The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials

The dynamic behavior of two parallel symmetric cracks in functionally graded piezoelectric/piezomagnetic materials subjected to harmonic antiplane shear waves is investigated using the Schmidt method. The present problem can be solved using the Fourier transform and the technique of dual integral equations, in which the unknown variables are jumps of displacements across the crack surfaces, not dislocation density functions. To solve the dual integral equations, the jumps of displacements across the crack surfaces are directly expanded as a series of Jacobi polynomials. Finally, the relations among the electric, magnetic flux, and dynamic stress fields near crack tips can be obtained. Numerical examples are provided to show the effect of the functionally graded parameter, the distance between the two parallel cracks, and the circular frequency of the incident waves upon the stress, electric displacement, and magnetic flux intensity factors at crack tips.     

Dynamic behavior of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips

The dynamic interaction of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips subjected to the anti-plane shear harmonic stress waves was investigated. By using the Fourier transform, the problem can be solved with the help of a pair of triple integral equations in which the unknown variable is jump of displacement across the crack surfaces. These equations are solved using the Schmidt method. Numerical examples are provided to show the effect of the functionally graded parameter, the circular frequency of the incident waves and the thickness of the strip upon stress, electric displacement and magnetic flux intensity factors of cracks.     

The behavior of a crack in functionally graded piezoelectric/piezomagnetic materials under anti-plane shear loading

Summary In this paper, the behavior of a crack in functionally graded piezoelectric/piezomagnetic materials subjected to an anti-plane shear loading is investigated. To make the analysis tractable, it is assumed that the material properties vary exponentially with the coordinate parallel to the crack. By using a Fourier transform, the problem can be solved with the help of a pair of dual integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. These equations are solved using the Schmidt method. The relations among the electric displacement, the magnetic flux and the stress field near the crack tips are obtained. Numerical examples are provided to show the effect of the functionally graded parameter on the stress intensity factors of the crack.The authors are grateful for financial support from the Natural Science Foundation of Hei Long Jiang Province (A0301), the National Natural Science Foundation of China (50232030, 10172030), the Natural Science Foundation with Excellent Young Investigators of Hei Long Jiang Province(JC04-08) and the National Science Foundation with Excellent Young Investigators (10325208).     

Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties

The paper presents a fracture analysis for an electromagnetically dielectric crack in a functionally graded magnetoelectroelastic strip. It is considered that the material properties are varying exponentially along the width direction. Under the assumption of the in-plane magneto-electro-mechanical loadings, the dielectric crack is simulated by using the semi-permeable crack-face boundary conditions. The Fourier transform technique is applied to solve the boundary-value problem and four coupling singular integral equations are determined. A nonlinear system of algebraic equations is further derived and solved numerically to determine the electromagnetic field inside the crack. Then the field intensity factors of stress, electric displacement, and magnetic induction are given. Through the numerical computations, the effects of the material non-homogeneity and the permeability of crack interior on the electric displacement and the magnetic induction at the crack faces are studied. The variations of the intensity factors of stress, electric displacement, and magnetic induction versus the geometry of the crack, the strip width, and the material non-homogeneity are presented in graphics respectively.     

The dynamic behavior of two collinear interface cracks in magneto-electro-elastic materials

In this paper, the dynamic behavior of two collinear symmetric interface cracks between two dissimilar magneto-electro-elastic material half planes under the harmonic anti-plane shear waves loading is investigated by Schmidt method. By using the Fourier transform, the problem can be solved with a set of triple integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. To solve the triple integral equations, the jump of the displacements across the crack surface is expanded in a series of Jacobi polynomials. Numerical solutions of the stress intensity factor, the electric displacement intensity factor and the magnetic flux intensity factor are given. The relations among the electric filed, the magnetic flux field and the stress field are obtained.     

Basic solutions of multiple parallel symmetric mode-III cracks in functionally graded piezoelectric/piezomagnetic material plane

The Schmidt method is adopted to investigate the fracture problem of multiple parallel symmetric and permeable finite length mode-III cracks in a functionally graded piezoelectric/piezomagnetic material plane. This problem is formulated into dual integral equations, in which the unknown variables are the displacement jumps across the crack surfaces. In order to obtain the dual integral equations, the displacement jumps across the crack surfaces are directly expanded as a series of Jacobi polynomials. The results show that the stress, the electric displacement, and the magnetic flux intensity factors of cracks depend on the crack length, the functionally graded parameter, and the distance among the multiple parallel cracks. The crack shielding effect is also obviously presented in a functionally graded piezoelectric/piezomagnetic material plane with mul- tiple parallel symmetric mode-III cracks.     

功能梯度压电带中裂纹对SH波的散射

研究功能梯度压电带中裂纹对SH波的散射问题,为了便于分析,材料性质假定为指数模型,并假设裂纹面上的边界条件为电渗透型的.根据压电理论得到压电体的状态方程,利用Fourier积分变换,问题转化为对偶积分方程的求解.用Copson方法求解积分方程.求得了裂纹尖端动应力强度因子、电位移强度因子的解析表达式,最后数值结果显示了标准动应力强度因子与入射波数、材料参数、带宽、波数以及入射角之间的关系.     

Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate

This work deals with the mode III fracture problem of a cracked functionally graded piezoelectric surface layer bonded to a cracked functionally graded piezoelectric substrate. The cracks are normal to the interface and the electro-elastic material properties are assumed to be varied along the crack direction. Potential and flux types of boundary condition are assigned on the edge of the surface layer. The problem under the assumptions of impermeable and permeable cracks can be formulated to the standard singular integral equations, which are solved by using the Gauss–Chebyshev technique. The effects of the boundary conditions, the material properties and crack interaction on the stress and electric displacement intensity factors are discussed.     

Dynamic fracture behaviors of cracks in a functionally graded magneto-electro-elastic plate

In this paper the dynamic anti-plane problem for a functionally graded magneto-electro-elastic plate containing an internal or an edge crack parallel to the graded direction is investigated. The crack is assumed to be magneto-electrically impermeable. Integral transforms and dislocation density functions are employed to reduce the problem to Cauchy singular integral equations. Field intensity factors and energy release rate are derived, analyzed and partially calculated numerically. The effects of material graded index, loading combination parameter (including size and direction) and geometry criterion of the plate on the dynamic energy release rate are shown graphically. Numerical results indicate that increasing the graded index can all retard the crack extension, and that both the applied magnetic field loadings and electric field loadings play a dominant role in the dynamic fracture behaviors of crack tips.     

An embedded mixed-mode crack in a functionally graded magnetoelectroelastic infinite medium

This paper focuses on the study of the influence of a mixed-mode crack on the coupled response of a functionally graded magnetoelectroelastic material (FGMEEM). The crack is embedded at the center of a 2D infinite medium subjected to magnetoelectromechanical loads. The material is graded in the direction orthogonal to the crack plane and is modeled as a nonhomogeneous medium with anisotropic constitutive laws. Using Fourier transform, the resulting plane magnetoelectroelasticity equations are converted analytically into singular integral equations which are solved numerically to yield the crack-tip mode I and II stress intensity factors, the electric displacement intensity factors and the magnetic induction intensity factors. The main objective of this paper is to study the influence of material nonhomogeneity on the fields’ intensity factors for the purpose of gaining better understanding on the behavior of graded magnetoelectroelastic materials.     

Analytical solution of multiple moving cracks in functionally graded piezoelectric strip

The dynamic behaviors of several moving cracks in a functionally graded piezoelectric (FGP) strip subjected to anti-plane mechanical loading and in-plane electrical loading are investigated. For the first time, the distributed dislocation technique is used to construct the integral equations for FGP materials, in which the unknown variables are the dislocation densities. With the dislocation densities, the field intensity factors are determined. Moreover, the effects of the speed of the crack propagation on the field intensity factors are studied. Several examples are solved, and the numerical results for the stress intensity factor and the electric displacement intensity factor are presented graphically finally.     

Antiplane internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half plane

This paper deals with the antiplane magnetoelectroelastic problem of an internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half plane. The properties of the material such as elastic modulus, piezoelectric constant, dielectric constant, piezomagnetic coefficient, magnetoelectric coefficient and magnetic permeability are assumed in exponential forms and vary along the crack direction. Fourier transforms are used to reduce the impermeable and permeable crack problems to a system of singular integral equations, which is solved numerically by using the Gauss-Chebyshev integration technique. The stress, electric displacement and magnetic induction intensity factors at the crack tips are determined numerically. The energy density theory is applied to study the effects of nonhomogeneous material parameter β, edge conditions, location of the crack and load ratios on the fracture behavior of the internal crack.     

DYNAMIC STRESS FIELD AROUND THE MODE Ⅲ CRACK TIP IN AN ORTHOTROPIC FUNCTIONALLY GRADED MATERIAL

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Nonlocal theory solution of two collinear cracks in the functionally graded materials

In this paper, the interaction of two collinear cracks in functionally graded materials subjected to a uniform anti-plane shear loading is investigated by means of nonlocal theory. The traditional concepts of the nonlocal theory are extended to solve the fracture problem of functionally graded materials. To make the analysis tractable, it is assumed that the shear modulus varies exponentially with the coordinate vertical to the crack. By use of the Fourier transform, the problem can be solved with the help of a pair of triple integral equations, in which the unknown variable is the displacement on the crack surfaces. To solve the triple integral equations, the displacement on the crack surfaces is expanded in a series of Jacobi polynomials. Unlike the classical elasticity solutions, it is found that no stress singularity is present near the crack tips. The nonlocal elastic solutions yield a finite hoop stress at the crack tip, thus allowing us to use the maximum stress as a fracture criterion in functionally graded materials. The magnitude of the finite stress field depends on the crack length, the distance between two cracks, the parameter describing the functionally graded materials and the lattice parameter of the materials.     

Electromechanical impact of a crack in a functionally graded piezoelectric medium

The Mode-I transient response of a functionally graded piezoelectric medium is solved for a through crack under the in-plane mechanical and electric impact. Integral transforms and dislocation density functions are employed to reduce the problem to singular integral equations. Numerical results display the effects of the loading combination parameter λ and the material parameter βa on the dynamic stress intensity factor and electric displacement intensity factor. The energy density factor criterion is applied to obtain the maximum of the minimum energy density factor and the direction of crack initiation.     

功能梯度压电板条中电绝缘型运动裂纹的电弹性场

基于三维弹性理论和压电理论，对材料系数按指数函数规律分布的功能梯度压电板条中的反平面运动裂纹问题进行了求解。利用Fourier积分变换方法将电绝缘型运动裂纹问题化为对偶积分方程，并进一步归结为易于求解的第二类Fredholm积分方程。通过渐近分析，获得了裂纹尖端应力、应变、电位移和电场的解析解，给出了裂纹尖端场各个变量的角分布函数，并求得了裂纹尖端场的强度因子，分析了压电材料物性梯度参数、几何尺寸及裂纹运动速度对它们的影响。结果表明，对于电绝缘型裂纹，功能梯度压电板条中运动裂纹尖端附近的各个场变量都具有-1／2阶的奇异性；当裂纹运动速度增大时，裂纹扩展的方向会偏离裂纹面。     

DYNAMIC BEHAVIOR OF TWO PARALLEL SYMMETRY CRACKS IN MAGNETO-ELECTRO-ELASTIC COMPOSITES UNDER HARMONIC ANTI-PLANE WAVES

The dynamic behavior of two parallel symmetry cracks in magneto-electro-elastic composites under harmonic anti-plane shear waves is studied by Schmidt method. By using the Fourier transform, the problem can be solved with a pair of dual integral equations in which the unknown variable is the jumps of the displacements across the crack surfaces. To solve the dual integral equations, the jumps of the displacements across the crack surface were expanded in a series of Jacobi polynomials. The relations among the electric filed, the magnetic flux and the stress field were obtained. From the results, it can be obtained that the singular stresses in piezoelectric/piezomagnetic materials carry the same forms as those in a general elastic material for the dynamic anti-plane shear fracture problem. The shielding effect of two parallel cracks was also discussed.     

Thermally induced fracture of a smart functionally graded composite structure

Discussed is the fracture behavior of a cracked smart actuator on a substrate under thermal load. The actuator is made of piezoelectric material with functionally graded material (FGM) properties. Integral transform method is used to reduce the problem to the solution of a set of singular integral equations and is solved numerically. This paper is completed by including graphical plots of the thermal flow, stress and electric displacement intensity factors around the crack for different crack positions and material gradients. Directions of crack initiation are also predicted by using the energy density criterion.     

SCATTERING OF THE HARMONIC STRESS WAVE BY CRACKS IN FUNCTIONALLY GRADED PIEZOELECTRIC MATERIALS

The present paper considers the scattering of the time harmonic stress wave by a single crack and two collinear cracks in functionally graded piezoelectric material （FGPM）. It is assumed that the properties of the FGPM vary continuously as an exponential function. By using the Fourier transform and defining the jumps of displacements and electric potential components across the crack surface as the unknown functions, two pairs of dual integral equations are derived. To solve the dual integral equations, the jumps of the displacement and electric potential components across the crack surface are expanded in a series of Jacobi polynomials. Numerical examples are provided to show the influences of material properties on the dynamic stress and the electric displacement intensity factors.     

Two mode III internal cracks located within two bonded functionally graded piezoelectric half planes respectively

This paper studies the mode III crack problem of two bonded functionally graded piezoelectric half planes which contain a crack respectively. These two cracks are located normal to the interface. All the material properties are assumed to vary along the direction of the crack line. A system of singular integral equations for electrically impermeable and permeable cracks is derived and solved numerically by using the Gauss–Chebyshev integration formula. The influence of the nonhomogeneous parameters and the dependence of the crack interactions on the stress and electric displacement intensity factors are investigated.