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利用分子动力学方法研究了H原子与C/Be样品的相互作用过程,当H原子轰击C/Be样品时,发现有一些H原子渗入样品中并且滞留在样品中,H原子的滞留率随H原子的初始入射能量的升高呈线性增长,有些沉积在样品中H原子与C原子相互作用形成H-C键。溅射产物以H原子和H2分子为主。H和H2的产额率随初始入射能量的变化趋势相反,分析了不同机制下产物H和H2的产额率随初始入射能量的关系,且通过分析H原子的入射能量和样品的原子密度的关系来研究轰击后的样品,发现样品中原子分布变化很小,同时分析了化合物中的化学键分布变化较小,只是其化学键的分布峰向样品表面移动。     

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采用分子动力学方法模拟200eV的CH3粒子轰击到不同基底温度的钨样品上,分析了C、H原子在钨表面的沉积、散射及溅射情况,结果表明C、H原子的沉降量均随入射剂量的增加而增加。在基底温度为100K时,相同入射剂量下沉积的C原子最多,而当基底温度为1200K,在入射剂量大于1.5X1016cm-2时,C原子的沉降量小于其它基底温度下的C的沉降量。CH3在轰击样品时发生了分解,各种分解情况随基底温度变化较小,其中不同基底温度下一级分解率在40%上下波动,二级分解在23%左右,而完全分解的CH3在9%左右。C、H原子的散射角主要分布在5°~85°间,散射C原子分布的最大值分布在40%~50°或50°~60°间,散射C原子分布的最小值分布在0°~10°或80°~90°间;而不同基底温度下散射H原子分布的最大值均在40°~50°间,最小值均在0°~10°间。散射C原子的能量在0~140eV之间,散射能量为0~120eV的C原子占散射总量的98%以上,散射C原子平均能量随基底温度的增加而增加,其变化从65.5eV增加到68.5eV;散射H原子的能量也在0~140eV之间,但大约70%的散射H原子能量在40eV以内,散射平均能量随基底温度的增加而减小,其变化从13.92eV减小到13.05eV。     

Pt(111)表面低能溅射现象的分子动力学模拟

利用嵌入原子方法的原子间相互作用势，通过分子动力学模拟，详细研究了贵金属原子在Pt (111)表面的低能溅射现象.模拟结果显示：对于垂直入射情况，入射原子的质量对Pt (11 1)表面的溅射阈值影响不大.当入射原子的能量小于溅射阈值时，入射原子基本以沉积为主 ；当入射原子的能量大于溅射阈值时，溅射产额随入射原子能量的增加而线性增大；当入射 原子能量达到200 eV时，各种入射原子的溅射产额都达到或接近1，此时入射原子主要起溅 射作用.溅射原子发射的角分布概率和溅射花样与高能溅射相类似.研究表明：与基于二体碰 撞近似的线性级联溅射理论不同，当入射原子能量大于溅射阈值时，低能入射原子的溅射产 额正比于入射原子的约化能量和入射原子与基体原子的质量比.通过对低能入射原子的钉扎 能力分析，提出了支配低能溅射的入射原子反射物理机理. 关键词： 分子动力学模拟、低能溅射     

CH基团与金刚石(111)面的碰撞反应及其对碳膜生长的影响

等离子体增强化学气相沉积技术中的碳膜选择性自组装机理是高性能碳膜制备过程中的挑战性基础课题.采用经典分子动力学方法,模拟了不同能量(1.625-65 eV)的CH基团在清洁金刚石和吸氢金刚石(111)面上的轰击行为,获得了吸附、反弹、反应等各类事件的发生概率,并据此探讨了含氢碳膜制备过程中CH基团的贡献.结果表明,随着入射能量的增加,CH基团对薄膜生长的贡献由单纯的吸附、反弹机理向反应、吸附混合机理转变,其中最主要的反应过程是释放一个或两个氢原子的反应,而释放氢分子的反应则很少发生.这些反应不仅使薄膜生长过程更均匀、薄膜表面更平整,还降低了薄膜的氢含量.生长机理的转变导致低能量条件下所成薄膜中的多数碳原子都包含一个氢原子作为配位原子,而高能量条件下的薄膜中的碳原子则很少有氢原子作为配位原子.另外,通过分析sp~3-C和sp~2-C数目的变化,研究了CH基团对金刚石基底的破坏作用.     

低能原子沉积在Pt(111)表面的分子动力学模拟

采用嵌入原子方法的原子间相互作用势,利用分子动力学方法模拟了六种贵金属原子(Ni,Pd,Pt,Cu,Ag,Au)分别在Pt(111)表面低能沉积的动力学过程.结果表明:随着入射能量从0.1eV升高到200eV,基体表面原子是按层迁移的,沉积过程对基体表面的影响和沉积原子在基体表层的作用均存在两个转变能量(ET1≈5eV,ET2≈70eV).当入射能量低于5eV时,基体表面几乎没有吸附原子和空位形成,沉积原子在基体表层几乎没有注入产生;当入射能量在5—70eV范围内时,沉积原子在基体表层有注入产生,其注入深度小于两个原子层,即为亚注入,此时吸附原子主要由基体表层原子形成,基体表面第三层以下没有空位形成;当入射能量高于70eV时,沉积原子的注入深度大于两个原子层,将会导致表面以下第三层形成空位,并且空位产额随入射能量的升高而急剧增加.基于分子动力学模拟的结果,对低能沉积作用下的薄膜生长以及最优沉积参数的选择进行了讨论.     

ADATOM, VACANCY AND SPUTTERING YIELDS OF ENERGETIC Pt ATOMS IMPACTING ON Pt(100) BY MOLECULAR DYNAMICS SIMULATION

We have studied the influence of incident atoms with low energy on the Pt(100) surface by molecular dynamics simulation. The interaction potential obtained by the embedded atom method (EAM) was used in the simulation. The incident energy changes from 0.1eV to 200eV, and the target temperature ranges from 100 to 500 K. The target scales are 6×6×4 and 8×8×4 fcc cells for lower and higher incident energies, respectively. The adatom, sputtering, vacancy and backscattering yields are calculated. It was found that there is a sputtering threshold for the incident energy. When the incident energy is higher than the sputtering threshold, the sputtering yield increases with the increase of incident energy, and the sputtering shows a symmetrical pattern. We found that the adatom and vacancy yields increase as the incident energy increases. The vacancy yields are much higher than those obtained by Monte Carlo simulation. The dependence of the adatom and sputtering yields on the incident energy and the relative atomistic mechanisms are discussed.     

带有碳杂质的钨中氢稳定性的第一性原理研究

应用第一性原理计算方法研究了碳(C)原子对钨(W)中氢(H)原子稳定性的影响. 本征W中, 当C-H间距离为～2.5 Å时, H的溶解能出现最低值, 此时为H最稳定的位置. W中存在空位时, 由于C的影响, H占据的最佳电子密度面值为0.10 Å^-3. 研究发现, W中单空位最多能容纳10个H原子, 且不能形成H分子, 不同于没有C存在的情况, 表明C对W中H稳定性存在很大影响. 此外, 当两个C原子存在于空位中时, H占据的最佳电子密度面值变为0.13 Å^-3.     

Relative sputtering yields from close-packed directions in nickel under low-energy Ar bombardment

A new approach to low-energy sputtering was developed wherein a monoenergetic Ar⁺ ion beam of the order of 10⁻⁹ A impinged onto a crystalline nickel target. Target preparation consisted of plating about 100 monolayers of high specific activity Ni-63 onto a coldrolled nickel substrate and then heating the target above its recrystallization temperature under ultra-high vacuum. The result was a highly ordered polycrystalline structure which, when sputtered, behaved like the (100) surface of a nickel single crystal. Approximately 25 percent of the surface atoms were Ni-63. Sputtered material was collected on a molybdenum foil which was subsequently analyzed by radiotracer techniques.

Experimental results concerning sputtering from [110] and [100] close-packed directions in nickel under bombardment by Ar⁺ ions of energy 25 eV to 600 eV are reported. The relative sputtering yields from [110] directions are presented as a function of incident ion energy for 75° and 15° ion incidence measured with respect to the [110] directions, and the extrapolated thresholds are compared with theoretical predictions.

In addition to the expected deposits on the foil due to sputtering from individual closepacked directions, secondary deposits occurred which are attributed to specular reflection of sputtered nickel atoms from the molybdenum foil.     

分子动力学模拟H原子与Si的表面相互作用

通过分子动力学模拟了入射能量对H原子与晶Si表面相互作用的影响. 通过模拟数据与实验数据的比较, 得到H原子吸附率随入射量的增加 呈先增加后趋于平衡的趋势. 沉积的H原子在Si表面形成一层氢化非晶硅薄膜, 刻蚀产物(H₂, SiH₂, SiH₃和SiH₄)对H原子吸附率趋于平衡有重要影响, 并且也决定了样品的表面粗糙度. 当入射能量为1 eV时, 样品表面粗糙度最小. 随着入射能量的增加, 氢化非晶硅薄膜中各成分(SiH, SiH₂, SiH₃)的量以及分布均有所变化. 关键词： 分子动力学 吸附率 表面粗糙度 氢化非晶硅薄膜     

Three-dimensional spatiokinetic distributions of sputtered andscattered products of Ar+ and Cu+ impacts onto theCu surface: molecular dynamics simulations

Energy and angular distributions of reflections and sputtered atoms are essential inputs for feature profile evolution simulations. Molecular dynamics simulations are used to compute the three-dimensional energy and angular distributions for reflected and sputtered products when both Ar⁺ and Cu⁺ ions bombard a copper surface. We term these “spatiokinetic” distribution functions (SKDF's). We show by example that SKDF's for reflected Ar⁺ ions focus as the incident angle &thetas;_i (normal=0°) is increased from 60-75° and broaden as the incident energy E_i is increased from 55-175 eV. We show that the SKDF's for glancing-angle reflected Cu⁺ ions focus when E_i is increased from 55-175 eV. We show that the SKDF's for copper atoms sputtered by 175 eV Ar⁺ are insensitive to &thetas;_i;. We report total sputter yields for Ar⁺ and Cu⁺ ions at 55 and 175 eV for incident angles between 0° and 85°, and sticking probabilities for Cu⁺ ions for these energies and angles. Comparison to representative experimental results (Doughty et al., 1997) is given