Room temperature oxidation of Cu(3)Ge films grown on Si and Si(1-x)Ge(x) substrates

Room temperature oxidation of Cu3Ge films grown on Si, Si(0.85)Ge(0.15) and Si(0.52)Ge(0.48) substrates, respectively, at a temperature of 200-300 degrees C was studied using transmission electron microscopy (TEM) in conjunction with energy dispersive spectrometry (EDS) and scanning electron microscopy (SEM). For Cu(3)Ge films grown at 200 degrees C and subsequently exposed in air for 1 week oxide protrusions and oxide networks appeared in the film surface and grain boundaries of Cu(3)Ge, respectively. At room temperature O from air and Si from the substrate, diffused along the grain boundaries of Cu(3)Ge to react with Cu(3)Ge grains, initiating the Cu(3)Si-catalyzed oxidation. Cu(3)Ge films are superior to Cu(3)(Si(1-x)Gex) films in retarding Cu(3)Si-catalyzed oxidation. Annealing at 300 degrees C allowed Si diffusion from the substrate into the Cu(3)Ge overlayer to form Cu(3)(Si(1-x)Gex), enhancing the Cu(3)Si-catalyzed oxidation rate. In the present study, Cu(3)Ge films grown on Si(0.52)Ge(0.48) at 200 degrees C show the best resistance to room temperature oxidation because higher Ge concentration in the substrate and lower temperature annealing can more effectively retard Si diffusion from the substrate into the Cu(3)Ge overlayer, and hence reduce the Cu(3)Si-catalyzed oxidation rate.     

Size-dependent phase transformations in nanoscale pure and Y-doped zirconia thin films

Phase stability in nanoscale pure zirconia and 9.5 mol.% yttria-doped zirconia (YDZ) thin films was studied by in-situ transmission electron microscopy. Oxygen vacancies are found to play a significant role in determining the microstructure and phase evolution. Pure zirconia thin films of ～52 nm thickness were stabilized without any dopants at room temperature, whereas they transformed into a tetragonal phase upon heating to 400°C. On the other hand, 9.5% yttria doping enables stabilization of the cubic structure regardless of grain growth. Annealing of amorphous YDZ films in air (oxygen-rich) leads to tetragonal phase formation, whereas ultrahigh vacuum (oxygen-deficient) annealed samples display a cubic phase at high temperature. Detailed discussions on the effects of initial microstructure, oxygen deficiency, aliovalent doping and thickness are presented.     

Stranski–Krastanow growth of multilayer In(Ga)As/GaAs QDs on Germanium substrate

We have described Stranski–Krastanow growth of multilayer In(Ga)As/GaAs QDs on Ge substrate by MBE. The growth technique includes deposition of a thin germanium buffer layer followed by migration-enhanced epitaxy (MEE) grown GaAs layer at 350°C. The MEE layer was overgrown by a thin low-temperature (475°C) grown GaAs layer with a subsequent deposition of a thick GaAs layer grown at 590°C. The sample was characterized by AFM, cross-sectional TEM and temperature-dependent PL measurements. The AFM shows dense formation of QDs with no undulation in the wetting layer. The XTEM image confirms that the sample is free from structural defects. The 8 K PL emission exhibits a 1051 nm peak, which is similar to the control sample consisting of In(Ga)As/GaAs QDs grown on GaAs substrate, but the observed emission intensity is lower. The similar slopes of Arrhenius plot of the integrated PL intensity for the as-grown QD sample grown on Ge substrate as well as for a reference QD sample grown on GaAs substrate are found to be identical, indicating a similar carrier emission process for both the samples. This in turn indicates coherent formation of QDs on Ge substrate. We presume due to the accumulated strain associated with the self-assembled growth of nanostructures on Ge that nonradiative recombination centers are introduced in the GaAs barrier in between the QD layers, which in turn degrades the overall optical quality of the sample.     

Regrowth kinetics of amorphous Ge layers created by 74Ge and 28Si implantation of Ge crystals

Epitaxial regrowth of ion-implanted amorphous Ge on the underlying crystal substrate occurs between 300 to 400°C with an activation energy of 2.0 eV and a rate of 100Å/min on <100> Ge at 350°C. The regrowth rate is strongly dependent on the orientation of the underlying Ge crystal. The regrowth behavior of amorphous Ge is similar to that of implanted amorphous Si.     

Aluminum-assisted crystallization and <Emphasis Type="Italic">p</Emphasis>-type doping of polycrystalline Si

Aluminum-doped p-type polycrystalline silicon thin films have been synthesized on glass substrates using an aluminum target in a reactive SiH₄+Ar+H₂ gas mixture at a low substrate temperature of 300 °C through inductively coupled plasma-assisted RF magnetron sputtering. In this process, it is possible to simultaneously co-deposit Si–Al in one layer for crystallization of amorphous silicon, in contrast to the conventional techniques where alternating metal and amorphous Si layers are deposited. The effect of aluminum target power on the structural and electrical properties of polycrystalline Si films is analyzed by X-ray diffraction, Raman spectroscopy, scanning electron microscopy and Hall-effect analysis. It is shown that at an aluminum target power of 100 W, the polycrystalline Si film features a high crystalline fraction of 91%, a vertically aligned columnar structure, a sheet resistance of 20.2 kΩ/□ and a hole concentration of 6.3×10¹⁸ cm⁻³. The underlying mechanism for achieving the semiconductor-quality polycrystalline silicon thin films at a low substrate temperature of 300 °C is proposed.     

The effect of Ag intermediate layer on crystalline, optical and electrical properties of nano-structured thin film

ITO thin films and ITO/Ag/ITO multilayered films were prepared on glass substrate by reactive thermal evaporation technique without intentionally heating the substrate. After deposition the films were annealed in air at three different temperatures (300°C, 420°C and 540°C). The thickness of each layer in the ITO/Ag/ITO films was kept constant at 50 nm/10 nm/40 nm. The opto-electrical and structural properties of ITO/Ag/ITO multilayered films were compared with conventional ITO single-layer films. Although both films had identical thickness, 100 nm, the ITO/Ag/ITO films showed a lower resistivity. XRD spectra showed that Ag intermediate layer had a small effect on crystalline properties of ITO/Ag/ITO films.     

Low-temperature growth of Y2O3 thin films by ultraviolet-assisted pulsed laser deposition

Thin Y₂O₃ films have been grown on (100) Si using an in-situ ultraviolet-assisted pulsed laser deposition (UVPLD) technique. When compared to conventional pulsed laser deposited (PLD) films under similar conditions, the UVPLD-grown films exhibited better structural and optical properties, especially those grown at lower substrate temperatures, from 200 °C to 400 °C. X-ray diffraction investigations showed that the films grown were highly crystalline and textured. According to X-ray photoelectron spectroscopy and Rutherford backscattering spectrometry investigations, UVPLD-grown Y₂O₃ films have a better overall stoichiometry and contain less physisorbed oxygen than the conventional PLD-grown films. The refractive index values, measured in the range 300-750 nm by using variable-angle spectroscopic ellipsometry, were similar to those of a reference Y₂O₃ film.     

Morphological transformation of a germanium layer grown on a silicon surface by molecular-beam epitaxy at low temperatures

Multilayer Si/Ge nanostructures with germanium layers of different thicknesses are grown by molecular-beam epitaxy at low temperatures (<350°C) and studied using photoluminescence and atomic force microscopy. It is found that the germanium layer undergoes a morphological transformation when its thickness becomes equal to approximately five monolayers: an island relief transforms into a smooth undulating relief.     

Influence of laser-ablation plume dynamics on the room-temperature epitaxial growth of CeO2 on silicon

High-quality epitaxial CeO₂ thin films were obtained on Si(001) buffered with a yttria-stabilised zirconia layer by pulsed laser deposition. Although the best structural properties were achieved at high substrate temperature, high-quality epitaxy was obtained even at room temperature. Epitaxial growth at low temperature is promoted by the high kinetic energy of particles reaching the substrate. The oxygen pressure and target-substrate distance had a strong influence on the crystallographic structure and surface morphology in low-temperature deposition. This behaviour is attributed to a change in the kinetic energy of the particles, which was evaluated from the plasma expansion velocity determined by an intensified CCD camera. If a shock wave forms, a minimum substrate temperature of 550 °C is necessary for epitaxial growth.     

Phase transformation of Ni/Si thin films induced by nanoindentation and annealing

Thin Ni/Si films are prepared by depositing a Ni layer with a thickness of 100 nm on a Si (100) substrate. The as-deposited thin-film specimens are indented to a maximum depth of 500 nm using a nanoindentation technique and are then annealed at temperatures of 200°C, 300°C, 500°C and 800°C for 2 min. The microstructural changes and phases induced in the various specimens are observed using transmission electron microscopy (TEM) and micro-Raman scattering spectroscopy (RSS). Based on the load-displacement data obtained in the nanoindentation tests, the hardness and Young’s modulus of the as-deposited specimens are found to be 13 GPa and 177 GPa, respectively. The microstructural observations reveal that the nanoindentation process prompts the transformation of the indentation-affected zone of the silicon substrate from a diamond cubic structure to a mixed structure comprising amorphous phase and metastable Si III and Si XII phases. Following annealing at temperatures of 200∼500°C, the indented zone contains either a mixture of amorphous phase and Si III and Si XII phases, or Si III and Si XII phases only, depending on the annealing temperature. In addition, the annealing process prompts the formation of nickel silicide phases at the Ni/Si interface or within the indentation zone. The composition of these phases depends on the annealing temperature. Specifically, Ni₂Si is formed at a temperature of 200°C, NiSi is formed at a temperature of 300°C and 500°C, and NiSi₂ is formed at 800°C.     

Interfacial reactions of rf-sputtered TiNi thin films on (100) silicon with a SiN diffusion barrier

Silicon nitride (SiN) with a 50?nm thickness on Si(100) as a thermal barrier was obtained by plasma-enhanced chemical vapour deposition (PECVD). TiNi thin films were rf sputtered on a SiN/Si substrate and then annealed at 400–700°C for 30?min. Their interfacial reactions were studied using transmission electron microscopy, X-ray diffraction and Auger electron spectroscopy analyses. Experimental results show that the thickness of reaction layer in TiNi/SiN/Si specimens is clearly reduced, compared with that in TiNi/Si specimens under the same annealing conditions. The significant effect of the SiN layer as a diffusion barrier in TiNi/SiN/Si can be recognized. N and Si atoms diffuse from the SiN layer to react with TiNi films at 500°C and 600°C respectively. The TiN_{1 ? x} phase is formed in specimens annealed at 500°C, and mixed Ti₂Ni₃Si and Ti₄Ni₂O compounds are found at 600°C. In the specimen annealed at 700°C, the reaction layer has sublayers in the sequence TiNi/Ti₄Ni₂O/Ti₂Ni₃Si/TiN_{1 ? x} /SiN/Si. The SiN thermal barrier obtained by PECVD caused quite different diffusion species to cross the interfaces between TiNi/SiN/Si and TiNi/Si specimens during the annealing.     

Study of Temperature and UV Wavelength Range Effects on Degradation of Photo-Irradiated Polyethylene Films Using DMA

Plastic bags mostly made of polyethylene (PE) cause pollution as solid waste due to their non-degradability nature. Initiation of a degradative process by enhanced photo-oxidation is a possible method for an accelerated degradation. This paper presents temperature treatment effects on PE films where photodegradation was initiated using ultraviolet (UV) irradiation in the ranges of 200–300 nm and 300–400 nm for 2 hr. Effects of temperature of 40°C and 55°C on non-UV-irradiated and UV-irradiated PE films processed by conventional methods were investigated and evaluated after 50 hr, 150 hr, and 350 hr of temperature exposure. The effects of UV wavelength range irradiation on the degradation were deduced. Measuring the dynamic moduli using a dynamic mechanical analyzer monitored the degradation. The decrease in average storage modulus was 62% with treatment at 55°C, higher than the 16% drop at 40°C for unirradiated samples after 350-hr exposure. Cross-linking in UV-exposed samples, characterized by an increase in dynamic modulus (stiffening), was observed followed by a reduction of storage modulus. Temperature treatment at 55°C together with 300–400-nm UV range irradiation resulted in the largest increase, i.e., 22% after 150 hr, followed by the largest reduction of storage modulus, i.e., 74.6% for a cumulative 350-hr exposure.     

Observation of grain growth in swift heavy ion irradiated NiO thin films

NiO thin films grown on Si(100) substrates by electron beam evaporation, were sintered at 500 °C and 700 °C. The films were irradiated with 120 MeV Au⁹⁺ ions. Irradiation had different effects depending upon the initial microstructure of the films. Irradiation of the films at a fluence of 3 × 10¹¹ ions cm⁻² leads to grain growth for the films sintered at 500 °C and grain fragmentation for the films sintered at 700 °C. At still higher fluences of irradiation, grain size in 500 °C sintered film decreased, but the same improved in 700 °C sintered film. Associated with the grain size, texturing of the films was also shown to undergo significant modifications under irradiation.     

Structural and magnetic properties of thin epitaxial Fe films on (1 1 0) GaAs prepared by metalorganic chemical vapor deposition

Iron films have been grown on (1 1 0) GaAs substrates by atmospheric pressure metalorganic chemical vapor deposition at substrate temperatures (T_s) between 135°C and 400°C. X-ray diffraction (XRD) analysis showed that the Fe films grown at T_s between 200°C and 330°C were single crystals. Amorphous films were observed at T_s below 200°C and it was not possible to deposit films at T_s above 330°C. The full-width at half-maximum of the rocking curves showed that crystalline qualities were improved at T_s above 270°C. Single crystalline Fe films grown at different substrate temperature showed different structural behaviors in XRD measurements. Iron films grown at T_s between 200°C and 300°C showed bulk α-Fe like behavior regardless of film thickness (100–6400 Å). Meanwhile, Fe films grown at 330°C (144 and 300 Å) showed a biaxially compressed strain between substrate and epilayer, resulting in an expanded inter-planar spacing along the growth direction. Magnetization measurements showed that Fe films (>200 Å) grown at 280°C and 330°C were ferromagnetic with the in-plane easy axis along the [1 1 0] direction. For the thinner Fe films (⩽200 Å) regardless of growth temperature, square loops along the [1 0 0] easy axis were very weak and broad.     

Effect of annealing on structural and optical properties of diamond-like nanocomposite thin films

The annealing effect on structural and optical properties of the Diamond-like Nanocomposite (DLN) thin film deposited on glass substrate by Plasma Assisted Chemical Vapor Deposition (PACVD) method has been investigated. The films were annealed at temperature ranging from 300 to 600 °C, with 100 °C interval for 9 minutes by rapid thermal process (RTP) under vacuum. The structural changes of the annealed films have been studied using Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, Scanning Electron Microscope (SEM), and optical parameters have been determined using transmittance and reflectance spectra in UV-UIS-NIR range. The result shows that the refractive index increases gradually from 1.79 to 2.84 with annealing temperature due to out-diffusion of H by breaking Si–H and C–H bond leads to Si–C bond, i.e. more cross linking structure. In higher temperature range, graphitization also enhanced the refractive index. However, the optical band gap at up to 400 °C initially increases from 3.05 to 3.20 eV and then decreases due to graphitization. The film has a great potential to be used as anti-reflection coating (ARC) on silicon-based solar cell.     

Oxidation kinetics of epitaxial Ge-covered Si(100) surfaces

We compared oxidation kinetics on Ge-covered Si(100) surfaces grown at 350 and 600°C for 0.9 and 2.0 ML Ge overlayer thicknesses. The O_KLL intensities showed clear oxidation enhancement on the surfaces grown at 600°C. The oxygen interaction for the surface covered with 2 ML Ge formed at 350°C was weaker than for the Ge(100) surface, indicating that the compressive strain due to the lattice mismatch may suppress the oxygen interaction with surface Ge dimers.     

Specific features of plastic relaxation of a metastable Ge x Si1 − x layer buried between a silicon substrate and a relaxed germanium layer

Heterostructures Ge/Ge _x Si_{1 ? x} /Si(001) grown by molecular beam epitaxy have been investigated using atomic scale high-resolution electron microscopy. A germanium film (with a thickness of 0.5–1.0 μm) grown at a temperature of 500°C is completely relaxed. An intermediate Ge_0.5Si_0.5 layer remains in a strained metastable state, even though its thickness is 2–4 times larger than the critical value for the introduction of 60° misfit dislocations. It is assumed that the Ge/GeSi interface is a barrier for the penetration of dislocations from a relaxed Ge layer into the GeSi layer. This barrier is overcome during annealing of the heterostructures for 30 min at a temperature of 700°C, after which dislocation networks having different degrees of ordering and consisting predominantly of edge misfit dislocations are observed in the Ge/GeSi and GeSi/Si(001) heteroboundaries.     

Photoluminescence of Si/Ge nanostructures grown by molecular-beam epitaxy at low temperatures

Multilayer Si/Ge nanostructures grown by molecular-beam epitaxy at low temperatures (250–300°C) of germanium deposition are studied using photoluminescence and atomic-force microscopy (AFM). It is assumed that, upon low-temperature epitaxy, the wetting layer is formed through the intergrowth of two-dimensional (2D) and three-dimensional (3D) nanoislands.     

Relaxation of mechanical stresses in an array of Ge quantum dots obtained in Si

Raman scattering on optical phonons in Si/Ge/Si structures with Ge quantum dots grown by molecular beam epitaxy at low temperatures 200–300°C has been investigated. A pseudomorphic state of an array of Ge quantum dots to a Si matrix with an ideally sharp interface has been obtained. Features associated with the inelastic relaxation of mechanical stresses have been revealed in the Raman spectrum. Two mechanisms of stress relaxation are separated. It has been shown that the spectrum of the electronic states of the array differs significantly from the set of the discrete levels of a single quantum dot, because the relaxation is inhomogeneous.     

Polycrystalline silicon films prepared by metal-induced crystallisation using pre- and post-deposited aluminium on amorphous silicon

We report on the successful fabrication of polycrystalline silicon films by aluminium-induced crystallisation (AIC) of Radio frequency (rf) plasma-enhanced chemical vapour deposited (PECVD) a-Si films. The effects of annealing at different temperatures (300 and 400°C), below the eutectic temperature of the Si–Al binary system, on the crystallisation process have been studied. This work emphasises the important role of the position of the Al layer with respect to the Si layer on the crystallisation process. The properties of the crystallised films were characterised using X-ray diffraction, Raman spectroscopy, ellipsometry, field-emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). With an increase in the annealing temperature, it was found that the degree of crystallisation of annealed a-Si/Al and Al/a-Si films increased. The results showed that the arrangement where the Al was on top of the a-Si had a more prominent effect on crystallisation enhancement than when Al was below the a-Si. The interfacial layer between the Al and a-Si film is crucial because it influences the layer-exchange process during annealing. The oxide layer formed between the Al and the a-Si layers greatly retards the crystallisation process in the case of the Al/Si arrangement. Our investigations suggest that polycrystalline Si films formed by AIC can be used as a seed layer in solar cell fabrication.