range, a QWIP which consists of a superlattice structure with a central quantum well (QW) with a different thickness is presented. The different QW in the symmetric structure, which plays the role of a defect in the otherwise periodic structure, gives rise to localized states in the continuum. The proposed InGaAs/InAlAs superlattice QWIP detects radiation around 2.1 microns, beyond the materials bandoffset. Additionally, the wavefunction parity anomaly is explored to increase the oscillator strength of the optical transitions involving higher order states. Second, with the purpose of achieving room temperature operation, an asymmetric InGaAs/InAlAs superlattice, in which the QW with a different thickness is not in the center, is used to detect infrared radiation around 4 microns at 300 K. This structure operates in the photovoltaic mode because it gives rise to states in the continuum which are localized in one direction and extended in the other, leading to a preferential direction for current flow.