Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Synthesis and properties of phosphorus-containing epoxy resins by novel method

Novel phosphorus-containing epoxy resins (1–3% phosphorus content) were synthesized by the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO) and the diglycidyl ether of bisphenol A and then cured with 4,4′-diaminodiphenyl sulfone or phenol novolac. Differential scanning calorimetry, high performance liquid chromatography, and epoxide equivalent weight titration were used to trace the reaction between the DOPO and the epoxy. The thermal stability and flame retardancy were checked by thermal gravimetric analysis, the limiting oxygen index, and the UL-94 vertical test. The glass transitions were measured by dynamic mechanical analysis. The relation between these properties (thermal stability, flame retardancy, and glass transition) and the DOPO contents (phosphorus content) were discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3903–3909, 1999     

Epoxy resins from novel monomers with a bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐) substituent

A new diepoxide and a new diamine, both bearing bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐)‐substituted methylene linkages, were prepared through the reaction of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide with benzophenone derivatives via a simple addition reaction followed by a dehydration reaction. These two compounds were used as monomers for preparing cured epoxy resins with high phosphorus contents. The resultant epoxy resins showed high glass‐transition temperatures (between 131 and 196 °C). All of the cured epoxy resins exhibited high thermal stability, with 5% weight loss temperatures over 316 °C, and excellent flame retardancy, with limited oxygen index values of 37–50. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 359–368, 2002     

Preparation and properties of high performance epoxy–silsesquioxane hybrid resins prepared using a maleimide–alkoxysilane compound as a modifier

An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N‐(4‐hydroxyphenyl)maleimide and 3‐glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5–10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI = 30) to bisphenol‐A‐based epoxy resins. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5787–5798, 2005     

Flame‐retardant epoxy resins: An approach from organic–inorganic hybrid nanocomposites

Phosphorus‐containing epoxy‐based epoxy–silica hybrid materials with a nanostructure were obtained from bis(3‐glycidyloxy)phenylphosphine oxide, diaminodiphenylmethane, and tetraethoxysilane in the presence of the catalyst p‐toluenesulfonic acid via an in situ sol–gel process. The silica formed on a nanometer scale in the epoxy resin was characterized with Fourier transform infrared, NMR, and scanning electron microscopy. The glass‐transition temperatures of the hybrid epoxy resins increased with the silica content. The nanometer‐scale silica showed an enhancement effect of improving the flame‐retardant properties of the epoxy resins. The phosphorus–silica synergistic effect on the limited oxygen index (LOI) enhancement was also observed with a high LOI value of 44.5. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 986–996, 2001     

Flame‐retardant epoxy resins with high glass‐transition temperatures from a novel trifunctional curing agent: Dopotriol

A novel phosphorus‐containing trifunctional novolac (dopotriol) was synthesized through the addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and rosolic acid. The structure of dopotriol was confirmed with NMR spectroscopy and elemental analyses. The dopotriol was blended with phenol novolac in the ratios of 10/0, 8/2, 6/4, 4/6, 2/8, and 0/10 to serve as a curing agent for diglycidyl ether of bisphenol A. Thermal properties, such as the glass‐transition temperature, thermal decomposition temperature, and flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The activity and activation energy of curing were studied with the methods of Kissinger and Ozawa by dynamic differential scanning calorimetry scans. The glass‐transition temperatures of the cured epoxy resins were 138–159 °C, increasing with the phosphorus content. This is rarely seen in the literature after the addition of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.87%. Similar dielectric properties and moisture absorption were observed for these phosphorus‐containing epoxy resins, and this implied that the addition of phosphorus to epoxy did not affect the dielectric properties and moisture absorption. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2862–2873, 2005     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

A kinked unit‐containing thermotropic liquid crystalline copolyester with low glass transition temperature and broad phase transition temperature

A novel phosphorus‐containing thermotropic liquid crystalline copolyester with kinked unit named as poly(hydroxybenzate‐co‐DOPO‐benzenediol dihydrodipheyl ether terephthalate) (PHDDT) was synthesized successfully by melting transesterification from terephthalic acid (TPA), p‐hydroxybenzoic acid (p‐ABH), 2‐(6‐oxid‐6H‐dibenz(c, e) (1,2) oxaphosphorin 6‐yl)1,4‐benzenediol (DOPO‐HQ), and 4,4′‐dihydroxydiphenyl ether (DOP). The chemical structure, the mesophase behavior, and the thermal properties of the copolyesters were characterized by Fourier transform infrared spectroscopy (FTIR), nuclear magnetic resonance spectroscopy (¹H, ¹³C, and ³¹P NMR), wide‐angle X‐ray diffraction, polarizing light microscopy (PLM), differential scanning calorimetry, thermogravimetric analysis, and dynamic mechanical analysis. Results suggested that PHDDTs exhibited the typical nematic mesophase that occurred at low temperatures and maintained in a broad temperature range from 230 °C to higher than 400 °C, and had low glass transition temperature ranging from 154.5 to 166.9 °C. The novel phosphorus‐containing thermotropic liquid crystalline copolyester will have a potential application in preparing various in situ reinforced polymer materials with excellent mechanical properties and flame retardancy. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 4703–4709, 2009     

Thermal properties and fracture toughness of epoxy resins cured by phosphonium and pyrazinium salts as latent cationic initiators

In this work, the latent thermal cationic initiators triphenyl benzyl phosphonium hexafluoroantimonate (TBPH) and benzyl‐2‐methylpyrazinium hexafluoroantimonate (BMPH) were newly synthesized and characterized with IR, ¹H NMR, and P NMR spectroscopy. The thermal and mechanical properties of difunctional epoxy [diglycidyl ether of bisphenol A (DGEBA)] resins cured by 1 phr of either TBPH or BMPH were investigated. The DGEBA/TBPH system showed a higher curing temperature and a higher critical stress intensity factor than the epoxy/BMPH system. This could be interpreted in terms of the slow thermal diffusion rate and bulk structure of the four phenyl groups in TBPH. However, the decomposition activation energy derived from the Coats–Redfern method was lower for epoxy/TBPH. This result was probably due to the fact that a broken short‐chain structure was developed by the steric hindrance of TBPH in the difunctional epoxy resin. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2393–2403, 2003     

Novel approach to the chemical modification of poly(vinyl alcohol): Phosphorylation

The chemical modification of poly(vinyl alcohol) (PVA) was performed through oxidation followed by nucleophilic addition. PVA was oxidized by KMnO₄ to form vinyl ketone units along the polymer backbone. The chemical modification of PVA was then conducted through the reaction of the carbonyl group of the vinyl ketone unit with 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) as a nucleophile. Through this approach, the phosphorous DOPO group was attached onto the carbon atom of the polymer main chain rather than onto the pendent hydroxyl groups of PVA. The formed DOPO‐containing PVA showed improved thermal stability, organosolubility, and flame retardance. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1107–1113, 2003     

Enhanced thermal properties and flame retardancy of unsaturated polyester‐based hybrid materials containing phosphorus and silicon

A phosphorus and silicon containing liquid monomer (9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide–vinyltrimethoxysilane (DOPO–VTS)) was synthesized by the reaction between DOPO and VTS. DOPO–VTS and methacryloxypropyltrimethoxylsilane were introduced into unsaturated polyester resin to prepare flame retardant UPR/SiO₂ (FR‐UPR/SiO₂) hybrid materials by sol–gel method and curing process. DOPO–VTS contributes excellent flame retardancy to UPR matrix, which was confirmed by the limiting oxygen index and microscale combustion calorimeter results. The thermogravimetric analysis (TGA) results indicate that the FR‐UPR/SiO₂ hybrid materials possess higher thermal stability and residual char yields than those of pure UPR at high temperature region. The thermal degradation of materials was investigated by TGA/infrared spectrometry (TG‐IR) and real‐time infrared spectrometry (RT‐IR), providing insight into the thermal degradation mechanism. Moreover, scanning electron microscopy (SEM) and X‐ray photoelectron spectroscopy (XPS) were used to explore the morphologies and chemical components of the residual char. Copyright © 2013 John Wiley & Sons, Ltd.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

Thermal properties and flame retardancy of novel epoxy based on phosphorus‐modified Schiff‐base

Through addition reaction of Schiff‐base terephthalylidene‐bis‐(p‐aminophenol) ( DP‐1 ) and diethyl phosphite (DEP), a novel phosphorus‐modified epoxy, 4,4'‐diglycidyl‐(terephthalylidene‐bis‐(p‐aminophenol))diphosphonate ether ( EP‐2 ), was obtained. An modification reaction between EP‐2 and DP‐1 resulted in an epoxy compound, EP‐3 , possessing both phosphonate groups and C?N imine groups. The structure of EP‐2 was characterized by Fourier transform infrared (FTIR), elemental analysis (EA), ¹H, ¹³C, and ³¹P NMR analyses. The thermal properties of phosphorus‐modified epoxies cured with 4,4'‐diaminodiphenylmethane (MDA) and 4,4'‐diaminodiphenyl ether (DDE) were studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The activation energies of dynamic thermal degradation (E_d) were calculated using Kissinger and Ozawa's methods. The thermal degradation mechanism was characterized using thermogravimetric analysis/infrared spectrometry (TG‐IR). In addition, the flame retardancy of phosphorus‐modified epoxy thermosets was evaluated using limiting oxygen index (LOI) and UL‐94 vertical test methods. Via an ingenious design, phosphonate groups were successfully introduced into the backbone of the epoxies; the flame retardancy of phosphorus‐modified epoxy thermosets was distinctly improved. Due to incorporation of C?N imine group, the phosphorus‐modified epoxy thermosets exhibited high thermal stabilities; the values of glass‐transition temperatures (T_gs) were about 201–210°C, the values of E_d were about 220–490 kJ/mol and char yields at 700°C were 49–53% in nitrogen and 45–50% in air. These results showed an improvement in the thermal properties of phosphorus‐modified epoxy by the incorporation of C?N imine groups. Copyright © 2010 John Wiley & Sons, Ltd.     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Mechanistic study of ring‐opening copolymerization of ɛ‐caprolactam with epoxide: Development of novel thermosetting epoxy resin system

We investigated the mechanism of the ring‐opening copolymerization of ?‐caprolactam (?‐CL) with glycidyl phenyl ether (GPE) to afford poly(?‐CL‐co‐GPE) as a model reaction of the thermal curing of certain epoxy resins with ?‐CL. The reaction of ?‐CL and GPE proceeded efficiently in the presence of 1,8‐diazabicyclo[5.4.0]undec‐7‐ene (DBU) at 170^°C for 2 h. The monomer reactivities r₁ of ?‐CL and r₂ of GPE calculated according to the Fineman‐Ross method and the Kelen‐Tüdös method were 0.58 and 5.52, respectively. These values indicate that poly(?‐CL‐co‐GPE) has a pseudo‐block gradient copolymer. Based on these results, we examined the thermal curing reactions of certain epoxy resins with ?‐CL. The corresponding novel cured products were obtained quantitatively, and each of them showed a high glass transition temperature and high thermal stability, presumably due at least in part to a pseudo‐block gradient primary structure resembling that of poly(?‐CL‐co‐GPE). © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2220–2228     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Preparation and properties of epoxy/amine hybrid resins from in situ polymerization

Homogeneous and transparent epoxy/amine hybrid resins were successfully obtained through the in situ curing of bisphenol A epoxy and hexakis(methoxymethyl)melamine with 2 wt % (3‐glycidoxypropyl)trimethoxysilane as a facial coupling agent. The hybrid resins showed good miscibility, high glass‐transition temperatures, good thermooxidative stability, and good flame retardance. The outstanding properties of the hybrid resins may lead to their use in high‐performance green electronic products. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1868–1875, 2004     

Synthesis and property of phosphorus‐containing bismaleimide by a novel method

A series of novel addition products (phosphorus content: 0.5, 1, 2, and 3 wt %) were synthesized from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and 4,4′‐bismaleimidodiphenylmethane (BMI). NMR and IR were used to confirm the structures of the synthetic bismaleimides. Dynamic mechanical analysis scans showed the glass‐transition temperatures of these cured BMIs decreased with phosphorus content. Thermal gravimetric analysis heating scans indicated that they had high thermal stability. Limiting oxygen index measurements implied that the flame retardancy was improved by the incorporation of DOPO. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2260–2268, 2000     

Synthesis and characterization of poly(epoxy‐imide) crosslinked networks

Poly(epoxy imide)s were prepared by a reaction between a hydroxyl‐group‐containing soluble copolyimide and commercial epoxy resins at 220 °C for 2 h. Poly(epoxy imide) thin films exhibited higher thermal stability and lower dielectric constants than a commercial flip‐chip package material (U300). The thermal stabilities of the poly(epoxy imide)s were 1.4–2.0 times higher than that of U300. The thermal stability increased with increasing crosslink density and with decreasing bulky CF₃ groups (which were easily decomposable). The dielectric constants of the poly(epoxy imide)s were 1.1–1.3 times lower than that of U300, and this is highly desirable for the microelectronic packaging industry. The dielectric constant dramatically decreased when bulky CF₃ groups were added and when the functionalities of epoxy resins decreased. The residual stresses, slopes in the cooling curves, and glass‐transition temperatures of the poly(epoxy imide)s were measured with a thin‐film stress analyzer. Low residual stresses and slopes in the cooling curves were achieved with a higher crosslink density. However, in the presence of bulky CF₃ groups, the copolyimide backbone structure did not affect the residual stress values. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4293–4302, 2004     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002