酸酐固化环氧树脂/蒙脱土复合材料的等温固化动力学

用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程，考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响. 实验表明， 环氧树脂的固化过程包含自催化机理，加入蒙脱土没有改变固化反应机理. 用Kamal方程对该体系的固化过程进行拟合，得到反应级数m、n，反应速率常数k1、k2，总反应级数(m + n)在2.4～3.0之间. MMT的加入使环氧树脂体系的k1、k2有所降低，而OMMT的加入对体系的k1、k2影响较为复杂，加入蒙脱土对环氧树脂固化体系的活化能影响较小.     

Rheokinetic cure characterization of epoxy–anhydride polymer system with shape memory characteristics

An epoxy resin capable of exhibiting shape memory property was derived by curing diglycidyl ether of bisphenol A (DGEBA) with a blend of carboxy telechelic poly(tetramethyleneoxide) (PTAC) and pyromellitic dianhydride (PMDA). The cure kinetics of DGEBA/PTAC/PMDA blend of varying compositions was investigated using isothermal rheological analysis. The overall reaction conformed to a second-order autocatalytic model. The kinetic parameters including reaction order, kinetic constants and activation energy were determined. The results showed that increase of PTAC decreased the overall activation energy and frequency factor of the cure reaction. This effect resulted in a diminution of the overall rate of curing. The catalysis by PTAC has its origin from the activation of epoxy groups by the protons of the COOH groups. The autocatalysis was caused by the COOH groups generated by the reaction of alcohol groups with anhydride. The activation energy for the autocatalysis was more than that for the primary reaction as the COOH groups responsible for autocatalysis were generated on a sterically hindered polymer backbone. The kinetics helped generate a master equation conforming to second-order autocatalytic model that could predict the cure profile of a specified resin system at a given temperature, leading to cure optimization.     

Effect of Non-Woven Carbon Nanofiber Mat Presence on Cure Kinetics of Epoxy Nanocomposites

Summary : An investigation was carried out into the cure kinetics of carbon nanofiber (CNF) mat-epoxy nanocomposites, composed of bisphenol-A based epoxy resin and diethylene triamine as a curing agent. It was observed that the rate of cure reaction for CNF mat-epoxy nanocomposites was higher than that for neat epoxy resin at low curing temperatures and the presence of the CNF mat produced the maximum influence at a certain curing temperature and time. At high curing temperature and long curing times, the effect of CNF mat on the cure rate was insignificant. The CNF mat-epoxy composite exhibited somewhat lower value of activation energy than that of the neat epoxy system at the beginning of the curing stage. The weight fraction of CNF mat also affected the cure reaction of epoxy nanocomposites at the same curing temperature. As the amount of CNF mat increased, the cure rate was higher at the same cure time. However, at high CNF mat loading, the cure reaction was retarded since the amount of epoxy and hardener decreased dramatically at high CNF contents together with the hindering effect of the CNF mat on the diffusion of epoxy resin and the curing agent, leading to lower crosslinking efficiency. Although the curing efficiency of epoxy nanocomposites dropped at high CNF mat content, the glass transition temperature (T_g) was still high due to the ultra-high strength of the CNF mat. The cure kinetics of CNF mat-epoxy nanocomposites was in good agreement with Kamal's model.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

松香改性酚醛环氧树脂的固化反应动力学研究

以自制的松香改性酚醛环氧树脂（RPAE）为对象,采用差示扫描量热法研究了其与4,4．二氨基二苯砜组成的体系（RPAE／DDS）的固化动力学,利用Kissinger方程计算得到体系的固化热约为109．29J／g,表观活化能为51．56kJ／mol,该体系反应级数为0．85,近似为1级反应,反应速率常数为2．69×10^4／s。采用Ozawa-Flynn-Wall方程分析,得到体系的表观活化能为70。1kJ／mol。     

Cure kinetics of liquid crystalline epoxy resins based on biphenyl mesogen

The cure kinetics of a biphenyl-based liquid crystalline (LC) epoxy resin (LCER) was studied using differential scanning calorimetry (DSC) and polarized optical microscopy. The effects of LC phase formation on the cure kinetics were investigated. Both a model-free isoconversional method and a model-fitting method were used to analyze the DSC data. Results from the isoconversional analysis were applied to develop tentative multi-step kinetic models describing the curing reaction. Kinetic analysis showed that compared to the resins cured in amorphous phase, LCERs exhibited higher values of reaction enthalpy and a complex dependence of activation energy on the degree of cure. The formation of the LC phase resulted in a decrease in activation energy, leading to higher degree of reaction.     

Characterization of epoxy prepreg SPX 8800 system by isothermal differential scanning calorimetry

Isothermal Differential Scanning Calorimetry (DSC) was used to study the curing behavior of epoxy prepreg SPX 8800 system, which contains DGEBA/DICY/Diuron (Diglycidyl ether of bisphenol A/Dicyandiamide/Diuron) reinforced by three layers of glass fibre. The rate curves from the DSC study agreed well with those obtained from the isothermal FT Near Infrared (FTNIR) study and similar activation energy was obtained in the range of 92.6 to 87.7 kJ/mol up to 50% total conversion. Modelling of the whole DSC trace with empirical equation dx/dt=kx^m(A-x)ⁿ gave relatively good fitting of the experimental curves (the error is lower than 15%.) in the whole studied cure temperature range (75-110°C) and no significant difference in cure kinetics was observed for both epoxy prepreg and neat resin.     

Curing reaction of o-cresol novolac epoxy resin according to hardener change

The investigations of cure kinetics and glass transition temperature (T_g) versus reaction conversion (α) of o-cresol novolac epoxy resin with the change of hardener were performed. All kinetic parameters of the curing reaction such as the reaction rate order, activation energy, and frequency factor were calculated. The curing mechanisms were classified into two types. One was an autocatalytic mechanism and the other was a nth order kinetic mechanism. The constants related to the chain mobility of polymer segments were obtained by using the DiBenedetto equation. We have tried to correlate the relationships between curing mechanism and molecular structures of hardeners from these results. © 1993 John Wiley & Sons, Inc.     

非等温法研究TGDDM/DDS体系固化反应动力学

采用DSC对4,4′-四缩水甘油基二氨基二苯基甲烷(TGDDM)和3,3′-二氨基二苯基砜(DDS)体系的固化反应动力学进行了研究.分别通过n级反应法和Malek的最大概然机理函数法确定了固化反应机理函数,求解了固化反应动力学参数,得到了固化反应动力学模型.结果表明,通过Kissinger,Crane方法求解动力学参数所得到的n级反应模型与实验值差别较大;而采用Malek方法判别机理,表明该固化反应按照自催化反应机理进行,实验得到的DSC曲线与模型计算所得到的曲线吻合的较好,所确立的模型在5~20K/min的升温速率下能较好地描述TGDDM/DDS体系的固化反应过程,并为工艺参数的选择和工艺窗口的优化提供了理论依据.     

Influence of surface modified graphene oxide on the mechanical performance and curing kinetics of epoxy resin

In this study, the hyperbranched polyester were successfully grafted onto graphene oxide (GO). The mechanical performance and curing kinetics of epoxy resin (EP), EP/ graphene oxide (EP/GO), and EP/ hyperbranched polyester grafted GO (EP/GO‐B) were investigated by means of mechanical tests and differential scanning calorimetry (DSC). Results revealed that the presence of GO lowered the cure temperature and accelerated the curing of EP, and the addition of GO‐B exhibited a stronger effect in accelerating the cure of EP compared with GO. Activation energies were calculated using Kissinger approach, and Ozawa approach, respectively. Results revealed lowered activation energy after the addition of GO or GO‐B at low degrees of cure, indicating that GO had a large effect on the curing reaction. The presence of GO facilitated the curing reaction, especially the initial epoxy‐amine reaction. Moreover, GO‐B exhibited better performance. Related mechanism was proposed.     

Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.     

Kinetics of thermoset cure and polymerization in the glass transition region

A theoretical approach to thermoset cure kinetics based on Arrhenius kinetics and mobility was developed by considering the activation of the reacting group and chain mobility as elementary steps for reaction. This extended kinetic equation was successfully applied to the curing of an epoxy by an amine, the trimerization of a cyanate, and to the polymerization of methyl methacrylate. Full agreement between theory and experimental data was obtained in all cases. The activation energies for chain mobility were exceptionally low (0.3–1 kJ/mol for bisphenol-A-based epoxy and cyanate) which indicates that the structural units must undergo only small-angle rotational oscillations to allow a reaction. A theoretical time–temperature–transformation (TTT) diagram is also presented. © 1993 John Wiley & Sons, Inc.     

气相生长碳纤维对环氧树脂固化反应的影响及其复合物固化动力学研究

用示差扫描量热方法研究了气相生长碳纤维作为填料对4,4′-二氨基二苯甲烷四缩水甘油环氧树脂(TGDDM)/4,4′-二氨基二苯基砜(DDS)等温固化反应的影响.与纯环氧树脂一样,气相生长碳纤维复合物的固化反应也属于自催化反应类型.气相生长碳纤维对环氧树脂的固化反应动力学影响很小.固化反应的过程可以用一种修正过的自催化动力学模型来描述,在整个固化反应过程中纯TGDDM/DDS环氧树脂及其气相生长碳纤维复合物模型拟合得到的结果和实验数据相当一致.     

Mechanism Studies on Water Sorption and Permeation in Epoxy Resin by Impedance Spectroscopy. II. Cure Kinetics of O-Cresol Novolac Resin with Esterfied Phenol Novolac Resin

Abstract

To study the effect of water affinity of the cured epoxy resin on water sorption and permeation in the cured epoxy resin, a novel hardener (esterfied phenol novolac was synthesized and used for obtaining the cured product without free hydroxyl group. Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FT-IR) were used to study the cure kinetics of o-cresol novolac epoxy resin using esterfied phenol novolac resin as curing agent in the presence of 2-methylimidazole as accelerator. Some kinetic parameters of the curing reaction such as the reaction order, activation energy, and frequency factor were obtained in the temperature range studied. The results show that this curing process is a first-order kinetic mechanism, which was different with that cured with phenol novolac resin.     

基于松香酸酐的环氧树脂体系固化动力学及TTT图绘制

研制了基于松香酸酐固化剂的生物质环氧树脂体系,采用全动态DSC法研究了树脂体系的固化反应动力学,通过半经验的唯象模型拟合得到了固化反应参数,活化能Ea为59.68 kJ/g,指前因子A0为1.28×1015s-1,反应级数n为2.483,由此建立了体系固化温度/时间/固化度间的关系;采用恒温DSC及DMA方法测试玻璃化转变温度,应用DiBenedetto经验方程拟合得到了玻璃化转变温度与固化度间的关系.应用锥板旋转黏度计测试了树脂体系不同温度下的凝胶时间,通过线性回归分析得到了凝胶时间与温度之间的关系.由唯象模型和DiBenedetto方程分别计算得到凝胶时的固化度为0.386,玻璃化转变温度为26.22°C.由上述工作绘制了基于松香酸酐生物质树脂体系的TTT(time-temperature-transition diagram)固化图,可确定树脂体系在不同温度任意时间下的状态.     

升温与等温法非模型动力学研究环氧树脂固化反应

基于DSC数据,采用以Vyazovkin积分法为基础的升温法非模型动力学和等温法非模型动力学对双酚A型环氧树脂E51/4,4′-二氨基二苯基砜(DDS)体系及多官能度环氧树脂AG80/DDS体系的固化过程进行了研究,并结合玻璃化转变温度的变化和原位红外测试技术,对比分析了升温与等温条件下的固化反应规律.结果表明,与传统的模型拟合法相比,非模型动力学更适合定量预测树脂固化反应过程,并能为固化过程中反应机理变化的研究提供重要依据;等温法非模型动力学能够更好地预测两种树脂体系在不同恒温条件下的固化反应历程,并且升温法与等温法非模型动力学所得到的反应活化能-固化度之间的变化关系不同,表明不同温度条件下树脂的反应机理不同,这与升温和恒温条件下玻璃化效应及环氧官能团的变化规律相吻合.     

环氧树脂/氧化石墨纳米复合物的等温固化行为研究

用示差扫描分析仪(DSC)研究了氧化石墨(GO)对N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯基甲烷环氧树脂(TGDDM)/4,4'-二氨基二苯基砜(DDS)体系的等温固化反应的影响,用X射线光电子能谱仪(XPS)和傅里叶变换红外光谱仪(FTIR)研究了GO上存在的官能团及其对TGDDM/DDS体系固化行为的影响,用热失重分析仪(TGA)研究了天然石墨和GO的热力学稳定性.XPS、FTIR和TGA结果表明,GO上存在的大量羟基、羧基、环氧基等官能团能够影响环氧树脂的固化行为.DSC研究发现,环氧树脂/氧化石墨纳米复合物的固化反应属于自催化类型,随着GO含量的增加,达到最大反应速率的时间不断减小,初始反应速率不断增大,这说明GO对环氧树脂的固化反应有促进作用.Kamal模型计算得到的结果表明,随着GO含量的增加自催化反应初期阶段表观活化能E1先减小再增大,而自催化反应结束后表观活化能E2略微减小.经Kamal模型扩散控制函数修正后,整个固化过程中拟合得到的结果与实验数据相当吻合.以上结果说明,少量的GO对TGDDM/DDS体系的固化反应起着催化作用.     

环氧树脂电子束固化过程中的电子能量传播机制

将环氧树脂辐射固化过程中的温度分布和辐射固化后的固化度分布与反应前的电子能量沉积模拟计算结果相结合, 探讨电子束在辐射固化过程中的能量传播机制. 结果表明, 辐射开始初期, 固化反应发生前, 电子能量在聚丙烯模具内环氧树脂体系中的沉积满足离子注入理论, 即电子能量沉积在距辐射表面一定距离处达到最大, 然后随辐射距离的增加沉积能量减小; 而在玻璃模具内的树脂体系中, 电子能量从辐射表面向里逐渐降低. 随体系中固化反应的发生, 最大电子浓度区域转移, 最终出现在临近最大电子沉积浓度区域辐射深度稍远的地方. 能量吸收和反应放热导致的升温不影响树脂固化度大小, 但会影响固化度分布.     

Cure Kinetics of DGEBA with Hyperbranched Poly （3-hydroxyphenyl） Phosphate as Curing Agent Studied by Non-isothermal DSC

IntroductionEpoxy resins are widely used in the fields of coa-tings,adhesives,insulating materials,etc..Diglycidylether of bisphenol A(DGEBA)is the most importantepoxy resin in industry because of its fluidity,physicaland mechanical properties after cure,…     

Cure kinetics of epoxy resin-natural zeolite composites

The cure kinetics of epoxy resin and epoxy resin containing 10 mass% of natural zeolite were investigated using differential scanning calorimetry (DSC). The conformity of the cure kinetic data of epoxy and epoxy-zeolite system was checked with the auto-catalytic cure rate model. The results indicated that the hydroxyl group on the zeolite surface played a significant role in the autocatalytic reaction mechanism. This group was able to form a new transition state between anhydride hardener and epoxide group. The natural zeolite particles acted as catalyst for the epoxy system by promoting its curing rate.