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Thermal stresses around a crack in the nonhomogeneous interfacial layer between two dissimilar elastic half-planes |
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| Institution: | 1. State Key Laboratory of Structural Analysis for Industrial Equipment, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, China;2. Shanghai Electro-Mechanical Engineering Institute, Shanghai 201109, China;2. School of science, Donghua University, Shanghai 201620, China |
| Abstract: | Thermal stresses around a crack in the interfacial layer between two dissimilar elastic half-planes are solved. The surfaces of the crack are assumed to be insulated. The material constants of the interfacial layer are assumed to vary continuously from those of the upper half-plane to those of the lower half-plane. Uniform heat flows perpendicular the crack. Stress intensity factors are calculated numerically for several thicknesses of the interfacial layer. |
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