The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials

The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials subjected to harmonic antiplane shear waves is investigated using the Schmidt method. The present problem can be solved using the Fourier transform and the technique of dual integral equations, in which the unknown variables are jumps of displacements across the crack surfaces, not dislocation density functions. To solve the dual integral equations, the jumps of displacements across the crack surfaces are directly expanded as a series of Jacobi polynomials. Finally, the relations among the electric, magnetic flux, and dynamic stress fields near crack tips can be obtained. Numerical examples are provided to show the effect of the functionally graded parameter, the distance between the two parallel cracks, and the circular frequency of the incident waves upon the stress, electric displacement, and magnetic flux intensity factors at crack tips.     

Nonlocal theory solution of two collinear cracks in the functionally graded materials

In this paper, the interaction of two collinear cracks in functionally graded materials subjected to a uniform anti-plane shear loading is investigated by means of nonlocal theory. The traditional concepts of the nonlocal theory are extended to solve the fracture problem of functionally graded materials. To make the analysis tractable, it is assumed that the shear modulus varies exponentially with the coordinate vertical to the crack. By use of the Fourier transform, the problem can be solved with the help of a pair of triple integral equations, in which the unknown variable is the displacement on the crack surfaces. To solve the triple integral equations, the displacement on the crack surfaces is expanded in a series of Jacobi polynomials. Unlike the classical elasticity solutions, it is found that no stress singularity is present near the crack tips. The nonlocal elastic solutions yield a finite hoop stress at the crack tip, thus allowing us to use the maximum stress as a fracture criterion in functionally graded materials. The magnitude of the finite stress field depends on the crack length, the distance between two cracks, the parameter describing the functionally graded materials and the lattice parameter of the materials.     

Two mode III internal cracks located within two bonded functionally graded piezoelectric half planes respectively

This paper studies the mode III crack problem of two bonded functionally graded piezoelectric half planes which contain a crack respectively. These two cracks are located normal to the interface. All the material properties are assumed to vary along the direction of the crack line. A system of singular integral equations for electrically impermeable and permeable cracks is derived and solved numerically by using the Gauss–Chebyshev integration formula. The influence of the nonhomogeneous parameters and the dependence of the crack interactions on the stress and electric displacement intensity factors are investigated.     

Dynamic behavior of two collinear anti-plane shear cracks in a functionally graded layer bonded to dissimilar half planes

In recent years, the functionally graded materials (FGMs) have been widely applied in extremely high temperate environment. In this paper, the dynamic behavior of two collinear cracks in FGM layer bonded to dissimilar half planes under anti-plane shear waves is studied by the Schmidt method. By using the Fourier transform technique, the present problem can be solved with a dual integral equation. These equations are solved using the Schmidt method. The present method is used to illustrate the fundamental behavior of the interacting cracks in FGMs under dynamic loading. Furthermore, the effects of the geometry of the interacting cracks, the shear stress wave velocity of the materials and the frequency of the incident wave on the Dynamic Stress Intensity Factor are investigated.     

梯度半空间梯度覆层中的Love波

对功能梯度弹性半空间上覆盖一层功能梯度材料中的Love波的频散问题进行了研究，给出 了Love波频散方程的一般形式. 对功能梯度弹性半空间和功能梯度覆层的反平面剪切波的运 动控制方程进行了求解，给出了半空间和覆盖层的位移、应力解析解，给出了Love波在该解析 解下的频散方程. 以覆盖层的剪切弹性模量和质量密度均呈指数函数变化，半空间的剪切弹 性模量和质量密度均呈抛物线变化为例，利用迭代方法对频散方程进行了求解，给出了频散 曲线. 结果显示：在最低阶振型频散曲线中出现截止频率.     

Dynamic behavior of two parallel symmetric permeable cracks in a piezoelectric strip

The dynamic behavior of two parallel symmetric cracks in a piezoelectric strip under harmonic anti-plane shear waves is studied using the Schmidt method for permeable crack surface conditions. The cracks are parallel to the edge of the strip. By means of the Fourier transform, the problem can be solved with the help of two pairs of dual integral equations. These equations are solved using the schmidt method. The results show that the stress and the electric displacement intensity factors depend on the geometry of the cracks, the frequency of incident waves, the distance between cracks and the thickness of the strip. It is also found that the electric displacement intensity factors for the permeable crack surface conditions are much smaller than those for the impermeable crack surface conditions. Project supported by the Post Doctoral Science Foundation of Heilongjiang Province, the Natural Science Foundation of Heilongjiang Province, the National Science Foundation with the Excellent Young Investigator Award (No. 19725209) and the Scientific Research Foundation of Harbin Institute of Technology (HIT.2000.30).     

Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate

This work deals with the mode III fracture problem of a cracked functionally graded piezoelectric surface layer bonded to a cracked functionally graded piezoelectric substrate. The cracks are normal to the interface and the electro-elastic material properties are assumed to be varied along the crack direction. Potential and flux types of boundary condition are assigned on the edge of the surface layer. The problem under the assumptions of impermeable and permeable cracks can be formulated to the standard singular integral equations, which are solved by using the Gauss–Chebyshev technique. The effects of the boundary conditions, the material properties and crack interaction on the stress and electric displacement intensity factors are discussed.     

SCATTERING OF HARMONIC ANTI-PLANE SHEAR STRESS WAVES BY A CRACK IN FUNCTIONALLY GRADED PIEZOELECTRIC/PIEZOMAGNETIC MATERIALS

In this paper, the dynamic behavior of a permeable crack in functionally graded piezoelectric/piezomagnetic materials is investigated. To make the analysis tractable, it is assumed that the material properties vary exponentially with the coordinate parallel to the crack. By using the Fourier transform, the problem can be solved with the help of a pair of dual integral equations in which the unknown is the jump of displacements across the crack surfaces. These equations are solved to obtain the relations between the electric filed, the magnetic flux field and the dynamic stress field near the crack tips using the Schmidt method. Numerical examples are provided to show the effect of the functionally graded parameter and the circular frequency of the incident waves upon the stress, the electric displacement and the magnetic flux intensity factors of the crack.     

功能梯度压电带中裂纹对SH波的散射

研究功能梯度压电带中裂纹对SH波的散射问题,为了便于分析,材料性质假定为指数模型,并假设裂纹面上的边界条件为电渗透型的.根据压电理论得到压电体的状态方程,利用Fourier积分变换,问题转化为对偶积分方程的求解.用Copson方法求解积分方程.求得了裂纹尖端动应力强度因子、电位移强度因子的解析表达式,最后数值结果显示了标准动应力强度因子与入射波数、材料参数、带宽、波数以及入射角之间的关系.     

SCATTERING OF ANTI-PLANE SHEAR WAVES IN A FUNCTIONALLY GRADED MATERIAL STRIP WITH AN OFF-CENTER VERTICAL CRACK

The scattering problem of anti-plane shear waves in a functionally graded material strip with an off-center crack is investigated by use of Schmidt method. The crack is vertically to the edge of the strip. By using the Fourier transform, the problem can be solved with the help of a pair of dual integral equations that the unknown variable is the jump of the displacement across the crack surfaces. To solve the dual integral equations, the jump of the displacement across the crack surfaces was expanded in a series of Jacobi polynomials. Numerical examples were provided to show the effects of the parameter describing the functionally graded materials, the position of the crack and the frequency of the incident waves upon the stress intensity factors of the crack.     

Basic solutions of multiple parallel symmetric mode-III cracks in functionally graded piezoelectric/piezomagnetic material plane

The Schmidt method is adopted to investigate the fracture problem of multiple parallel symmetric and permeable finite length mode-III cracks in a functionally graded piezoelectric/piezomagnetic material plane. This problem is formulated into dual integral equations, in which the unknown variables are the displacement jumps across the crack surfaces. In order to obtain the dual integral equations, the displacement jumps across the crack surfaces are directly expanded as a series of Jacobi polynomials. The results show that the stress, the electric displacement, and the magnetic flux intensity factors of cracks depend on the crack length, the functionally graded parameter, and the distance among the multiple parallel cracks. The crack shielding effect is also obviously presented in a functionally graded piezoelectric/piezomagnetic material plane with mul- tiple parallel symmetric mode-III cracks.     

DYNAMIC BEHAVIOR OF SEVERAL CRACKS IN FUNCTIONALLY GRADED STRIP SUBJECTED TO ANTI-PLANE TIME-HARMONIC CONCENTRATED LOADS

This paper contains a theoretical formulations and solutions of multiple cracks sub- jected to an anti-plane time-harmonic point load in a functionally graded strip. The distributed dislocation technique is used to construct integral equations for a functionally graded material strip weakened by several cracks under anti-plane time-harmonic load. These equations are of Cauchy singular type at the location of dislocation, which are solved numerically to obtain the dislocation density on the faces of the cracks. The dislocation densities are employed to evaluate the stress intensity factor and strain energy density factors （SEDFs） for multiple cracks with differ- ent configurations. Numerical calculations are presented to show the effects of material properties and the crack configuration on the dynamic stress intensity factors and SEDFs of the functionally graded strip with multiple curved cracks.     

DYNAMIC BEHAVIOR OF TWO COLLINEAR PERMEABLE CRACKS IN A PIEZOELECTRIC LAYER BONDED TO TWO HALF SPACES

IntroductionIn the fracture mechanics studies for piezoelectric materials,differently electricboundary conditions at the crack surfaces have been proposed by many researchers.Forexample,for the sake of analytical simplification,the assumption that the cra…     

Dynamic behavior of two unequal parallel permeable interface cracks in a piezoelectric layer bonded to two half piezoelectric materials planes

IntroductionDuetotheintrinsicelectro_mechanicalcouplingbehavior,piezoelectricmaterialsareveryusefulinelectronicdevices.However,mostpiezoelectricmaterialsarebrittlesuchasceramicsandcrystals.Therefore ,piezoelectricmaterialshaveatendencytodevelopcriticalcracksduringthemanufacturingandthepolingprocesses.So ,itisimportanttostudytheelectro_elasticinteractionandfracturebehaviorsofpiezoelectricmaterials.Theincreasingattentiontothestudyofcrackproblemsinpiezoelectricmaterialshasledtoalotofsignificantw…     

Mode III crack problems for two bonded functionally graded piezoelectric materials

This paper investigates the singular electromechanical field near the crack tips of an internal crack. The crack is perpendicular to the interface formed by bonding two half planes of different functionally graded piezoelectric material. The properties of two materials, such as elastic modulus, piezoelectric constant and dielectric constant, are assumed in exponential forms and vary along the crack direction. The singular integral equations for impermeable and permeable cracks are derived and solved by using the Gauss–Chebyshev integration technique. It shows that the stresses and electrical displacements around the crack tips have the conventional square root singularity. The stress intensity and electric displacement intensity factors are highly affected by the material nonhomogeneity parameters β and γ. The solutions for some degenerated problems can also be obtained.     

The scattering of harmonic elastic anti-plane shear waves by two collinear cracks in the piezoelectric plate by using the non-local theory

In this paper, the dynamic interaction between two collinear cracks in a piezoelectric material plate under anti-plane shear waves is investigated by using the non-local theory for impermeable crack surface conditions. By using the Fourier transform, the problem can be solved with the help of two pairs of triple integral equations. These equations are solved using the Schmidt method. This method is more reasonable and more appropriate. Unlike the classical elasticity solution, it is found that no stress and electric displacement singularity is present at the crack tip. The non-local dynamic elastic solutions yield a finite hoop stress at the crack tip, thus allowing for a fracture criterion based on the maximum dynamic stress hypothesis. The project supported by the Natural Science Foundation of Heilongjiang Province and the National Natural Science Foundation of China(10172030, 50232030)     

The dynamic behavior of two collinear interface cracks in magneto-electro-elastic materials

In this paper, the dynamic behavior of two collinear symmetric interface cracks between two dissimilar magneto-electro-elastic material half planes under the harmonic anti-plane shear waves loading is investigated by Schmidt method. By using the Fourier transform, the problem can be solved with a set of triple integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. To solve the triple integral equations, the jump of the displacements across the crack surface is expanded in a series of Jacobi polynomials. Numerical solutions of the stress intensity factor, the electric displacement intensity factor and the magnetic flux intensity factor are given. The relations among the electric filed, the magnetic flux field and the stress field are obtained.     

Dynamic stress intensity factors of multiple cracks in a functionally graded orthotropic half-plane

In the present paper dynamic stress intensity factor and strain energy density factor of multiple cracks in the functionally graded orthotropic half-plane under time-harmonic loading are investigated. By utilizing the Fourier transformation technique the stress fields are obtained for a functionally graded orthotropic half-plane containing a Volterra screw dislocation. The variations of the material properties are assumed to be exponential forms which the equilibrium has an analytical solution. The dislocation solution is utilized to formulate integral equation for the half-plane weakened by multiple smooth cracks under anti-plane deformation. The integral equations are of Cauchy singular type at the location of dislocation which are solved numerically to obtain the dislocation density on the faces of the cracks. The dislocation densities are employed to determined stress intensity factor and strain energy density factors (SEDFs) for multiple smooth cracks under anti-plane deformation. Numerical examples are provided to show the effects of material properties and the crack configuration on the dynamic stress intensity factors and SEDFs of the functionally graded orthotropic half-plane with multiple curved cracks.     

Multi-interface cracks in a piezoelectric layer bonded to two half-piezoelectric spaces under anti-plane shear loading

The behavior of four parallel symmetry permeable interface cracks in a piezoelectric layer bonded to two half-piezoelectric spaces under anti-plane shear loading is investigated. By using the Fourier transform, the problem can be solved with the help of two pairs of triple integral equations. These equations are solved by the Schmidt method. This process is quite different from that papers adopted previously. The normalized stress and electrical displacement intensity factors are determined for different geometric and property parameters for permeable crack surface conditions. Numerical examples are provided to show the effect of the geometry of the interacting cracks, the thickness and the materials constants of the piezoelectric layer upon the stress and electric displacement intensity factors of the cracks. It is found that the electric displacement intensity factors for the permeable crack surface conditions are much smaller than the results for the impermeable crack surface conditions.     

A mode III crack in functionally graded piezoelectric materials

This paper considers the mode III crack problem in functionally graded piezoelectric materials. The mechanical and the electrical properties of the medium are considered for a class of functional forms for which the equilibrium equations have an analytical solution. The problem is solved by means of singular integral equation technique. Both a single crack and a series of collinear cracks are investigated. The results are plotted to show the effect of the material inhomogeneity on the stress and the electric displacement intensity factors.