Preparation of high‐temperature polyurethane by alloying with reactive polyamide

A series of novel poly(urethane amide) films were prepared by the reaction of a polyurethane (PU) prepolymer and a soluble polyamide (PA) containing aliphatic hydroxyl groups in the backbone. The PU prepolymer was prepared by the reaction of polyester polyol and 2,4‐tolylenediisocyanate and then was end‐capped with phenol. Soluble PA was prepared by the reaction of 1‐(m‐aminophenyl)‐2‐(p‐aminophenyl)ethanol and terephthaloyl chloride. The PU prepolymer and PA were blended, and the clear, transparent solutions were cast on glass substrates; this was followed by thermal treatments at various temperatures to produce reactions between the isocyanate group of the PU prepolymer and the hydroxyl group of PA. The opaque poly(urethane amide) films showed various properties, from those of plastics to those of elastomers, depending on the ratio of the PU and PA components. Dynamic mechanical analysis showed two glass‐transition temperatures (T_g's), a lower T_g due to the PU component and a higher T_g due to the PA component, suggesting that the two polymer components were phase‐separated. The rubbery plateau region of the storage modulus for the elastic films was maintained up to about 250 °C, which is considerably higher than for conventional PUs. Tensile measurements of the elastic films of 90/10 PU/PA showed that the elongation was as high as 347%. This indicated that the alloying of PU with PA containing aliphatic hydroxyl groups in the backbone improved the high‐temperature properties of PU and, therefore, enhanced the use temperature of PU. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 3497–3503, 2002     

Synthesis of poly(urethane‐imide) using aromatic secondary amine‐blocked polyurethane prepolymer

A set of poly(urethane‐imide)s were prepared using blocked Polyurethane (PU) prepolymer and pyromellitic dianhydride (PMDA). The PU prepolymer was prepared by the reaction of polyether glycol and 2,4‐tolylene diisocyanate, and end capped with N‐methyl aniline. The PU prepolymer was reacted with PMDA until the evolution of carbon dioxide ceased. The effect of tertiary amine catalysts, organo tin catalysts, solvents, and reaction temperature were studied and compared with the poly(urethane‐imide) prepared using phenol‐blocked PU prepolymer. N‐methyl aniline blocked PU prepolymer gave a higher molecular weight poly(urethane‐imide) at a lower reaction temperature in a shorter time. Amine catalysts were found to be more efficient than organo tin catalysts. The reaction was favorable in particular with N‐ethylmorpholine and diazabicyclo(2.2.2)octane (DABCO) as catalysts, and dimethylpropylene urea as a reaction medium. The poly(urethane‐imide)s were characterized by FTIR, GPC, TGA, and DSC analyses. The molecular weight decreased with an increase in reaction temperature. The thermal stability of the PU was found to increase by the introduction of imide component. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 4032–4037, 2000     

Preparation and absorption spectrum studies of aromatic and alicyclic poly(amide acid) ammonium salts in water and DMF and in films

A series of ammonium salts of poly(amide acid)s (PAS) were prepared from various poly(amide acid)s (PAA) with tertiary amines. The solubility of poly(amide acid) ammonium salts prepared from PAA(PMDA/ODA) in water is related to the ion concentration of tertiary amines. In order to elucidate the influence of the chemical structures of poly(amide acid)s and poly(amide acid) ammonium salts on their absorption spectra, pyromellitic dianhydride (PMDA), 3,3′,4,4 ′-biphenyltetracarboxylic dianhydride (BPDA), and 3,3′,4,4 ′-benzophenonetetracarboxylic dianhydride (BTDA) were chosen to react with p-phenylenediamine (PDA) and (4,4′-diaminodicyclohexyl)methane (DCHM) to give three kinds of aromatic PAAs and three kinds of alicyclic PAAs. The corresponding PASs were prepared by the reaction of PAAs with triethanolamine (TEA). Their ultraviolet–visible (UV–vis) absorption spectra were investigated compared to those of model compounds. A transparent film without absorption above 320 nm was obtained for PAS(PMDA/DCHM). The difference in absorption spectra of PAS(PMDA/PDA) from that of PAS(PMDA/DCHM) can be related to the existence of intra- and intermolecular charge transfer (CT) for PAS(PMDA/PDA). The absorption spectra of PASs with PDA in films are red shifted compared to those of corresponding PAAs in films, while the absorption spectra of PASs in water are blue shifted compared to those of corresponding PAAs in DMF. No differences in the absorption spectra of PAAs and PASs were found in DMF/H₂O (9/1) mixed solvent. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1329–1340, 1998     

A novel type of Si-containing poly(urethane-imide)s: synthesis, characterization and electrical properties

A novel type of a Si-containing poly(urethane-imide) (PUI) was prepared by two different methods. In the first method, Si-containing polyurethane (PU) prepolymer having isocyanate end groups was prepared by the reaction of diphenylsilanediol (DSiD) and toluene diisocyanate (TDI). Subsequently the PU prepolymer was reacted with pyromellitic dianhydride (PMDA) or benzophenonetetracarboxylic dianhydride (BTDA) in N-methyl pyrolidone (NMP) to form Si-containing modified polyimide directly. In the second method, PU prepolymer was reacted with diaminodiphenylether (DDE) or diaminodiphenylsulfone (DDS) in order to prepare an amine telechelic PU prepolymer. Finally, the PU prepolymer having diamine end groups was reacted with PMDA or BTDA to form a Si-containing modified polyimide. Cast films prepared by second method were thermally treated at 160 °C to give a series of clear, transparent PUI films. Thermogravimetric analysis indicated that the thermal degradation of PUI starts at 265 °C which is higher than degradation temperature of conventional PU, confirming that the introduction of imide groups improved the thermal stability of PU.To characterize the modified polyimides and their films, TGA, FTIR, SEM and inherent viscosity analyses were carried out. The dielectrical properties were investigated by the frequency-capacitance method. Dielectric constant, dielectric breakdown strength, moisture uptake and solubility properties of the films were also investigated.     

Role of the in‐plane orientation of polyimide films in graphitization

Poly(amide acid) labeled with perylenetetracarboxydiimide (PEDI) was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), p‐phenylenediamine (PDA), and diamino‐PEDI. Poly(amide acid) was then reacted with sodium hydride and various kinds of alkyl iodides for transformation into various poly(amide ester)s. The cast films were imidized while fixed on glass substrates to give BPDA/PDA polyimide films. The degree of in‐plane molecular orientation (f) of the polyimides and their precursors, poly(amide acid) and poly(amide ester)s, were determined via measurements of the visible dichroic absorption at an incidence angle for a rodlike dye (PEDI) bound to the main chain. All precursor films showed relatively low degrees of in‐plane orientation. After imidization of the precursors fixed on glasses, however, striking spontaneous in‐plane orientation behavior was observed. The f value for polyimide film from a poly(amide acid) precursor was as high as 0.7–0.8. The f value for polyimide film from a methyl ester precursor, however, was lowered to 0.4–0.5, but it increased with the increasing size of the alkyl groups. Good correlations of the in‐plane orientation of the polyimide films with the tensile modulus of the films and the in‐plane orientation of the graphitized films were observed. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 3011–3019, 2001     

Synthesis and characterization of poly(urethane‐benzoxazine) films as novel type of polyurethane/phenolic resin composites

Poly(urethane‐benzoxazine) films as novel polyurethane ( PU )/phenolic resin composites were prepared by blending a benzoxazine monomer ( Ba ) and PU prepolymer that was synthesized from 2,4‐tolylene diisocyanate (TDI) and polyethylene adipate polyol (MW ca. 1000) in 2 : 1 molar ratio. DSC of PU/Ba blend showed an exotherm with maximum at ca. 246 °C due to the ring‐opening polymerization of Ba, giving phenolic OH functionalities that react with isocyanate groups in the PU prepolymer. The poly(urethane‐benzoxazine) films obtained by thermal cure were transparent, with color ranging from yellow to pale wine with increase of Ba content. All the films have only one glass transition temperature (T_g ) from viscoelastic measurements, indicating no phase separation in poly(urethane‐benzoxazine) due to in situ polymerization. The T_g increased with the increase of Ba content. The films containing 10 and 15% of Ba have characteristics of an elastomer, with elongation at break at 244 and 182%, respectively. These elastic films exhibit good resilience with excellent reinstating behavior. The films containing more than 20% of Ba have characteristics of plastics. The poly(urethane‐benzoxazine) films showed excellent resistance to the solvents such as tetrahydrofuran, N,N‐dimethyl formamide, and N‐methyl‐2‐pyrrolidinone that easily dissolve PU s. Thermal stability of PU was greatly enhanced even with the incorporation of a small amount of Ba . © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 4165–4176, 2000     

Fluorinated polyamides and poly(amide imide)s based on 1,4‐bis(4‐amino‐2‐trifluromethylphenoxy)benzene,aromatic dicarboxylic acids,and various monotrimellitimides and bistrimellitimides: Syntheses and properties

A CF₃‐containing diamine, 1,4‐bis(4‐amino‐2‐trifluromethylphenoxy) benzene ( I ), was prepared from hydroquinone and 2‐chloro‐5‐nitrobenzotrifluoride. Imide‐containing diacids ( V _a–h and VI _a,b ) were prepared through the condensation reaction of amino acids, aromatic diamines, and trimellitic anhydride. Then, a series of soluble fluorinated polyamides ( VII _a–h ) and poly(amide imide)s ( VIII _a–h and X _a,b ) were synthesized from I with various aromatic diacids ( II _a–h ) and imide‐containing diacids ( V _a–h and VI _a,b ) via direct polycondensation with triphenyl phosphate and pyridine. The polyamides and poly(amide imide)s had inherent viscosities of 1.00–1.70 and 0.79–1.34 dL/g, respectively. All the synthesized polymers showed excellent solubility in amide‐type solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide, and N‐dimethylformamide and afforded transparent and tough films via solvent casting. Polymer films of VII _a–h , VIII _a–h , and X _a,b had tensile strengths of 91–113 MPa, elongations to break of 8–40%, and initial moduli of 2.1–2.8 GPa. The glass‐transition temperatures of the polyamides and poly(amide imide)s were 254–276 and 255–292 °C, respectively, and the imide‐containing poly(amide imide)s had better thermal stability than the polyamides. The polyamides showed higher transparency and were much lighter in color than the poly(amide imide)s, and their cutoff wave numbers were below 400 nm. In comparison with isomeric IX _{c – h} , poly(amide imide)s VIII _c–h exhibited less coloring and showed lower yellowness indices. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3116–3129, 2004     

Synthesis and characterization of poly(aryl amide imide)s derived from diphenyltrimellitic anhydride

The synthesis and characterization of a series of novel poly(aryl amide imide)s based on diphenyltrimellitic anhydride are described. The poly(aryl amide imide)s, having inherent viscosities of 0.39–1.43 dL/g in N-methyl-2-pyrrolidinone at 30°C, were prepared by polymerization with aromatic diamines in N,N-dimethylacetamide and subsequent chemical imidization. All the polymers were amorphous, readily soluble in aprotic polar solvents such as DMAC, NMP, dimethylsulfoxide, N,N-dimethylformamide, and m-cresol, and could be cast to form flexible and tough films. The glass transition temperatures were in the range of 284–366°C, and the temperatures for 5% weight loss in nitrogen were above 468°C. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 4541–4545, 1999     

Novel method for preparation of poly(benzoxazinone‐imide)

A novel method was developed to prepare poly(benzoxazinone‐imide) by the dealcoholization of poly(amide‐imide), having pendent ethoxycarbonyl groups, which was prepared from poly(amide acid). The poly(amide acid) was prepared from the reaction of pyromellitic dianhydride and 4,4′‐diamino‐6‐ethoxycarbonyl benzanilide. The curing behavior of the poly(amide acid) was monitored by DSC, which indicated the presence of two broad endotherms, one with maximum at 153 °C due to imide‐ring formation and the other with maximum at 359 °C due to benzoxazinone‐ring formation. The poly(amide acid) was thermally treated at 300 °C/1 h to get poly(amide‐imide) with pendent ester groups, then at 350 °C/2 h to convert into poly(benzoxazinone‐imide) by dealcoholization. Viscoelastic measurements of the poly(amide‐imide) showed that the storage modulus dropped at about 280 °C with glass‐transition temperature (T_g ) at about 340 °C. The storage modulus of poly(benzoxazinone‐imide), however, was almost constant up to 400 °C and no T_g was detected below 400 °C. Also, the tensile modulus and tensile strength of the poly(benzoxazinone‐imide) was much higher than that of the poly(amide‐imide). The 5% decomposition of poly(benzoxazinone‐imide) film was at 535 °C, which reflects its excellent thermal stability. Also, poly(benzoxazinone‐imide) showed more hydrolytic stability against alkali in comparison to polyimides. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1647–1655, 2000     

New organosoluble and thermally stable poly(amide‐imide)s with benzoxazole or benzothiazole pendent groups: synthesis and characterization

Two new benzoxazole or benzothiazole‐containing diimide‐dicarboxylic acid monomers, such as 2‐[3,5‐bis(N‐trimellitimidoyl)phenyl]benzoxazole ( 2 _o ) or 2‐[3,5‐bis(N‐trimellitimidoyl)phenyl]benzothiazole ( 2 _s ) were synthesized from the condensation reaction between 3,5‐diaminobenzoic acid and 2‐aminophenol or 2‐aminothiophenol in polyphosphoric acid (PPA) with subsequent reaction of trimellitic anhydride in the presence of glacial acetic acid, respectively, and two new series of modified aromatic poly(amide‐imide)s were prepared. This preparation was done with pendent benzoxazole or benzothiazole units from the newly synthesized diimide‐dicarboxylic acid and various aromatic diamines by triphenyl phosphite‐activated polycondensation. In addition, the corresponding unsubstituted poly(amide‐imide)s were prepared under identical experimental conditions for comparative purposes. Characterization of polymers was accomplished by inherent viscosity measurements, FT‐IR, UV–visible, ¹H‐NMR spectroscopy and thermogravimetry. The polymers were obtained in quantitative yields with inherent viscosities between 0.39 and 0.81 dl g^?1. The solubilities of modified poly(amide‐imide)s in common organic solvents as well as their thermal stability were enhanced compared to those of the corresponding unmodified poly(amide‐imide)s. The glass transition temperature, 10% weight loss temperature, and char yields at 800°C were, respectively, 7–26°C, 17–46°C and 2–5% higher than those of the unmodified polymers. Copyright © 2010 John Wiley & Sons, Ltd.     

Synthesis and characterization of new poly(ether amide)s based on a new cardo monomer

A new cardo diamine monomer 3, 3‐bis‐[4‐{2′trifluoromethyl 4′‐(4″‐aminophenyl) phenoxy} phenyl]‐2‐phenyl‐2, 3‐dihydro‐isoindole‐1‐one ( 4 ) has been synthesized from potentially cheap phenolphthalein as the starting material. This diamine was used for the synthesis of a new poly(ether amide) and two co‐poly(ether amide)s using 4, 4′‐diaminodiphenyl ether (ODA) as co‐monomer by direct solution polycondensation with 5‐t‐butyl iso‐phthalic acid. These new polymers showed inherent viscosities of 0.48–0.62 dL g^?1. The resulting poly(ether amide) and co‐poly(ether amide)s were readily soluble in polar aprotic solvents like NMP, DMF, DMAc, DMSO, and pyridine. The polymers have been fully characterized by ¹H and ¹³C NMR, FTIR spectroscopy, and elemental analysis. These polymers showed glass transition temperatures in the range of 267–310°C. Thermogravimetric analysis indicated high thermal stability of these polymers at 5 and 10% weight loss temperature in air above 357°C and 419°C, respectively. The poly(ether amide) films cast from DMAc were flexible with tensile strength up to 91 MPa, elongations at break up to 11%, and modulus of elasticity up to 1.82 GPa. X‐ray diffraction measurements indicate the amorphous nature of the poly(ether amide)s. Copyright © 2009 John Wiley & Sons, Ltd.     

Preparation and properties of new poly(amide‐imide)s based on 1,4‐bis(4‐trimellitimidophenoxy)naphthalene and aromatic diamines

A diimide dicarboxylic acid, 1,4‐bis(4‐trimellitimidophenoxy)naphthalene (1,4‐BTMPN), was prepared by condensation of 1,4‐bis(4‐aminophenoxy)naphthalene and trimellitic anhydride at a 1 : 2 molar ratio. A series of novel poly(amide‐imide)s (IIa–k) with inherent viscosities of 0.72 to 1.59 dL/g were prepared by triphenyl phosphite‐activated polycondensation from the diimide‐diacid 1,4‐BTMPN with various aromatic diamines (Ia–k) in a medium consisting of N‐methyl‐2‐pyrrolidinone (NMP), pyridine, and calcium chloride. The poly(amide‐imide)s showed good solubility in NMP, N,N‐dimethylacetamide, and N,N‐dimethylformamide. The thermal properties of the obtained poly(amide‐imide)s were examined with differential scanning calorimetry and thermogravimetry analysis. The synthesized poly(amide‐imide)s possessed glass‐transition temperatures in the range of 215 to 263°C. The poly(amide‐imide)s exhibited excellent thermal stabilities and had 10% weight losses at temperatures in the range of 538 to 569°C under a nitrogen atmosphere. A comparative study of some corresponding poly(amide‐imide)s also is presented. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1–8, 2000     

New poly(amide–imide)s syntheses. XXIII. Synthesis and properties of poly(amide–imide)s derived from 4,4′‐[1,4‐phenylenebis(isopropylidene‐1,4‐phenyleneoxy)]dianiline and various bis(trimellitimide)s

A series of poly(amide–imide)s III_a–m containing flexible isopropylidene and ether groups in the backbone were synthesized by the direct polycondensation of 4,4′‐[1,4‐phenylenebis(isopropylidene‐1,4‐phenyleneoxy)]dianiline (PIDA) with various bis(trimellitimide)s II_a–m in N‐methyl‐2‐pyrrolidone (NMP) using triphenyl phosphite and pyridine as condensing agents. The resulting poly(amide–imide)s had inherent viscosities in the range of 0.80–1.36 dL/g. Except for those from the bis(trimellitimide)s of p‐phenylenediamine and benzidine, all the polymers could be cast from DMAc into transparent and tough films. They exhibited excellent solubility in polar solvents. The 10% weight loss temperatures of the polymers in air and in nitrogen were all above 495°C, and their T_g values were in the range of 201–252°C. Some properties of poly(amide–imide)s III were compared with those of the corresponding poly(amide–imide)s V prepared from the bis(trimellitimide) of diamine PIDA and various aromatic diamines. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 69–76, 1999     

Poly(ether‐imide) and related sepiolite nanocomposites: investigation of physical,thermal, and mechanical properties

Novel poly(ether‐imide) and sepiolite nanocomposites were synthesized based on a unique diamine monomer with the aim of improving physical and mechanical properties of final polyimide films. The diamine was polycondensed with 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride to produce related poly(ether amic acid) prepolymer. Pure poly(ether‐imide) and nanocomposite films were prepared via thermal imidization process of poly(ether amic acid). Coexistence of ether, pyridine, and phenylene functional groups in the diamine chemical structure resulted in flexible polyimide films with significant thermal, physical, and mechanical properties. Thermal stability, glass‐transition temperature, dimensional stability, and tensile properties of polymer and nanocomposites were studied and compared. Morphology of nanocomposites was also investigated using scanning and transmission electron microscopic methods to study the distribution and dispersion behavior of sepiolite nanofibers in the polyimide matrix. By introduction of sepiolite nanoparticles, overall improvement of properties was observed in respect to pure polyimides. Copyright © 2015 John Wiley & Sons, Ltd.     

Isomeric compositions in amide acids and poly(amic acid)s derived from 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride

Two different poly(amic acid)s were synthesized by the polycondensations of 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (CF3DAN) with p-phenylene diamine and benzidine. In addition, an amide acid model compound was prepared from CF3DAN and aniline. Isomeric units in the poly(amic acid)s as well as the amide acid were investigated by ¹H and ¹³C-nuclear magnetic resonance (NMR) spectroscopies. Spectroscopic results indicate that the major isomeric component was a CF3-meta-isomeric unit centered on the aromatic carbon substituted with the trifluoromethyl group. In particular, the amide acid compound was determined to be composed of 80 mol % CF3-meta-isomer and 20 mol % H-meta-isomer. Therefore, for the poly(amic acid)s, the minor isomeric component is speculated to be a H-meta-isomeric unit rather than a para-isomeric unit. The result might result mainly from the strong electron-withdrawable and bulky trifluoromethyl substituent in the CF3DAN monomer. The strong electron withdrawability might significantly enhance the reactivities of the adjacent carbons in the monomer to the nucleophilic attack of the amino nitrogen in the aniline and diamines, and consequently overcome the role of the bulkyness, ultimately leading to the amide acid and poly(amic acid)s rich with the CF3-meta-isomeric unit. In addition, a portion of the imide form was detected in the dried AN-CF3DAM-AN amide acid. Thus, the formation of imide linkage might be involved in a small portion for the dried poly(amic acid)s. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1755–1765, 1998     

Synthesis and characterization of novel poly(amide‐imide)s containing 1,3‐diamino mesitylene moieties

A series of poly(amide‐imide)s were prepared using a new monomer, 1,3‐bis(trimellitimido)‐2,4,6‐trimethyl benzene (BTB), with four different diamines: 1,4‐phenylene diamine (PDA), 2,4‐diamino mesitylene (DAM), 2,2′‐dimethyl‐4,4′‐diamino biphenyl (DMDB), and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFDB). They were prepared by the condensation method in N‐methyl‐2‐pyrrolidinone (NMP) solvent using triphenyl phosphate and pyridine as condensing agents. The synthesized poly(amide‐imide)s were characterized by Fourier transform infrared and ¹H NMR techniques. Films were prepared and characterized using DSC, thermogravimetric analysis (TGA), a prism coupler, and a film dielectric property analyzer. DSC measurement showed that the glass‐transition temperatures of the polymers were in the range of 259–327 °C. TGA analysis showed 5% weight loss, in the range of 472–514 °C. The refractive index varied from 1.6004 to 1.6586 in the following increasing order: BTB‐TFBM < BTB‐DAM < BTB‐DMDB < BTB‐PDA. For the poly(amide‐imide) films, the birefringence varied in the range of 0.0319–0.0580, in the following increasing order: BTB‐DAM < BTB‐TFBM < BTB‐DMDB < BTB‐PDA. The capacitance method showed that the dielectric constant of poly(amide‐imide) varied with the diamine structure; no difference was found by the optical method. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 137–143, 2004     

Preparation and characterization of new poly(amide–imide) reinforced layer silicate nanocomposite containing N,N′-pyrromellitoyl-bis-l-phenyl acetic acid

Two new samples of poly(amide–imide)/montmorillonite reinforced nanocomposites containing N,N′-pyrromellitoyl-bis-l-phenyl acetic acid moiety in the main chain were synthesized by a convenient solution intercalation technique. Poly(amide–imide) (PAI) 3 as a source of polymer matrix was synthesized by the direct polycondensation reaction of N,N′-pyrromelitoyl-bis-l-phenyl acetic acid 1 with 4,4′-diamino diphenyl ether 2 in the presence of triphenyl phosphite (TPP), CaCl₂, pyridine and N-methyl-2-pyrrolidone (NMP). Morphology and structure of the resulting PAI-nanocomposite films 4a and 4b with 10% and 20% silicate particles were characterized by FTIR spectroscopy, X-ray diffraction (XRD) and scanning electron microscopy (SEM). The effect of clay dispersion and the interaction between clay and polymeric chains on the properties of nanocomposite films were investigated by using UV–vis spectroscopy, thermogravimetric analysis (TGA) and water uptake measurements.     

Synthesis and properties of organosoluble poly(amide‐imide)s with propeller‐shaped 1,1,1‐triphenylethane units in the main chain

A dicarboxylic acid {1,1‐bis[4‐(4‐trimellitimidophenoxy)phenyl]‐1‐phenylethane ( II )} bearing two performed imide rings was prepared from the condensation of 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane and trimellitic anhydride in a 1/2 molar ratio. A novel family of poly(amide‐imide)s with inherent viscosities of 0.83–1.51 dL/g was prepared by triphenyl phosphite‐activated polycondensation from the diimide‐diacid II with various aromatic diamines in a medium consisting of N‐methyl‐2‐pyrrolidinone (NMP), pyridine, and calcium chloride. Because the 1,1,1‐triphenylethane group of II was unsymmetrical, most of the resulting polymers showed an amorphous nature and were readily soluble in polar solvents such as NMP and N,N‐dimethylacetamide. All the soluble poly(amide‐imide)s afforded tough, transparent, and flexible films, which had tensile strengths ranging from 88 to 102 MPa, elongations at break from 6 to 11%, and initial moduli from 2.23 to 2.71 GPa. The synthesized poly(amide‐imide)s possessed glass‐transition temperatures from 250 to 287 °C. The poly(amide‐imide)s exhibited excellent thermal stabilities and had 10% weight losses from 501 to 534 °C under a nitrogen atmosphere. A comparative study of some corresponding poly(amide‐imide)s is also presented. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 775–787, 2001     

Synthesis and characterization of fluorinated poly(amide imide)s derived from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and aromatic diamines

A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10^?3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003     

Synthesis and properties of organosoluble poly(amide imide imide)s based on tetraimide dicarboxylic acid condensed from 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, 4,4′‐oxydianiline,and trimellitic anhydride and various aromatic diamines

A novel tetraimide dicarboxylic acid was synthesized with the ring‐opening addition of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, 4,4′‐oxydianiline, and trimellitic anhydride in a 1/2/2 molar ratio in N‐methyl‐2‐pyrrolidone followed by azeotropic condensation to tetraimide dicarboxylic acid. A series of poly(amide imide imide)s (PAIIs) with inherent viscosities of 0.8–1.1 dL/g were prepared from tetraimide dicarboxylic acid with various aromatic diamines by direct polycondensation. Most of the PAIIs were readily soluble in a variety of amide polar solvents and even in less polar m‐cresol and pyridine. Solvent‐cast films had tensile strengths ranging from 99 to 106 MPa, elongations at break ranging from 8 to 13%, and initial moduli ranging from 2.0 to 2.3 GPa. The glass‐transition temperatures of these PAIIs were recorded at 244–276 °C. They had 10% weight losses at temperatures above 520 °C in air or nitrogen atmospheres. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1092–1102, 2002