The physical properties of bisphenol-A-based epoxy resins during and after curing

A series of epoxy resins derived from diglycidyl ethers of bisphenol A with differing initial linear molecular chain lengths have been studied during and after curing with the diamines MDA (4,4′-methylene dianiline) and DDS (4,4′-diamino diphenyl sulfone). The properties that were measured during curing were the volume, the fictive temperature T_f, the gel fraction, the viscosity, and the equilibrium compliance. Graphs of T_f as a function the time of curing t_c obtained at four curing temperatures between 40 and 100°C have been reduced to a common curve. After curing, creep compliance curves J(t) were determined which characterize the viscoelastic response from the glassy compliance level to a rubbery equilibrium compliance level. The change in properties that occurs during the time-dependent spontaneous densification below the glass temperature T_g was monitored with repeated measurements of J(t). Time-scale shift factors as a function of volume contraction obtained during this physical aging below T_g were reduced to a common curve.     

The evolution of the viscoelastic retardation spectrum during the development of an epoxy resin network

The evolution of the viscoelastic behavior of an epoxy resin at various stages of curing has been followed with the changes in the retardation spectrum. The creep J(t) and recoverable creep compliance J_r(t) curves of the neat epoxy resin Epon l00lF (Shell) were determined at temperatures between 30 and 77°C. The viscosity decreased over 8 orders of magnitude as the temperature was increased. Specimens with eight stages of network development were prepared by reacting all of the epoxy resin's oxirane rings with amine hydrogens from varying ratios of a monofunctional amine (methyl aniline) and a tetrafunctional amine 4,4′-diamino diphenyl sulfone (DDS). Preparations in which 25, 35, and 40% DDS were used did not result in a molecular network, so they were viscoelastic liquids. With 45% DDS, the product had a nascent network and was judged to be just beyond the point of incipient gelation. The remaining preparations from 0.50, 0.60, 0.70, and 1.0 DDS yielded tighter less compliant molecular networks. The creep and recoverable compliance curves were measured over a range of temperatures above the glass transition temperature, T_g. They were reduced to T_g, and retardation spectra L(ln τ) were calculated.     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Structure and property relationships in model diglycidyl ether of bisphenol‐a and diglycidyl ether of tetramethyl bisphenol‐a epoxy systems. I. Mechanical property characterizations

Model epoxy networks, with variations in crosslink density and in epoxy monomer rigidity, were prepared to study how the network structure affects modulus, T_g, and toughness/toughenability of epoxy resins. Diglycidyl ether of bisphenol‐A and diglycidyl ether of tetramethyl‐bisphenol‐A, along with the corresponding chain extenders, were chosen to study how monomer backbone rigidity and crosslink density affect physical and mechanical properties of epoxies. The present study indicates that, as expected, the backbone rigidity of the epoxy network, not the crosslink density alone, will strongly influence modulus and T_g of epoxy resins. Upon rubber toughening, it is found that the rigidity of the epoxy backbone and/or the nature of the crosslinking agent utilized are most critical to the toughenability of the epoxy. That is, the well‐known correlation between toughenability and the average molecular weight between crosslinks (M_c) does not necessarily hold true when the nature of epoxy backbone molecular mobility is altered. The potential significance of the present findings for a better design of toughened thermosets for structural applications is discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2137–2149, 1999     

Broad-line NMR studies of molecular motion in cured epoxy resins

The conformation of network chain segments in a rigid glassy DDM-cured bisphenol A epoxy resin has been determined by means of rotational isomeric-state model and confirmed by conformity of experimental NMR second moments with a theoretical estimate based on the model. The glass transition temperatures T_g have been determined from precipitate NMR line narrowing with increase in temperature due to the onset of rapid (>10⁴ Hz) main-chain molecular motion. The temperature dependence of the correlation frequency has been determined and the type and extent of molecular motion that occurs in such epoxy resins is discussed.     

Synthesis and properties of two novel silicon‐containing cycloaliphatic epoxy resins for electronic packaging application

In this paper, two silicon‐containing cycloaliphatic olefins were synthesized through the nucleophilic substitution reactions of cyclohex‐3‐enyl‐1‐methanol with di‐ or tri‐chlorosilane compounds. Then, after epoxidation, two new cycloaliphatic epoxy resins with different epoxy groups were successfully prepared. Their chemical structures were confirmed by ²⁹Si NMR, ¹H NMR, and Fourier‐transform infrared spectra (FTIR). The properties of cured products, including viscoelasticity, glass transition temperature (T_g), coefficient of thermal expansion, thermal stability and water absorption, were investigated. Compared to the difunctional epoxy resin, the trifunctional one exhibited a remarkably increased cross‐linking density from 0.82 to 4.08 × 10^?3 mol/cm³ and T_g from 157 to 228°C. More importantly, prior to curing, they had viscosities of only 240–290 mPa sec at 25°C, which were much lower than that of ERL‐4221 (409 mPa sec), providing the possibility of easy processing. The high glass transition temperatures, good thermal stabilities, and mechanical properties as well as excellent flowability endow the silicon‐containing epoxy resins with promising potential in microelectronic packaging application. Copyright © 2011 John Wiley & Sons, Ltd.     

Viscoelastic properties of amorphous polymers. 5. A coupling model analysis of the thermorheological complexity of polyisobutylene in the glass-rubber softening dispersion

Isothermal data of high molecular weight polyisobutylene obtained by mechanical measurements with a spectral range over eight decades and additional photon correlation measurements have found that there are three distinct viscoelastic mechanisms in the glass-rubber transition zone. Theoretical considerations have helped to identify these three mechanisms to originate separately from local segmental (α) modes, sub-Rouse (sR) modes, and Rouse (R) modes. The temperature dependences of the shift factors of these mechanisms, a_T,α, a_T,sR and a_T,R, determined over a common temperature range are found to be all different. The differences in temperature dependences are explained quantitatively by the coupling model. The local segmental motion contributes to compliances ranging from the glassy compliance, J_g, up to 10^−8.5 Pa⁻¹. The sub-Rouse modes contribute in the compliance range, 10^−8.5 ≤ J(t) ≤ 10⁻⁷ Pa⁻¹. The Rouse modes account for the compliances in the range of 10⁻⁷ Pa⁻¹ ≤ J(t) ≤ J_plateau, where J_plateau is the plateau compliance. The magnitudes of the bounds given here are only rough estimates. Shift factors, a_T, obtained by time-temperature superpositioning of viscoelastic data taken in the softening transition over a limited experimental window are shown to be a combination of the three individual shifts factors, a_T,α, a_T,sR, and a_T,R. Consequently, care must be exercised in interpreting or using the WLF equation that fits the shift factors of the entire softening dispersion, because the latter do not describe the temperature dependence of any one of the three viscoelastic mechanisms. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys, 35: 599–614, 1997     

Positronium annihilation in amine-cured epoxy polymers

Positronium annihilation spectroscopy (PAS) has been used to study the microstructural properties of amine-cured epoxy polymers. We have determined the free-volume “hole” sizes in these polymers by comparing the observed ortho-positronium lifetimes with the known lifetime–free volume correlation for low-molecular-weight systems. The free volumes for four epoxies with different crosslink densities are found to vary significantly over the temperature range between ?78° and 250°C. The free-volume holes for these polymers are found to range from 0.025 to 0.220 nm³. Two important transition temperatures were found: one corresponds to the glass transition temperature T_g determined by differential scanning calorimetry (DSC), and the other occurs about 80–130°C below T_g. The sub-T_g transition temperature is interpreted tentatively as being where hole size reaches dimensions adequate for positronium trapping or else the onset temperature for local mode or side-chain motions. These two transition temperatures plus two additional onset temperatures are found to be correlated with crosslink densities calculated from stoichiometry.     

Effect of crosslink length on the enthalpy relaxation of fully cured epoxy–diamine resins

Enthalpy relaxation of epoxy–diamine thermosets of different crosslink lengths (CLL) has been studied by DSC. The epoxy resins based on diglycidyl ether of bisphenol A were cured with ethylenediamine (FEDA), and diamines of polyoxypropylene of 2.6 and 5.6 oxypropylene units, named FJ230 and FJ400, respectively. As was expected, increasing the CLL decreases the glass transition temperature T_g from 121°C (FEDA) to 47°C (FJ400). Aging experiments at T_g − 20 K for each resin permit the determination of the enthalpy loss, the relaxation rate per decade (β_H), and the nonlinearity parameter, x. The apparent activation energy, Δh*, and the nonexponentiality parameter β are found for each resin from intrinsic cycles in which the sample is heated at 10 K min⁻¹ following cooling at various rates through the glass transition region. An increase of CLL is related to an increase of β_H, and of the nonlinearity parameter. In agreement with the general trend for thermoplastic polymers, the increase of the parameter x is correlated with a decrease of Δh* and with an increase in the nonexponentiality parameter. Application of the Adam–Gibbs (AG) theory reveals that the parameters B and T_f/T₂ increase with CLL, corresponding to a decrease of the nonlinear behavior of the glassy epoxies. However, the T₂ values calculated in this way appear unrealistic, and the alternative assumption that T₂ = T_g −51.6 K, making use of the “universal” WLF constant, leads to a much smaller variation of B, which nevertheless still increases with CLL. From a consideration of the minimum number of configurations required for a cooperative rearrangement, it is argued that the elementary activation energy Δμ increases, and the minimum size of the cooperatively rearranging region decreases as CLL increases. This is consistent with the relaxation process becoming more cooperative as the CLL decreases, as is suggested by the decrease in the value of β. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 456–468, 2000     

Continuous and gradual photo-activation methods: influence on degree of conversion and crosslink density of composite resins

Thermal properties and degree of conversion (DC%) of two composite resins (microhybrid and nanocomposite) and two photo-activation methods (continuous and gradual) displayed by the light-emitting diode (LED) light-curing units (LCUs) were investigated in this study. Differential scanning calorimetry (DSC) thermal analysis technique was used to investigate the glass transition temperature (T _g) and degradation temperature. The DC% was determined by Fourier transform infrared spectroscopy (FT-IR). The results showed that the microhybrid composite resin presented the highest T _g and degradation temperature values, i.e., the best thermal stability. Gradual photo-activation methods showed higher or similar T _g and degradation temperature values when compared to continuous method. The Elipar Freelight 2^TM LCU showed the lowest T _g values. With respect to the DC%, the photo-activation method did not influence the final conversion of composite resins. However, Elipar Freelight 2^TM LCU and microhybrid resin showed the lowest DC% values. Thus, the presented results suggest that gradual method photo-activation with LED LCUs provides adequate degree of conversion without promoting changes in the polymer chain of composite resins. However, the thermal properties and final conversion of composite resins can be influenced by the kind of composite resin and LCU.     

Viscoelastic behavior of low molecular weight polystyrene

The shear creep and creep recovery behavior of narrow molecular weight distribution polystyrene samples of low molecular weight, 1.1 × 10³, 3.4 × 10³, and 1.57 × 10⁴ are reported as a function of temperature, near and above the glass temperature. Time-temperature equivalence for the total creep compliance is found to be nonapplicable, and in fact the steady-state recoverable compliance, J_e, is a strong function of temperature. The time-scale shift factors for the recoverable compliance are analyzed in the light of free volume theory. Viscosity data are presented for samples with molecular weights between 1.1 × 10³ and 6.0 × 10⁵. The temperature dependence of the characteristic time constant ηJ_e can be explained in terms of free volume concepts whereas that of viscosity η cannot. Effects of residual molecular weight heterogeneity are demonstrated.     

Glass transition temperature for epoxy-diamine networks

The glass transition temperature of systems based on epoxy resin and a number of diamines has been determined by using a torsion pendulum. An equation relating composition and crosslink density with the glass transition temperature has been established which gives reasonable predictions of the glass transition temperatures for systems based on aliphatic or aromatic amines and methylated amines and for systems containing a monofunctional epoxy diluent. The equation may be used to predict T_g for systems with non-stoichiometric quantities of curing agent and blends of amines. Deviation of the predicted and observed values for T_g is interpreted in terms of differences between definitions of T_g used by other workers and, also the occurrence of competing side reactions during polymerization which lead to additional crosslinks.     

Investigating Chain Dynamics in Highly Crosslinked Polymers using Solid‐State 1H NMR Spectroscopy

Solid state ¹H NMR line‐shape analysis and (double quantum) DQ ¹H NMR experiments have been used to investigate the segmental and polymer chain dynamics as a function of temperature for a series of thermosetting epoxy resins produced using different diamine curing agents. In these thermosets, chemical crosslinks introduce topological constraints leading to residual stresses during curing. Materials containing a unique ferrocene‐based diamine (FcDA) curing agent were evaluated to address the role of the ferrocene fluxional process on the atomic‐level polymer dynamics. At temperatures above the glass transition temperature (T_g), the DQ ¹H NMR experiments provided a measure of the relative effective crosslink and entanglement densities for these materials and revealed significant polymer chain dynamic heterogeneity in the FcDA‐cured thermosets. © 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2019 , 57, 1143–1156     

Physical aging of poly(ether sulfone)-modified epoxy resin

The physical aging process of 4,4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with poly(ether sulfone) (PES) was studied by differential scanning calorimetry (DSC) at four aging temperatures between T_g-50°C and T_g-10°C. At aging temperatures between T_g-50 and T_g-30°C, the experimental results of epoxy resin blended with 20 wt% of PES showed two enthalpy relaxation processes. One relaxation process was due to the physical aging of PES, the other relaxation process was due to the physical aging of epoxy resin. The distribution of enthalpy relaxation process due to physical aging of epoxy resin in the blend was broader and the characteristic relaxation time shorter than those of pure epoxy resin at the above aging temperatures (between T_g-50 and T_g-30°C). At an aging temperature between T_g-30 and T_g-10°C, only one enthalpy relaxation process was found for the epoxy resin blended with PES, the relaxation process was similar to that of pure epoxy resin. The enthalpy relaxation process due to the physical aging of PES in the epoxy matrix was similar to that of pure PES at aging temperatures between T_g-50 and T_g-10°C. © 1997 John Wiley & Sons, Inc.     

Mechanical and Thermal Properties and Morphology of Epoxy Resins Modified by a Silicon Compound

A silicon compound (GAPSO) was synthesized to modify the diglycidyl ether of bisphenol-A (DGEBA). The chemical structure of GAPSO was confirmed using FT-IR, ²⁹Si NMR and GPC. The mechanical and thermal properties and morphologies of the cured epoxy resins were investigated by impact testing, tensile testing, differential scanning calorimetry and environmental scanning electron microscopy. The impact strength and tensile strength were both increased by introducing GAPSO, meanwhile the glass transition temperature (T_g ) was not decreased and the morphologies of the fracture surfaces show that the compatibility of GAPSO with epoxy resin was very good and the toughening follows the pinning and crack tip bifurcation mechanism. The high functional groups in GAPSO can react during the curing process, and chemically participate in the crosslinking network. GAPSO is thus expected to improve the toughness of epoxy resin, meanwhile maintain the glass transition temperature.     

Effects of high-pressure CO2 on the glass transition temperature and mechanical properties of polystyrene

Hydrostatic pressure usually increases the glass transition temperature T_g of a polymer glass by decreasing its free volume; if the pressurizing environment is soluble in the polymer, however, one might expect an initial decrease in T_g with pressure as the polymer is plasticized by the environment. Just such a minimum in the T_g of polystyrene (PS) is observed as the pressure of CO₂ gas is increased over the range 0.1–105 MPa from both ultrasonic (1 MHz) measurements of Young's modulus E and static measurements of the creep compliance J. A time-temperature-pressure superposition law is obeyed by PS which allows a master curve for the compliance to be constructed and shift factors to be determined. A master curve for E is then obtained by using the Boltzmann superposition principle. The compliance J reaches a maximum, and E and T_g reach minima, at a CO₂ pressure of ca. 20 MPa at both 34 and 45°C, which are above the critical temperature (31°C) of CO₂. At the minimum, T_g is 41 at 45°C and 36 at 34°C, the larger depression at 34°C evidently corresponding to the higher solubility of CO₂ at the lower temperature. The plasticization effect due to CO₂ can be isolated by subtracting the effect of hydrostatic pressure alone from the experimental data. The results leave no doubt that at high pressures CO₂ gas is a severe plasticizer for polystyrene.     

Ultimate tensile properties of elastomers. VII. Effect of crosslink density on time–temperature dependence

Data on tensile strength and elongation at break for a series of Viton A-HV vulcanizates are discussed. The data were obtained at various extension rates at temperatures from ?5 to 230°C (25 ? T — T_g ? 260°C) on seven vulcanizates having crosslink densities v_e (estimated from C₁ in the Mooney-Rivlin equation) from 0.46 × 10^?5 to 24.4 × 10^?5 mole/cm³. At an extension rate of 1 min^?1, an increase in v_e affects the tensile strength σ_b (based on the undeformed cross-sectional area) and the true tensile strength σ_bσ_b (based on the cross-sectional area of a deformed specimen) as follows: σ_b is essentially constant at a low temperature; it passes through a decided maximum at intermediate temperatures; and it increases to a plateau at elevated temperatures. In contrast, λ_bσ_b decreases markedly at all temperatures, an exception being the most lightly crosslinked vulcanizate(s). Application of time—temperature superposition to the ultimate-property data gave log a_T; its temperature dependence is that typical of nonpolar rubbery polymers. Data on the vulcanizates were compared in corresponding temperature states by plotting log 273σ_b/T, log 273λ_bσ_b/T, and (λ_b — 1)/(λ_b — 1)_max against logt_b/(t_b)_max, where t_b is the temperature-reduced time to break and (t_b)_max is the value at which the ultimate extension ratio λ_b attains its maximum, (λ_b)_max. Except for the most lightly crosslink vulcanizate, the comparison shows that 273λ_bσ_b/T and (λ_b — 1)/(λ_b — 1)_max are substantially independent of (or only weakly dependent on) crosslink density, that 273λ_b/T increases with v_e, and that 273λ_b/T ∝? v_e^0.6 and λ_b ∝? v_e^?0.4 at a large value of t_b/(t_b)_max.     

Thermal properties of anhydride-cured bio-based epoxy blends

Epoxidized palm oil (EPO) (0–12 wt%) was added into petrochemical-based epoxy blends (diglycidyl ether of bisphenol-A (DGEBA)/cycloaliphatic epoxide resin/epoxy novolac resin) to develop a thermal curable bio-based epoxy system. The thermal behaviors of the EPO, epoxy blends (EB), and bio-based epoxy blends (EB/EPO) were characterized using differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DMT) and thermo-mechanical analysis (TM). The glass transition temperature (T _g) and storage modulus (E′) of the EB/EPO system was reduced with the increasing of the EPO loading. This is attributed to the plasticizing effect of the EPO. It was found that epoxy blends with higher loading of EPO possessed higher coefficient of thermal expansion (CTE) and tanδ value. This is due to the increase of the free volume and chain flexibility in the three-dimensional network of the epoxy blends. The internal thermal stresses of the EB/EPO were decreased as the increasing loading of EPO, owing to the reduction of crosslink density, modulus of elasticity, and T _g in the epoxy blends.     

Vanillin‐derived phosphorus‐containing compounds and ammonium polyphosphate as green fire‐resistant systems for epoxy resins with balanced properties

Flame retardants from vanillin when utilized together with ammonium polyphosphate (APP) yield excellent synergistic flame retardancy toward epoxy resins. Bisphenol A epoxy resins have been widely used due to their excellent mechanical properties, chemical resistance, electrical properties, adhesion, etc., while they are flammable. Environment‐friendly and bio‐based flame retardants have captured increasing attention due to their ecological necessity. In this paper, 3 bio‐based flame retardants were synthesized from abundant and more importantly renewable vanillin, and their chemical structures were determined by ¹H NMR and ¹³C NMR. They were used together with APP (an environment‐friendly commercial flame retardant) to improve the fire resistance of bisphenol A epoxy resin. With the addition APP content of 15 phr, the modified bisphenol A epoxy resin could reach UL‐94V0 rating during vertical burning test and limit oxygen index values of above 35%, but reducing APP content to 10 phr, the flame retardancy became very poor. With the total addition content of 10 phr, the epoxy resins modified by 7 to 9 phr APP and 1 to 3 phr bio‐based flame retardants with epoxy groups or more benzene rings showed excellent flame retardancy with UL‐94V0 rating and limit oxygen index values of around 29%. The T_gs of the epoxy resins could be remained or even increased after introducing bio‐based flame retardants, as the control; those of APP alone‐modified epoxy resins compromised a lot. The green synergistic flame‐retardant systems have a great potential to be used in high‐performance materials.     

Effects of novel reactive toughening agent on thermal stability of epoxy resin

A reactive amino-ended toughener was blended with different commercial epoxy resins namely, diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl p-aminophenol and 1,5-naphthalenediamine as curing agent. The toughener was an aromatic amino-ended copolyethersulphone (coPES):poly(ether-sulphone)–poly(etherether-sulphone). The effect of the toughener on the thermal decomposition and char oxidation behaviour of the epoxy resins was studied by the simultaneous differential thermal analysis and thermogravimetric techniques. The glass transition temperature (T _g) as well as characteristic parameters of decomposition, initial decomposition temperature (T _i) and temperature at maximum degradation rate (T _m), in both inert and oxidative environments, were determined in order to verify the influence of toughener on the thermal degradation of the different epoxy systems. It was observed that the presence of coPES maintains the high level thermal stability of the resin and that the glass transition temperature increase with the toughener percentage.