Chemical Mechanical Planarization (CMP) for Microelectronic Applications

Surface planarity is of paramount importance in microelectronics. Chemical Mechanical Polishing (CMP) is the most viable approach to address the planarity issues during the fabrication of advanced semiconductor devices. With the integration of copper as interconnect and low k materials as dielectric, the CMP community is facing an ever increasing demand on reducing defectivity without scarifying production throughput. Key issues in CMP today include reduction of surface defectivity and enh…