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1.
We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93° to 149°. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180°.  相似文献   

2.
Silicon is employed in a variety of electronic and optical devices such as integrated circuits, photovoltaics, sensors, and detectors. In this paper, Au-assisted etching of silicon has been used to prepare superhydrophobic surfaces that may add unique properties to such devices. Surfaces were characterized by contact angle and contact angle hysteresis. Superhydrophobic surfaces with reduced hysteresis were prepared by Au-assisted etching of pyramid-structured silicon surfaces to generate hierarchical surfaces. Consideration of the Laplace pressure on hydrophobized hierarchical surfaces gives insight into the manner by which contact is established at the liquid/composite surface interface. Light reflectivity from the etched surfaces was also investigated to assess application of these structures to photovoltaic devices.  相似文献   

3.
The article reports on a very simple method to fabricate superhydrophobic surfaces with Cu-Zn alloy via changing the local oxygen concentration and formation of oxygen difference cell, which can be readily realized by covering or contacting the Cu-Zn alloy surface with a glass slide. This superhydrophobic film comes from the formation of a flower-like hierarchical structure due to the accelerated alloy etching. In contrast, the white film grown in the un-covered area showed a much lower hydrophobicity due to its different morphology. These superhydrophobic surfaces or superhydrophobic-hydrophobic surfaces are expected to find applications in making self-cleaning alloy surface, in metal anticorrosion, and in biomineralization, etc.  相似文献   

4.
Nanostructured superhydrophobic silicon surfaces with tunable reflectance are fabricated via a simple maskless deep reactive-ion etching process. By controlling the scale of the high-aspect-ratio nanostructures on a wafer-scale surface, surface reflectance is maximized or minimized over the UV-vis-IR range while maintaining superhydrophobic properties.  相似文献   

5.
Superhydrophobic surfaces are biomimetic structures with potential applications in several key technological areas. In the past decade, several top-down and bottom-up fabrication methods have been developed to create such surfaces. These typically combine a hierarchical structure and low surface energy coatings to increase the contact angle and decrease the rolling angles. Silicon-based superhydrophobic surfaces are particularly attractive since they can be integrated with active electronics in order to protect them from the detrimental effects of environmental water and moisture. In this work, we introduce a simple and inexpensive process incorporating electrochemical surface modification (to create a fractal shape micro-nano topography) in combination with a final wet etching step to fabricate a superhydrophobic silicon surface with a contact angle of 160 degrees and a sliding angle of less than 1 degree.  相似文献   

6.
Scanning probe microscopy has emerged as a powerful technique for mapping the surface morphology of biological specimens, including proteins and cells. In addition to providing measurements of topographic images, it enables the fabrication of micro-/nanostructures with a high spatial resolution. Herein, we demonstrate a simple and reliable method for the preparation of single Escherichia coli bacterial cell arrays using pre-fabricated microwell structures. Using a <100>-oriented silicon substrate, microwell arrays with inclined sidewalls were fabricated by scanning probe lithography and sequential chemical wet etching. The trapping efficiency of single cells was optimized by controlling the geometries of the microwells. These data suggest that single-cell arrays may be applicable in a variety of areas, including drug testing and toxicology, as well as basic cell biology.  相似文献   

7.
超声刻蚀法构建分级结构的超疏水表面   总被引:1,自引:0,他引:1  
在湿法刻蚀和超声空化的基础上, 采用超声刻蚀法制备了具有微纳米分级结构的超疏水表面. 以等体积比的硝酸/乙醇(体积分数为4%)和双氧水(质量分数为30%)的混合溶液作为刻蚀剂, 在室温下对60Si2Mn钢、 60#钢、 T10钢、 Cr06钢、 65Mn钢和硅钢表面超声刻蚀2~10 min, 构建出多种形貌的微纳米分级结构. 上述表面经氟硅烷修饰后具有超疏水性, 水的表观接触角高达157.0°, 155.8°, 157.4°, 154.9°, 157.6°和156.8°, 滚动角分别为6.5°, 19.2°, 6.1°, 7.8°, 6.7°和7.2°. 与常规刻蚀方法相比, 超声刻蚀的化学刻蚀作用因与空化作用耦合而得到强化和改变, 从而在钢表面构建出分级结构. 由于材料表面微结构形貌和固/液界面接触状态不同, 制得的超疏水表面表现出的润湿行为也不同. 超声刻蚀法简单易行, 成本低廉, 适用于其它金属表面构建微纳米分级结构和超疏水表面.  相似文献   

8.
This paper proposes a simple, precise, and controllable method to fabricate wettability-gradient surfaces. Combining electrochemical etching and lithography, different micro/nanostructures can be obtained by adjusting the etching time. After being modified by low energy substances, low adhesive superhydrophobic and sticky hydrophobic regions can be obtained on one surface. Based on the obtained adhesion gradient, droplets of different volumes can be controlled to roll off at dissimilar tilted angles via designing sticky hydrophobic tracks with different widths. Directional transportation of water droplets on curve tracks is also realized based on the anisotropic sliding angles parallel and perpendicular to the tracks.  相似文献   

9.
A straightforward metal-particle-induced, highly localized site-specific corrosion-like mechanism was proposed for the formation of aligned silicon-nanowire arrays on silicon in aqueous HF/AgNO3 solution on the basis of convincing experimental results. The etching process features weak dependence on the doping of the silicon wafers and, thus, provides an efficient method to prepare silicon nanowires with desirable doping characteristics. The novel electrochemical properties between silicon and active noble metals should be useful for preparing novel silicon nanostructures and also new optoelectronic devices.  相似文献   

10.
Surface roughness is promotive of increasing their hydrophilicity or hydrophobicity to the extreme according to the intrinsic wettability determined by the surface free energy characteristics of a base substrate. Top-down etched silicon nanowires are used to create superhydrophilic surfaces based on the hemiwicking phenomenon. Using fluorine carbon coatings, surfaces are converted from superhydrophilic to superhydrophobic to maintain the Cassie-Baxter state stability by reducing the surface free energy to a quarter compared with intrinsic silicon. We present the robust criteria by controlling the height of the nanoscale structures as a design parameter and design guidelines for superhydrophilic and superhydrophobic conditions. The morphology of the silicon nanowires is used to demonstrate their critical height exceeds several hundred nanometers for superhydrophilicity, and surpasses a micrometer for superhydrophobicity. Especially, SiNWs fabricated with a height of more than a micrometer provide an effective means of maintaining superhydrophilic (<10°) long-term stability.  相似文献   

11.
A simple technique was developed for the fabrication of a superhydrophobic surface on the aluminum alloy sheets. Different hierarchical structures(Ag, Co, Ni and Zn) were formed on the aluminum surface by the galvanic replacement reactions. After the chemical modification of them with fluorination, the wettability of the surfaces was changed from superhydrophilicity to superhydrophobicity. Scanning electron microscopy(SEM), energy dispersive spectrometry(EDS) and water contact angle measurement were performed to characterize the morphological characteristic, chemical composition and superhydrophobicity of the surfaces. The as-prepared superhydrophobic surfaces showed a water contact angle as high as ca.160° and sliding angle as low as ca.3°. We hope the method to produce superhydrophobic surface can be used in many fields.  相似文献   

12.
We report the drop impact characteristics on four hydrophobic surfaces with different well-scale structures (smooth, nano, micro, and hierarchical micro/nano) and the effects of those structures on the behavior of water drops during impact. The specimens were fabricated using silicon wet etching, black silicon formation, or the combination of these methods. On the surfaces, the microstructures form obstacles to drop spreading and retracting, the nanostructures give extreme water-repellency, and the hierarchical micro/nanostructures facilitate drop fragmentation. The maximum spreading factor (D*(max)) differed among the structures. On the basis of published models of D*(max), we interpret the results of our experiment and suggest reasonable explanations for these differences. Especially, the micro/nanostructures caused instability of the interface between liquid and air at Weber number We > ~80 and impacting drops fragmented at We > ~150.  相似文献   

13.
Plasma-based processes for surface wettability modification   总被引:1,自引:0,他引:1  
In this article, we describe a method to create rough features on silicon surfaces by reactive etching of a photoresist layer. The roughness and, consequently, the wettability of the surfaces can be modified by modifying the duration of plasma etching. Hydrophobic materials deposited on the rough silicon surface can be modified until a superhydrophobic behavior is obtained, whereas hydrophilic materials become more hydrophilic. The elaboration technique described herein offers an inexpensive and rapid method for the creation of tunable roughness on silicon surfaces with large areas.  相似文献   

14.
A surface roughening method by simple chemical etching was developed for the fabrication of superhydrophobic surfaces on three polycrystalline metals, namely aluminum, copper, and zinc. The key to the etching technique was the use of a dislocation etchant that preferentially dissolves the dislocation sites in the grains. The etched metallic surfaces, when hydrophobized with fluoroalkylsilane, exhibited superhydrophobic properties with water contact angles of larger than 150 degrees, as well as roll-off angles of less than 10 degrees for 8-microL drops. Also, the dislocation etching concept introduced here may be helpful in the fabrication of superhydrophobic surfaces on other polycrystalline substrates.  相似文献   

15.
We describe a new method of fabricating large-area, highly scalable, "hybrid" superhydrophobic surfaces on silicon (Si) substrates with tunable, spatially selective adhesion behavior by controlling the morphologies of Si nanowire arrays. Gold (Au) nanoparticles were deposited on Si by glancing-angle deposition, followed by metal-assisted chemical etching of Si to form Si nanowire arrays. These surfaces were chemically modified and rendered hydrophobic by fluorosilane deposition. Au nanoparticles with different size distributions resulted in the synthesis of Si nanowires with very different morphologies (i.e., clumped and straight nanowire surfaces). The difference in nanowire morphology is attributed to capillary force-induced nanocohesion, which is due to the difference in nanowire porosity. The clumped nanowire surface demonstrated the lotus effect, and the straighter nanowires demonstrated the ability to pin water droplets while maintaining large contact angles (i.e., the petal effect). The high contact angles in both cases are explained by invoking the Cassie-Baxter wetting state. The high adhesion behavior of the straight nanowire surface may be explained by a combination of attractive van der Waals forces and capillary adhesion. We demonstrate the spatial patterning of both low- and high-adhesion superhydrophobicity on the same substrate by the simultaneous synthesis of clumped and straight silicon nanowires. The demonstration of hybrid superhydrophobic surfaces with spatially selective, tunable adhesion behavior on single substrates paves the way for future applications in microfluidic channels, substrates for biologically and chemically based analysis and detection where it is necessary to analyze a particular droplet in a defined location on a surface, and as a platform to study in situ chemical mixing and interfacial reactions of liquid pearls.  相似文献   

16.
Both surface microstructure and low surface energy modification play a vital role in the preparation of superhydrophobic surfaces. In this study, a safe and simple electrochemical method was developed to fabricate superhydrophobic surfaces of Zr-based metallic glasses with high corrosion resistance. First, micro–nano composite structures were generated on the surface of Zr-based metallic glasses by electrochemical etching in NaCl solution. Next, stearic acid was used to decrease surface energy. The effects of electrochemical etching time on surface morphology and wettability were also investigated through scanning electron microscopy and contact angle measurements. Furthermore, the influence of micro–nano composite structures and roughness on the wettability of Zr-based metallic glasses was analysed on the basis of the Cassie–Baxter model. The water contact angle of the surface was 154.3° ± 2.2°, and the sliding angle was <5°, indicating good superhydrophobicity. Moreover, the potentiodynamic polarisation test and electrochemical impedance spectroscopy suggested excellent corrosion resistance performance, and the inhibition efficiency of the superhydrophobic surface reached 99.6%. Finally, the prepared superhydrophobic surface revealed excellent temperature-resistant and self-cleaning properties.  相似文献   

17.
Hierarchical roughness is known to effectively reduce the liquid-solid contact area and water droplet adhesion on superhydrophobic surfaces, which can be seen for example in the combination of submicrometer and micrometer scale structures on the lotus leaf. The submicrometer scale fine structures, which are often referred to as nanostructures in the literature, have an important role in the phenomenon of superhydrophobicity and low water droplet adhesion. Although the fine structures are generally termed as nanostructures, their actual dimensions are often at the submicrometer scale of hundreds of nanometers. Here we demonstrate that small nanometric structures can have very different effect on surface wetting compared to the large submicrometer scale structures. Hierarchically rough superhydrophobic TiO(2) nanoparticle surfaces generated by the liquid flame spray (LFS) on board and paper substrates revealed that the nanoscale surface structures have the opposite effect on the droplet adhesion compared to the larger submicrometer and micrometer scale structures. Variation in the hierarchical structure of the nanoparticle surfaces contributed to varying droplet adhesion between the high- and low-adhesive superhydrophobic states. Nanoscale structures did not contribute to superhydrophobicity, and there was no evidence of the formation of the liquid-solid-air composite interface around the nanostructures. Therefore, larger submicrometer and micrometer scale structures were needed to decrease the liquid-solid contact area and to cause the superhydrophobicity. Our study suggests that a drastic wetting transition occurs on superhydrophobic surfaces at the nanometre scale; i.e., the transition between the Cassie-Baxter and Wenzel wetting states will occur as the liquid-solid-air composite interface collapses around nanoscale structures. Consequently, water adheres tightly to the surface by penetrating into the nanostructure. The droplet adhesion mechanism presented in this paper gives valuable insight into a phenomenon of simultaneous superhydrophobicity and high water droplet adhesion and contributes to a more detailed comprehension of superhydrophobicity overall.  相似文献   

18.
通过化学刻蚀和阳极氧化在AA2024铝合金表面制备超疏水表面。当化学刻蚀时间超过3 min时,表面在很宽pH值范围内显示出水静态接触角大于150°。SEM和AFM照片表明化学刻蚀时间决定了试样表面形貌和粗糙度。FTIR用来研究氟硅烷(G502)与AA2024表面的结合。结果说明FAS(氟硅烷)分子与铝合金表面的三氧化二铝发生反应,并在阳极氧化膜层表面展示出优异的结合性能。超疏水表面的耐腐蚀性能通过在质量分数为3.5%的NaCl溶液中进行动电位极化和交流阻抗(EIS)测试。电化学测试结果和等效电路模型显示出超疏水表面显著改善抗腐蚀性能。  相似文献   

19.
Highly antireflective porous silicon surfaces with superhydrophobicity were obtained by means of chemical etching and fluoroalkylsilane self-assembly. The results show that wettability and reflectivity of these surfaces strongly depend on the etching method and the resultant surface morphology. All of the four resultant porous silicon surfaces by alkaline etching, acidic etching, thick Pt-assisted acidic etching, and thin Pt-assisted acidic etching can reduce reflectance, but the efficiency differs greatly. Except for the alkaline etching, the porous silicon surfaces produced by the other three etching methods can reach superhydrophobicity after fluoroalkylsilane modification. These differences are due to the different surface morphology and roughness. Moreover, the porous silicon surface produced by thin Pt-assisted acidic etching presents abundant holes and particles with diameters ranging from nanometers to submicrometers. This morphology enables the porous silicon surface to own a very low reflectance value that is averaged to be about 3% over the whole experimental photon wavelength spanning 300-800 nm.  相似文献   

20.
Silicon disk arrays and silicon pillar arrays with a close-packed configuration having an ordered periodicity were fabricated by the electrochemical etching of a silicon substrate through colloidal crystals used as a mask. The colloidal crystals were directly prepared by the self-assembly of polystyrene particles on a silicon substrate. The transfer of a two-dimensional hexagonal array of colloidal crystals to the silicon substrate could be achieved by the selective electrochemical etching of the exposed silicon surfaces, which were located in interspaces among adjacent particles. The diameter of the tip of the silicon pillars could be controlled easily by changing the anodization conditions, such as current density and period of electrochemical etching.  相似文献   

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