Analysis of resistive switching behaviors of vanadium oxide thin film

We demonstrated the polarization of resistive switching for Cu/VO_x/Cu memory cell. Switching behaviors of Cu/VO_x/Cu cell were tested by semiconductor device analyzer (Agilent B1500A), and the relative micro-analysis of I-V characteristics of VO_x/Cu was characterized by conductive atomic force microscope (CAFM). The I-V test results indicated that both forming and the reversible resistive switching between low resistance state (LRS) and high resistance state (HRS) can be observed under either positive or negative sweep. The CAFM images for LRS and HRS directly exhibited evidences of the formation and rupture of filaments based on positive or negative voltage. Cu/VO_x/Cu sandwiched structure exhibits a reversible resistive switching behavior and shows potential applications in the next generation nonvolatile memory field.     

Engineering oxide resistive switching materials for memristive device application

Based on a unified physical model and first-principle calculations, a material-oriented methodology has been proposed to control the bipolar switching behavior of an oxide-based resistive random access memory (RRAM) cell. According to the material-oriented methodology, the oxide-based RRAM cell can be designed by material engineering to achieve the required device performance. In this article, a Gd-doped HfO₂ RRAM cell with excellent bipolar switching characteristics is developed to meet the requirements of memristive device application. The typical memristive characteristics of the Gd-doped HfO₂ RRAM cell are presented, and the mechanism is discussed.     

Effect of AlN layer on the resistive switching properties of TiO2 based ReRAM memory devices

The present study reports the resistive switching behaviour in Titanium Dioxide (TiO₂) material, with possible implementations in non volatile memory device. The Cu/TiO₂/Pt memory device exhibit uniform and stable bipolar resistive switching behaviour. The current-voltage (I-V) analysis shows two discrete resistance states, the High Resistance State (HRS) and the Low Resistance State (LRS). The effect of an additional AlN layer in the resistive memory cell is also investigated. The Cu/TiO₂/AlN/Pt device shows a multilevel (tri-state) resistive switching. Multilevel switching is facilitated by ionic and metallic filament formation, and the nature of the formed filaments is confirmed by performing a resistance vs. temperature measurement. The bilayer device shows improved reliability over the single layer device. The formation of high thermal conductive interfacial oxy-nitride (AlON) layer is the main reasons for the enhancement of resistive switching properties in Cu/TiO₂/AlN/Pt cell. The performance of device was measured in terms of endurance and retention, which exhibits good endurance over 10⁵ cycles and long retention time of 10⁵ s at 125 °C. The above result suggests the feasibility of Cu/TiO₂/AlN/Pt devices for multilevel non volatile ReRAM application.     

Resistive switching of silicon-rich-oxide featuring high compatibility with CMOS technology for 3D stackable and embedded applications

This paper discusses the resistive switching devices based on highly compatible silicon-rich-oxide, including silicon monoxide (SiO) and SiO _x N _y material, which can be fabricated by low temperature process, and thus fully compatible with the back-end CMOS technology. The demonstrated SiO based RRAM suitable for 3D stackable applications shows repeatable unipolar resistive switching behavior with excellent on/off resistance ratio and good retention performance, but a little bit high switching voltage. The presented silicon-rich silicon-oxynitride RRAM device can effectively reduce the switching voltages (∼1 V) and shows good retention capability under 180°C baking as well as fast speed, giving great potentials for 3D stackable and embedded applications. The switching mechanisms in the studied devices are discussed. The method of switching voltage reduction through nitrogen doping, as a kind of defect engineering, can provide some guidelines for RRAM design.     

Rectifying resistance switching behaviors of SnO2 microsphere films modulated by top electrodes

Based on the bipolar resistive switching (RS) characteristics of SnO₂ films, we have fabricated a new prototypical device with sandwiched structure of Metal/SnO₂/fluorine-doped tin oxide (FTO). The SnO₂ microspheres film was grown on FTO glass by template-free hydrothermal synthesis, which was evaporated with various commonly used electrodes such as aluminium (Al), silver (Ag), and gold (Au), respectively. Typical self-rectifying resistance switching behaviors were observed for the RS devices with Al and Au electrodes. However, no obvious rectifying resistance switching behavior was observed for the RS device with Ag electrode. Above results were interpreted by considering the different interface barriers between SnO₂ and top metal electrodes. Our current studies pave the ways for modulating the self-rectifying resistance switching properties of resistive memory devices by choosing suitable metal electrodes.     

Mechanism analysis of switching direction transformation in an Er2O3 based RRAM device

The resistive random access memory (RRAM) based on resistive switching effect has considered to be the most advanced next generation memory, in which the switching direction determines the order of reading-writing. In this work, the rare-earth metal Er₂O₃ was used as functional layer, and Ag and indium-tin-oxide (ITO) are selected as top and bottom electrode to fabricate resistive switching device. Further, it is observed that the switching direction and memory window of resistive switching device can be regulated by exchanging top and bottom electrode. Moreover, the complementary switching memory behavior in Ag/Er₂O₃/ITO/Er₂O₃/Ag structure was also observed. Through mechanism analysis, it is expected that the barrier changes and metal-ions oxidation-reduction should be responsible for the conversion of switching direction and regulation of memory window. This work opens up a way to the development of next generation new concept memory.     

Investigation of resistive switching behaviours in WO3-based RRAM devices

In this paper, a WO₃-based resistive random access memory device composed of a thin film of WO₃ sandwiched between a copper top and a platinum bottom electrodes is fabricated by electron beam evaporation at room temperature. The reproducible resistive switching, low power consumption, multilevel storage possibility, and good data retention characteristics demonstrate that the Cu/WO₃/Pt memory device is very promising for future nonvolatile memory applications. The formation and rupture of localised conductive filaments is suggested to be responsible for the observed resistive switching behaviours.     

Flexible and transparent resistive switching devices using Au nanoparticles decorated reduced graphene oxide in polyvinyl alcohol matrix

We have investigated the resistive switching mechanism in solution processed Au-reduced graphene oxide-polyvinyl alcohol (PVA) nanocomposites on flexible substrates. Monodispersed gold nanoparticles (Au NPs) attached to reduced graphene oxide (RGO) in aqueous PVA solution have been synthesized using a novel one pot technique. The fabricated hybrid device showed high On/Off switching ratio more than 10³ with low operating voltages. The performance of hybrid device can be effectively enhanced over control RGO device. The switching mechanism occurs from the electrochemical reduction/oxidation process of partially reduced graphene oxide. The proposed devices reveal superior asymmetric bipolar resistive switching characteristics attractive for solution processable flexible and transparent non-volatile memory applications.     

Flexible NiO nanocrystal-based resistive memory device fabricated by low-temperature solution-process

In this study, a nickel oxide (NiO) nanocrystal (NC) based flexible resistive memory device is demonstrated at temperature as low as 180 °C by ligand exchange process. The fabricated device for flexible application with structure Ni/NiO/Ni on PI substrate exhibits excellent switching characteristics with low set/reset voltages and stable resistance values in both ON and OFF states for over 100 switching cycles of memory operation. Also, this flexible memory device shows stable resistive switching properties under compressive stress with bending radius to 10 mm and consecutive bending cycles. The ReRAM fabricated by a low-temperature solution-process shows potential for next generation flexible electronics.     

Fabrication of solution-processed SnO2–Based flexible ReRAM using laser-induced graphene transferred onto PDMS

In this paper, we are reporting the fabrication of a solution-processed SnO₂-based flexible ReRAM using laser-induced graphene (LIG) transferred onto polydimethylsiloxane (PDMS). The fabricated ReRAM showed forming-free and self-compliance bipolar resistive switching characteristics when the applied voltage was swept from 0 V to 4.5 V for SET and from 0 V to - 4.5 V for RESET. The device operates as a filamentary type ReRAM and its conduction mechanism analysis indicates that the space charge limited conduction (SCLC) is dominant mechanism in the analog resistive switching of the fabricated device. For the reliability analysis, 100 cycles of endurance test and 1.8 × 10³ s of retention test were performed. The flexibility of the fabricated ReRAM device was demonstrated by showing that the resistive switching characteristics were still obtained after bending 200 times repeatedly down to 1 mm radius. Our study suggests the new fabrication process of a solution-processed flexible ReRAM and proves its potential applications to flexible electronics.     

Coexistence of filamentary and homogeneous resistive switching in graded WOx thin films

Reversible clockwise and counter‐clockwise resistive switching in a Pt/graded WO_x /W stack is reported. Two stable switching modes with opposite switching polarity and different electrical characteristics are found to coexist in the same memory cell. Clockwise switching shows filamentary characteristics that lead to relatively faster switching with excellent retention at high temperature. Counter‐clockwise switching exhibits homogeneous conduction with slower switching and moderate retention. The field‐induced switching reversal might be due to inhomogeneous expansion of W during thermal oxidation. Our results provide a clue to modulate the switching type in Pt/WO_x /W memory cells. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Dynamic moderation of an electric field using a SiO2 switching layer in TaOx ‐based ReRAM

ReRAMs using oxygen vacancy drift in their resistive switching are promising candidates as next generation memory devices. One remaining issue is degradation of the on/off ratio down to 10² or less with an increased number of switching cycles. Such degradation is caused by a local hard breakdown in a set process due to a very high electric field formed just before the completion of a conductive filament formation. We found that introducing an ultra‐thin SiO₂ layer prevents the hard breakdown by dynamical moderation of the electric field formed in the TaO_x matrix, resulting in repeated switching while retaining a higher on/off ratio of about 10⁵. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Top electrode effects on resistive switching behavior in CuO thin films

Top electrode (TE) material on the resistive switching behavior of (TE)/CuO/SnO₂:F/Si substrate has been studied. We investigated the switching properties of CuO films deposited by sol-gel process. Two kinds of top electrode (TE) material on the resistive switching behaviors have been studied. The nonpolar and bipolar resistive switching phenomenon was observed in CuO thin films with different top electrodes. The filamentary mechanism was used to explain the two kinds of resistive switching behaviors. For the Pt/CuO/ATO device, it showed the nonpolar resistive switching where conducting path is formed and disappear due to the oxygen vacancy. For the Cu/CuO/ATO device, the resistance reduction is due to the existing Cu to form conduction Cu-rich pathways. An opposite bias takes the existing Cu back to the Cu electrode to its high-resistance state. CuO thin films are also observed by XRD, AFM and XPS.     

铜掺杂氧化锌薄膜阻变特性的研究

以 ZnO：Al为底电极,Cu为顶电极,在同种工艺条件下分别制备了类电容结构的纯ZnO 阻变器件和ZnO：2%Cu阻变器件,分析比较了两种器件的典型I-V特性曲线、置位电压（V_Set）和复位电压（V_Reset）的分布范围、器件的耐久性。结果显示,ZnO：Cu阻变器件较纯ZnO阻变器件有更大的开关比和更稳定的循环性能。另外,研究了 ZnO：Cu阻变器件的阻变机理,通过对其I-V特性曲线分析得出以下结论：ZnO：Cu阻变器件在高阻态遵循空间电荷限制电流效应,低阻态符合欧姆定律。     

Characteristics and mechanism of nano‐polycrystalline La2O3 thin‐film resistance switching memory

We investigated the characteristics and the mechanism of Pt/La₂O₃/Pt resistance switching memory with a set of measurements. The La₂O₃ films were determined as nano‐poly‐crystalline (diameter of the nanocrystals 5–10 nm) by XRD and HRTEM analysis. The Pt/La₂O₃/Pt device exhibited excellent resistive switching properties, including low switching voltage (<2 V), large low/high resistance ratio (>10⁸), and good cycling endurance property. The conduction mecha‐ nisms of the Pt/La₂O₃/Pt device were revealed with current–voltage characteristics, which are different in the low and high resistance states. Furthermore, XPS analysis and temperature‐dependent resistance measurement in the low resistance state showed that the conducting filaments in the Pt/La₂O₃/Pt device are mainly affected by oxygen defects rather than metallic La. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Characteristic modification by inserted metal layer and interface graphene layer in ZnO-based resistive switching structures

ZnO-based resistive switching device Ag/ZnO/TiN, and its modified structure Ag/ZnO/Zn/ZnO/TiN and Ag/graphene/ZnO/TiN, were prepared. The effects of inserted Zn layers in ZnO matrix and an interface graphene layer on resistive switching characteristics were studied. It is found that metal ions, oxygen vacancies, and interface are involved in the RS process. A thin inserted Zn layer can increase the resistance of HRS and enhance the resistance ratio. A graphene interface layer between ZnO layer and top electrode can block the carrier transport and enhance the resistance ratio to several times. The results suggest feasible routes to tailor the resistive switching performance of ZnO-based structure.     

Highly improved resistive switching performances of the self-doped Pt/HfO2:Cu/Cu devices by atomic layer deposition

Metal-oxide electrochemical metallization (ECM) memory is a promising candidate for the next generation nonvolatile memory. But this memory suffers from large dispersion of resistive switching parameters due to the intrinsic randomness of the conductive filament. In this work, we have proposed a self-doping approach to improve the resistive switching characteristics. The fabricated Pt/HfO₂:Cu/Cu device shows outstanding nonvolatile memory properties, including high uniformity, good endurance, long retention and fast switching speed. The results demonstrate that the self-doping approach is an effective method to improve the metal-oxide ECM memory performances and the self-doped Pt/HfO₂:Cu/Cu device has high potentiality for the nonvolatile memory applications in the future.     

Analysis of the resistive switching behaviors of vanadium oxide thin film

We demonstrate the polarization of resistive switching for a Cu/VOx/Cu memory cell.The switching behaviors of Cu/VOx/Cu cell are tested by using a semiconductor device analyzer(Agilent B1500A),and the relative micro-analysis of I-V characteristics of VOx/Cu is characterized by using a conductive atomic force microscope(CAFM).The I-V test results indicate that both the forming and the reversible resistive switching between low resistance state(LRS) and high resistance state(HRS) can be observed under either positive or negative sweep.The CAFM images for LRS and HRS directly exhibit evidence for the formation and rupture of filaments based on positive or negative voltage.The Cu/VOx/Cu sandwiched structure exhibits reversible resistive switching behavior and shows potential applications in the next generation of nonvolatile memory.     

Self‐formed Schottky barrier induced selector‐less RRAM for cross‐point memory applications

We propose a selector‐less Pr_0.7Ca_0.3MnO₃ (PCMO) based resistive‐switching RAM (RRAM) for high‐density cross‐point memory array applications. First, we investigate the inhomogeneous barrier with an effective barrier height (Φ_eff), i.e., self‐formed Schottky barrier. In addition, a scalable 4F² selector‐less cross‐point 1 kb RRAM array has been successfully fabricated, demonstrating set, reset, and read operation for high cell efficiency and high‐density memory applications. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Colossal resistive switching behavior and its physical mechanism of Pt/<Emphasis Type="Italic">p</Emphasis>-NiO/<Emphasis Type="Italic">n</Emphasis>-Mg<Subscript>0.6</Subscript>Zn<Subscript>0.4</Subscript>O/Pt thin films

A heterojunction structure of p-NiO/n-Mg_0.6Zn_0.4O with an aim to tuning or improving the resistive switching properties was fabricated on Pt/TiO₂/SiO₂/Si substrates by the sol-gel spin-coating technique. The Pt/NiO/Mg_0.6Zn_0.4O/Pt heterojunction thin-film device shows excellent resistive switching properties, such as a reduced threshold current of 1 μA for device initiation, a small dispersion of reset voltage ranging from 0.54 to 0.62 V, long retention time and a high resistance ratio of high-resistance state to low-resistance state about six orders of magnitude. These results indicate that the resistive switching properties can be greatly improved by constructing the p-NiO/n-Mg_0.6Zn_0.4O heterojunction for nonvolatile memory applications. The physical mechanism responsible for colossal resistive switching properties of the heterojunction was analyzed based on interfacial defect effect and formation and rapture of conductive filaments.