Application of TiO2 nano-particles on the electrode of dye-sensitized solar cells

In this study, nano-TiO₂ thin film electrode and solar cell have been investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), ultraviolet-visible absorption spectra, contact angle, X-ray photoelectron spectroscopy (XPS), and current-voltage characteristics analyses. X-ray diffraction patterns show that the best sintering temperature of a nano-TiO₂ film is 600 °C, at which TiO₂ anatase phase forms best and the particle size of 8-10 nm can be obtained. The SEM images of a nano-TiO₂ thin film show that the surface of the film is smooth and porous, and the thickness of the nano-TiO₂ film is 4 μm. The measurements of contact angle between nano-TiO₂ film and deionized water (DI water) reveal that the nano-TiO₂ film is super-hydrophilic when solarized under ultraviolet. The electrode of dye-sensitized solar cell is used as a free-base porphyrin with carboxyl group, 5,10,15,20-tetrakis (4-carboxyphenyl) porphyrin (TCPP) as the sensitizer to adsorb onto the TiO₂ thin film. From the results of ultraviolet-visible absorption spectra and XPS analyses of the electrode, the effects of nano-TiO₂ particles’ addition to the electrode of dye-sensitized solar cell can improve the absorption of visible light (400-700 nm) and increase electrons transferred from TCPP to the conduction band of TiO₂, resulting in the enhancement of efficiency for dye-sensitized solar cells.     

Annealing and measurement temperature dependence of W2B5-based rectifying contacts to n-GaN

The thermal stability and measurement temperature dependence of Schottky contact characteristics on n-GaN using a W₂B₅/Ti/Au metallization scheme was studied using current-voltage (I-V), scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) measurements. The elemental profile obtained from samples annealed at 350 °C showed some titanium diffusion into the gold layer but little other difference from the as-deposited wafer. Annealing at 700 °C produced significant diffusion of titanium. The Schottky barrier height increased with anneal temperature up to 200 °C, reaching a maximum value of 0.65 eV, but decreased at higher annealing temperatures. The reverse breakdown voltage from diodes fabricated using the W₂B₅-based contacts showed a similar dependence. The reverse current magnitude was larger than predicted by thermionic emission alone. The barrier height showed only minor changes with measurement temperature up to 150 °C.     

Investigation of Ni/Ta contacts on 4H silicon carbide upon thermal annealing

Nickel and Tantalum thin films with 3:5 thickness ratios were deposited in succession onto 4H-SiC substrate at room temperature. The samples were then heated in situ in vacuum at 650, 800 or 950 °C for 30 min. Glancing angle X-ray diffraction (XRD), Auger electron spectroscopy (AES) and current-voltage (I-V) technique were used for characterising the interfacial reactions and electrical properties. Amorphous Ni-Ta can be formed by solid-state reaction at 650 °C. The minor dissolved Ni in the Ta metal promotes the reaction between Ta and SiC. With increasing annealing temperature up to 950 °C, the dominant carbide changes from Ta₂C to TaC and a layer structure is developed. Electrical measurements show that ohmic contact is formed after annealing at or above 800 °C.     

Structural, optical, and electrical properties of p-type NiO films and composite TiO2/NiO electrodes for solid-state dye-sensitized solar cells

p-Type nickel oxide thin films were prepared by sol-gel method, and their structural, optical and electrical properties were investigated. The Ni(OH)₂ sol was formed from nickel (II) acetate tetrahydrate, Ni(CH₃COO)₂·4H₂O, in a mixture of alcohol solution and poly(ethylene glycol), and deposited on an ITO substrate by spin coating followed by different heat treatments in air (50-800 °C). The formation and composition of NiO thin film was justified by EDX analysis. It is found that the thickness of the NiO film calcined at 450 °C for 1 h is about 120 nm with average particle size of 22 nm, and high UV transparency (∼75%) in the visible region is also observed. However, the transmittance is negligible for thin films calcined at 800 °C and below 200 °C due to larger particle size and the amorphous characteristics, respectively. Moreover, the composite electrode comprising n-type TiO₂ and p-type NiO is fabricated. The current-voltage (I-V) characteristics of the composite TiO₂/NiO electrode demonstrate significant p-type behavior by the shape of the rectifying curve in dark. The effect of calcination temperature on the rectification behavior is also discussed.     

Annealing temperature effect on the structural, optical and electrical properties of ZnS thin films

Zinc sulfide thin films were prepared on glass substrates at room temperature using a chemical bath deposition method. The obtained films were annealed at temperatures ranging from 100 to 500 °C in steps of 100 °C for 1 h. The films were characterized by X-ray diffraction (XRD), Raman spectroscopy, energy dispersive X-ray analysis (EDX), optical absorption spectra, and electrical measurements. X-ray diffraction analysis indicates that the deposited films have an amorphous structure, but after being annealed at 500 °C, they change to slightly polycrystalline. The optical constants such as the refractive index (n_r), the extinction coefficient (k), and the real (ε₁) and imaginary (ε₂) parts of the dielectric constant are calculated depending on the annealing temperature. Aside from the ohmic characteristics of the I-V curve, a nonlinear I-V curve owing to the Schottky contact is also found, and the barrier heights (?_bn) for Au/n-ZnS and In/n-ZnS heterojunctions are calculated. The conductivity type was identified by the hot-probe technique.     

Temperature dependent transport properties of CuInSe2-ZnO heterostructure solar Cell

Experimental study of dc and ac transport properties of CuInSe₂/ZnO heterostructure is presented. The current-voltage (I-V) and frequency dependent capacitance (C-f) characteristics of CuInSe₂/ZnO heterostructure were investigated in the temperature range 160-393 K. The heterostructure showed non-ideal behavior of I-V characteristics with an ideality factor of 3.0 at room temperature. Temperature dependent dc conductivity studies exhibited Arrhenius type behavior and revealed the presence of trap level. The C⁻²-V plot measured at frequency 50 kHz had shown non-linear behavior. An increase in capacitance with temperature was observed. The capacitance-frequency characteristics exhibited a transition between low frequency and the high frequency capacitance. As the temperature was lowered the transition occurred at lower frequencies. The frequency and temperature dependent device capacitance had shown a defect state having activation energy of 108 meV.     

Growth of nanocrystalline CuIn3Se5 (OVC) thin films by ion exchange reactions at room temperature and their characterization as photo-absorbing layers

Nanocrystalline CuIn₃Se₅ thin films have been grown on ITO glass substrates using chemical ion exchange reactions with CdS, in alkaline medium at pH 11. The as-deposited films were annealed in air at 200 °C for 30 min and characterized using X-ray diffraction (XRD), transmission electron microscopy, energy dispersive X-ray analysis, X-ray photoelectron spectroscopy, and scanning electron microscopy to study the structural, compositional and morphological properties. The XRD patterns reveal the nanoparticles size to be of 18-20 nm diameter, while from the SEM images the nanoparticles size is estimated to be 20-30 nm. It is observed that the annealed films contain nanocrystallites connected with each other through grain boundaries, with grain size of about 100-125 nm and have an overall n-type electrical conductivity and higher photoconductivity. The current-voltage (I-V) characteristics (in dark and light) of these films indicated the formation of a Schottky like junction between the n-CuIn₃Se₅ (OVC) and CdS/ITO layers.     

The effect of interface states, excess capacitance and series resistance in the Al/SiO2/p-Si Schottky diodes

The current-voltage (I-V) characteristics of Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) Schottky diodes were measured at room temperature. In addition the capacitance-voltage (C-V) and conductance-voltage (G-V) measurements are studied at frequency range of 10 kHz-1 MHz. The higher value of ideality factor of 3.25 was attributed to the presence of an interfacial insulator layer between metal and semiconductor and the high density of interface states localized at Si/SiO₂ interface. The density of interface states (N_ss) distribution profile as a function of (E_ss − E_v) was extracted from the forward bias I-V measurements by taking into account the bias dependence of the effective barrier height (Φ_e) at room temperature for the Schottky diode on the order of ≅4 × 10¹³ eV⁻¹ cm⁻²_. These high values of N_ss were responsible for the non-ideal behaviour of I-V and C-V characteristics. Frequency dispersion in C-V and G-V can be interpreted only in terms of interface states. The N_ss can follow the ac signal especially at low frequencies and yield an excess capacitance. Experimental results show that the I-V, C-V and G-V characteristics of SD are affected not only in N_ss but also in series resistance (R_s), and the location of N_ss and R_s has a significant on electrical characteristics of Schottky diodes.     

Fabrication and characterization of Fe-doped titania semiconductor electrodes with p-n homojunction devices

The nano-TiO₂ electrode with a p-n homojunction device was designed and fabricated by coating of the Fe³⁺-doped TiO₂ (p-type) film on top of the nano-TiO₂ (n-type) film. These films were prepared from synthesized sol-gel TiO₂ samples which were verified as anatase with nano-size particles. The semiconductor characteristics of the p-type and n-type films were demonstrated by current-voltage (I-V) measurements. Results show that the rectifying curves of undoped TiO₂ and Fe³⁺-doped TiO₂ sample films were observed from the I-V data illustration for both the n-type and p-type films. In addition, the shapes of the rectifying curves were influenced by the fabrication conditions of the sample films, such as the doping concentration of the metal ions, and thermal treatments. Moreover, the p-n homojunction films heating at different temperatures were produced and analyzed by the I-V measurements. From the I-V data analysis, the rectifying current of this p-n junction diode has a 10 mA order higher than the current of the n-type film. The p-n homojunction TiO₂ electrode demonstrated greater performance of electronic properties than the n-type TiO₂ electrode.     

Comparison of electrical parameters of Zn/p-Si and Sn/p-Si Schottky barrier diodes

In this study, current-voltage (I-V) and capacitance-voltage (C-V) characteristics of metal-semiconductor (MS) Zn/p-Si and Sn/p-Si Schottky diodes, with high resistivity silicon structures, are investigated. The parameters of series resistance (R_S), the ideality factor (n) and the barrier height (Φ_b) are determined by performing different plots from the forward bias current-voltage (I-V) and reverse bias capacitance-voltage (C-V) characteristics. Thus, the barrier heights (Φ_b) for the Si Schottky diodes obtained between 0.725 and 1.051 eV, the ideality factor (n) between 1.043 and 1.309, and the series resistance (R_S) between 12.594 and 12.950 kΩ. The energy distribution of interface states density was determined from the forward bias I-V characteristics by taking into account the bias dependence of the effective barrier height. It was concluded that the density of interface states in the considered energy range are in close agreement with each other values obtained for Zn/p-Si and Sn/p-Si Schottky diodes.     

Investigation on the barrier height and inhomogeneity of nickel silicide Schottky

The apparent Schottky barrier height (SBH) of the nickel silicide Schottky contacts annealed at different temperatures was investigated based on temperature dependence of I-V characteristic. Thermionic emission-diffusion (TED) theory, single Gaussian and double Gaussian models were employed to fit I-V experimental data. It is found the single Gaussian and double Gaussian SB distribution model can give a very good fit to the I-V characteristic of apparent SBH for different annealing temperatures. Also, the apparent SBH and the leakage current increase with annealing temperatures under reverse voltage. In addition, the homogeneity of interfaces for the samples annealed at temperatures of 500 and 600 °C is much better than that of the samples annealed at temperatures of 400, 700, and 800 °C. This may result from the phase transformation of nickel silicide due to the different annealing temperatures and from the low Schottky barrier (SB) patches.     

Temperature dependence of the current-voltage characteristics of the Al/Rhodamine-101/p-Si(1 0 0) contacts

The current-voltage (I-V) characteristics of Al/Rhodamine-101/p-Si/Al contacts have been measured at temperatures ranging from 280 to 400 K at 20 K intervals. A barrier height (BH) value of 0.817 eV for the Al/Rh101/p-Si/Al contact was obtained at the room temperature that is significantly larger than the value of 0.58 eV of the conventional Al/p-Si Schottky diode. While the barrier height Φ_b0 decreases the ideality factors (n) become larger with lowering temperature. The high values of n depending on the sample temperature may be ascribed to decrease of the exponentially increase rate in current due to space-charge injection into Rh101 thin film at higher voltage. Therefore, at all temperatures, it has been seen that the I-V characteristics show three different regions, the ohmic behavior at low voltages, and the space charge limited current with an exponential distribution of traps at high voltages.     

Current conduction mechanism in Al/p-Si Schottky barrier diodes with native insulator layer at low temperatures

The forward bias current-voltage (I-V) characteristics of Al/p-Si (MS) Schottky diodes with native insulator layer were measured in the temperature range of 80-300 K. The obtained zero bias barrier height Φ_B0(I-V), ideality factor (n) and series resistance (R_s) determined by using thermionic emission (TE) mechanism show strong temperature dependence. There is a linear correlation between the Φ_B0(I-V) and n because of the inhomogeneties in the barrier heights (BHs). Calculated values from temperature dependent I-V data reveal an unusual behaviour such that the Φ_B0 decreases, as the n and R_s values are increasing with decreasing absolute temperature, and these changes are more pronounced especially at low temperatures. Such temperature dependence of BH is contradictory with the reported negative temperature coefficient of the barrier height. In order to explain this behaviour we have reported a modification in the expression reverse saturation current I_o including the n and the tunnelling factor (αΧ^1/2δ) estimated to be 15.5. Therefore, corrected effective barrier height Φ_bef.(I-V) versus temperature has a negative temperature coefficients (α = −2.66 × 10⁻⁴ eV/K) and it is in good agreement with negative temperature coefficients (α = −4.73 × 10⁻⁴ eV/K) of Si band gap. In addition, the temperature dependent energy distribution of interface states density N_ss profiles was obtained from the forward bias I-V measurements by taking into account the bias dependence of the Φ_e and n. The forward bias I-V characteristics confirm that the distribution of N_ss, R_s and interfacial insulator layer are important parameters that the current conduction mechanism of MS Schottky diodes.     

Characterization of conductance under finite bias for a self-assembled monolayer coated Au quantized point contact

We have demonstrated that an experimental cross-wire junction set-up can be used to measure the I-V characteristics of a self-assembled monolayer (SAM) stabilized metal quantized point contact. The increased stability due to the presence of the SAM allows the measurement of the I-V characteristics. However, the SAM also provides additional conductance paths in addition to the pure metal point contact. The presence of the SAM may contribute to the non-integral quantum conductance transition and the non-linear I-V characteristics of the quantum contact. Nonetheless, a straight I-V curve is obtained for the Au quantized point contact from 0 to 1 V with a conductance of approximately 1G₀, in contrast to previous work reported in the literature.     

Effect of surface preparation on the properties of Au/p-Cd1−xZnxTe

The effect of bromine methanol (BM) etching and NH₄F/H₂O₂ passivation on the Schottky barrier height between Au contact and semi-insulated (SI) p-Cd_1−xZn_xTe (x ≈ 0.09-0.18) was studied through current-voltage (I-V) and capacitance-voltage (C-V) measurements. Near-infrared (NIR) spectroscopy technique was utilized to determine the Zn concentration. X-ray photoelectron spectroscopy (XPS) for surface composition analysis showed that BM etched sample surface left a Te⁰-rich layer, however, which was oxidized to TeO₂ and the surface [Te]/([Cd] + [Zn]) ratio restored near-stoichiometry after NH₄F/H₂O₂ passivation. According to I-V measurement, barrier height was 0.80 ± 0.02-0.85 ± 0.02 eV for Au/p-Cd_1−xZn_xTe with BM etching, however, it increased to 0.89 ± 0.02-0.93 ± 0.02 eV with NH₄F/H₂O₂ passivation. Correspondingly, it was about 1.34 ± 0.02-1.43 ± 0.02 eV and 1.41 ± 0.02-1.51 ± 0.02 eV by C-V method.     

Investigation of electrical and ammonia sensing characteristics of Schottky barrier diode based on a single ultra-long ZnO nanorod

Novel ultra-long ZnO nanorods, with lengths about 0.5-1.5 mm and diameters ranging from 100 to 1000 nm, in mass production have been synthesized via the vapor-phase transport method with CuO catalyst at 900 °C. Rectifying Schottky barrier diodes have been fabricated by aligning a single ultra-long ZnO nanorod across paired Ag electrodes. The resulting current-voltage (I-V) characteristics of the SBD exhibit a clear rectifying behavior. The ideality factor of the diode is about 4.6, and the threshold voltage is about 0.54 V at room temperature (300 K). At the same time the detailed I-V characteristics have been investigated in the temperature range 423-523 K. In addition, after exposure of the Schottky diodes to NH₃, the forward and reverse currents increase rapidly, indicating a high sensitivity to NH₃ gas.     

Inhomogeneities in 130 MeV Au ion irradiated Au/n-Si (1 0 0) Schottky structure

The electrical characteristics of Au/n-Si (1 0 0) Schottky rectifier have been studied in a wide irradiation fluence range using conventional current-voltage (I-V) and capacitance-voltage (C-V) measurements. The I-V characteristics showed an abnormal increase in forward current at low voltage. The device shows a bend in forward I-V and reverses bias C-V characteristics due to extra current, suggesting that there are two independent contributions to thermionic current, corresponding to two levels of the Schottky barrier. It is shown that the excess current at low voltage can be explained by taking into account the role of heavy ion irradiation induced defects at the metal semiconductor interface.     

Metal contacts to n-GaN

Al, Au, Ti/Al and Ti/Au contacts were prepared on n-GaN and annealed up to 900 °C. The structure, phase and morphology were studied by cross-sectional transmission and scanning electron microscopy as well as by X-ray diffraction (XRD), the electrical behaviour by current-voltage measurements. It was obtained that annealing resulted in interdiffusion, lateral diffusion along the surface, alloying and bowling up of the metal layers. The current-voltage characteristics of as-deposited Al and Ti/Al contacts were linear, while the Au and Ti/Au contacts exhibited rectifying behaviour. Except the Ti/Au contact which became linear, the contacts degraded during heat treatment at 900 °C. The surface of Au and Ti/Au contacts annealed at 900 °C have shown fractal-like structures revealed by scanning electron microscopy. Transmission electron microscopy and XRD investigations of the Ti/Au contact revealed that Au diffused into the n-GaN layer at 900 °C. X-ray diffraction examinations showed, that new Ti₂N, Au₂Ga and Ga₃Ti₂ interface phases formed in Ti/Au contact at 900 °C, new Ti₂N phase formed in Ti/Al contact at 700 and 900 °C, as well as new AlN interface phase developed in Ti/Al contact at 900 °C.     

Characterization of the low temperature dopant activation behavior at NiSi/silicon interface formed by implant into silicide method

Process temperature and thermal budget control are very important for high-k dielectric device manufacturing. This work focuses on the characteristics of low temperature activated nickel silicide/silicon (M/S) interface formed by implant into silicide (IIS) method. By combining SIMS, C-V, I-V, and AFM measurements in this work, it provides a clear picture that the high dopant activation ratio can be achieved at low temperature (below 600 °C) by IIS method. From SIMS and C-V measurements, high dopant activation behavior is exhibited, and from I-V measurement, the ohmic contact behavior at the M/S junction is showed. AFM inspection displays that under 2nd RTA 700 °C 30 s no agglomeration occurs. These results suggest that IIS method has the potential to integrate with high-k dielectric due to its low process temperature. It gives an alternate for future device integration.     

Effect of deposition conditions on YBa2Cu3O7−δ thin films by inverted cylindrical magnetron sputtering and substrate effects

The dependence of YBCO thin film properties on the deposition conditions was studied for different substrates. The deposition conditions were optimized for the epitaxial growth of high quality YBCO thin films of 1500 Å thickness onto single crystal (100-oriented) SrTiO₃ (STO), MgO and LaAlO₃ (LAO) substrates by DC Inverted Cylindrical Magnetron Sputtering (ICMS). The samples were investigated in detail by means of X-ray diffraction analysis (XRD), EDX, AFM, ρ-T, magnetic susceptibility and current-voltage (I-V) characterizations. The samples show strong diamagnetic behavior and sharp transition temperatures of 89-91 K with ΔT<0.5 K. XRD of the samples exhibited highly c-axis orientation. The full width at half maximum (FWHM) values of the rocking curves were ranging typically from 0.22 to 0.28°. The samples have smooth surfaces as shown from AFM micrographs. The surface roughness, R_a, changed between 5-7 nm. I-V characteristics were obtained from the 20 μm-wide microbridges, which were patterned by a laser writing technique. The critical current densities (J_c, 1.06×10⁶ for LAO-based YBCO, 1.39×10⁶ for MgO-based YBCO, 1.67×10⁶ A/cm² for STO based YBCO) of the microbridges were evaluated from I-V curves at 77 K.