Characteristics of Cu films prepared using a magnetron sputter type negative ion source (MSNIS)

Cu films have been deposited at room temperature using a magnetron sputter type negative ion source (MSNIS) at various conditions. By the principle of operation, the negative ion production probability is the function of the Cs flow rate in MSNIS. A set of films were deposited at different Cs flow rates and compared with normal-magnetron-sputtered films. The long-throw method was combined to MSNIS to increase the directionality and the negative ion arrival ratio. The film properties, such as resistivity, surface roughness, film structure, and step coverage on high aspect-ratio trench samples were obtained and analyzed using SEM, SIMS and AFM methods. The results showed that the resistivity of the film improved toward the theoretical values from 2.3 to 1.8 μΩ cm for the 100 nm thickness films. AFM scan of the film showed surface roughness was improved using MSNIS by ion bombarding effect. Depth profiling SIMS result showed Cs level resided in the film was less than 1 × 10¹⁹ at./cm³. As an application, Cu seed layer deposition on trench structure was investigated. Cross-sectional SEM was employed to see the step coverage of the film. The biasing effect was investigated. The different biasing conditions resulted as the clearly different coverage mode.     

Laser sintering of Cu paste film printed on polyimide substrate

We here show that highly conductive copper films are obtainable from Cu paste by laser sintering. The Cu paste synthesized using an organo-metallic compound was screen-printed onto polyimide substrate and the printed films were scanned by an ultraviolet laser beam at 355 nm under nitrogen atmosphere. Very compact microstructure was observed throughout the whole thickness and the sintered films were mechanically robust. Although Cu is known susceptible to oxidation, no Cu oxides were incorporated into the film during laser sintering. An electrical resistivity of 1.86 × 10⁻⁵ Ω cm was obtained. This resistivity is several orders of magnitude lower than those reported for the copper nanoparticle paste thermally sintered under N₂ or H₂ atmosphere.     

Dependence of intermediated noble metals on the optical and electrical properties of ITO/metal/ITO multilayers

Sn doped In₂O₃ (ITO) single layer and a sandwich structure of ITO/metal/ITO (IMI) multilayer films were deposited on a polycarbonate substrate using radio-frequency and direct-current magnetron sputtering process without substrate heating. The intermediated metal films in the IMI structure were Au and Cu films and the thickness of each layer in the IMI films was kept constant at 50 nm/10 nm/40 nm. In this study, the ITO/Au/ITO films show the lowest resistivity of 5.6 × 10⁻⁵ Ω cm.However the films show the lower optical transmission of 71% at 550 nm than that (81%) of as deposited ITO films. The ITO/Cu/ITO films show an optical transmittance of 54% and electrical resistivity of 1.5 × 10⁻⁴ Ω cm. Only the ITO/Au/ITO films showed the diffraction peaks in the XRD pattern. The figure of merit indicated that the ITO/Au/ITO films performed better in a transparent conducting electrode than in ITO single layer films and ITO/Cu/ITO films.     

Study on the electrical and optical properties of Ag/Al-doped ZnO coatings deposited by electron beam evaporation

A layer of silver was deposited onto the surface of glass substrates, coated with AZO (Al-doped ZnO), to form Ag/AZO film structures, using e-beam evaporation techniques. The electrical and optical properties of AZO, Ag and Ag/AZO film structures were studied. The deposition of Ag layer on the surface of AZO films resulted in lowering the effective electrical resistivity with a slight reduction of their optical transmittance. Ag (11 nm)/AZO (25 nm) film structure, with an accuracy of ±0.5 nm for the thickness shows a sheet resistance as low as 5.6 ± 0.5 Ω/sq and a transmittance of about 66 ± 2%. A coating consisting of AZO (25 nm)/Ag (11 nm)/AZO (25 nm) trilayer structure, exhibits a resistance of 7.7 ± 0.5 Ω/sq and a high transmittance of 85 ± 2%. The coatings have satisfactory properties of low resistance, high transmittance and highest figure of merit for application in optoelectronics devices including flat displays, thin films transistors and solar cells as transparent conductive electrodes.     

Dependence of film thickness on the electrical and optical properties of ZnO-Cu-ZnO multilayers

ZnO-Cu-ZnO multilayers were prepared by simultaneous RF magnetron sputtering of ZnO and DC magnetron sputtering of Cu. Cu films with different thickness were used as the intermediate metal layer. The optical and electrical properties of the multilayers studied by UV-vis spectrophotometer and four point probe method, respectively, shows that transmittance increases with decrease of copper thickness up to an optimum thickness of 5 nm and sheet resistance decreases with increase of thickness. Low resistivity and high transmission were obtained when the film structure has a thickness of ZnO/Cu/ZnO: 50/5/50 nm. The performance of the multilayers as transparent conducting material was better than the single layer ZnO of equal thickness.     

Characteristic difference between ITO/ZrCu and ITO/Ag bi-layer films as transparent electrodes deposited on PET substrate

The metallic-glass film of ZrCu layer deposited by co-sputtering was utilized as the metallic layer in the bi-layer structure transparent conductive electrode of ITO/ZrCu (IZC) deposited on the PET substrate using magnetron sputtering at room temperature. In addition, the pure Ag metal layer was applied in the same structure of transparent conductive film, ITO/Ag, in comparison with the IZC film. The ZrCu layer could form a continuous and smooth film in thickness lower than 6 nm, compared with the island structure of pure Ag layer of the same thickness. The 30 nm ITO/3 nm ZrCu films could show the optical transmittance of 73% at 550 nm wavelength. The 30 nm ITO/12 nm ZrCu films could show the better sheet resistance of 20 Ω/sq, but it was still worse than that of the ITO/Ag films. It was suggested that an alloy system with lower resistivity and negative mixing heat between atoms might be another way to form a continuous layer in thickness lower than 6 nm for metal film.     

Characteristics of ZnO-Cu-ZnO multilayer films on copper layer properties

ZnO/Cu/ZnO multilayers on glass with different copper layer thickness were prepared by simultaneous RF magnetron sputtering of ZnO and dc magnetron sputtering of Cu. Different optimization procedure were used for good transparent conductive film. Several analytical tools such as spectrophotometer, scanning electron microscope (SEM), four point probes were used to explore the causes of the changes in electrical and optical properties. The sheet resistance of the structure was severely influenced by the deposition condition of both top ZnO and intermediate Cu layer. Effect of substrate temperature and annealing treatment on ZnO and Cu layer was analyzed. A sheet resistance of 10 Ω/sq and transmittance over 85% at 580 nm wavelength was achieved and could be reproduced by controlling the preparation process parameter. The results of an optimization condition of both oxide layers and metallic Cu layers are illustrated.     

Investigation of agglomerated Cu seed on Cu oxidation after chemical mechanical planarization

After chemical mechanical planarization (CMP), the reason which caused the formation of Cu-oxide defects at the interface between Cu deposit and TaN barrier layer has been studied. The experimental results of atomic force microscopy, secondary ion mass spectroscopy, X-ray diffraction demonstrated that the agglomeration phenomenon was found on Cu seed in the thickness of only 10 nm, thus resulting in the electrodeposited Cu film with more abundant C impurities at Cu/TaN interface and lower (1 1 1)/(2 0 0) ratio compared to the thick one (30 nm). Therefore it caused the Cu deposit with poor corrosion resistance and then the Cu-oxide defects were easily formed after CMP. As a result, the correlation between Cu-oxide defects at the Cu/TaN interface and the agglomeration on Cu seed layer was proposed herein.     

Growth characteristics and properties of ZnO:Ga thin films prepared by pulsed DC magnetron sputtering

Transparent conductive ZnO:Ga thin films were deposited on Corning 1737 glass substrate by pulsed direct current (DC) magnetron sputtering. The effects of process parameters, namely pulse frequency and film thickness on the structural and optoelectronic properties of ZnO:Ga thin films are evaluated. It shows that highly c-axis (0 0 2) oriented polycrystalline films with good visible transparency and electrical conductivity were prepared at a pulsed frequency of 10 kHz. Increasing the film thickness also enlarged the grain size and carrier mobility which will subsequently lead to the decrease in resistivity. In summary, ZnO:Ga thin film with the lowest electrical resistivity of 2.01 × 10⁻⁴ Ω cm was obtained at a pulse frequency of 10 kHz with 500 nm in thickness. The surface RMS (root mean square) roughness of the film is 2.9 nm with visible transmittance around 86% and optical band gap of 3.83 eV.     

Room-temperature deposition of transparent conducting Al-doped ZnO films by RF magnetron sputtering method

Transparent conductive Al-doped zinc oxide (AZO) films with highly (0 0 2)-preferred orientation were deposited on quartz substrates at room temperature by RF magnetron sputtering. Optimization of deposition parameters was based on RF power, Ar pressure in the vacuum chamber, and distance between the target and substrate. The structural, electrical, and optical properties of the AZO thin films were investigated by X-ray diffraction, Hall measurement, and optical transmission spectroscopy. The 250 nm thickness AZO films with an electrical resistivity as low as 4.62 × 10⁻⁴ Ω cm and an average optical transmission of 93.7% in the visible range were obtained at RF power of 300 W, Ar flow rate of 30 sccm, and target distance of 7 cm. The optical bandgap depends on the deposition condition, and was in the range of 3.75-3.86 eV. These results make the possibility for light emitting diodes (LEDs) and solar cells with AZO films as transparent electrodes, especially using lift-off process to achieve the transparent electrode pattern transfer.     

Room temperature synthesis and characterization of CdO nanowires by chemical bath deposition (CBD) method

A chemical synthesis process for the fabrication of CdO nanowires is described. In the present work, transparent and conductive CdO films were synthesized on the glass substrate using chemical bath deposition (CBD) at room temperature. These films were annealed in air at 623 K and characterized for the structural, morphological, optical and electrical properties were studied by means of X-ray diffraction (XRD), scanning electron microscopy (SEM), optical and electrical resistivity. The XRD analysis showed that the as-deposited amorphous can be converted in to polycrystalline after annealing. Annealed CdO nanowires are 60-65 nm in diameter and length ranges typically from 2.5 to 3 μm. The optical properties revealed the presence of direct and indirect band gaps with energies 2.42 and 2.04 eV, respectively. Electrical resistivity measurement showed semiconducting behavior and thermoemf measurement showed n-type electrical conductivity.     

A promising approach to conductive patterns with high efficiency for flexible electronics

A promising approach for conductive patterns with high efficiency for flexible electronics was developed by direct-writing, silver(I) solution (silver nitrate, acetate silver, etc.) with no solid particles as a conductive ink, conductive pen as a writing implement, and polyimide (PI) film as a substrate. The physical properties of the conductive ink were investigated by a dynamic contact angle system, ubbelohde viscometer and surface tension instrument. Conductive properties of silver ink film were investigated by 4-point probe, scanning electron microscope (SEM) and surface profilometer. It is demonstrated how the design of solvent composition in conductive ink affects surface morphology, and conductivity of silver ink films. It can be obtained that conductive patterns drawn on PI substrate not only have good mechanical/electrical fatigue properties, but also have low resistivity. Especially, when the sintering condition is 200 °C for 60 min, the resistivity can be down to 6.6 μΩ cm, 4.25 times the silver bulk resistivity.     

ZnO nanorods on undoped and indium-doped ZnO thin films as a TCO layer on nonconductive glass for dye-sensitized solar cells

We present the growth of ZnO nanostructures on indium-doped ZnO film on a non-conductive glass substrate. The indium-doped ZnO film was used as the transparent conductive layer replaces the ITO layer. Various indium doping concentrations can change the electrical properties of ZnO film. The reduced electrical resistivity was investigated from 16.60 × 10⁻² to 10 × 10⁻² Ω cm. after doping with the optimal concentration of 2 wt% indium. It is found that the characteristic of ZnO nanostructures was strongly affected with indium doping concentration in ZnO films. The overall structural characteristics of ZnO ranged from 100–500 nm in size and 7–10 μm in length and the branch-like structures can be revealed from the 2 wt% indium-doped ZnO film. The room-temperature photoluminescence spectra show a sharp ultraviolet band of 353 nm, indicated to the ZnO nanorods structure. The branch-like structures on the 2 wt% indium-doped film can be yielded the photovoltaic properties with a short-circuit current density of 3.96 mA/cm², an open-circuit voltage of 0.72 V, a fill factor of 20% and an overall power conversion efficiency of 0.56% under irradiance of 100 mW/cm² (AM 1.5 G).     

Failure behavior of ITO diffusion barrier between electroplating Cu and Si substrate annealed in a low vacuum

A structure of Cu/ITO(10 nm)/Si was first formed and then annealed at various temperatures for 5 min in a rapid thermal annealing furnace under 10⁻² Torr pressure. In Cu/ITO(10 nm)/Si structure, the ITO(10 nm) film was coated on Si substrate by sputtering process and the Cu film was deposited on ITO film by electroplating technique. The various Cu/ITO(10 nm)/Si samples were characterized by a four-point probe, a scanning electron microscope, an X-ray diffractometer, and a transmission electron microscope. The results showed that when the annealing temperature increases near 600 °C the interface between Cu and ITO becomes unstable, and the Cu₃Si particles begin to form; and when the annealing temperature increases to 650 °C, a good many of Cu₃Si particles about 1 μm in size form and the sheet resistance of Cu/ITO(10 nm)/Si structure largely increases.     

Molybdenum thin film deposited by in-line DC magnetron sputtering as a back contact for Cu(In,Ga)Se2 solar cells

In this paper, we reported the effect of the power and the working pressure on the molybdenum (Mo) films deposited using an in-line direct current (DC) magnetron sputtering system. The electrical and the structural properties of Mo film were improved by increasing DC power from 1 to 3 kW. On the other side, the resistivity of the Mo films became higher with the increasing working pressure. However, the adhesion property was improved when the working pressure was higher. In this work, in order to obtain an optimal Mo film as a back metal contact of Cu(In,Ga)Se₂ (CIGS) solar cells, a bilayer Mo film was formed through the different film structures depending on the working pressure. The first layer was formed at a high pressure of 12 mTorr for a better adhesion and the second layer was formed at a low pressure of 3 mTorr for a lower resistivity.     

Thermal stability and electrical characteristics of NiSi films with electroplated Ni(W) alloy

In this study, an electroplating method to deposited Ni, crystalline NiW(c-NiW), amorphous NiW (a-NiW) films on P-type Si(1 0 0) were used to form Ni-silicide (NiSi) films. After annealed at various temperatures, sheet resistance of Ni/Cu, c-NiW/Cu and a-NiW/Cu was measured to observe the performance of those diffusion barrier layers. With W added in the barrier layer, the barrier performance was improved. The results of XRD and resistance measurement of the stacked Si/Ni(W)/Cu films reveal that Cu atom could diffuse through Ni barrier layer at 450 °C, could diffuse through c-NiW at 550 °C, but could hardly diffuse through a-NiW barrier layer. c-NiW layer has a better barrier performance than Ni layer, meanwhile the resistance is lower than a-NiW layer.     

Effects of Cu doping on nickel oxide thin film prepared by sol–gel solution process

We prepared nickel oxide (NiO) thin films with p-type Cu dopants (5 at%) using a sol–gel solution process and investigated their structural, optical, and electrical characteristics by X-ray diffraction (XRD), atomic force microscopy (AFM), optical transmittance and current–voltage (I–V) characteristics. The crystallinity of the NiO films improved with the addition of Cu dopants, and the grain size increased from 38 nm (non-doped) to 50 nm (Cu-doped). The transmission of the Cu-doped NiO film decreased slightly in the visible wavelength region, and the absorption edge of the film red-shifted with the addition of the Cu dopant. Therefore, the width of the optical band gap of the Cu-doped NiO film decreased as compared to that of the non-doped NiO film. The resistivity of the Cu-doped NiO film was 23 Ω m, which was significantly less than that of the non-doped NiO film (320 Ω m). Thus, the case of Cu dopants on NiO films could be a plausible method for controlling the properties of the films.     

Sonication-assisted layer-by-layer deposition of gold nanoparticles for highly conductive gold patterns

Sonication-assisted layer-by-layer (LBL) deposition of gold nanoparticles (GNPs) was carried out in an attempt to prepare highly conductive gold patterns on polyimide substrates. First, sonication time was optimized with GNPs (12.8 nm) whose size was large enough to be analyzed by FE-SEM in order to evaluate the surface coverage. Next, multilayer formation (4, 8 and 12 layer) was confirmed using ethanedithiol (EDT) as linker molecules under optimized conditions by measuring their UV absorption, near-IR (NIR) transmittance, thickness, and electrical conductivity. Finally, 20-layer films using small GNPs (2.5 nm) were prepared with or without patterning, followed by sintering at 150 °C for 1 h, which provided clean gold patterns with high electrical conductivity (2.5 × 10⁵ Ω⁻¹ cm⁻¹).     

Growth, coalescence, and electrical resistivity of thin Pt films grown by dc magnetron sputtering on SiO2

Ultra thin platinum films were grown by dc magnetron sputtering on thermally oxidized Si (1 0 0) substrates. The electrical resistance of the films was monitored in situ during growth. The coalescence thickness was determined for various growth temperatures and found to increase from 1.1 nm for films grown at room temperature to 3.3 nm for films grown at 400 °C. A continuous film was formed at a thickness of 2.9 nm at room temperature and 7.5 nm at 400 °C. The room temperature electrical resistivity decreases with increased growth temperature, while the in-plain grain size and the surface roughness, measured with a scanning tunneling microscope (STM), increase. Furthermore, the temperature dependence of the film electrical resistance was explored at various stages during growth.     

Morphology, optical and electrical properties of Cu-Ni nanoparticles in a-C:H prepared by co-deposition of RF-sputtering and RF-PECVD

We report optical and electrical properties of Cu-Ni nanoparticles in hydrogenated amorphous carbon (Cu-Ni NPs @ a-C:H) with different surface morphology. Ni NPs with layer thicknesses of 5, 10 and 15 nm over Cu NPs @ a-C:H were prepared by co-deposition of RF-sputtering and RF-Plasma Enhanced Chemical Vapor Deposition (RF-PECVD) from acetylene gas and Cu and Ni targets. A nonmetal-metal transition was observed as the thickness of Ni over layer increases. The surface morphology of the sample was described by a two dimensional (2D) Gaussian self-affine fractal, except the sample with 10 nm thickness of Ni over layer, which is in the nonmetal-metal transition region. X-ray diffraction profile indicates that Cu NPs and Ni NPs with fcc crystalline structure are formed in these films. Localized Surface Plasmon Resonance (LSPR) peak of Cu NPs is observed around 600 nm in visible spectra, which is widen and shifted to lower wavelengths as the thickness of Ni over layer increases. The variation of LSPR peak width correlates with conductivity variation of these bilayers. We assign both effects to surface electron delocalization of Cu NPs.