Adhesives and coatings from phenol-formaldehyde/resorcinol-formaldehyde resins

Resole phenol-formaldehyde resins were prepared and modified with the prepared resorcinol-formaldehyde resins. The optimum conditions of formulation and curing processes were studied to obtain modified wood adhesives characterized by high-tensile shear strength values. This study indicated that the more suitable conditions are equal weight ratios of phenol-formaldehyde to resorcinol-formaldehyde resins in the presence of paraformaldehyde (10 or 15 wt%) of the resin content as a curing agent at 80 or 25°C for 40 min or 100–110 days, respectively. The activation energies of the curing reactions for phenol-formaldehyde/resorcinol-formaldehyde resin samples were determined. Metallic and glass coatings from the previous pure resins and their formulated cured mixtures were prepared and evaluated as varnishes or paints. Copyright © 1998 John Wiley & Sons, Ltd.     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Synthesis and properties of a deuterated phenolic resin

A highly deuterated novolac‐type phenolic resin was prepared by polycondensation of deuterated phenol and formaldehyde using oxalic acid as an acid catalyst. The polycondensation of deuterated monomers and the formation of the highly deuterated phenolic resin were confirmed by the gel permeation chromatography, IR, and ¹H NMR analyses. With the exception of hydroxyl groups, the degree of deuteration was estimated to be more than 98%. The polymer conformation in THF solution was evaluated by the scaling exponent of the Mark–Houwink–Sakurada equation. The exponent of the deuterated phenolic resin is 0.26 in THF at 40 °C and is close to that of a nondeuterated phenolic resin, which suggests that phenolic resins behave like a compact sphere irrespective of deuteration. The curing behavior of the deuterated phenolic resin with hexamethylenetetramine was confirmed by differential scanning calorimetry analysis. The cured highly deuterated phenolic resin exhibits a lower incoherent neutron scattering background than that of the nondeuterated phenolic resin, which suggests that the former is suitable for matrix resins with low incoherent backgrounds for small‐angle neutron scattering studies of thermosetting resins. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011.     

Epoxy-modified, unsaturated polyester hybrid networks

Hybrid polymer networks (HPNs) based on unsaturated polyester resin (UPR) and epoxy resins were synthesized by reactive blending. The epoxy resins used were epoxidised phenolic novolac (EPN), epoxidised cresol novolac (ECN) and diglycidyl ether of bisphenol A (DGEBA). Epoxy novolacs were prepared by glycidylation of the novolacs using epichlorohydrin. The physical, mechanical, and thermal properties of the cured blends were compared with those of the control resin. Epoxy resins show good miscibility and compatibility with the UPR resin on blending and the co-cured resin showed substantial improvement in the toughness and impact resistance. Considerable enhancement of tensile strength and toughness are noticed at very low loading of EPN. Thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA) and differential scanning calorimetry (DSC) were employed to study the thermal properties of the toughened resin. The EPN/UPR blends showed substantial improvement in thermal stability as evident from TGA and damping data. The fracture behaviour was corroborated by scanning electron microscopy (SEM). The performance of EPN is found to be superior to other epoxy resins.     

Thermal and mechanical properties of epoxy resin toughened with epoxidized soybean oil

A series of new modified epoxy resin (EP) cured products were prepared from epoxidized soybean oil and commercial epoxy resin, with methyl nadic anhydride as curing agent and 1-methylimidazole as promoting agent. The thermal properties of the resins were characterized by DMA and TG; DSC was used to determine the curing process. Fourier transform infrared spectroscopy was utilized to investigate their molecular structures and scanning electron microscopy was used to observe the micro morphology of their impact fracture surfaces. Tensile and impact testing was employed to characterize the mechanical properties of the cured products. The combination of commercial EP with 20 wt% ESO resulted in a bioresin with the optimum set of properties: 130.5 °C T _g, 396.9 °C T _50 %, 74.89 MPa tensile strength, and 48.86 kJ m^?2 impact resistance.     

Preparation and properties of biocomposites composed of bio‐based epoxy resin,tannic acid,and microfibrillated cellulose

As new bio‐based epoxy resin systems, glycerol polyglycidyl ether (GPE) and sorbitol polyglycidyl ether (SPE) were cured with tannic acid (TA) at various conditions. When the curing conditions were optimized for the improvement of thermal and mechanical properties, the most balanced properties were obtained for the GPE/TA and SPE/TA cured at 160 °C for 2–3 h at the epoxy/hydroxyl ratio of 1/1. The cured SPE/TA had a higher glass transition temperature (T_g) and tensile strength than the cured GPE/TA. Next, biocomposites of GPE/TA and SPE/TA with microfibrillated cellulose (MFC) were prepared by mixing aqueous solution of the epoxy/curing reagent with MFC, and subsequent drying and curing at the optimized condition. For both the GPE/TA/MFC and SPE/TA/MFC biocomposites, T_g and the storage modulus at rubbery plateau region increased with increasing MFC content over the studied range of 3–15 wt %. The tensile strength at 25 °C for GPE/TA/MFC biocomposite with MFC content 10 wt % was 76% higher than that of control GPE/TA, while the tensile modulus was little improved. On the other hand, the tensile strength and modulus of SPE/TA/MFC biocomposite with MFC content 10 wt % were 30 and 55% higher than those of control SPE/TA, respectively. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 425–433, 2010     

The curing of epoxy resins with aminophenoxycyclotriphosphazenes

Aminophenoxycyclotriphosphazenes have been used as curing agents for epoxy resins. The thermal curing was performed in stages at 120–125 and 175–180°C followed by postcuring at 225°C to give tough brown polymers. The thermal curing reaction was monitored using FTIR and differential scanning calorimetry. Thermogravimetric analysis of the cured resins has shown thermal stability up to 350–340°C. The char yield obtained in nitrogen at 800°C was about 55–42% and in air at 700°C was about 40–32%. Graphite cloth laminates were prepared. The mechanical properties evaluated were found superior to those of commonly used epoxy resin systems. These resins are useful for making fire- and heat-resistant composites, laminates, molded parts, and adhesives.     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

Effect of temperature and volume on the tensile and adhesive properties of photocurable resins

Knowing the mechanical properties of UV‐curable resins at cryogenic conditions is important to ongoing fusion‐energy research and to emerging aerospace applications. The tensile and interfacial shear strengths of two commercially available UV‐curable resins were measured at room‐temperature and cryogenic conditions for both bulk and reduced (subnanoliter) specimen volumes. The tensile properties of cured specimens are remarkably sensitive to both testing temperature and specimen size. For one type of resin, the cold (?150 °C) tensile strength of subnanoliter specimens is ～9× larger (179 ± 19 MPa) than bulk values at room temperature. The interfacial shear strength between SiC fibers and small volumes of resin volumes is comparable to the bulk, room‐temperature tensile strength, but it varies over a wide range at ?150 °C (15–53 MPa). All resins were fully cured, and an analysis of fractured surfaces revealed microstructural features. The enhanced strength in microscopic specimens may be related to inhomogeneous stress fields that develop during cure. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 936–945     

A dismantlable photoadhesion system fabricated by an anionic UV curing of epoxy resins with a base amplifier having a disulfide bond

A base amplifier (BA) that autocatalytically generates a diamine having a disulfide bond has been developed. Diamines generated from this BA are integrated into cross‐linked networks of epoxy resins that also have disulfide bonds. Anionic UV curing is performed using a photobase generator, the BA and the epoxy resins, and cured films are obtained after UV irradiation and subsequent heating at 160 °C. Furthermore, this curing system is applied successfully to adhesion of two stainless substrates, which is cancelled with gentle heating and a shear force. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 237–241     

Dynamic mechanical properties of epoxy‐phenolic mixtures

The dynamic‐mechanical properties of different mixtures formed by an epoxy resin (DGEBA type) and a phenolic resin (resole type) cured by trietylenetetramine and/or p‐toluensulphonic acid at different concentrations have been studied by means of dynamic mechanical thermal analysis (DMTA). All samples were cured by pressing at 90 °C during 6 h. The mechanical studies were performed between ?100 to 300 °C at a heating rate of 2 °C/min. This study was also carried out for the epoxy‐TETA and phenolic‐p‐toluensulphonic acid systems. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1548–1555, 2005     

Preparation and properties characterization of gallic acid epoxy resin/succinic anhydride bionanocomposites modified by green reduced graphene oxide

Graphene oxide was reduced into reducing-graphene oxide (r-GO) successfully using gallic acid (GA) as a green reducing agent. Biobased gallic acid epoxy resin (GAER) was synthesized from renewable GA, and the biobased GAER/r-GO nanocomposites and glass fiber-reinforced composites were prepared with succinic anhydride as a curing agent. The dynamic mechanical, thermal, and mechanical properties of the composites with varying r-GO contents were characterized. When the content of r-GO was 0.5 wt%, the glass transition temperature was 10.4°C higher than the pure resin system. The thermal and mechanical properties were increased with increasing r-GO content; when the r-GO content was 1.0 wt%, the initial degradation temperature was enhanced by approximately 6.8°C, the tensile and impact strengths were 34.5% and 49.1% higher, respectively, than the pure cured GAER. The impact strength of GAER was higher than that of the bisphenol A epoxy resin/SUA curing system, but the tensile strength was lower than it.     

Epoxy resins from novel monomers with a bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐) substituent

A new diepoxide and a new diamine, both bearing bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐)‐substituted methylene linkages, were prepared through the reaction of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide with benzophenone derivatives via a simple addition reaction followed by a dehydration reaction. These two compounds were used as monomers for preparing cured epoxy resins with high phosphorus contents. The resultant epoxy resins showed high glass‐transition temperatures (between 131 and 196 °C). All of the cured epoxy resins exhibited high thermal stability, with 5% weight loss temperatures over 316 °C, and excellent flame retardancy, with limited oxygen index values of 37–50. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 359–368, 2002     

Effect of internal mold release agent on flexural and inter laminar shear properties of carbon and glass fabric reinforced thermoset composites

The study is focused on thermoset composites reinforced with carbon and glass woven fabrics. Two types of thermoset resins, for example, epoxy and vinyl ester were used as the matrix. Varying concentrations of internal mold releasing (IMR) agent was used in the resin. The composites were cured both at room temperature and at 80°C. The flexural properties were studied using 3‐point bending test method. Further theinter‐laminar shear strength (ILSS) was investigated using the short beam shear strength test based on 3‐point bending. The flexural modulus of room temperature cured epoxy resin is higher than that of high temperature cured epoxy resin and cured vinyl ester resin. The flexural modulus is lowest for 1% IMR sample in epoxy system and the modulus for 0% and 2% epoxy are not significantly different. Lowest flexural strength and modulus can be observed for the combination of reinforcement and curing conditions for samples containing 1% IMR for the epoxy systems. Carbon fiber is found to be less compatible with the vinyl ester resin system and the addition of IMR to the resin degraded the properties further. Inter‐laminar shear strength for epoxy‐based composites is not much affected by presence of IMR, but in case of vinyl ester based composites there is a decrease in ILSS on addition of IMR agent. The study explains variation in flexural properties on addition of IMR and change of curing conditions. These results can be used for ascertaining variation in mechanical properties in real use.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Recyclable carbon fiber‐reinforced plastics (CFRP) containing degradable acetal linkages: Synthesis,properties, and chemical recycling

Two epoxy resins containing degradable acetal linkages were synthesized by the reaction of cresol novolak‐type phenolic resin (CN) with vinyl ethers containing a glycidyl group [cyclohexane dimethanol vinyl glycidyl ether (CHDMVG) and 4‐vinyloxybutyl glycidyl ether (VBGE). Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating laminated prepreg sheets with CN‐CHDMVG resin (derived from CN and CHDMVG) and CN‐VBGE resin (derived from CN and VBGE), in which carbon fibers are impregnated with epoxy resins containing curing agents [dicyandiamide (DICY)] and curing accelerator [3‐(3,4‐dichlorophenyl)‐1,1‐dimethylurea (DCMU)]. CN‐CHDMVG‐based CFRPs and CN‐VBGE‐based CFRPs exhibited almost the same tensile strength as the conventional bisphenol‐A‐based CFRPs. CN‐CHDMVG‐based CFRPs and CN‐VBGE‐based CFRPs underwent smooth breakdown with the treatment of hydrochloric acid in tetrahydrofuran at room temperature for 24 h to regenerate strands of carbon fibers. The surface conditions of the recovered carbon fibers had little changes during degradation and recovery processes on the basis of scanning electron microscopy (SEM) and X‐ray photoelectron spectroscopy (XPS). The recovered carbon fibers exhibited almost the same tensile strength as virgin carbon fibers and hence would be reused for the production of CFRPs. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 1052–1059     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Syntheses and characterizations of thermally reworkable epoxy resins. Part I

To meet the need for reworkable epoxy resins, a series of cycloaliphatic diepoxides containing thermally cleavable carbamate linkages were synthesized and characterized. These materials were shown to undergo curing reactions with cyclic anhydride in a similar fashion as a commercial cycloaliphatic epoxide, except that the carbamate group within the diepoxides can act as the internal catalyst. Furthermore, cured samples of the formulations from these diepoxides started to decompose at lower temperatures, i.e., between 200–300°C as compared with 350°C for the cured sample of the commercial cycloaliphatic epoxide, which showed their potential to be used as reworkable underfill encapsulants in the electronic packaging area. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2991–3001, 1999