Annealing effects of highly homogeneous a-Si1−xCx:H

We report the effect of annealing on the properties of amorphous hydrogenated silicon carbide thin films. The samples were deposited onto different substrates by plasma enhanced chemical vapor deposition at temperatures between 300 and 350 °C. The gaseous mixture was formed by silane and methane, at the ‘silane starving plasma regime’, and diluted with hydrogen. Rutherford backscattering and Fourier transform infrared spectrometry were used, respectively, to determine the atomic composition and chemical bonds of the samples. The film’s structure was analyzed by means of X-ray absorption fine structure and X-ray diffraction. For temperatures higher than 600 °C, amorphous silicon carbide films annealed under inert atmosphere (Ar or N₂) clearly changed their structural and compositional properties due to carbon loss and oxidation, caused by the presence of some oxygen in the annealing system. At 1000 °C, crystallization of the films becomes evident but only stoichiometric films deposited on single crystalline Si[1 0 0] substrates presented epitaxial formation of SiC crystals, showing that the crystallization process is substrate dependent. Films annealed in high-vacuum also changed their structural properties for annealing temperatures higher than 600 °C, but no traces of oxidation were observed or variations in their silicon or carbon content. At 1200 °C the stoichiometric films are fully polycrystalline, showing the existence of only a SiC phase. The XANES signal of samples deposited onto different substrates and annealed under high-vacuum also show that crystallization is highly substrate dependent.     

A new method for fabricating water repellent silica films having high heat-resistance using the sol–gel method

There has been a great demand in the field of kitchen appliances to develop transparent water repellent films which have high heat-resistance around 300°C. However, those films have not been obtained by conventional sol–gel methods. In this paper, we propose a new method for fabricating transparent water repellent films with high heat-resistance using the sol–gel method, in which silicon or germanium substrates were coated with a solution including tetraethoxysilane (Si(OC₂H₅)₄) and (2-perfluorooctyl)ethyltrimethoxysilane (CF₃(CF₂)₇C₂H₄Si(OCH₃)₃), followed by ‘ammonia-treatment' and annealed at 300°C. The contact angles of water on the ammonia-treated film maintained its initial value, 110° after the heat treatment at 300°C for 250 h while those on the untreated film decreased to 70°, indicating that the ammonia-treatment improves heat-resistance on the film. The mechanism of ammonia-treatment was inferred from FT-IR results; the ammonia-treatment should accelerate hydrolysis and polymerization of FAS and TEOS molecules, resulting in high density of siloxane bonds between FAS and silica glass. These bonds suppress the evaporation of FAS molecules from the film during the heat treatment at 300°C, thus the film has high heat-resistance.     

Structure and thermal stability of MOCVD ZrO2 films on Si (1 0 0)

The structure and thermal stability of ZrO₂ films grown on Si (1 0 0) substrates by metalorganic chemical vapor deposition have been studied by high-resolution transmission electron microscopy, selected area electron diffraction and X-ray energy dispersive spectroscopy. As-deposited films consist of tetragonal ZrO₂ nanocrystallites and an amorphous Zr silicate interfacial layer. After annealing at 850°C, some monoclinic phase is formed, and the grain size is increased. Annealing a 6 nm thick film at 850°C in O₂ revealed that the growth of the interfacial layer is at the expense of the ZrO₂ layer. In a 3.0 nm thick Zr silicate interfacial layer, there is a 0.9 nm Zr-free SiO₂ region right above the Si substrate. These observations suggest that oxygen reacted with the Si substrate to grow SiO₂, and SiO₂ reacted with ZrO₂ to form a Zr silicate interfacial layer during the deposition and annealing. Oxygen diffusion through the tetragonal ZrO₂ phase was found to be relatively easier than through the monoclinic phase.     

Homogeneity of a ZrF4-based glass at the nano-scale

A glass of composition 53ZrF₄–20BaF₂–4LaF₃–3AlF₃–20NaF (T_g=260°C) was prepared by careful crucible melting. High-resolution atomic force microscopy of fracture surfaces displayed the presence of nano-pores with diameters of 20–50 nm, being 4–10 nm deep, in all glasses. It was further found that only glasses without annealing and glasses with an annealing step considerably below T_g showed a distinct pattern, i.e. ripples of ≈20 nm in diameter and an rms roughness of ≈0.6 nm. Glasses annealed either near T_g or at the temperatures of maximum nucleation or maximum crystal growth rates showed both regions with the ripple pattern and regions with nano-hillocks, growing in size with increasing annealing temperature and time. Thus these hillocks nearly reach micro-dimensions of ≈270 nm in diameter and ≈65 nm in height following a 90 min annealing step at 343°C, the temperature of maximum crystal growth. These findings give evidence that the glass system, which is thought to be one of the most suitable for fiber drawing, is much less stable against nucleation and crystallization than anticipated.     

Stability and formation of pyrochlore phase in doped Sr0.8Bi2.3Ta2O9 thin films

Ferroelectric thin films of bismuth-containing layered perovskite Sr_0.8Bi_2.3Ta_2−xM_xO₉ (SBTM), where M is V, Ti, W, and Zr, have been prepared on Pt/Ti/SiO₂/Si substrates using the metal-organic decomposition method. The effect of the incorporated B-site cations on pyrochlore phase formation and microstructure evolution of SBTM films was investigated. The pyrochlore phase formation has been identified due to out-diffusion of titanium from underneath platinum layer to participate in the reaction with the films. Furthermore, the formation of pyrochlore phase in the SBTM films has been observed strongly dependent on the characteristics of incorporated M cation. The substitution of both W and V for Ta leads to the formation of pyrochlore phase at lower annealing temperature (750–800 °C). On the other hand, the addition of Zr can retard the formation of pyrochlore phase from 850 to 900 °C. A model based on the binding energy of octahedral structure is used to elucidate the formation and stability of the pyrochlore phase present in the SBT film.     

Investigation of defects in low-temperature-grown GaAs using optical transient spectroscopy

Optical transient current spectroscopy (OTCS) has been used to investigate defects in the low-temperature-grown GaAs after postgrowth rapid thermal annealing (RTA). Two samples A and B were grown at 220°C and 360°C on (0 0 1) GaAs substrates, respectively. After growth, samples were subjected to 30 s RTA in the range of 500–800°C. Before annealing, X-ray diffraction measurements show that the concentrations of the excess arsenic for samples A and B are 2.5×10¹⁹ and 1×10¹⁹ cm⁻³, respectively. It is found that there are strong negative decay signals in the optical transient current (OTC) for the annealed sample A. Due to the influence of OTC strong negative decay signals, it is impossible to identify deep levels clearly from OTCS. For a comparison, three deep levels can be identified for sample B before annealing. They are two shallower deep levels and the so-called As_Ga antisite defect. At the annealing temperature of 600°C, there are still three deep levels. However, their structures are different from those in the as-grown sample. OTC strong negative decay signals are also observed for the annealed sample B. It is argued that OTC negative decay signals are related to arsenic clusters.     

后退火气氛对磁控溅射制备β-Ga2O3薄膜材料的影响

近年来,宽禁带半导体材料β-Ga₂O₃越来越多地受到关注,在材料制备、掺杂、刻蚀等方面都有广泛研究。射频磁控溅射是常用的β-Ga₂O₃薄膜制备方法之一,后退火处理往往是提高薄膜质量的关键工艺步骤。本文研究后退火工艺中退火温度和退火气氛对射频磁控溅射在C面蓝宝石基底上制备得到的β-Ga₂O₃薄膜材料的影响。X射线衍射和原子力显微镜表征结果表明:在氮气气氛下退火,退火温度为1 000 ℃时得到的β-Ga₂O₃薄膜质量较优;相同的温度下,氧气气氛退火比氮气气氛退火更有利于提升薄膜的结晶性能、降低表面粗糙度;在氧气气氛下,1 000 ℃退火得到的薄膜质量相对比900 ℃退火得到的薄膜质量好。     

Correlation between interfacial structure and c-axis-orientation of LiNbO3 films grown on Si and SiO2 by electron cyclotron resonance plasma sputtering

Thin films of crystalline lithium niobate (LN) grown on Si(1 0 0) and SiO₂ substrates by electron cyclotron resonance plasma sputtering exhibit distinct interfacial structures that strongly affect the orientation of respective films. Growth at 460–600 °C on the Si(1 0 0) surface produced columnar domains of LiNbO₃ with well-oriented c-axes, i.e., normal to the surface. When the SiO₂ substrate was similarly exposed to plasma at temperatures above 500 °C, however, increased diffusion of Li and Nb atoms into the SiO₂ film was seen and this led to an LN–SiO₂ alloy interface in which crystal-axis orientations were randomized. This problem was solved by solid-phase crystallization of the deposited film of amorphous LN; the degree of c-axis orientation was then immune to the choice of substrate material.     

Energy transfer and annealing behavior of luminescence in Dy-doped PbWO4 single crystal

The Dy³⁺: PWO single crystal was subsequently annealed in air atmosphere at a temperature of 500°C, 550°C, 600°C, 700°C, 800°C, 900°C, and 1000°C, respectively. X-ray excited luminescence spectra were measured before and after each step of annealing. Annealing experiments confirmed the energy transfer-taking place from PbWO₄ (PWO) host to Dy³⁺ ions, followed by the enhancing characteristic emission of Dy³⁺ ions. In the process of annealing, the luminescence of PWO host was significantly reduced while that of Dy³⁺ was increased simultaneously. Annealing at a temperature below 700°C suppressed the blue luminescence of the PWO host and enhanced its green components, while the emission of Dy³⁺ is increased to some extent. Further annealing at higher temperature strongly reduced the luminescence of the PWO host, while the emission of Dy³⁺ was greatly increased. Interstitial oxygen O_i could play an important role in the luminescence. Annealing could modify the luminescence of Dy³⁺ ions in PWO, which may be useful in terms of some application purposes.     

Study on the Ce substitution effects of BiFeO3 films on ITO/glass substrates

Ce substituted Bi_1−xCe_xFeO₃ (BCFO) films with x=0–0.15 were deposited on indium tin oxide (ITO)/glass substrates by sol–gel process annealed at 500 °C. Rhombohedral phase was confirmed by XRD study and no impure phases were observed till x=0.15. Substantially enhanced ferroelectricity was observed at room temperature due to the substitution of Ce. In the films with x=0.05 and 0.10, the double remnant polarization are 75.5 and 57.7 μC/cm² at an applied field 860 kV/cm. Moreover, the breakdown field was enhanced in the films with Ce substitution.     

Effect of the substrate temperature on the crystallization of TiO2 films prepared by DC reactive magnetron sputtering

Titanium oxide (TiO₂) films were deposited on silicon substrates at the temperature in the range 50–600 °C by DC reactive magnetron sputtering. It was found that the anatase and rutile phases co-existed in the TiO₂ films deposited at 450–500 °C, while only the anatase phase existed in those deposited at other temperatures. The mechanism of such a crystallization behavior of TiO₂ films is preliminarily explained.     

Solvothermal growth of ZnO

The growth of ZnO single crystals and crystalline films by solvothermal techniques is reviewed. Largest ZnO crystals of 3 inch in diameter are grown by a high-pressure medium-temperature hydrothermal process employing alkaline-metal mineralizer for solubility enhancement. Structural, thermal, optical and electrical properties, impurities and annealing effects as well as machining are discussed. Poly- and single-crystalline ZnO films are fabricated from aqueous and non-aqueous solutions on a variety of substrates like glass, (100) silicon, -Al₂O₃, Mg₂AlO₄, ScAlMgO₄, ZnO and even some plastics at temperatures as low as 50 °C and ambient air conditions. Film thickness from a few nanometers up to some tens of micrometers is achieved. Lateral epitaxial overgrowth of thick ZnO films on Mg₂AlO₄ from aqueous solution at 90 °C was recently developed. The best crystallinity with a full-width half-maximum from the (0002) reflection of 26 arcsec has been obtained by liquid phase epitaxy employing alkaline-metal chlorides as solvent. Doping behavior (Cu, Ga, In, Ge) and the formation of solid solutions with MgO and CdO are reported. Photoluminescence and radioluminescence are discussed.     

Anomalous effect of temperature on atomic layer deposition of titanium dioxide

A strong influence of growth temperature on the deposition rate and refractive index of TiO₂ thin films, grown by atomic layer deposition from TiCl₄ and H₂O, was observed. The growth rate increased from 0.05 to 0.09 nm per cycle while the refractive index decreased from 2.63 to 2.00 with the increase of growth temperature from 150°C to 225°C. The effect was due to crystallization processes starting at these temperatures. The substrate temperature range, in which the growth rate most significantly changed, depended on the TiCl₄ pulse time.     

Hydrogenated amorphous silicon with substrate-dependent structure

Hydrogenated amorphous silicon (a-Si:H) thin films grown at 250°C on (1 0 0) crystalline substrate using plasma-enhanced chemical vapor deposition (PECVD) with SiH₄/H₂ gas flow ratio equal to 5/1 (sccm) are investigated by transmission electron microscopy. It is found that the thin film is totally amorphous when grown on a glass substrate. But when the substrate is changed to crystalline silicon, some crystalline grains are found embedded in the amorphous structure in certain regions even if the thickness of the film reaches 600 nm. It is suggested that the amorphous silicon film grown on a crystalline silicon substrate at a temperature of 250°C without heavy H₂ dilution is a mixed network of a small amount of crystalline silicon and the major portion of amorphous silicon.     

Growth mechanisms in excimer laser photolytic deposition of gallium nitride at 500°C

The mechanisms of controlling laser-induced chemical vapour deposition of GaN at substrate temperatures between 350 and 650°C have been investigated. Ultraviolet (193 nm) photolytic decomposition of trimethylgallium (TMGa) and ammonia (NH₃) precursors was examined in this range. Laser-induced fluorescence studies support the view that the dissociated intermediate fragments GaCH₃ and NH are the reacting species in GaN film formation, irrespective of substrate temperature. It was found that two crystal phases coexist in films grown at substrate temperatures below 500°C, wurtzite crystal structure with (0002) orientation forms at substrate temperatures above 500°C. The growth rate increases with both NH₃/TMGa ratio, and TMGa flow rate, while the temperature dependence shows a thermal activation energy of 0.2 eV which is smaller by a factor of five than that of films prepared by conventional thermal CVD. The large NH₃/TMGa ratios needed to achieve stoichiometry are interpreted in terms of the two-photon dissociation cross section of NH₃.     

Formation of LiNbO3 films by hydrolysis of metal alkoxides

Homogeneous, crack-free, thin films of crystalline LiNbO₃ were synthesized above 250°C on Si(100) substrates by the dip-coating method using a double alkoxide solution. The coating solution, which was prepared by the controlled partial hydrolysis of the double alkoxide, gave stoichiometric LiNbO₃ crystalline films at temperatures as low as 250°C. The concentration of the alkoxide solution influenced both of thickness and quality of films. Crystallinity of thin film top-coated directly on the substrate affected the crystallization state of films coated on the film remarkably. Films crystallized on -Al₂O₃(0001) showed preferred orientation along the c-axis, while the preferred orientation could not be observed on Si(100) substrates.     

A study of growth and morphological features of TiOxNy thin films prepared by MOCVD

The growth and morphological features of MOCVD TiO_xN_y films have been characterized to evaluate the effect of various process parameters on film growth. XRD analysis of the films deposited at 600°C on Si(1 1 1) and mica show a TiN(1 1 1) peak at 2θ=36.6°, but only anatase peaks are detected below 550°C. Above 650°C, both anatase and rutile peaks are detected. The presence of ammonia is not effective below 550°C as the deposited film is mostly TiO₂. Also, ammonia does not play any role in homogeneous nucleation in the gas phase, as evident by the deposition of anatase/rutile particles above 650°C. The following changes in the morphological features are observed by varying process parameters. By increasing the ratio of titanium-isopropoxide to ammonia flow, the cluster shape changes from angular to rounded; dilution of the flow results in larger elongated clusters; increase in flow rate at constant precursor to ammonia ratios, changes the cluster shape from rounded to elongated and the cluster size deceases. Deposition at higher temperatures results in finer clusters with a slower growth rate and eventually results in a very thin film with particle deposition at 650°C and above.     

Behaviour of vicinal InP surfaces grown by MOVPE: exploitation of AFM images

InP substrates and epilayers grown by MOVPE have been studied by AFM. For different misorientation angles, we observed the surface of the substrate after annealing under phosphine (PH₃) and of the epilayers under different growth conditions such as growth temperature T_g and trimethylindium (TMI) partial pressure. After annealing the terrace width corresponds to the nominal value of misorientation angle measured by X-ray diffraction. We observed different topographies and roughnesses for the grown layers corresponding to different growth modes. We propose, taking into account the roughness of the surface, a calculation of the step height and terrace width. For 2D nucleation (θ ≤ 0.2° and T_g = 500°C) and step flow mode, the roughness is low while it is increased by step bunching (θ ≥ 0.5° and T_g ≥ 580°C). Moreover we have examined the surface morphology for different misorientation angles and determined the influence of growth conditions (growth temperature, indium partial pressure) on the growth mechanism. At T_g = 580°C the increase of the TMI partial pressure in the reactor enhances the step bunching and leads to larger terraces.     

Anisotropic atomic structure of Tb---Fe and Tb---Co amorphous alloys

The uniaxial anisotropy of Tb₁₉Co₈₁ and Tb₁₉Fe₈₁ amorphous alloy films was investigated by using X-ray diffraction analysis and measuring the magnetic anisotropy constants, K_u, on annealing at 200°C. It was revealed that, in the Tb---Fe film investigated, the anisotropic structure was more extensively relaxed at an early stage of annealing than in the Tb---Co film. During this relaxation process, near-neighboor correlations changed mainly around Tb---Tb pairs in the Tb---Fe film, whereas they changed mainly around Co---Co pairs in the Tb---Co film. The magnetic anisotropy decreased more rapidly in the Tb---Fe film than in the Tb---Co film, reflecting this difference in the structural relaxation process.     

SIMS study of the concentration of dopants in LPCVD silicon thin films

Measurements of solid phase dopant concentration (S) of LPCVD Si thin films as a function of substrate temperature (T_s = 500−640 ° C) and gas phase doping ratio (R = 1 × 10⁻⁵ −4 × 10⁻²) by SIMS indicate different behaviors of P and B in the films. A linear relation S = b(T)R is observed for B-doped film with b(T) varying from 4 to 50 depending on T_s. Boron-doped microcrystalline film has a higher doping efficiency than that of P-doped ones.