The physical properties of bisphenol-a-based epoxy resins during and after curing. II. Creep behavior above and below the glass transition temperature

The creep behavior of a series of fully cured epoxy resins with different crosslink densities was determined from the glassy compliance level to the equilibrium compliance J_e at temperatures above T_g and at the glassy level below T_g during spontaneous densification at four aging temperatures, 4,4-diamino diphenyl sulfone DDS was used to crosslink the epoxy resins. The shear creep compliance curves J(t) obtained with materials at equilibrium densities near and above T_g were compared at their respective T_gs. T_gs from 101 to 205°C were observed for the epoxies which were based on the diglycidyl ether of bisphenol A. Creep rates were found to be the same at short times, and equilibrium compliances J_e were close to the predictions of the kinetic theory of rubberlike elasticity. Time scale shift factors determined during physical aging were reduced to T_g. At compliances below 2 × 10^?10 cm²/dyn, Andrade creep, where J(t) is a linear function of the cube root of creep time, was observed. The time to reach an equilibrium volume at T_g was found to be longer for the epoxy resin with lower crosslink densities. The increase of density during curing is illustrated for the epoxy resin with the highest crosslink density.     

The physical properties of bisphenol-A-based epoxy resins during and after curing

A series of epoxy resins derived from diglycidyl ethers of bisphenol A with differing initial linear molecular chain lengths have been studied during and after curing with the diamines MDA (4,4′-methylene dianiline) and DDS (4,4′-diamino diphenyl sulfone). The properties that were measured during curing were the volume, the fictive temperature T_f, the gel fraction, the viscosity, and the equilibrium compliance. Graphs of T_f as a function the time of curing t_c obtained at four curing temperatures between 40 and 100°C have been reduced to a common curve. After curing, creep compliance curves J(t) were determined which characterize the viscoelastic response from the glassy compliance level to a rubbery equilibrium compliance level. The change in properties that occurs during the time-dependent spontaneous densification below the glass temperature T_g was monitored with repeated measurements of J(t). Time-scale shift factors as a function of volume contraction obtained during this physical aging below T_g were reduced to a common curve.     

Creep behavior of amorphous ethylene–styrene interpolymers in the glass transition region

The viscoelastic behavior of amorphous ethylene–styrene interpolymers (ESIs) was studied in the glass transition region. The creep behavior at temperatures from 15°C below the glass transition temperature (T_g) to T_g was determined for three amorphous ESIs. These three copolymers with 62, 69, and 72 wt % styrene had glass transition temperatures of 11, 23, and 33°C, respectively, as determined by DMTA at 1 Hz. Time–temperature superposition master curves were constructed from creep curves for each polymer. The temperature dependence of the shift factors was well described by the WLF equation. Using the T_g determined by DMTA at 1 Hz as a reference temperature, C₁ and C₂ constants for the Williams, Landel, and Ferry (WLF) equation were calculated as approximately 7 and 40 K, respectively. The master curves were used to obtain the retardation time spectrum and the plateau compliance. The entanglement molecular weight obtained from the plateau compliance increased with increasing styrene content as 1,600, 1,870, and 2,040, respectively. The entanglement molecular weight of the ESIs was much closer to that of polyethylene (1,390) than to that of polystyrene (18,700); this was attributed to the unique chain microstructure of these ESIs with no styrene–styrene dyads. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2373–2382, 1999     

Viscoelasticity of nanobubble‐inflated ultrathin polymer films: Justification by the coupling model

The nanobubble inflation method is the only experimental technique that can measure the viscoelastic creep compliance of unsupported ultrathin films of polymers over the glass–rubber transition zone as well as the dependence of the glass transition temperature (T_g) on film thickness. Sizeable reduction of T_g was observed in polystyrene (PS) and bisphenol A polycarbonate by the shift of the creep compliance to shorter times. The dependence of T_g on film thickness is consistent with the published data of free‐standing PS ultrathin films. However, accompanying the shift of the compliance to shorter times, a decrease in the rubbery plateau compliance is observed. The decrease becomes more dramatic in thinner films and at lower temperatures. This anomalous viscoelastic behavior was also observed in poly(vinyl acetate) and poly (n‐butyl methacrylate), but with large variation in the change of either the T_g or the plateau compliance. By now, well established in bulk polymers is the presence of three different viscoelastic mechanisms in the glass–rubber transition zone, namely, the Rouse modes, the sub‐Rouse modes, and the segmental α‐relaxation. Based on the thermorheological complexity of the three mechanisms, the viscoelastic anomaly observed in ultrathin polymer films and its dependence on chemical structure are explained in the framework of the Coupling Model. © 2012 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2013     

Physical aging of poly(ether sulfone)-modified epoxy resin

The physical aging process of 4,4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with poly(ether sulfone) (PES) was studied by differential scanning calorimetry (DSC) at four aging temperatures between T_g-50°C and T_g-10°C. At aging temperatures between T_g-50 and T_g-30°C, the experimental results of epoxy resin blended with 20 wt% of PES showed two enthalpy relaxation processes. One relaxation process was due to the physical aging of PES, the other relaxation process was due to the physical aging of epoxy resin. The distribution of enthalpy relaxation process due to physical aging of epoxy resin in the blend was broader and the characteristic relaxation time shorter than those of pure epoxy resin at the above aging temperatures (between T_g-50 and T_g-30°C). At an aging temperature between T_g-30 and T_g-10°C, only one enthalpy relaxation process was found for the epoxy resin blended with PES, the relaxation process was similar to that of pure epoxy resin. The enthalpy relaxation process due to the physical aging of PES in the epoxy matrix was similar to that of pure PES at aging temperatures between T_g-50 and T_g-10°C. © 1997 John Wiley & Sons, Inc.     

The effect of masked isocyanates on the moisture absorption of MY 720/DDS epoxy resin

Several masked isocyanates were prepared with variations in both the type of isocyanate and masking group. They were characterized by elemental analysis and NMR spectroscopy, and their unblocking temperatures were determined. In general, higher unblocking temperatures were obtained using acyclic and cyclic aliphatic isocyanates and fluorinated phenols. Those with unblocking temperatures in the range of 120–180°C were incorporated into MY 720/DDS epoxy resin prior to cure. Highly fluorinated variations were incompatible with the resin. IR and DSC analyses showed that residual functional groups in the epoxy resin reacted with the masked isocyanates. Reductions in moisture absorption as high as 65% were obtained depending on the masked isocyanate. DMA studies showed that the T_g of the epoxy resin is lowered by incorporation of the masked isocyanate but the elastic modulus (E′) is relatively unchanged at temperatures below T_g.     

Volume-dependent rate processes in an epoxy resin

Results for four different volume-dependent rate processes of an epoxy resin, Epon 1001F, fully cured with a stoichiometric amount of 4,4′-diamino diphenyl sulfone are presented: (1) specific volume measurements at constant rates of cooling; (2) time-dependent volume measurements after rapid temperature changes; (3) elongational creep compliance measurements; and (4) shear creep compliance measurements. Voluminal and shear retardation spectra are compared as are the temperature time scale shift factors, a_T obtained from the four processes. Volume–temperature cooling curves show the decreasing glass temperature with decreasing rate of cooling, but appear to reach the glass line at a constant temperature regardless of the rate of cooling. This narrowing of the “transition range” is not predicted by the Kovacs, Aklonis, Hutchinson, and Ramos (KAHR) multiparameter model, which assumes thermorheological simplicity.     

Approach to improving the toughness of TGMDA/DDS epoxy resin by blending with thermoplastic polymer powders

A series of hot-melt processable thermosetting compositions was prepared by blending N,N,N′,N′-tetraglycidyl-4,4′ -diaminodiphenyl-methane/4,4′-diaminodiphenylsulfone (TGMDA/DDS) epoxy resin and thermoplastic polymer powders with average particle size below 30 μm. The basic thermoplastic polymers were either a high T_g amorphous cardo polyimide (T_g=350°C) or commercial semicrystalline PA6 and PA12 polyamides. The resulting heterogeneous mixtures showed viscosity values below 5000 cps suitable for prepregging process. After cure, phase-separated morphologies were maintained with a rather limited interphase miscibility as demonstrated by thermomechanical analysis. Scanning electron microscope examination of fracture surfaces pointed out a strong adhesion between the powder particles and the surrounding polyepoxy network, particularly for the potentially reactive polyamide structures. Moreover, as shown by differential scanning calorimeter analysis, the crystallinity ratio of the PA6 and PA12 powders was lowered due to melting during thermal polymerization. The fracture toughness properties of the powder-containing materials were compared with those of a fully miscible cardo polyimide–TGMDA/DDS blend coming from an homogeneous resin composition. The best improvement in fracture energy was obtained for the powder-modified resins. The most effective composition filled with 16 wt% of powdered polyimide exhibited a fourfold increase in G_IC (388 J/m² versus 100 J/m²) without compromising the epoxy thermomechanical stability (T_g=227°C versus 223°C).     

Viscoelastic properties of amorphous polymers 3: low molecular weight poly(methylphenylsiloxane)

By making creep and recoverable creep measurements of a nearly monodisperse low molecular weight poly(methyl phenyl siloxane) sample, we have found on decreasing temperature towardsT _g that there is continuously a change in the viscoelastic spectrum concomitant with a decrease of the steadystate recoverable compliance. This behavior is exactly the same as previously observed in low molecular weight poly(styrene), proving that this spectacular anomaly in the viscoelasticity of low molecular weight polymers is general and deserves an explanation. Photon correlation spectroscopic measurements performed on the same sample have extended the observation of the viscoelastic response to shorter times and the result corroborates the trend of variation established by the creep data.Dedicated to Prof.Dr. E. W. Fischer on his 65th Birthday. Prof.Dr. Fischer is known for his valuable contribution to fosterine, international collaboration of research in polymer science. This work is an example of his contribution because it would not be possible without him bringing us together. One of us (KLN) would like to take this opportunity to thank Prof. Dr. Fischer for his unwaiving support of the 1st (Crete) and the 2nd (Alicante) International Discussion Meeting on Relaxations in Complex Systems     

Relation between the network structure and dynamic mechanical properties of a typical amine-cured epoxy polymer

The dynamic mechanical properties of a series of epoxy polymers of known network structure have been investigated. It was shown that the distance between crosslinks could be predicted from either the shift in the glass transition temperature T_g or by use of the dynamic modulus above T_g. The front factor in the equation of state for rubber elasticity was near unity for stoichiometric equivalence of epoxy and amine and increased slowly with excess of either component.     

A viscoelastic description of the glass transition-conversion relationship for reactive polymers

The glass transition temperature,T _g is a sensitive and practical parameter for following cure of reactive thermosetting systems. A new equation was developed for predicting theT _g -conversion relationship based on the Dillman-Seferis viscoelastic compliance model. It assumes that the changes inT _g are primarily due to changes in relaxation time as chain extension and crosslinking reduce the mobility of a polymer network. Such information is essential in combining kinetic and viscoelastic measurements, which monitor transformations of thermosets during cure. The equation derived from the viscoelastic model was shown to be applicable for a variety of experimental data. The success of the methodology was further demonstrated by comparing well-established relations, such as the Fox equation and the Di-Benedetto equation, to predictions made possible by adjusting two viscoelastic model parameters. Finally, the fitting power of the proposed equation was shown by fitting published epoxy data from the literature as well as experimental data on a relatively new resin system such as dicyanates used as a model in this study.Der GlasumwandlungspunktT _g ist eine empfindliche und praktische Grö\e zum Verfolgen der AushÄrtung reaktiver Duroplaste. Basierend auf dem viskoelastischen Steifigkeitsmodell von Dillman-Seferis wurde eine neue Gleichung zur Vorhersage der Beziehung zwischenT _g und Konversion entwickelt. Dabei wird angenommen, da\ die Änderung vonT _g in erster Linie durch eine Änderung der Relaxationszeit bedingt ist, da KettenverlÄngerung und Vernetzung die Beweglichkeit des Polymergefüges herabsetzen. Bei einer Kombination von kinetischen und viskoelastischen Messungen, mit denen die Umwandlungen wÄhrend des AushÄrtens von Duroplasten verfolgt werden können, ist diese Erkenntnis von gro\er Bedeutung. Die auf der Basis des viskoelastischen Modelles erhaltene Gleichung ist für eine gro\e Breite von experimentellen Daten anwendbar. Den Erfolg dieser Methodik zeigt weiterhin ein Vergleich bewÄhrter Beziehungen, wie z.B. der Foxschen Gleichung und der Gleichung von DiBenedetto, mit Aussagen, die durch Anpassung zweier viskoelastischer Parameter ermöglicht wurden. Die StÄrke der vorgeschlagenen Gleichung wird letztlich durch Anpassen von Epoxy-Daten aus der Literatur sowie von experimentellen Daten eines relativ neuen und in dieser Untersuchung als Modell benutzten Harzsystemes gezeigt.     

Simultaneous kinetic and microdielectric studies of some epoxy–amine systems

Three reactive epoxy–amine systems based on diglycidyl ether of bisphenol A (DGEBA) with 4,4′-diaminodiphenylsulfone (DDS), 4,4′-methylenebis [3-chloro 2,6-diethylaniline] (MCDEA), and 4,4′-methylenebis [2,6-diethylaniline] (MDEA), were studied during isothermal curings at 140 and 160°C. The simultaneous kinetic and dielectric studies allow to express conductivity, σ, in terms of conversion, x, and of glass transition temperature, T_g. The conductivity, σ₀, of the initial monomer mixture and, σ_∞ of the fully cured network are measured. It is found that:

• The glass transition temperature, T_g, versus conversion, x, curves follows the equation of Di Benedetto modified by Pascault and Williams
• There exists a linear relation between log σ/log σ₀ and T_g.

So, it is possible to predict both kinetic and dielectric behaviors of these epoxy-amine systems by the knowledge of T_g0, ΔC_p0, and σ₀, respectively, glass transition temperature, heat capacity, and conductivity of initial monomer mixture, T_g∞ and ΔC_p∞, and σ_∞, respectively, glass transition temperature and heat capacity and conductivity of fully cured network. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 2911–2921, 1998     

Effect of crosslink density on the pressure relaxation response of polycyanurate networks

The effect of crosslink density on the pressure-volume-temperature (PVT) behavior and on the pressure relaxation response for two polycyanurate networks is investigated using a custom-built pressurizable dilatometer. Isobaric cooling measurements were made to obtain the pressure-dependent glass transition temperature (T_g). The pressure relaxation studies were carried out as a function of time after volume jumps at temperatures in the vicinity of the pressure-dependent T_g, and the pressure relaxation curves obtained were shifted to construct master curves by time-temperature superposition. The reduced pressure relaxation curves are found to be identical in shape and placement, independent of crosslink density, when T_g is used as the reference temperature. The horizontal shift factors used to create the master curves are plotted as a function of the temperature departure from T_g (T − T_g), and they agree well with their counterparts obtained from the shear response. Moreover, the retardation spectra are derived from bulk compliance and compared to those from the shear. The results, similar to our previous work on polystyrene, indicate that at short times, the bulk and shear responses have similar underlying molecular mechanisms; however, the long-time mechanisms available to the shear response, which increase with decreasing crosslink density, are unavailable to the bulk response. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 2477–2486, 2009     

The temperature dependence of the equilibrium and instantaneous compliances of low molecular weight polystyrene melts

The equilibrium compliance of three low molecular weight polystyrene melts has been determined over the range 15–70°K above T_g from dynamic viscoelastic measurements using alternating shear. Results are favorably compared with the previous results of Plazek and O'Rourke obtained from creep measurements, but agreement with predictions based on the Rouse theory is obtained only in the case of the highest molecular weight sample.     

Pressure relaxation of polystyrene and its comparison to the shear response

Isothermal pressure relaxation as a function of temperature in two pressure ranges has been measured for polystyrene using a self-built pressurizable dilatometer. A master curve for pressure relaxation in each pressure regime is obtained based on the time–temperature superposition principle, and time–pressure superposition of the two master curves is found to be applicable when the master curves are referenced to their pressure-dependent T_g. The pressure relaxation master curves, the shift factors, and retardation spectra obtained from these curves are compared with those obtained from shear creep compliance measurements for the same material. The shift factors for the bulk and shear responses have the same temperature dependence, and the retardation spectra overlap at short times. Our results suggest that the bulk and shear response have similar molecular origin, but that long-time chain mechanisms available to shear are lost in the bulk response. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 3375–3385, 2007     

Isothermal and nonisothermal creep of lightly crosslinked cis-1,4 polybutadiene

A nonisothermal creep experiment has been analyzed to ascertain its suitability for determining the temperature dependence of low activation energy viscoelastic processes in elastomers far above T_g. The nonisothermal method was employed to determine the activation energy for creep near 35°C in a lightly crosslinked cis-1,4 polybutadiene elastomer at small strains within the linear viscoelastic region, and at various large deformations up to rupture. The observed activation energy was essentially independent of the level of strain, and the value of ΔH_a (～11 kcal/mole) determined via the nonisothermal creep method was in good agreement with the result (～12 kcal/mole) obtained via time-temperature superposition of isothermal linear viscoelastic creep data. The nonisothermal data allowed for an estimate of the volume of the “flow unit” associated with the controlling viscoelastic creep mechanism, attributed here to slippage of entanglements within the lightly crosslinked network.     

Toughening of a trifunctional epoxy system: IV. Dynamic mechanical relaxational study of the thermoplastic-modified cure process

Dynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T_g behavior of the epoxy phase. Prereaction of the PSF material with the epoxy resin was found to greatly increase the solubility of the PSF in the epoxy phase with little effect on the concentration of the epoxy monomer dissolving in the PSF phase. The curing behavior of the epoxy component in the thermoplastic phase was also investigated, in addition to changes in the mobility of the network at both gelation and vitrification. © 1997 John Wiley & Sons, Inc.     

Thermal properties of anhydride-cured bio-based epoxy blends

Epoxidized palm oil (EPO) (0–12 wt%) was added into petrochemical-based epoxy blends (diglycidyl ether of bisphenol-A (DGEBA)/cycloaliphatic epoxide resin/epoxy novolac resin) to develop a thermal curable bio-based epoxy system. The thermal behaviors of the EPO, epoxy blends (EB), and bio-based epoxy blends (EB/EPO) were characterized using differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DMT) and thermo-mechanical analysis (TM). The glass transition temperature (T _g) and storage modulus (E′) of the EB/EPO system was reduced with the increasing of the EPO loading. This is attributed to the plasticizing effect of the EPO. It was found that epoxy blends with higher loading of EPO possessed higher coefficient of thermal expansion (CTE) and tanδ value. This is due to the increase of the free volume and chain flexibility in the three-dimensional network of the epoxy blends. The internal thermal stresses of the EB/EPO were decreased as the increasing loading of EPO, owing to the reduction of crosslink density, modulus of elasticity, and T _g in the epoxy blends.     

High resolution solid‐state 13C‐NMR study of as‐cured and irradiated epoxy resins

This article presents the effects of strong ionizing radiations on the physico‐chemical modifications of aliphatic or aromatic amine‐cured epoxy resins based on diglycidyl ether of bisphenol A (DGEBA). Such epoxy resins have a considerable number of applications in the nuclear industrial field and are known to be very stable under moderate irradiation conditions. Using extensively high resolution solid‐state ¹³C‐NMR spectroscopy we show that the aliphatic amine‐cured resin (DGEBA‐TETA) appears much more sensitive to gamma rays than the aromatic amine‐cured one (DGEBA‐DDM). On the one hand, qualitative analyses of the high resolution solid‐state ¹³C‐NMR spectra of both epoxy resins, irradiated under similar conditions (8.5 MGy), reveal almost no change in the aromatic amine‐cured resin whereas new resonances are observed for the aliphatic amine‐cured resin. These new peaks were interpreted as the formation of new functional groups such as amides, acids and/or esters and to alkene groups probably formed in the aliphatic amine skeleton. On the other hand, molecular dynamics of these polymers are investigated by measuring the relaxation times, T_CH, T_1ρH and T_1C , before and after irradiation. The study of relaxation data shows the formation, under irradiation, of a more rigid network, especially for the aliphatic amine‐cured system and confirms that aromatic amine‐cured resin [DGEBA‐4,4′‐diaminodiphenylmethane(DDM)] is much less affected by ionizing radiations than the aliphatic amine‐cured resin [DGEBA‐triethylenetetramine(TETA)]. Moreover, it has been shown that the molecular modifications generated by irradiation on the powder of the aliphatic‐amine‐cured resin appear to be homogeneously distributed inside the polymers as no phase separations can be deduced from the above analyses. Copyright © 2001 John Wiley & Sons, Ltd.     

Influence of carboxyl‐terminated (butadiene‐co‐acrylonitrile) loading on the mechanical and thermal properties of cured epoxy blends

A mixture of epoxy with liquid nitrile rubber, carboxyl‐terminated (butadiene‐co‐acrylonitrile) (CTBN) was cured under various temperatures. The cured resin was a two‐phase system, where spherical rubber domains were dispersed in the matrix of epoxy. The morphology development during cure was investigated by scanning electron microscope (SEM). There was slight reduction in the glass transition temperature of the epoxy matrix (T_g) on the addition of CTBN. It was observed that, for a particular CTBN content, T_g was found to be unaffected by the cure temperature. Bimodal distribution of particles was noted by SEM analysis. The increase in the size of rubber domains with CTBN content is due probably to the coalescence of the rubber particles. The mechanical properties of the cured resin were thoroughly investigated. Although there was a slight reduction in tensile strength and young's modulus, appreciable improvements in impact strength, fracture energy, and fracture toughness were observed. Addition of nitrile rubber above 20 parts per hundred parts of resin (phr) made the epoxy network more flexible. The volume fraction of dispersed rubbery phase and interfacial area were increased with the addition of more CTBN. A two‐phase morphology was further established by dynamic mechanical analysis (DMA). © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2531–2544, 2004